TWM665607U - Two-phase immersion cooling system - Google Patents

Abstract

A two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises a cooling tank, a first condensation unit, a second condensation unit, and a piping unit. The cooling tank is used to contain a first fluid, and the electronic devices are accessible and immersed in the first fluid. The first condensation unit is disposed in the cooling tank and is located above the first fluid in a liquid state. The second condensation unit is configured to be independent of the cooling tank. The first condensation unit and the second condensation unit successively condense the first fluid evaporated into a gaseous state, so that the first fluid is converted from a gaseous state into a liquid state and mixed with the first fluid in a liquid state in the cooling tank to reduce its temperature, thereby improving the cooling efficiency of the entire device.

Description

Two-phase immersion cooling system

The invention relates to a cooling system, in particular to a two-phase immersion cooling system.

Two-phase immersion cooling technology is a heat dissipation technology that has gradually gained attention in recent years. It is mainly used in high-performance electronic equipment, data centers or server systems. This cooling method is based on the phase change process of liquid coolant. When the heat generated by the electronic equipment is transferred to the liquid coolant, the liquid coolant absorbs the heat and undergoes a phase change (liquid to gas). In this process, the heat can be effectively removed.

Although two-phase immersion cooling technology has significant advantages in heat dissipation efficiency compared to traditional air cooling using fans and single-phase liquid cooling, it also faces some technical challenges and difficulties, such as high cost of coolant, gas-liquid phase change management, closed system design, and difficulty in equipment maintenance. Among them, the key to gas-liquid phase change management is how to properly manage the condensation and circulation of gaseous coolant after the coolant absorbs heat and evaporates, otherwise it may lead to a decrease in cooling efficiency. The key to closed system design is how to prevent the coolant from evaporating into the air, which not only increases maintenance costs but also may cause environmental pollution. The key to the difficulty of equipment maintenance lies in how to drain the coolant first and then remove the electronic equipment when the electronic equipment to be cooled fails or needs maintenance, so as to avoid losses caused by evaporation of the coolant.

Therefore, the object of the present invention is to provide a two-phase immersion cooling system that can improve cooling efficiency.

Therefore, the novel two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises a cooling tank, a first condensing unit, a second condensing unit, and a piping unit. The cooling tank is used to accommodate a first fluid, and the electronic devices are accessible and arranged in the cooling tank and immersed in the first fluid. The cooling tank comprises at least one gas outlet and a liquid return port. The first condensing unit is arranged in the cooling tank and is located above the first fluid in liquid state. The second condensing unit is configured to be independent of the cooling tank, and has at least one gas inlet and a liquid outlet. The piping unit comprises at least one gas delivery pipe and at least one liquid return pipe. The at least one gas delivery pipe connects the gas flow outlet of the cooling tank and the gas flow inlet of the second condensing unit. The at least one gas delivery pipe is used to deliver the first fluid in the gas state in the cooling tank to the second condensing unit. The at least one liquid return pipe connects the liquid flow outlet of the second condensing unit and the liquid return port of the cooling tank. The at least one liquid return pipe is used to deliver the first fluid converted into liquid in the second condensing unit back to the cooling tank.

Another object of the present invention is to provide a two-phase immersion cooling system capable of cooling more electronic devices.

Therefore, the novel two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises a plurality of cooling tanks, a plurality of first condensing units, a plurality of second condensing units, a plurality of piping units, and a plurality of liquid distribution pipes. The cooling tanks are used to contain a first fluid. The electronic devices are grouped together and are respectively and accessibly disposed in the cooling tanks and immersed in the first fluid. Each cooling tank comprises at least one gas flow outlet and a liquid return port. The first condensing units are respectively disposed in the cooling tanks. Each first condensing unit is located above the first fluid in liquid state. The second condensing units are configured to be independent of the cooling tanks and interconnected, and each second condensing unit has at least one gas flow inlet and a liquid flow outlet. The pipeline units correspond to the cooling tanks and the first condensing units and the second condensing units, respectively. Each pipeline unit includes at least one gas delivery pipe and a liquid return pipe. The at least one gas delivery pipe connects the gas flow outlet of the corresponding cooling tank and the gas flow inlet of the second condensing unit, and the at least one gas delivery pipe is used to deliver the first fluid in the corresponding cooling tank in the gas state to the second condensing unit. The liquid return pipe connects the liquid flow outlet of the corresponding second condensing unit and the liquid return port of the cooling tank, and the liquid return pipe is used to deliver the first fluid converted into liquid in the corresponding second condensing unit back to the cooling tank. The liquid distribution pipes are respectively connected to two adjacent cooling tanks to allow the first fluids in the cooling tanks to circulate with each other.

