TWM669271U - Wafer inspection system - Google Patents

Abstract

A wafer inspection system is provided, including a manipulator module for moving a wafer, a positioning module for positioning the wafer, a resistance measurement module for measuring the resistance value of the wafer, a determining module, a first defect detection module, and a second defect detection module. The determining module is configured to drive the manipulator module to move the wafer to the first defect detection module or the second defect detection module according to the resistance value of the wafer.

Description

Wafer Inspection System

The present invention relates to a wafer inspection system. More specifically, the present invention relates to a wafer inspection system comprising a plurality of defect inspection modules.

In conventional wafer inspection systems, it is often difficult to inspect wafers with higher resistance values using infrared inspection machines, while using X-ray inspection machines has the disadvantages of being slow and costly. Based on the above reasons, one of the common practices is to first measure the resistance value of the wafer manually, and then choose to use an infrared inspection machine or an X-ray inspection machine based on the measured resistance value to inspect the wafer for holes or defects.

However, the above-mentioned conventional method not only requires high manpower costs, but also easily generates risks of data matching errors and misuse of machines. In addition, since the conventional method requires the use of multiple different machines, the wafer must be repeatedly loaded and unloaded, which easily increases the probability of wafer wear.

In view of this, how to provide a wafer inspection system that can reduce costs and improve efficiency has become an important issue for researchers in this new technology field.

A wafer inspection system includes a transport module, a positioning module, a resistance measurement module, a judgment module, a first defect detection module and a second defect detection module. The transport module can be used to grab and move a wafer, and the positioning module can be used to position the wafer. The resistance measurement module can measure the resistance value of the wafer after being positioned by the positioning module. The judgment module can judge whether the resistance value is greater than a threshold value.

In one embodiment, when the resistance value is less than the threshold value, the first defect detection module performs a first defect detection on the wafer. On the other hand, when the resistance value is greater than the threshold value, the second defect detection module performs a second defect detection on the wafer.

In one embodiment, the first defect detection module includes an infrared detection unit for performing a first defect detection on the wafer, and the second defect detection module includes an X-ray detection unit for performing a second defect detection on the wafer.

In one embodiment, the first defect detection module further includes a first chamber, and the second defect detection module further includes a second chamber, wherein the infrared detection unit is disposed in the first chamber, and the X-ray detection unit is disposed in the second chamber.

In one embodiment, the wafer inspection system further includes a pre-processing area, and the positioning module and the resistance measurement module are disposed in the pre-processing area.

In one embodiment, the transport module is located between the positioning module and the resistance measurement module.

In one embodiment, the pre-treatment area is adjacent to the first chamber and the second chamber.

In one embodiment, the second chamber is adjacent to the first chamber.

In one embodiment, the positioning module includes a wafer aligner.

In one embodiment, the resistance measurement module includes an Eddy current sensor or a Four-Point Probes Resistance Meter.

In one embodiment, the determination module and the resistance measurement module perform data transmission via a wired or wireless method.

The following describes a wafer inspection system of the novel embodiment. However, it is easy to understand that the novel embodiment provides many suitable novel concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the novel in a specific way and are not used to limit the scope of the novel.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

The above-mentioned and other technical contents, features and effects of the present invention will be clearly presented in the detailed description of the preferred embodiment with reference to the drawings below. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and are not used to limit the present invention.

First, please refer to FIG. 1 , which is a schematic diagram of a wafer inspection system 100 according to an embodiment of the present invention.

As shown in FIG. 1 , a wafer inspection system 100 of an embodiment of the present invention is mainly used to detect holes and defects in wafers, and includes a pre-processing area P, a transport module R, a storage unit 11, a positioning module 12, a resistance measurement module 13, a judgment module 14, a first defect detection module M1, and a second defect detection module M2.

The storage unit 11 is located at one side of the pre-processing area P, and it may include one or more wafer boxes. Specifically, the storage unit 11 in this embodiment includes two wafer boxes 111 and 112 for storing wafers W, and the transport module R, the resistance measurement module 13, and the judgment module 14 are arranged in the pre-processing area P, wherein the transport module R may include a robot arm for taking out the wafers W from the wafer boxes 111 and 112, or for putting the wafers W into the wafer boxes 111 and 112.

It should be understood that the aforementioned transport module R can selectively move the wafer W to the aforementioned positioning module 12, the resistance measurement module 13, the first defect detection module M1 or the second defect detection module M2, and the position of the aforementioned transport module R is between the positioning module 12 and the resistance measurement module 13, so that the internal space of the pre-processing area P can be effectively utilized, thereby helping to achieve the miniaturization of the wafer inspection system 100.

In addition, as can be seen from FIG. 1, the judgment module 14 is disposed on one side of the pre-processing area P, wherein the judgment module 14 may include, for example, an integrated circuit such as a central processing unit (CPU) and/or a memory, and data transmission may be performed between the judgment module 14 and the resistance measurement module 13 via wired or wireless means.

