TWM669265U - Camera - Google Patents

Abstract

A camera device includes a first circuit board, a second circuit board, a first heat conductor and a second heat conductor. The first circuit board has a first heat conductor and a photosensitive surface and a back surface opposite to each other, the photosensitive surface has a photosensitive element, and the first heat conductor contacts the photosensitive element. The second circuit board is spaced apart from the first circuit board, and has a second heat conductor and a first surface and a second surface opposite to each other, and the first surface faces the back surface of the first circuit board. The first heat conductor is located between the back surface of the first circuit board and the first surface of the second circuit board, and the first heat conductor contacts the first heat conductor and the second heat conductor. The second heat conductor is disposed on the second surface of the second circuit board, and the second heat conductor contacts the second heat conductor and a heat sink.

Description

Camera

This work is about an optical device, in particular a photographic device.

With the development of technology, camera devices are increasingly being used in personal electronics, automotive, and medical fields. For example, a personal computer can be equipped with a camera to support functions such as photography, web video, or facial recognition.

As people's requirements for the performance of photographic devices increase, in order to install enough electronic components in a limited space to meet the requirements, some photographic devices will adopt a design of stacking and fixing multiple layers of circuit boards. However, during the operation of the photographic device, the electronic components on each circuit board will generate heat. Therefore, the use of multiple layers of circuit boards is likely to lead to insufficient heat dissipation space, causing each circuit board to overheat and affect the clarity of the captured image.

In view of the above, in one embodiment, a camera device is provided, including a first circuit board, a second circuit board, a first thermal conductor, and a second thermal conductor. The first circuit board has a first thermal conductor and a photosensitive surface and a back surface opposite to each other, the photosensitive surface has a photosensitive element, the first thermal conductor is located between the photosensitive surface and the back surface, and the first thermal conductor contacts the photosensitive element. The second circuit board is spaced apart from the first circuit board, the second circuit board has a second thermal conductor and a first surface and a second surface opposite to each other, the first surface faces the back surface of the first circuit board, and the second thermal conductor is located between the first surface and the second surface. The first thermal conductor is located between the back surface of the first circuit board and the first surface of the second circuit board, and the first thermal conductor contacts the first thermal conductor and the second thermal conductor. The second thermal conductor is disposed on the second surface of the second circuit board, and the second thermal conductor contacts the second thermal conductor and a heat sink.

In summary, according to the camera device of the present invention, the heat generated by the operation of the photosensitive element of the first circuit board can be transferred to the heat sink in sequence through the first heat conductor, the first heat conductor, the second heat conductor and the second heat conductor to achieve a good heat dissipation effect, thereby avoiding overheating of each circuit board and the photosensitive element and maintaining the clarity of the image captured by the photosensitive element.

It should be noted that in the description of each embodiment, the so-called "first" and "second" are used to describe different elements, and these elements are not limited by such terms. In addition, for the convenience and clarity of the description, the thickness or size of each element in the drawings is exaggerated, omitted or roughly represented for the understanding and reading of people familiar with this technology, and the size of each element is not completely its actual size, and is not used to limit the limiting conditions for the implementation of this creation, so it has no technical substantive significance. Any structural modification, change in proportion or adjustment of size should still fall within the scope of the technical content disclosed by this creation without affecting the effect and purpose that can be achieved by this creation. The same reference numerals will be used to represent the same or similar elements in all drawings.

FIG. 1 is a perspective view of an embodiment of the creative camera device, FIG. 2 is an exploded perspective view of an embodiment of the creative camera device, and FIG. 3 is a cross-sectional view of an embodiment of the creative camera device. As shown in FIG. 1 to FIG. 3, the camera device 1 of the embodiment includes a housing 10, a lens 20, a first circuit board 30, a second circuit board 40, a first heat conductor 50, and a second heat conductor 60. In some embodiments, the camera device 1 can be applied to various electronic products to capture images around the electronic products. For example, the camera device 1 can be applied to automotive products (such as a driving recorder, a reversing display system, or a surround imaging system), mobile devices (such as a smart phone, a tablet computer, or a notebook computer), or electronic products such as cameras.