Yet another object of the present invention is to provide another two-phase immersion cooling system capable of cooling more electronic devices.

Therefore, the novel two-phase immersion cooling system includes two cooling tanks, two first condensing units, two second condensing units, a piping unit, and a liquid distribution pipe. Each cooling tank is used to accommodate a plurality of electronic devices and a first fluid. The electronic devices are accessible and arranged in the cooling tank and immersed in the first fluid. The cooling tank includes two gas outlets and a liquid return port. The first condensing units are respectively arranged in the cooling tanks and are located above the first fluid in liquid state. The second condensing units are configured to be independent of the cooling tanks. Each second condensing unit has two gas inlets and a liquid outlet. The piping unit includes four gas delivery pipes and two liquid return pipes. Two of the gas delivery pipes are respectively connected to the gas flow outlets of one of the cooling tanks and the gas flow inlets of each of the second condensing units, and the other two of the gas delivery pipes are respectively connected to the gas flow outlets of another cooling tank and the other gas flow inlets of each of the second condensing units. The gas delivery pipes are used to transport the first fluid in the gas state in the cooling tanks to the second condensing units. One end of the liquid return pipes is respectively connected to the liquid flow outlets of the second condensing units, and the other ends of the liquid return pipes are interconnected and respectively connected to the liquid return ports of the cooling tanks. The liquid return pipes are used to transport the first fluid converted into liquid in the second condensing units back to the cooling tanks. The liquid distribution pipe is connected to the cooling tanks to allow the first fluid in the cooling tanks to circulate with each other.

The effect of the present invention is that: the first condensing unit can initially condense a part of the first fluid that evaporates into gas in the cooling tank, so that the first fluid is converted from gas to liquid and drips downward, so that the first fluid in liquid state in the cooling tank is cooled; in addition, another part of the first fluid that evaporates into gas is transported to the second condensing unit through the gas transport pipe for condensation, so that the first fluid is converted from gas to liquid and drips downward and is transported back to the cooling tank through the liquid return pipe, where it mixes with the first fluid in liquid state in the cooling tank to reduce its temperature, thereby improving the cooling efficiency of the entire device.

Before the present invention is described in detail, it should be noted that similar components are represented by the same reference numerals in the following description.

1 to 3 , a first embodiment of the novel two-phase immersion cooling system is suitable for cooling a plurality of electronic devices 10 (see FIG. 4 ), and includes a cooling tank 2, a first condensing unit 3, a second condensing unit 4, a piping unit 5, and a liquid storage tank 6.

The electronic devices 10 may be servers or other heat-generating devices that need to be cooled.

The cooling tank 2 is used to contain a first fluid F1. The electronic devices 10 are accessible and disposed in the cooling tank 2 and immersed in the first fluid F1. The cooling tank 2 includes a frame 21, four side plates 22 sealed around the frame 21, four side cooling channels 23 respectively recessed on the outer surfaces of the side plates 22, four side cover plates 24 respectively welded and sealed to the side cooling channels 23, two gas outlets 25 arranged at the rear side of the frame 21, a liquid return port 26 arranged at the rear side of the side plate 22, an input and output port 28 arranged at the front side of the frame 21, an observation window 29 arranged at the left side of the frame 21, and a plurality of through holes 20 arranged at the right side of the frame 21. The side cooling channels 23 are used for a second fluid (not shown) to flow.

