TWM668871U - Mainboard module - Google Patents

Abstract

A mainboard module is adapted to be placed on a plane and is adapted to insert a display card with a bracket. The mainboard module includes a back board, a mainboard and multiple foot bases. The back board includes a first surface, a second surface, a first opening and multiple second openings. The mainboard is disposed on the first surface and includes a processor socket. The processor socket is corresponding to the first opening. The multiple foot bases are movably disposed on the back board and are adapted to pass through the second openings which are corresponding to. When the display card is inserted in the mainboard and the multiple foot bases are in an expanding status, the second surface and the plane have a first distance, and the bracket and the plane have a second distance. The first distance is greater than the second distance.

Description

Motherboard Module

The present invention relates to a motherboard module, and in particular to a motherboard module which can improve user convenience and avoid interference between a display card and a setting plane.

When a graphics card is inserted into a motherboard module currently on the market, the motherboard module cannot be directly placed on a flat surface because the bracket of the graphics card will interfere with the flat surface. In addition, if the user uses an additional adhesive bracket to allow the motherboard module to be placed on a flat surface, when the user wants to place the motherboard module in a chassis, the user must remove the adhesive bracket before the motherboard module can be placed in the chassis, causing inconvenience in use. Therefore, how to allow the user to conveniently place the motherboard module in a chassis or on a flat surface without the graphics card interfering with the flat surface when it is placed on a flat surface is a problem that this field is committed to exploring.

The present invention provides a motherboard module, which can improve the convenience of users and avoid the interference between the display card and the plane on which it is installed.

The motherboard module of the present case is suitable for being placed on a plane and suitable for inserting a display card, and the display card has a bracket. The motherboard module includes a backplane, a motherboard and a plurality of pins. The backplane includes a first surface and a second surface opposite to each other and has a first opening and a plurality of second openings. The motherboard is arranged on the first surface and includes a processor socket, and the processor socket corresponds to the first opening. These pins can be movably arranged on the backplane and are suitable for passing through the corresponding second openings. When the display card is inserted into the motherboard and when these pins are in an unfolded state, the second surface has a first distance from the plane, and the bracket has a second distance from the plane, and the first distance is greater than the second distance.

Based on the above, the motherboard module of the present invention includes a plurality of feet disposed on the back plate, and these feet can be conveniently switched from a storage state to an unfolded state, so that the motherboard module can be disposed on a plane. Accordingly, the motherboard module of the present invention can improve the convenience of the user. In addition, when these feet are in the unfolded state, the first distance between the second surface of the back plate and the plane is greater than the second distance between the bracket of the display card inserted into the motherboard module and the plane, so that the display card can be prevented from interfering with the plane on which it is disposed.

FIG. 1 is a schematic diagram of a motherboard module according to an embodiment of the present invention. FIG. 2 is a side view of the motherboard module of FIG. 1 arranged on a plane. FIG. 3A is a schematic diagram of the motherboard module of FIG. 1 from another viewing angle. Referring to FIG. 1 to FIG. 3A , the motherboard module 100 of the present invention is suitable for being placed on a plane 20 and suitable for inserting a display card 10. The display card 10 has a bracket 11. The motherboard module 100 includes a back plate 110, a motherboard 120 and a plurality of pins 130. In the present embodiment, the motherboard module 100 can enhance the heat dissipation effect of the motherboard 120 by means of the back plate 110. The structure of the motherboard module 100 is described in detail below.

FIG. 3B shows the footrest of FIG. 3A moving to the storage state. FIG. 4 is an exploded view of the motherboard module of FIG. 3B. FIG. 5 is a cross-sectional view of the backplane and footrest of FIG. 3B along the Z-Z line. Please refer to FIG. 3A to FIG. 5. In detail, the backplane 110 includes a first surface 111 and a second surface 112 opposite to each other and has a first opening 113 and a plurality of second openings 114 (FIG. 4). The motherboard 120 is disposed on the first surface 111 as shown in FIG. 2 and includes a processor socket 121. The processor socket 121 corresponds to the first opening 113 as shown in FIG. 3A and FIG. 3B and is suitable for arranging a processor (not shown). These footrests 130 can be movably disposed on the backplane 110 and are suitable for passing through the corresponding second openings 114 as shown in FIG. 5.

FIG. 6A and FIG. 6B are side views of the back plate and the feet of FIG. 3A and FIG. 3B, respectively. Referring to FIG. 6A and FIG. 6B, when the feet 130 are in the stored state as shown in FIG. 6B, the feet 130 do not protrude from the second surface 112, so that the motherboard module 100 is suitable for installation in a chassis (not shown) or a packaging box (not shown). When the display card 10 is inserted into the motherboard 120, and when the feet 130 are in the unfolded state as shown in FIG. 3A, the second surface 112 has a first distance D1 with the plane 20, and the bracket 11 has a second distance D2 with the plane 20. The first distance D1 is greater than the second distance D2.

