TWM666264U - Light source heat dissipation structure and light source device - Google Patents

Abstract

A light source heat dissipation structure includes a light-emitting element and a carrying plate. The carrying plate has a carrying surface, and the light-emitting element is disposed on the carrying surface; the material of the carrying plate is at least a high thermal conductivity material, and its thermal conductivity is 380 W/mK or above 380 W/mK. The high thermal conductivity material forms a first area on the carrying surface, and the light-emitting element is disposed in contact with the first area. A light source device including the aforementioned light source heat dissipation structure.

Description

Light source heat dissipation structure and light source device thereof

This invention relates to a heat dissipation structure, in particular a heat dissipation structure suitable for a light source device.

With the advancement of technology, medical fields are no longer limited to specific places. In other words, the demand for portable and mobile equipment in the medical and rescue fields is increasing. However, due to their special conditions, some equipment is difficult to develop towards miniaturization or lightweight. For example, high lumen output light sources or light boxes often need to be equipped with large heat sinks, thus hindering the development of light sources or light boxes towards miniaturization and lightweight; however, the sufficient lighting provided by the high lumen output light source/light box is required for medical and emergency rescue. Therefore, how to meet the heat dissipation performance and achieve the miniaturization/lightweight of the equipment is a problem to be overcome.

This invention provides a light source heat dissipation structure with good heat dissipation performance, high heat dissipation efficiency, and reliable light output.

This invention also provides a light source device with good heat dissipation performance and high heat dissipation efficiency, which can provide reliable light output.

To achieve one or part or all of the above purposes or other purposes, an embodiment of the present invention provides a light source heat dissipation structure, including a light-emitting element and a carrier plate. The carrier plate has a carrier surface, and the light-emitting element is arranged on the carrier surface; wherein the material of the carrier plate is at least a high thermal conductivity material, and its thermal conductivity is above 380W/mK. The high thermal conductivity material constitutes a first area on the carrier surface, and the light-emitting element is arranged in contact with the first area.

In one embodiment of the present invention, the above-mentioned high thermal conductivity material is copper.

This invention also provides a light source device in an embodiment, including the above-mentioned light source heat dissipation structure, a heat sink and a box. The heat sink is connected to the light source heat dissipation structure, and the box has a light outlet; wherein the light source heat dissipation structure and the heat sink are arranged in the box, and the light generated by the light-emitting element is suitable for being emitted through the light outlet.

This invention uses a carrier plate made of high thermal conductivity material, and the light-emitting element is placed on the carrier plate, so the heat dissipation performance and efficiency are excellent, so that the temperature range of the light-emitting element can be well controlled and help provide reliable light output. The use of high thermal conductivity materials is also conducive to achieving good heat dissipation effects with a smaller volume, which can further realize the miniaturization and lightweight of the light source device.

In order to make the above and other purposes, features and advantages of this creation more clearly understood, the following is a detailed description of the implementation examples and the attached drawings.

1: Light source device

11: Cylindrical structure

10. 10a: Light source heat dissipation structure

100, 100a: light-emitting element

110: Pin pair

110a, 110b: pins

120: Pin pair

200, 200a: Carrier plate

201: Loading surface

2011: First Region

2012: Second Region

220:Through hole

240: Jack pair

242: Insulation layer

260: Notch

310: First electrode pair

310a: Positive pole

310b: Negative pole 311, 312: Soldering point

320: Second electrode pair

400: Thermistor

500: Circuit board

510: Insulation layer

520: Circuit layer

60: Connectors

600: Plate body

620:Piercing

640: Groove

650: Ring-shaped seat

660: Accommodation space

680: Notch

70: Heat sink

701: Platform Department

80: Cabinet

81~86: Panels

810: light exit hole

830: Light outlet

90: Fan

C: Control panel

Figure 1 is a three-dimensional schematic diagram of the light source heat dissipation structure of the first embodiment of this invention.

FIG2 is a three-dimensional exploded schematic diagram of the light source heat dissipation structure of the embodiment of FIG1.