As shown in FIGS. 1 to 3 , in this embodiment, the housing 10 includes a first housing 101 and a second housing 102, and the first housing 101 and the second housing 102 are assembled with each other. For example, the first housing 101 and the second housing 102 can be assembled and fixed by adhesion, snapping or locking to form a hollow housing 10, but it is not limited to this. In other embodiments, the housing 10 can also be the housing of other electronic products (such as a laptop or a mobile phone). In addition, in this embodiment, one side of the housing 10 has a light-transmitting portion 103, for example, the light-transmitting portion 103 can be a transparent cover (as shown in FIG. 3 ) or a through hole, so that external light can pass through the light-transmitting portion 103 and enter the interior of the housing 10.

As shown in FIGS. 1 to 3 , the first circuit board 30 is disposed inside the housing 10. For example, the first circuit board 30 can be fixed inside the housing 10 by means of adhesion, snapping or locking. The first circuit board 30 has a photosensitive surface 31 and a back surface 32 opposite to each other. The photosensitive surface 31 faces the light-transmitting portion 103, and the back surface 32 faces away from the light-transmitting portion 103. A photosensitive element 33 is disposed on the photosensitive surface 31. In some embodiments, the photosensitive element 33 can be specifically a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a complementary metal-oxide semiconductor active pixel sensor (CMOS Active pixel sensor).

As shown in FIGS. 1 to 3 , the lens 20 is disposed inside the housing 10 and between the light-transmitting portion 103 and the photosensitive element 33, so that after external light enters through the light-transmitting portion 103, it can be transmitted to the photosensitive element 33 through the lens 20, so that the photosensitive element 33 can sense and obtain an image. In this embodiment, the lens 20 is assembled on a base 25, and the lens 20 is fixed to the photosensitive surface 31 of the first circuit board 30 through the base 25, so that the position of the photosensitive element 33 corresponds to the position of the lens 20, and the distance between the lens 20 and the photosensitive element 33 is maintained.

As shown in FIGS. 1 to 3 , the first circuit board 30 further has a first heat conductive member 36, which is located between the photosensitive surface 31 and the back surface 32, and the first heat conductive member 36 can directly or indirectly contact the photosensitive element 33, so that the heat generated by the photosensitive element 33 during operation can be transferred to the first heat conductive member 36. In this embodiment, the photosensitive element 33 and the first heat conductive member 36 are stacked in a direction perpendicular to the first circuit board 30.

In some embodiments, the first heat conductive member 36 may be made of a material with a high thermal conductivity coefficient to provide a good heat conduction effect, and the first heat conductive member 36 may be a single component or a plurality of components. For example, the first heat conductive member 36 may be a metal member (such as a sheet or block made of materials such as copper, iron, aluminum or steel), the first heat conductive member 36 may be located in the through hole of the first circuit board 30, and a partial area of the first heat conductive member 36 is exposed on the photosensitive surface 31 and the back surface 32 to contact the photosensitive element 33 on the photosensitive surface 31.

As shown in FIGS. 1 to 3 , the second circuit board 40 is disposed inside the housing 10 and is spaced apart from the first circuit board 30. For example, the second circuit board 40 can be fixed inside the housing 10 by adhesion, snapping or locking. In this embodiment, the first circuit board 30 is located between the second circuit board 40 and the lens 20. The second circuit board 40 has a first surface 41 and a second surface 42 opposite to each other. The first surface 41 faces the back surface 32 of the first circuit board 30, and the second surface 42 faces away from the first circuit board 30.

As shown in FIGS. 1 to 3 , the second circuit board 40 further has a second heat conductive member 46, which is located between the first surface 41 and the second surface 42, and the position of the second heat conductive member 46 corresponds to the position of the first heat conductive member 36 of the first circuit board 30. In some embodiments, the second heat conductive member 46 can also be made of a material with a high thermal conductivity coefficient to provide a good heat conduction effect, and the second heat conductive member 46 can be a single component or a plurality of components. For example, the second heat conductive member 46 can be a metal member (such as a block made of materials such as copper, iron, aluminum or steel), and the second heat conductive member 46 can be located in the through hole of the second circuit board 40, and a local area of the second heat conductive member 46 exposes the first surface 41 and the second surface 42.