It is worth mentioning that the feet 130 of the present embodiment can be conveniently switched between the storage state and the unfolded state, so that the motherboard module 100 can be set in the chassis or on the plane 20. Accordingly, the motherboard module 100 of the present embodiment can enhance the convenience of the user. In addition, when the feet 130 are in the unfolded state, the first distance D1 between the second surface 112 of the back plate 110 and the plane 20 is greater than the second distance D2 between the bracket 11 of the display card 10 inserted into the motherboard module 100 and the plane 20, so that the display card 10 can be prevented from interfering with the plane 20.

In this embodiment, when the feet 130 are in the stored state as shown in FIG. 6B , the overall height H1 of the back plate 110 and the feet 130 is less than 6.35 mm, so that the motherboard module 100 is suitable for being installed in the chassis as described above. When the feet 130 are in the unfolded state as shown in FIG. 6A , the overall height H2 of the back plate 110 and the feet 130 is greater than 10.36 mm, so that the first distance D1 between the second surface 112 of the back plate 110 and the plane 20 is greater than the second distance D2 between the bracket 11 of the graphics card 10 and the plane 20 as described above, so that the bracket 11 of the graphics card 10 and the plane 20 can be prevented from interfering.

The structure of the base 130 of this embodiment is described in detail below.

FIG. 7A is a partial enlarged view of region A of the motherboard module of FIG. 3A . FIG. 7B is a partial enlarged view of region B of the motherboard module of FIG. 3B . Referring to FIG. 7A and FIG. 7B , each of the footrests 130 includes a fixing portion 131 and a supporting portion 132. The fixing portion 131 is fixed to the back plate 110 and does not protrude from the second surface 112 as shown in FIG. 5 . The supporting portion 132 is rotatably disposed on the fixing portion 131. The fixing portion 131 has a receiving space 1311. When these footrests 130 are in the storage state as shown in FIG. 7B , the supporting portion 132 is located in the receiving space 1311 and does not protrude from the second surface 112, so that the motherboard module 100 is suitable for being disposed in a chassis as described above. When the feet 130 are in the unfolded state as shown in FIG. 7A , part of the supporting portion 132 protrudes from the accommodating space 1311 and the second surface 112 , so that when the motherboard module 100 is set on the plane 20 , the first distance D1 between the second surface 112 of the back plate 110 and the plane 20 is greater than the second distance D2 between the bracket 11 of the graphics card 10 and the plane 20 as described above, so as to avoid interference between the bracket 11 of the graphics card 10 and the plane 20 .

In this embodiment, the material of the fixing portion 131 and the supporting portion 132 is plastic, but the present invention is not limited thereto.

Please refer to FIG. 3A , the motherboard module 100 of the present embodiment further includes a heat sink 140, and the back plate 110 includes a first recess 115, the first recess 115 is recessed in the second surface 112 and surrounds a portion of the first opening 113 as shown in FIG. 3A , a portion of the heat sink 140 is located in the first recess 115 and the heat sink 140 is connected to the processor socket 121, which can enhance the heat dissipation effect of the processor, and can further ensure that when the motherboard module 100 is in the storage state as shown in FIG. 6B , the overall height H1 of the back plate 110 and the feet 130 will not increase, thereby allowing the motherboard module 100 to be set in a chassis.

Referring to FIG. 4 , the back plate 110 of the present embodiment further has a plurality of second recesses 116, which are recessed in the second surface 112 and respectively surround the corresponding second openings 114. The motherboard module 100 of the present embodiment can further ensure that the overall height H1 of the back plate 110 and the legs 130 does not increase when the motherboard module 100 is in the storage state shown in FIG. 6B by providing the second recesses 116, thereby enabling the motherboard module 100 to be placed in a chassis.

Referring to FIG. 4 , the motherboard module 100 of the present embodiment further includes a plurality of fasteners 150, which are respectively inserted into the fixing portions 131 of the corresponding feet 130 and fixed to the back plate 110. The fasteners 150 do not protrude from the second surface 112, and can further ensure that when the motherboard module 100 is in the storage state shown in FIG. 6B , the overall height H1 of the back plate 110 and the feet 130 will not increase, thereby allowing the motherboard module 100 to be placed in a chassis.