The first fluid F1 is a non-conductive cooling liquid, such as a fluorinated liquid, but not limited thereto. The second fluid can be a mixture of water and a condensing agent or other cooling liquids.

4 , the frame 21 has a first condensation space 27 above the first liquid fluid F1 . The gas outlets 25 are connected to the first condensation space 27 .

Referring to FIG. 3 and FIG. 4 , the first condensation unit 3 is disposed on the cooling tank 2 and is located above the first fluid F1 in liquid form. The first condensation unit 3 includes a top plate 31 disposed on the top of the frame 21, a plurality of fin condensation modules 32 disposed on the lower surface of the top plate 31, an upper cooling channel 33 recessed on the upper surface of the top plate 31 and used for the second fluid to flow, and an upper cover plate 34 welded and sealed to the upper cooling channel 33.

The input/output port 28 has a plurality of power interfaces 281 and a plurality of signal connection interfaces 282. The power interfaces 281 are used for connecting a plurality of power cables (not shown) and for providing power to the electronic devices 10. The signal connection interfaces 282 may be HDMI interfaces, VGA interfaces or USB-A interfaces for connecting corresponding signal cables and for signal connection to the electronic devices 10.

The observation window 29 allows the user to observe the internal conditions of the cooling tank 2 from the outside.

The through holes 20 are used to pass through power lines connected to a plurality of sensors (not shown) disposed in the frame 21. The sensors may be temperature sensors, liquid level sensors, and pressure sensors, but are not limited thereto.

Referring to FIG. 4 and FIG. 5 , the fin condensation modules 32 are located in the first condensation space 27 and above the first fluid F1 in liquid state. Each fin condensation module 32 has a bracket 37, a plurality of fins 38 installed at intervals on the bracket 37, and a plurality of indium sheets 39. The bracket 37 is L-shaped and has a fixing plate 371 disposed on the lower surface of the top plate 31, a mounting plate 372 extending downward from the fixing plate 371 and for mounting the fins 38, and a plurality of arc-shaped converging protrusions 373 formed at the bottom of the mounting plate 372. Each fin 38 has a connecting piece 381 mounted on the mounting plate 372, a condensing piece 382 connected to the connecting piece 381, a plurality of arc-shaped converging protrusions 383 formed at the bottom of the condensing piece 382, and a plurality of gas flow holes 384 disposed on the condensing piece 382. One of the indium sheets 39 is disposed between the top plate 31 and the fixing plate 371 of the bracket 37, and the remaining indium sheets 39 are disposed between the connecting piece 381 of the fin 38 and the mounting plate 372 of the bracket 37.

Referring to FIG. 5 and FIG. 6 , the fins 38 of each fin condensation module 32 are arranged on both sides of the mounting plate 372 and arranged in a staggered manner. The fins 38 adjacent to each other on the left and right sides of the fin condensation modules 32 are also arranged in a staggered manner. Through such an arrangement, the fins 38 can maximize the use of the area of the bottom of the top plate 31, improve the condensation efficiency, and keep the gaseous first fluid F1 in the first condensation space 27 as much as possible.

It is worth noting that the indium sheets 39 have good ductility and can fill the gap between the top plate 31 and the fixing plate 371 of the bracket 37, as well as the gap between the connecting sheet 381 of the fins 38 and the mounting plate 372 of the bracket 37, which helps to improve the thermal conductivity of the fin condensation module 32.

4 and 7 , the second condensing unit 4 is configured to be independent of the cooling tank 2, and includes a main box body 41 defining a second condensing space 411, a main condensing pipe 42 located in the second condensing space 411, two gas inlets 43 (see FIG. 4 ) disposed at the front side of the main box body 41 and connected to the second condensing space 411, a liquid outlet 44 (see FIG. 7 ) disposed at the bottom of the main box body 41 and connected to the second condensing space 411, and a volume expansion device 45 disposed at the top of the main box body 41 and connected to the second condensing space 411.