As shown in FIGS. 1 to 3 , the first heat conductor 50 is located between the back surface 32 of the first circuit board 30 and the first surface 41 of the second circuit board 40, and the first heat conductor 50 contacts the first heat conductive member 36 and the second heat conductive member 46, so that the heat of the first heat conductive member 36 can be transferred to the second heat conductive member 46 via the first heat conductor 50. In some embodiments, the first heat conductor 50 can be made of a material with a high thermal conductivity coefficient to provide a good heat conduction effect, and the first heat conductor 50 can be a single component or a plurality of components. For example, the first heat conductor 50 can be a metal part (such as a sheet or block made of materials such as iron, aluminum or steel). Alternatively, the first thermal conductor 50 may be an elastic thermal conductor having properties such as high thermal conductivity and elasticity. For example, the first thermal conductor 50 may be made of an elastic material (such as silicone rubber) with a high thermal conductivity coefficient (such as a thermal conductivity coefficient greater than 1 W/mK). Thus, when the first circuit board 30 and the second circuit board 40 are slightly offset due to assembly tolerance or heat, each first thermal conductor 50 can continue to contact the first thermal conductive member 36 and the second thermal conductive member 46 based on the elastic property, thereby maintaining a good thermal conductivity effect.

As shown in FIGS. 1 to 3 , the second heat conductor 60 is disposed on the second surface 42 of the second circuit board 40, and the second heat conductor 60 contacts the second heat conductive member 46 and a heat sink 11. In the present embodiment, the heat sink 11 is a local area of the housing 10, but the present invention is not limited thereto. The heat sink 11 may also be a heat sink fin, a metal plate, or other heat dissipating structure. In other words, the heat sink 11 may not be a part of the housing 10. Thereby, the heat generated by the photosensitive element 33 during operation can be transferred to the heat sink 11 in sequence through the first heat conductive member 36 of the first circuit board 30, the first heat conductor 50, the second heat conductive member 46 of the second circuit board 40, and the second heat conductor 60, so that the multi-layer circuit board structure can also achieve a good heat dissipation effect, thereby preventing the first circuit board 30 and the second circuit board 40 from being overheated and deformed, and the photosensitive element 33 is not easy to overheat and affect the clarity of the captured image.

In some embodiments, the first circuit board 30 and the second circuit board 40 may be made of materials with good heat resistance and low thermal expansion coefficient to prevent deformation caused by heat. The second heat conductor 60 may also be made of materials with high thermal conductivity to provide good heat conduction effect, and the second heat conductor 60 may be a single component or a plurality of components. For example, the second heat conductor 60 may be a metal part (e.g., a sheet or block made of materials such as iron, aluminum or steel). Alternatively, the second thermal conductor 60 may be an elastic thermal conductor having properties such as high thermal conductivity and elasticity. For example, the second thermal conductor 60 may be made of an elastic material (such as silicone rubber) with a high thermal conductivity coefficient (such as a thermal conductivity coefficient greater than 1 W/mK). When the second circuit board 40 and the heat sink 11 are slightly offset due to assembly tolerance or heat, each second thermal conductor 60 can continue to contact the second thermal conductive element 46 and the heat sink 11 based on its elastic property, thereby maintaining a good thermal conductivity effect.

In addition, as shown in FIG. 3 , in the present embodiment, the first heat conductor 36 of the first circuit board 30, the first heat conductor 50, the second heat conductor 46 of the second circuit board 40, and the second heat conductor 60 are stacked one on another along a direction perpendicular to the first circuit board 30, so that the heat of the photosensitive element 33 can be quickly transferred to the heat sink 11 along the shortest path perpendicular to the first circuit board 30, thereby having a better heat dissipation effect.

As shown in FIG3, in this embodiment, the cross-sectional areas of the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 in the direction parallel to the first circuit board 30 may be the same. For example, as shown in FIG2 and FIG3, when the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 are all rectangular parallelepipeds, the length and width of the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 may be the same, and the heights of the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 may be the same or different, so as to avoid heat transfer in the direction parallel to the first circuit board 30 and affect the heat dissipation effect. Alternatively, when the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 are all cylinders, the diameters of the first heat conductor 36, the first heat conductor 50, the second heat conductor 46 and the second heat conductor 60 can be the same, which can also achieve the effect of preventing heat from being transferred in a direction parallel to the first circuit board 30 and affecting the heat dissipation.