Figure 3 is a three-dimensional exploded schematic diagram of the embodiment of Figure 1 from another angle.

Figure 4 is a top view schematic diagram of the carrier plate of the first embodiment of this invention.

Figure 5 is a schematic cross-sectional view of the embodiment of Figure 4 along line AA.

Figure 6 is a three-dimensional exploded schematic diagram of the light source heat dissipation structure of the second embodiment of this invention.

FIG7 is a three-dimensional exploded schematic diagram of the embodiment of FIG6 from another angle.

Figure 8 is a top view schematic diagram of the carrier plate of the second embodiment of this invention.

Figure 9 is a schematic cross-sectional view of the embodiment of Figure 8 along line BB.

Figure 10 is a three-dimensional schematic diagram of the light source device of this creative embodiment.

Figure 11 is a schematic diagram of the decomposition of the embodiment of Figure 10.

Figure 12 is a partial schematic diagram of the embodiment of Figure 11.

Figure 13 is a partial schematic diagram of the embodiment of Figure 12.

Figure 14 is a schematic diagram of the decomposition of the embodiment of Figure 13.

FIG15 is a schematic diagram of the embodiment of FIG13 from another angle.

Figure 16 is a partial schematic diagram of a light source device of another embodiment of the present invention.

The light source heat dissipation structure of the present invention, as shown in the embodiments of FIGS. 1 to 3 , includes a light-emitting element 100 and a carrier plate 200. The carrier plate 200 has a carrier surface 201, and the light-emitting element 100 is disposed on the carrier surface 201. The material of the carrier plate 200 is at least a high thermal conductivity material, and the light-emitting element 100 may further contact an area of the high thermal conductivity material disposed on the carrier plate 200. In a preferred embodiment of the present invention, the high thermal conductivity material is preferably copper or other materials having a thermal conductivity of, for example, 380 W/mK or more, and the light-emitting element 100 is generally a high heat source, so the contact arrangement of the light-emitting element 100 on the carrier plate 200 facilitates rapid conduction of heat and subsequent dissipation. In the present invention, the light-emitting element 100 may be, for example, a light-emitting diode, a laser diode, and preferably a white light laser diode. The light-emitting element 100 may be, for example, a TO-CAN package or other types, such as a ceramic package.

The high thermal conductivity material of the carrier plate 200 can further form a first region 2011 on the carrier surface 201, and the light-emitting element 100 is disposed in contact with the first region 2011. In a preferred embodiment of the present invention, the first region 2011 is located in the middle of the carrier surface 201. An electrode pair, i.e., a positive electrode and a negative electrode, is preferably disposed on the carrier surface 201, which is electrically connected to the light-emitting element 100. As shown in FIGS. 2-3, the electrode pair includes a first electrode pair 310, and the light-emitting element 100 can have a pin pair 110. The pin pair 110 is preferably located at the bottom of the light-emitting element 100, wherein the side close to the carrier plate 200 is the bottom. The first electrode pair 310 is electrically connected to the light-emitting element 100, for example, the positive electrode 310a is welded to the pin 110a, and the negative electrode 310b is welded to the pin 110b. Secondly, it can be electrically connected to an external circuit. The external circuit can be a circuit covering, for example, a power system or a control unit. Therefore, the light-emitting element 100 can be driven to emit light through the first electrode pair 310.

FIG4 and FIG5 show a schematic top view of the carrier plate 200 and a schematic cross-sectional view along AA, respectively. As shown in FIG4-5, the light source heat dissipation structure 10 further includes a circuit board 500, wherein the circuit board 500 can be disposed on the carrier surface 201. In addition to the first area 2011, the carrier surface 201 can further include a second area 2012 surrounding the first area 2011, and the circuit board 500 can be further disposed in the second area 2012. There is an insulating arrangement between the circuit board 500 and the high thermal conductivity material of the carrier plate 200. Preferably, the circuit board 500 includes an insulating layer 510 and a circuit layer 520.