The main condenser 42 is used for a third fluid (not shown) to flow. The liquid outlet 44 is located below the main condenser 42. The volume expansion device 45 has a fixing frame 451 mounted on the main box 41, and a telescopic bag 452 connected to the second condensation space 411. One end of the telescopic bag 452 is fixedly mounted on the fixing frame 451, and the other end of the telescopic bag 452 can move relative to the fixing frame 451, so that the telescopic bag 452 can be extended to accommodate more of the first fluid F1 in a gaseous state.

The third fluid may be a mixture of water and a condensate or other cooling liquid.

1 , 4 and 7 , the pipeline unit 5 includes two gas delivery pipes 51 , a liquid return pipe 52 , a liquid extraction pipe 531 , a liquid return pipe 532 , an extraction connecting pipe 533 , a return connecting pipe 534 , two gas isolation valves 54 , a liquid isolation valve 55 , two fans 56 , an extraction pump 57 , and a return pump 58 .

4 , the gas delivery pipes 51 are respectively connected to the gas outlets 25 of the cooling tank 2 and the gas inlet 43 of the second condensing unit 4. The gas delivery pipes 51 are used to deliver the gaseous first fluid F1 in the first condensing space 27 to the second condensing space 411 of the second condensing unit 4.

It is worth noting that the number of the gas outlets 25 of the cooling tank 2, the number of the gas inlet 43 of the second condensing unit 4, and the number of the gas delivery pipe 51 of the pipeline unit 5 can be only one. A single gas delivery pipe 51 can also deliver the gaseous first fluid F1 in the first condensing space 27 to the second condensing space 411, so it is not limited to this embodiment.

4 and 7 , the liquid return pipe 52 connects the liquid outflow port 44 of the second condensing unit 4 and the liquid return port 26 (see FIG. 3 ) of the cooling tank 2 . The liquid return pipe 52 is used to transport the first fluid F1 converted into liquid in the second condensing unit 4 back to the cooling tank 2 .

Referring to FIG. 1 and FIG. 3 , one end of the liquid extraction pipe 531 is mounted on the bottom of the frame 21 of the cooling tank 2. One end of the liquid return pipe 532 is mounted on the bottom of the frame 21 of the cooling tank 2. One end of the extraction connecting pipe 533 is detachably connected to the liquid extraction pipe 531, and the other end of the extraction connecting pipe 533 is fixedly connected to the liquid storage barrel 6. One end of the return connecting pipe 534 is detachably connected to the liquid return pipe 532, and the other end of the return connecting pipe 534 is fixedly connected to the liquid storage barrel 6.

1 and 4 , the gas isolation valves 54 are respectively installed on the gas delivery pipes 51 and can be operated to block the gas communication between the first condensation space 27 and the second condensation space 411. The liquid isolation valve 55 is installed on the liquid return pipe 52 and can be operated to block the first fluid F1 converted into liquid in the second condensation unit 4 from flowing back into the cooling tank 2.

The fans 56 are respectively installed in the gas delivery pipes 51 and are used to help the first fluid F1 in the gaseous state in the first condensation space 27 to be blown to the second condensation space 411 .

The extraction pump 57 is installed on the extraction connecting pipe 533 and is used to pump the first fluid F1 in liquid form in the cooling tank 2 to the liquid storage tank 6.

The return pump 58 is installed on the return connecting pipe 534 and is used to pump the first fluid F1 in liquid form in the liquid storage tank 6 to the cooling tank 2 .

It should be particularly noted that the liquid storage barrel 6 is not normally connected to the cooling tank 2. Instead, when the electronic devices 10 need to be repaired or removed from the cooling tank 2 due to other circumstances, the liquid storage barrel 6 is connected to the cooling tank 2, and the first fluid F1 in the cooling tank 2 is extracted and temporarily stored in the liquid storage barrel 6. After the electronic devices 10 are placed back into the cooling tank 2, the first fluid F1 in the liquid storage barrel 6 is transported back to the cooling tank 2. The specific operation process will be described in detail in the following description.