FIG4 is a schematic diagram of a stack of the first circuit board and the second circuit board of an embodiment of the present creative photographic device, wherein the thickness and size of the first circuit board 30 and the second circuit board 40 in FIG4 are exaggerated for the purpose of clearly presenting the structure of each layer of the first circuit board 30 and the second circuit board 40, and are not their actual sizes. As shown in FIG4, in the present embodiment, the first circuit board 30 includes a plurality of first layers 301 stacked on each other, wherein the first layers 301 may be made of an insulating material. The first heat conductor 36 includes a plurality of first metal layers 361, wherein the plurality of first metal layers 361 are stacked respectively between the plurality of first layers 301, and the positions of the plurality of first metal layers 361 correspond to each other and are in indirect contact with each other. In addition, two first metal layers 361 among the multiple first metal layers 361 that are closest to the photosensitive surface 31 and the back surface 32 expose the photosensitive surface 31 and the back surface 32 respectively, and the two first metal layers 361 that are closest to the photosensitive surface 31 and the back surface 32 respectively contact the photosensitive element 33 and the first thermal conductor 50, so that the heat generated when the photosensitive element 33 is in operation can be transferred to the first thermal conductor 50 through the multiple first metal layers 361.

As shown in FIG. 4 , the second circuit board 40 may also include a plurality of second layers 401 stacked one on another, wherein the second layers 401 may be made of an insulating material, and the second heat conducting member 46 includes a plurality of second metal layers 461, wherein the plurality of second metal layers 461 are stacked one on another between the plurality of second layers 401, and the positions of the plurality of second metal layers 461 correspond to each other and are in indirect contact with each other. The two second metal layers 461 closest to the first surface 41 and the second surface 42 in the metal layer 461 expose the first surface 41 and the second surface 42 respectively, and the two second metal layers 461 closest to the first surface 41 and the second surface 42 contact the first thermal conductor 50 and the second thermal conductor 60 respectively, so that the heat of the first thermal conductor 50 can be transferred to the second thermal conductor 60 through multiple second metal layers 461.

As shown in FIG4 , in this embodiment, first metal sheets 35 are stacked between the first layers 301 of the first circuit board 30, wherein the first metal sheets 35 are used to provide a channel for transmitting electric signals between the electronic components and for the power supply in the first circuit board 30, and the first metal sheets 35 have good heat dissipation capabilities. Second metal sheets 45 are stacked between the second layers 401 of the second circuit board 40, wherein the second metal sheets 45 are used to provide a channel for transmitting electric signals between the electronic components and for the power supply in the second circuit board 40, and the second metal sheets 45 have good heat dissipation capabilities.

In some embodiments, each of the first metal layers 361 may be a local area of each first metal sheet 35. For example, during the manufacturing process, a local area of each first metal sheet 35 may be removed to form a circuit and each of the first metal layers 361. Similarly, each of the second metal layers 461 may be a local area of each second metal sheet 45. For example, during the manufacturing process, a local area of each second metal sheet 45 may be removed to form a circuit and each of the second metal layers 461. In other words, the first metal layer 361 and the second metal layer 461 are local areas of the first metal sheet 35 and the second metal sheet 45 originally used to form the circuit, so that the imaging device 1 does not need to add additional heat dissipation components and the manufacturing cost is greatly reduced.

FIG5 is an exploded perspective view of another embodiment of the creative photography device. As shown in FIG5, the difference between this embodiment and the embodiment of FIG2 is at least that, in addition to the photosensitive element 33, the photosensitive surface 31 of the first circuit board 30 of this embodiment has one or more heating elements 34 (two heating elements 34 in this case) on the photosensitive surface 31 of the first circuit board 30. For example, each heating element 34 can be an electronic element such as a microprocessor, a memory, a resistor or a capacitor. The first circuit board 30 has first sub-heat conductive members 37. The positions and number of the first sub-heat conductive members 37 correspond to the positions and number of the heating elements 34. The first sub-heat conductive members 37 are located between the photosensitive surface 31 and the back surface 32 of the first circuit board 30. Each first sub-heat conductive member 37 contacts each heating element 34 so that the heat generated by each heating element 34 during operation can be transferred to each first sub-heat conductive member 37. In some embodiments, the structure and material of the first sub-heat conductive member 37 may be the same or similar to the first heat conductive member 36 described above, and will not be repeated here.