As shown in FIG. 5 , the insulating layer 510 can be further disposed at the bottom of the circuit board 500, the portion in contact with the carrier board 200, and the surface portion of the circuit board 500, and the circuit layer 520 can be located in the inner layer of the circuit board 500. In other words, the insulating layer 510 and the circuit layer 520 can be arranged overlappingly, and the insulating layer 510 and the circuit layer 520 are not limited to one layer. The circuit board 500 can also be electrically connected to the aforementioned external circuit. In the preferred embodiment of the present invention, the aforementioned first electrode pair 310 can also be further arranged on the circuit board 500 and connected to the circuit layer 520. As shown in FIG. 5 , for example, the light-emitting element 100 can be electrically connected to the first electrode pair 310 by, for example, welding the pin pair 110 to the solder joint 311 on the inner side of the first electrode pair 310, and then fixed to the carrier board 200. The solder joint 312 on the outer side of the first electrode pair 310 can be used, for example, to be welded to an external circuit. Therefore, the light-emitting element 100 can be electrically connected to, for example, a power system or a control unit through the circuit board 500.

The light source heat dissipation structure 10 may further include other components, and in a preferred embodiment of the present invention, the light source heat dissipation structure 10 also includes a thermistor 400, which can be used to detect the temperature and temperature change of the light-emitting element 100. In some embodiments of the present invention, the thermistor 400 may be, for example, a thermistor, whose resistance value may change with the change of temperature and be fed back to the power system or control unit, thereby affecting the work of the light-emitting element 100. For example, the thermistor 400 may prevent the light-emitting element 100 from approaching the temperature threshold and better maintain the light-emitting element 100 in an appropriate temperature range, thereby having a reliable brightness output. The thermistor 400 may be further electrically connected to the electrode pair on the carrier surface 201. As shown in FIG. 2 and FIG. 4 , the electrode pair may include a second electrode pair 320 electrically connected to the thermistor 400, such as the positive electrode and the negative electrode are respectively welded to the pin pair (not shown) of the thermistor 400. In addition, the thermistor 400 may also be fixed to the carrier plate 200 by welding.

Figures 6 to 9 are schematic diagrams of a light source heat dissipation structure 10a of another embodiment of the present invention. As shown in Figures 6 to 9, the light source heat dissipation structure 10a includes a light-emitting element 100a and a carrier plate 200a. The difference from the aforementioned embodiment is that the light-emitting element 100a has a pin pair 120 at the bottom, and the fixing seat 200a has a socket pair 240 corresponding to the pin pair 120. As shown in Figures 8 to 9, the socket pair 240 passes through the carrier plate 200a and opens at the first area 2011 and the opposite side of the carrier surface 201, and the pin pair 120 passes through the socket pair 240 and can protrude from the opposite side of the carrier surface 201.

In this embodiment, the light-emitting element 100a can be electrically connected to, for example, a power system or a control unit through the pin pair 120. For example, the pin pair 120 can be electrically connected to an external circuit through wire welding, and the light-emitting element 100a can be further fixed to the carrier board 200a. In addition, an insulating layer 242 is provided in each socket pair 240 to separate the pin pair 120 from the hole wall of the socket pair 240, wherein the hole wall of the socket pair 240 may include an area of a material with a high thermal conductivity coefficient. The light-emitting element 100a may be, for example, a white light laser diode packaged in a TO-CAN package.

As shown in Figures 1-4, 6-8, the light source heat dissipation structure 10 (10a) of the present invention can also form a through hole 220 on the carrier plate 200 (200a). The through hole 220 passes through the carrier plate 200 (200a) and opens on the carrier surface 201 and the opposite side of the carrier surface 201, and is suitable for the wire to pass through. For example, when the electrode pair such as the first electrode pair 310 and/or the second electrode pair 320 is welded to the wire of the external circuit, the wire can pass through the through hole 220 and be received therein, but it is not limited to this. The light source heat dissipation structure 10 (10a) of the present invention can also form a notch 260 on the edge of the carrier plate 200 (200a). The notch 260 can also be used for the wire to pass through and be received therein.