In the cooling tank 2, the first fluid F1 in liquid state can absorb the heat energy generated by the electronic devices 10 and then be converted into the first fluid F1 in gas state. The first fluid F1 in gas state flows upward to the first condensation space 27, and a portion of the first fluid F1 in gas state is converted into the first fluid F1 in liquid state under the condensation effect of the fin condensation modules 32 and drips downward, and mixes with the first fluid F1 in liquid state that immerses the electronic devices 10, so as to reduce the temperature of the first fluid F1 in liquid state in the cooling tank 2. Another portion of the first fluid F1 in gas state in the first condensation space 27 enters the gas delivery pipes 51 through the gas outlets 25, and is blown by the fans 56 and enters the second condensation space 411 through the gas inlet 43. The gaseous first fluid F1 entering the second condensation space 411 is converted into the liquid first fluid F1 by the condensation action of the main condensation tube 42 and drips downward, and enters the liquid return pipe 52 through the liquid outflow port 44, and then enters the cooling tank 2 through the liquid return port 26, and mixes with the liquid first fluid F1 immersing the electronic devices 10 to reduce the temperature of the liquid first fluid F1 in the cooling tank 2. The two-phase immersion cooling system can improve the cooling efficiency of the entire device through the two-stage condensation action of the fin condensation modules 32 and the main condensation tube 42.

Through the convergence protrusions 373 of the bracket 37 of each fin condensation module 32 and the convergence protrusions 383 of each fin 38, the first fluid F1 will be concentrated on the convergence protrusions 373, 383 when the condensation sheet portions 382 of the fins 38 and the mounting plate 372 of the bracket 37 are converted from gas to liquid, which helps the liquid first fluid F1 to drip downward to mix with the liquid first fluid F1 that immerses the electronic devices 10. The fins 38 of each fin condensation module 32 can effectively transfer heat energy to the bracket 37 through the indium sheets 39, and the bracket 37 can effectively transfer heat energy to the top plate 31 through one of the indium sheets 39. The second fluid in the upper cooling channel 33 absorbs the heat energy of the top plate 31 and takes the heat away through the flow of the second fluid, thereby reducing the temperature of the fin condensation modules 32 and helping to improve the condensation efficiency of the fin condensation modules 32 for the first fluid F1.

By having the second fluid flow in the side cooling channels 23 on the side plates 22, the second fluid can absorb and carry away the heat energy transferred from the first fluid F1 in the cooling tank 2 to the side plates 22, and also help to lower the temperature of the liquid first fluid F1 in the cooling tank 2, so as to enhance the cooling effect of the liquid first fluid F1 on the electronic devices 10.

The second condensation space 411 is connected via the expansion bag 452 of the volume expansion device 45. When the gaseous first fluid F1 continuously enters the second condensation space 411, the gaseous first fluid F1 will also enter the expansion bag 452, causing the expansion bag 452 to expand. Therefore, the volume expansion device 45 can increase the amount of gas entering the second condensation space 411 and reduce the gas pressure in the second condensation space 411.

Before taking the electronic devices 10 out of the cooling tank 2, the gas isolation valves 54 and the liquid isolation valves 55 must be closed to block the gas connection between the first condensation space 27 and the second condensation space 411, and to block the liquid connection between the second condensation space 411 and the cooling tank 2. At this time, the main body 41 of the second condensation unit 4 contains part of the first fluid F1 in gaseous state and part of the first fluid F1 in liquid state. Then, the extraction connecting pipe 533 and the return connecting pipe 534 connected to the liquid storage tank 6 are connected to the liquid extraction pipe 531 and the liquid return pipe 532 respectively, and the extraction pump 57 is started to pump the liquid first fluid F1 in the cooling tank 2 to the liquid storage tank 6. When the first fluid F1 in the liquid state in the cooling tank 2 has been completely drained and stored in the liquid storage barrel 6, the top plate 31 can be opened to take out the electronic devices 10 for inspection and maintenance.