As shown in FIG. 5 , in this embodiment, the camera device 1 includes a first sub-heat conductor 55 and a second sub-heat conductor 65, and the second circuit board 40 has a second sub-heat conductor 47, and the second sub-heat conductor 47 is located between the first surface 41 and the second surface 42 of the second circuit board 40, wherein the number of the first sub-heat conductor 55, the number of the second sub-heat conductor 47, and the number of the second sub-heat conductor 65 can respectively correspond to the number of the heating element 34. The number of heat generating elements 34 is two (here, the number of heat generating elements 34 is two), each first sub-heat conductor 55 is located between the back side 32 of the first circuit board 30 and the first surface 41 of the second circuit board 40, and each first sub-heat conductor 55 contacts each first sub-heat conductive element 37 of the first circuit board 30 and each second sub-heat conductive element 47 of the second circuit board 40, and each second sub-heat conductor 65 contacts each second sub-heat conductive element 47 and the above-mentioned heat sink 11. Thus, through the design of concentrated heat transfer in the vertical direction, the heat generated by each heating element 34 during operation can be transferred to the heat sink 11 in sequence through each first sub-heat conductive element 37 of the first circuit board 30, each first sub-heat conductor 55, each second sub-heat conductive element 47 of the second circuit board 40, and each second sub-heat conductor 65, so as to avoid overheating and deformation of the first circuit board 30 and the second circuit board 40, and each heating element 34 is not easy to overheat and affect the performance.

In some embodiments, the structure and material of the first sub-thermal conductor 55 may be the same as or similar to the first thermal conductor 50, the structure and material of the second sub-thermal conductor 47 of the second circuit board 40 may be the same as or similar to the second thermal conductor 46, and the structure and material of the second sub-thermal conductor 65 may be the same as or similar to the second thermal conductor 60, so as to provide a good thermal conductivity effect, which will not be repeated here.

As shown in FIG5 , in this embodiment, the first heat conductive member 36 of the first circuit board 30 and each first heat conductive sub-member 37 can be connected by a first heat conductive connector 365, so that heat can be transferred between the first heat conductive member 36 and each first heat conductive sub-member 37 to jointly dissipate heat from the photosensitive element 33 and the two heat generating members 34 to improve the heat dissipation efficiency, wherein the first heat conductive connector 365 can be located between the photosensitive surface 31 and the back surface 32 and made of a material with a high thermal conductivity coefficient. The second heat conductive member 46 of the second circuit board 40 and each second heat conductive sub-member 47 can be connected by a second heat conductive connector 465, so that heat can be transferred between the second heat conductive member 46 and each second heat conductive sub-member 47, wherein the second heat conductive connector 465 can be located between the first surface 41 and the second surface 42 and made of a material with a high thermal conductivity coefficient.

Preferably, the circuits formed by the first sub-heat-conducting members 37 and the first heat-conducting connectors 365 of the first circuit board 30 and the first metal sheets 35 can be staggered to avoid affecting the original circuit configuration. The circuits formed by the second sub-heat-conducting members 47 and the second heat-conducting connectors 465 and the second metal sheets 45 of the second circuit board 40 can also be staggered to avoid affecting the original circuit configuration.

As shown in FIG5 , in this embodiment, the first heat conductor 50 and each first heat sub conductor 55 may also be connected via a first heat conductive connector 51, wherein the first heat conductor 50, each first heat conductive connector 51 and each first heat sub conductor 55 are an integrally formed structure, so that heat can be transferred between the first heat conductor 50 and each first heat sub conductor 55. The second heat conductor 60 and each second heat sub conductor 65 may also be connected via a second heat conductive connector 61, wherein the second heat conductor 60, each second heat conductive connector 61 and each second heat sub conductor 65 are an integrally formed structure, so that heat can be transferred between the second heat conductor 60 and each second heat sub conductor 65. In addition, each first thermally conductive connector 51 contacts each first thermally conductive connector 365 of the first circuit board 30 and each second thermally conductive connector 465 of the second circuit board 40, and each second thermally conductive connector 61 contacts each second thermally conductive connector 465 of the second circuit board 40 and the above-mentioned heat sink 11, so as to further improve the heat dissipation efficiency of the photosensitive element 33 and the two heating elements 34.

As mentioned above, through the arrangement of the above-mentioned first heat-conducting connectors 365, the first heat-conducting connectors 51, the second heat-conducting connectors 465 and the second heat-conducting connectors 61, the present invention enables the heat energy generated by the photosensitive element 33 and the heating elements 34 during operation to be transmitted in a direction perpendicular to the first circuit board 30 as well as in a direction parallel to the first circuit board 30, so that the heat energy can be transmitted to the heat sink 11 more quickly to improve the heat dissipation efficiency.

Although the technical content of this creation has been disclosed as above in the form of a preferred embodiment, it is not intended to limit this creation. Any slight changes and modifications made by anyone familiar with this art without departing from the spirit of this creation should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be based on the scope defined in the attached patent application.