The invention also provides a light source device with better heat dissipation and reliable brightness output. FIG. 10 is a three-dimensional schematic diagram of the light source device of the embodiment of the invention, and FIG. 11 is its exploded diagram. As shown in FIGS. 10-11, the light source device 1 includes the aforementioned light source heat dissipation structure 10, a heat sink 70, and a box 80. The heat sink 70 is formed of a material with good thermal conductivity, and preferably has a groove type, a fin structure, or other structural designs that are conducive to increasing the heat dissipation area. The heat sink 70 is connected to the light source heat dissipation structure 10, and both are arranged in the box 80.

As shown in FIG. 11 , the housing 80 of the light source device 1 may be composed of several parts such as upper and lower plates 81, 82, front and rear plates 83, 84, and left and right plates 85, 86, wherein the front plate 83 may further have a light outlet 830 for light emission. The light source heat dissipation structure 10 has a side with the light-emitting element 100 facing the light outlet 830. In a preferred embodiment of the invention, the light source device 1 further includes a cylindrical structure 11. The cylindrical structure 11 can be used for the light-emitting element 100 to be set therein, and is fitted with the front plate 83 and extends out of the housing 80 from the light outlet 830. The cylindrical structure 11 may further be provided with optical elements such as lenses, reflectors, prisms, etc. or combinations thereof, and may be used to enhance or change the light output of the light-emitting element 100, for example, to adjust the angle of light output. On the other hand, as shown in FIG10 , since the cylindrical structure 11 protrudes from the housing 80 , it is suitable as a connection structure between the light source device 1 and other devices in some embodiments of the present invention. For example, when the light source device 1 is used in a medical field, such as to provide an endoscope light source, the cylindrical structure 11 may be used to connect to the base of the endoscope.

The light source device 1 may further include a fan 90 and a control panel C, and both are disposed in the housing 80. The fan 90 is preferably disposed adjacent to the heat sink 70, and the number is not limited to one. In some embodiments of the present invention, the heat sink 70 may be approximately in the shape of a long column, and the fan 90 may be arranged roughly along the column height direction of the heat sink 70. In a preferred embodiment of the present invention, a plurality of fans 90 are disposed on opposite sides of the heat sink 70, such as the left side and the right side, and the fans 90 are arranged along the column height direction on each side. The housing 80 may have openings at locations corresponding to the fan 90, such as the left plate 85 and the right plate 86, for air convection and heat dissipation. The fan 90 may be fixed to the plates 85, 86 and/or the heat sink 70 by, for example, screwing, but is not limited thereto.

The control panel C may be equivalent to the aforementioned control unit, or may perform all or part of the functions of the aforementioned control unit. The aforementioned power system may be, for example, a direct current power supply, an alternating current power supply, an alternating current power supply, or a combination thereof. In the present inventive embodiment, the control panel C in the housing 80 may preferably be disposed near the upper or lower plate 81, 82, the left or right plate 85, 86, and may be electrically connected to the light-emitting element 100, the thermistor 400, and the power system. By being electrically connected to the light-emitting element 100, the control panel C may control the light-emitting element 100 to emit light, for example, by transmitting power and control signals to make the light-emitting element 100 emit light, and may enable the light-emitting element 100 to have different light brightness and variable light frequency. For example, the control board C can reduce the supply of current to reduce the luminous brightness, or increase the supply of current to increase the luminous brightness; it can control the supply of power to be continuous or non-continuous, so that the light-emitting element 100 can emit light continuously or intermittently. By being electrically connected to the thermistor 400, the control board C can receive temperature-related signals and respond. For example, after receiving feedback from the thermistor 400, the control board C can reduce or limit the supply of current, such as current, to avoid continuous temperature rise of the light-emitting element 100, and/or maintain the light-emitting element 100 in an appropriate temperature range for reliable light output.