In one embodiment, the aforementioned judgment module 14 may also be disposed in the pre-processing area P or other sides of the first and second defect detection modules M1 and M2, or may also be separated from the pre-processing area P and the first and second defect detection modules M1 and M2, and is not limited to those disclosed in the present embodiment.

The pre-processing zone P, the first defect detection module M1 and the second defect detection module M2 are arranged adjacent to each other, wherein the first defect detection module M1 has a first chamber C1 and an infrared detection unit L1, the infrared detection unit L1 is arranged in the first chamber C1, and the first chamber C1 can be connected to the pre-processing zone P through a first gate G1.

Similarly, the second defect detection module M2 has a second chamber C2 and an X-ray detection unit L2. The X-ray detection unit L2 is disposed in the second chamber C2, and the second chamber C2 can be connected to the pre-processing area P through a second gate G2.

Next, please refer to FIG. 2 , which is a schematic diagram showing the transport module R moving the wafer W to the positioning module 12 .

As shown in FIG. 2 , when a wafer W in the storage unit 11 is to be inspected for holes or defects, the transport module R can first be used to grab the wafer W in the wafer box 111 or the wafer box 112 , and then the wafer W is moved and transported to the positioning module 12 to align and correct the position and angle of the wafer W.

For example, the positioning module 12 includes a wafer aligner for positioning the wafer W, such as a flat finder or a notch finder, to detect and adjust the angle and/or position of the wafer W.

Please refer to FIG. 3 , which is a schematic diagram showing the transport module R moving the wafer W to the resistance measurement module 13 .

As shown in FIG. 3 , after the wafer W is calibrated and positioned by the positioning module 12 , the transport module R can move the wafer W to the resistance measurement module 13 , and the resistance measurement module 13 can measure the resistance of the wafer W.

For example, the resistance measurement module 13 may include an Eddy current sensor or a Four-Point Probes Resistance Meter, so as to measure the resistance value of the wafer W, wherein the resistance value information may be transmitted to the judgment module 14 via a wired or wireless method, and the judgment module 14 may transmit a driving signal to the transport module R according to the resistance value, so that the transport module R may be used to transport the wafer W to the first defect detection module M1 or the second defect detection module M2 for subsequent hole or defect detection.

Please refer to FIG. 4 , which is a schematic diagram showing the transport module R moving the wafer W to the first defect detection module M1 .

As shown in FIG. 4 , after the aforementioned judgment module 14 obtains the resistance value information of the wafer W measured by the resistance measurement module 13, the judgment module 14 can judge whether the resistance value is less than a preset threshold value. If the resistance value is less than the threshold value, the judgment module 14 can transmit a first driving signal to the transport module R. At this time, the transport module R can move the wafer W through the first gate G1 to reach the first defect detection module M1, and can use the infrared detection unit L1 inside the first chamber C1 to perform a first defect detection on the wafer W.

Please refer to FIG. 5 , which is a schematic diagram showing the transport module R moving the wafer W to the second defect detection module M2 .

As shown in FIG. 5 , when the judgment module 14 obtains the resistance value information of the wafer W measured by the resistance measurement module 13, if the resistance value is greater than the threshold value, the judgment module 14 transmits a second driving signal to the transport module R. At this time, the transport module R can move the wafer W through the second gate G2 to reach the second defect detection module M2, and can use the X-ray detection unit L2 inside the second chamber C2 to perform a second defect detection on the wafer W.

It should be particularly noted that after the wafer W is inspected by the infrared inspection unit L1 or the X-ray inspection unit L2, the transport module R can be used to move the wafer W back to the wafer box 111 or the wafer box 112 of the storage unit 11 to facilitate subsequent processing operations.

Please refer to FIGS. 1 to 6 , wherein FIG. 6 is a flow chart showing the inspection operation flow of the wafer inspection system 100 on the wafer W.

As mentioned above, when the wafer W is to be inspected for defects using the novel wafer inspection system 100, the wafer W can first be moved from the storage unit 11 into the pre-processing area P using the transport module R to complete the loading process (as shown in step S1 in FIG. 1 and FIG. 6 ), and then the wafer W is transported to the positioning module 12 through the transport module R, and a positioning process is performed on the wafer W through the positioning module 12 (as shown in step S2 in FIG. 2 and FIG. 6 ).

Afterwards, the transport module R can transport the wafer W to the resistance measurement module 13, and perform a resistance measurement procedure on the wafer W through the resistance measurement module 13 (as shown in step S3 in Figures 3 and 6), wherein the resistance value information of the wafer W will be transmitted to the judgment module 14, and the aforementioned judgment module 14 can drive the transport module R to transport the wafer W to the first defect detection module M1 or the second defect detection module M2 according to the size of the resistance value (as shown in step S4 in Figure 6).