1: Camera device 10: Housing 101: First housing 102: Second housing 103: Translucent part 11: Heat sink 20: Lens 25: Base 30: First circuit board 301: First layer 31: Photosensitive surface 32: Back surface 33: Photosensitive element 34: Heat generating element 35: First metal sheet 36: First heat conducting element 361: First metal layer 365: First heat conducting connector 37: First sub-heat conducting element 40: Second circuit board 401: Second layer 41: First surface 42: Second surface 45: Second metal sheet 46: Second heat conducting element 461: Second metal layer 465: second heat-conducting connector 47: second sub-heat-conducting connector 50: first heat conductor 51: first heat-conducting connector 55: first sub-heat conductor 60: second heat conductor 61: second heat-conducting connector 65: second sub-heat conductor

FIG. 1 is a three-dimensional diagram of an embodiment of the creative photographic device. FIG. 2 is a three-dimensional diagram of an exploded view of an embodiment of the creative photographic device. FIG. 3 is a cross-sectional view of an embodiment of the creative photographic device. FIG. 4 is a schematic diagram of the stacking of the first circuit board and the second circuit board of an embodiment of the creative photographic device. FIG. 5 is a three-dimensional diagram of another embodiment of the creative photographic device.

1: Camera device

10: Shell

101: First shell

102: Second shell

103: light-transmitting part

11: Heat sink

20: Lens

25: Base

30: First circuit board

31: Photosensitive surface

32: Back

33: Photosensitive element

36: First heat conducting element

40: Second circuit board

41: First surface

42: Second surface

46: Second heat conducting element

50: First thermal conductor

60: Second thermal conductor

Claims (10)

A camera device includes: a first circuit board having a first heat conductor and a photosensitive surface and a back surface opposite to each other, the photosensitive surface having a photosensitive element, the first heat conductor being located between the photosensitive surface and the back surface, and the first heat conductor being in contact with the photosensitive element; a second circuit board, the second circuit board being spaced apart from the first circuit board, the second circuit board having a second heat conductor and a first surface and a second surface opposite to each other, the first surface facing the back surface of the first circuit board, the second heat conductor being located between the first surface and the second surface; a first heat conductor being located between the back surface of the first circuit board and the first surface of the second circuit board, and the first heat conductor being in contact with the first heat conductor of the first circuit board and the second heat conductor of the second circuit board; and A second heat conductor is disposed on the second surface of the second circuit board, and the second heat conductor contacts the second heat conducting member and a heat sink. An imaging device as described in claim 1, wherein at least one of the first thermal conductor and the second thermal conductor is a flexible thermal conductor. The imaging device as described in claim 1, wherein the first circuit board includes a plurality of first layer boards which are stacked on top of each other, and the first heat conductive element includes a plurality of first metal layers which are stacked between the first layer boards, and the positions of the first metal layers correspond to each other. The imaging device as described in claim 1, wherein the second circuit board includes a plurality of second layer boards which are stacked on top of each other, and the second heat conductive element includes a plurality of second metal layers which are stacked between the second layer boards, and the positions of the second metal layers correspond to each other. The imaging device as described in claim 1, wherein the photosensitive surface of the first circuit board has a heat generating element, the first circuit board has a first sub-thermal conductive element, the first sub-thermal conductive element is located between the photosensitive surface and the back surface, and the first sub-thermal conductive element contacts the heat generating element. An imaging device as described in claim 5, wherein the first thermal conductor and the first sub-thermal conductor are connected via a first thermally conductive connector. The imaging device as described in claim 6 further includes a first sub-thermal conductor, which is located between the back surface of the first circuit board and the first surface of the second circuit board, and the first sub-thermal conductor is in contact with the first sub-thermal conductive element. An imaging device as described in claim 7, wherein the first thermal conductor and the first sub-thermal conductor are connected via a first thermally conductive connector. An imaging device as described in claim 8, wherein the first thermally conductive connector contacts the first thermally conductive connector. The imaging device as described in claim 7 further includes a second sub-thermal conductor, the second circuit board has a second sub-thermal conductor, the second sub-thermal conductor is located between the first surface and the second surface, the first sub-thermal conductor contacts the first sub-thermal conductor and the second sub-thermal conductor, and the second sub-thermal conductor contacts the second sub-thermal conductor and the heat sink.

Images