In a preferred embodiment of the present invention, the material of the heat sink 70 is at least a material with a high thermal conductivity coefficient, and is preferably copper, and the light source heat sink structure 10 is disposed in contact with the heat sink 70. In addition, the control board C can also be further provided for the control board C to be disposed thereon. FIG12 is a partial schematic diagram of the light source device. As shown in FIGS. 11-12, the heat sink 70 can further have a platform portion 701, which is suitable for the control board C to be disposed thereon, and can help dissipate heat from the control board C. FIG13 is a partial schematic diagram of FIG12, and FIG14 is an exploded schematic diagram of FIG13. As shown in FIGS. 12-14, the light source device 1 preferably further includes a connector 60 disposed between the light source heat sink structure 10 and the heat sink 70. The connecting member 60 is in contact with the heat sink 70 and the light source heat sink structure 10, so the heat energy of the light source heat sink structure 10 can be effectively transferred to the heat sink 70 and the light-emitting element 100 can be maintained in an appropriate temperature range.

As shown in FIG. 14 , the connector 60 includes a plate 600 and an annular seat 650, and the annular seat 650 is disposed on the plate 600, wherein a receiving space 660 is formed between the inner side of the annular seat 650 and the plate 600. The light source heat dissipation structure 10 is further disposed on the annular seat 650 in contact, and the supporting plate 200 can cover the receiving space 660. In a preferred embodiment of the present invention, the projection of the first area 2011 of the supporting surface 201 on the connector 60 is preferably covered in the receiving space 660. The receiving space 660 can be used, for example, to receive wires, for example, to receive external circuit wires connected to the electrode pair.

As shown in FIGS. 14-15 , the plate body 600 of the connector 60 is further formed with at least one through hole 620 and a groove 640. The through hole 620 passes through the plate body 600 and can be opened in the accommodating space 660, and is suitable for the wire to pass through. For example, the external circuit wire connected to the electrode pair can pass through the through hole 620 and then be connected to the control board C. The through hole 620 can be connected to the groove 640, but is not limited to this. The groove 640 is located on the opposite side of the plate body 600 where the annular seat 650 is provided, preferably in an elongated shape and extending to the edge of the plate body 600, and is suitable for accommodating the wire, thereby preventing the wire from protruding on the plate body 600 and affecting the flatness between the plate body 600 and the heat sink 70. The connector 60 may also form a notch 680 at the edge of the plate 600. The notch 680 may be connected to the groove 640, but is not limited thereto. The notch 680 allows the wire to pass through and be stored therein. In some embodiments of the present invention, for example, the wire from the electrode pair may pass through the notch 260 at the edge of the carrier plate 200 and the notch 680 at the edge of the plate 600, and then be connected to the control board C.

FIG. 16 is a partial schematic diagram of another light source device of the present invention. The difference from the aforementioned embodiment is that the light source device 1 of FIG. 16 has a light source heat dissipation structure 10a. As described above, the light emitting element 100a of the light source heat dissipation structure 10a has a pin pair 120, and the pin pair 120 can protrude from the opposite side of the bearing surface 201 through the socket pair 240 and is used to be electrically connected to the external circuit. In this embodiment, the wire connecting the pin pair 120 can pass through the accommodating space 660 and the through hole 620, and then be connected to the control board C.

In summary, the light source heat dissipation structure 10 (10a) of the present invention has the characteristics of material and structure. The material has the characteristic of ultra-high thermal conductivity, so the light source heat dissipation structure 10 (10a) has good heat dissipation performance and high heat dissipation efficiency. In terms of structure, there is direct and effective contact between the light-emitting element 100 (100a) of the high heat source and the ultra-high thermal conductivity material, including the contact arrangement between the light-emitting element 100 (100a) and the carrier plate 200 (200a), the contact arrangement between the connector 60 and the carrier plate 200 (200a) and the heat sink 70, and the flatness between the connector 60 and the heat sink 70. In addition, the materials of the carrier plate 200 (200a), the connector 60 and the heat sink 70 are at least materials with ultra-high thermal conductivity, which is more helpful to improve the heat dissipation efficiency of the light source heat dissipation structure 10 (10a). Due to the good heat dissipation performance and heat dissipation efficiency of the light source heat dissipation structure 10 (10a), the temperature range of the light-emitting element 100 (100a) can be well controlled, thereby providing reliable light output. In addition, due to its good heat dissipation, it can achieve the same or better heat dissipation effect with a smaller volume, which is conducive to the miniaturization and lightweighting of light source devices.