FIG8A is a schematic diagram of a foot of a motherboard module according to another embodiment of the present invention. FIG8B shows the foot of FIG8A being moved to a storage state. Referring to FIG8A and FIG8B , the difference between the foot 130a of the present embodiment and the foot 130 of the above-mentioned embodiment is that the fixing portion 131a and the supporting portion 132a of the foot 130a of the present embodiment are made of metal, so that the motherboard module 100 can have a better structural strength. In addition, the fixing portion 131a of the foot 130a of this embodiment is connected to the first surface 111 of the back plate 110, which can ensure that when the motherboard module 100 is in the storage state shown in FIG. 6B, the overall height H1 of the back plate 110 and the foot 130 will not increase, thereby allowing the motherboard module 100 to be placed in the chassis.

In summary, the motherboard module of the present invention includes a plurality of feet disposed on the back plate, and these feet can be conveniently switched from a storage state to an unfolded state, so that the motherboard module can be disposed on a plane. Accordingly, the motherboard module of the present invention can enhance the convenience of the user. In addition, when these feet are in the unfolded state, the first distance between the second surface of the back plate and the plane is greater than the second distance between the bracket of the display card inserted into the motherboard module and the plane, so that the display card can be prevented from interfering with the disposed plane.

10: Graphics card 11: Bracket 20: Plane 100: Motherboard module 110: Backplane 111: First side 112: Second side 113: First opening 114: Second opening 115: First recess 116: Second recess 120: Motherboard 121: Processor socket 130, 130a: Footrest 131, 131a: Fixing part 1311: Accommodating space 132, 132a: Support part 140: Heat sink 150: Fastener D1: First distance D2: Second distance H1, H2: Height

FIG. 1 is a schematic diagram of a motherboard module according to an embodiment of the present invention. FIG. 2 is a side view of the motherboard module of FIG. 1 arranged on a plane. FIG. 3A is a schematic diagram of the motherboard module of FIG. 1 at another viewing angle. FIG. 3B shows the footrest of FIG. 3A moving to a storage state. FIG. 4 is an exploded view of the motherboard module of FIG. 3B. FIG. 5 is a cross-sectional view of the back plate and footrest of FIG. 3B along the Z-Z line. FIG. 6A and FIG. 6B are side views of the back plate and footrest of FIG. 3A and FIG. 3B, respectively. FIG. 7A is a partial enlarged view of region A of the motherboard module of FIG. 3A. FIG. 7B is a partial enlarged view of region B of the motherboard module of FIG. 3B. FIG. 8A is a schematic diagram of the footrest of the motherboard module according to another embodiment of the present invention. Figure 8B shows the footrest of Figure 8A moving to the retracted state.

10: Graphics card

11: Bracket

100: Motherboard module

110: Back panel

112: Second side

113: First opening

115: First concave portion

116: Second concave portion

120: Motherboard

121: Processor socket

130: Footrest

131:Fixed part

1311: Accommodation space

132: Support part

140: Heat sink

150: Fasteners

Claims (10)

A motherboard module is suitable for being placed on a plane and for inserting a display card, the display card having a bracket, and the motherboard module comprises: a backplane, comprising a first surface and a second surface opposite to each other and having a first opening and a plurality of second openings; a motherboard, arranged on the first surface and comprising a processor socket, the processor socket corresponding to the first opening; and a plurality of feet, movably arranged on the backplane and suitable for passing through the corresponding second openings, wherein when the display card is inserted into the motherboard and when the feet are in an unfolded state, the second surface has a first distance from the plane, the bracket has a second distance from the plane, and the first distance is greater than the second distance. As described in claim 1, each of the feet includes a fixing portion and a supporting portion, the fixing portion is fixed to the back plate and does not protrude from the second surface, and the supporting portion is rotatably disposed on the fixing portion. A motherboard module as described in claim 2, wherein the fixing portion has a receiving space, and when the pins are in a stored state, the supporting portion is in the receiving space and does not protrude from the second surface, and when the pins are in the expanded state, part of the supporting portion protrudes from the receiving space and the second surface. A motherboard module as described in claim 2, wherein the fixing portion and the supporting portion are made of metal. In the motherboard module as described in claim 2, the fixing portion and the supporting portion are made of plastic. A motherboard module as described in claim 2, wherein when the pins are in a retracted state, a height between the back panel and the pins is less than 6.35 mm. A motherboard module as described in claim 2, wherein when the pins are in the expanded state, the height of the back panel and the pins is greater than 10.36 mm. The motherboard module as described in claim 1 further includes a heat sink, wherein the back plate includes a first recessed portion, the first recessed portion is recessed in the second surface and surrounds a portion of the first opening, a portion of the heat sink is located in the first recess and the heat sink is connected to the processor socket. The motherboard module as described in claim 1, wherein the back plate further has a plurality of second recesses, the second recesses are recessed in the second surface and respectively surround the corresponding second openings. The motherboard module as described in claim 9 further includes a plurality of fasteners, wherein the fasteners are respectively inserted into the corresponding sockets and fixed to the back plate, and the fasteners do not protrude from the second surface.

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