After completing the above procedures, if the resistance value is less than a threshold value, the transport module R will move the wafer W to the first defect detection module M1, and the infrared detection unit L1 inside the first chamber C1 can be used to perform a first defect detection on the wafer W (as shown in step S51 in FIG. 4 and FIG. 6 ).

On the contrary, if the resistance value is greater than the threshold value, the transport module R will move the wafer W to the second defect detection module M2 and perform a second defect detection on the wafer W using the X-ray detection unit L2 inside the second chamber C2 (as shown in step S52 in FIGS. 5 and 6 ).

Finally, when the wafer W has been inspected, the transport module R can be used to transport the wafer W back to the wafer box 111 or the wafer box 112 of the storage unit 11 to complete the entire wafer inspection process (as shown in step S6 in FIG. 6 ).

In summary, the present invention provides a wafer inspection system 100 that can first measure the resistance value of the wafer W, and then selectively move the wafer W to the first defect inspection module M1 or the second defect inspection module M2 according to the resistance value information of the wafer W. In this way, wafers W with different resistance values can be automatically screened and defect inspected using the infrared inspection unit L1 or the X-ray inspection unit L2, respectively, thereby greatly reducing labor costs and effectively reducing the risk of data comparison errors and misuse of the machine.

On the other hand, the new type integrates different inspection modules into the same machine system, which not only avoids repeated loading and unloading of wafers to reduce the probability of wafer wear, but also greatly improves production efficiency and helps to achieve miniaturization of wafer inspection systems.

Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the relevant technical field can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present invention, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described here, they can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each patent application and embodiment.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

100: Wafer inspection system P: Pre-treatment area R: Transport module 11: Storage unit 111: Wafer box 112: Wafer box 12: Positioning module 13: Resistance measurement module 14: Judgment module C1: First chamber C2: Second chamber G1: First gate G2: Second gate L1: Infrared inspection unit L2: X-ray inspection unit M1: First defect inspection module M2: Second defect inspection module S1: Step S2: Step S3: Step S4: Step S51: Step S52: Step S6: Step W: Wafer

FIG. 1 is a schematic diagram of a wafer inspection system 100 of an embodiment of the present invention. FIG. 2 is a schematic diagram of a transport module R moving a wafer W to a positioning module 12. FIG. 3 is a schematic diagram of a transport module R moving a wafer W to a resistance measurement module 13. FIG. 4 is a schematic diagram of a transport module R moving a wafer W to a first defect detection module M1. FIG. 5 is a schematic diagram of a transport module R moving a wafer W to a second defect detection module M2. FIG. 6 is a flowchart of the inspection operation performed by the wafer inspection system 100 on the wafer W.

100: Wafer inspection system

P: Pretreatment area

R: Transport module

11: Storage unit

111: Wafer box

112: Wafer box

12: Positioning module

13: Resistance measurement module

14: Judgment module

C1: First chamber

C2: Second chamber

G1: First gate

G2: Second gate

L1: Infrared detection unit

L2: X-ray detection unit

M1: First defect detection module

M2: Second defect detection module

W: Wafer

Claims (10)

A wafer inspection system includes: a transport module for grabbing and moving a wafer; a positioning module for positioning the wafer; a resistance measurement module for measuring the resistance value of the wafer after being positioned by the positioning module; a judgment module for judging whether the resistance value is greater than a threshold value; a first defect detection module, wherein when the resistance value is less than the threshold value, the first defect detection module performs a first defect detection on the wafer; and a second defect detection module, wherein when the resistance value is greater than the threshold value, the second defect detection module performs a second defect detection on the wafer. A wafer inspection system as claimed in claim 1, wherein the first defect inspection module includes an infrared inspection unit for performing a first defect inspection on the wafer, and the second defect inspection module includes an X-ray inspection unit for performing a second defect inspection on the wafer. A wafer inspection system as claimed in claim 2, wherein the first defect inspection module further includes a first chamber, and the second defect inspection module further includes a second chamber, wherein the infrared inspection unit is disposed in the first chamber, and the X-ray inspection unit is disposed in the second chamber. As in claim 3, the wafer inspection system further includes a pre-processing area, and the positioning module and the resistance measurement module are arranged in the pre-processing area. A wafer inspection system as claimed in claim 4, wherein the transport module is located between the positioning module and the resistance measurement module. A wafer inspection system as claimed in claim 4, wherein the pre-processing area is adjacent to the first chamber and the second chamber. A wafer inspection system as claimed in claim 6, wherein the second chamber is adjacent to the first chamber. A wafer inspection system as claimed in claim 1, wherein the positioning module includes a wafer aligner. A wafer inspection system as claimed in claim 1, wherein the resistance measurement module includes an Eddy current sensor or a Four-Point Probes Resistance Meter. As in claim 1, the wafer inspection system, wherein the judgment module and the resistance measurement module transmit data via wired or wireless means.

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