Although this creation has been disclosed as above by way of embodiments, it is not intended to limit this creation. People with ordinary knowledge in the technical field to which this creation belongs can make some changes and embellishments without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the patent application attached hereto.

10: Light source heat dissipation structure

100: Light-emitting element

200: Carrier board

220:Through hole

260: Notch

400: Thermistor

Claims (17)

A light source heat dissipation structure includes: a light-emitting element; and a carrier plate; the carrier plate has a carrier surface, and the light-emitting element is arranged on the carrier surface; wherein the material of the carrier plate is at least a high thermal conductivity material, and its thermal conductivity is above 380W/mK, and the high thermal conductivity material forms a first area on the carrier surface, and the light-emitting element is arranged in contact with the first area. The light source heat dissipation structure as described in claim 1, wherein the high thermal conductivity material is copper. The light source heat dissipation structure as described in claim 1 further includes a first electrode pair disposed on the supporting surface, and the first electrode pair is electrically connected to the light-emitting element. The light source heat dissipation structure as described in claim 3, wherein the light-emitting element further comprises a pin pair; the light-emitting element is fixed to the carrier plate by welding the pin pair, and is further electrically connected to the first electrode pair through the pin pair. The light source heat dissipation structure as described in claim 3 further includes a circuit board disposed on the carrier surface; wherein the circuit board includes an insulating layer and a circuit layer stacked together, and the first electrode pair is further disposed on the circuit board and connected to the circuit layer. The light source heat dissipation structure as described in claim 5, wherein the carrier surface further includes a second area, and the first area is located in the middle of the carrier surface and the second area surrounds the first area; wherein the circuit board is further disposed in the second area. The light source heat dissipation structure as described in claim 1 further includes a thermal element and a second electrode pair disposed on the supporting surface, and the thermal element is electrically connected to the second electrode pair. The light source heat dissipation structure as described in claim 1, wherein the carrier plate is further formed with a pair of holes, and the pair of holes passes through the carrier plate and opens at the first area and the opposite side of the carrier surface; the light-emitting element further includes a pair of pins, and the pair of pins passes through the pair of holes and protrudes from the opposite side of the carrier surface. The light source heat dissipation structure as described in claim 8, wherein an insulating layer is provided in the center of each pair of sockets, and each pin is separated from the hole wall of each pair of sockets by the insulating layer. The light source heat dissipation structure as described in claim 1, wherein the carrier plate is further formed with at least one through hole, and the at least one through hole passes through the carrier plate and opens at the carrier surface and the opposite side of the carrier surface; wherein the through hole is suitable for a wire to pass through. A light source heat dissipation structure as described in claim 1, wherein the light-emitting element is further a laser diode. A light source device, comprising: a light source heat dissipation structure as described in any one of claim items 1 to 11; a heat sink connected to the light source heat dissipation structure; and a box having a light exit hole; wherein the light source heat dissipation structure and the heat sink are arranged in the box, and the light generated by the light-emitting element is suitable for being emitted through the light exit hole. The light source device as described in claim 12 further includes a connecting member disposed between the light source heat dissipation structure and the heat dissipation member. A light source device as described in claim 13, wherein the connecting member comprises a plate and an annular base, and the annular base is disposed on the plate; wherein a receiving space is formed between the inner side of the annular base and the plate. As described in claim 14, the light source heat dissipation structure is further disposed in contact with the annular base, and the supporting plate covers the accommodating space. A light source device as described in claim 14, wherein the plate further has at least one through hole and a groove; the at least one through hole passes through the plate and opens into the receiving space, and the groove is located on the plate on the opposite side of the annular seat; wherein the at least one through hole and the groove are suitable for a wire to pass through. The light source device as described in claim 12 further includes a control board electrically connected to the light source heat dissipation structure, and the control board is suitable for controlling the light emission of the light-emitting element.

Images