Next, the electronic devices 10 are placed back into the cooling tank 2 and covered with the top plate 31, and then the return pump 58 is started to pump the liquid first fluid F1 in the liquid storage barrel 6 back to the cooling tank 2, and finally the gas isolation valves 54 and the liquid isolation valves 55 are opened.

Thus, when the electronic devices 10 are to be repaired or replaced with new ones, the above-mentioned operation method can prevent the liquid first fluid F1 from being exposed to the air and evaporating, thereby reducing the loss of the first fluid F1 and lowering the maintenance cost.

It should be particularly noted that in other embodiments, the fin condensation modules 32, the top plate 31, the upper cooling channel 33, and the upper cover plate 34 of the first condensation unit 3 can be interchangeably arranged with the main condensation pipe 42 of the second condensation unit 4. Specifically, the top plate 31 can be arranged at the top end of the main box body 41, the upper cooling channel 33 is also recessed and formed on the upper surface of the top plate 31, the upper cover plate 34 is welded and sealed to the upper cooling channel 33, and the fin condensation modules 32 are arranged on the lower surface of the top plate 31 and are located in the second condensation space 411. The main condensing pipe 42 is disposed in the first condensing space 27 of the cooling tank 2, and the volume expansion device 45 can be selectively disposed on the side of the main box 41 or on the top of the cooling tank 2 to connect to the first condensing space 27.

Referring to FIG8 , a second embodiment of the novel two-phase immersion cooling system is similar to the first embodiment, except that the structure of the first condensing unit 3 in the second embodiment is different. In the second embodiment, the first condensing unit 3 has a cover plate 35 covering the top of the frame 21 (see FIG3 ) of the cooling tank 2, three top plates 31 sealingly covering the cover plate 35, three upper cooling connecting pipes 36 formed on the top of the top plate 31 and for the second fluid to flow, and a plurality of fin condensing modules 32 respectively installed on the bottom of the top plate 31. The fin condensing modules 32 are the same as the fin condensing modules 32 of the first embodiment, and will not be described in detail for the sake of brevity.

In this way, the second fluid in the upper cooling connecting pipes 36 can also absorb the heat energy of the top plates 31 and take away the heat energy through the flow of the second fluid, thereby reducing the temperature of the fin condensation modules 32 and achieving the same effect as the first embodiment.

Referring to FIG. 9 , a third embodiment of the novel two-phase immersion cooling system is similar to the first embodiment, except that in the third embodiment, the two-phase immersion cooling system further includes two third condensing units 7, and the pipeline unit 5 includes three liquid return pipes 52. The third condensing units 7 are respectively installed on both sides of the second condensing unit 4 and are interconnected. Each third condensing unit 7 includes a sub-tank 71 connected to the main tank 41 of the second condensing unit 4, a sub-condensing pipe (not shown) disposed in the sub-tank 71, and a liquid outflow outlet (not shown) formed at the bottom of the sub-tank 71. The sub-tank 71 defines a third condensing space (not shown) that is connected to the second condensing space 411 (see FIG. 7 ). One of the liquid return pipes 52 is connected to the liquid outflow port 44 (see FIG. 7 ) of the second condensing unit 4 and the liquid return port 26 (see FIG. 3 ) of the cooling tank 2, as in the first embodiment. The other two of the liquid return pipes 52 are connected to the liquid outflow ports of the third condensing units 7 and the aforementioned liquid return pipe 52 connected to the second condensing unit 4, respectively.

When the gaseous first fluid F1 in the first condensation space 27 enters the second condensation space 411, it is diverted to the third condensation space of the third condensation units 7 and converted into the liquid first fluid F1 through the condensation action of the auxiliary condensation pipes. The first fluid F1 converted into the liquid in the second condensation unit 4 and the third condensation units 7 is collected in the middle liquid return pipe 52 and transported back to the cooling tank 2.

Thus, by installing the third condensing units 7, the efficiency of converting the gaseous first fluid F1 entering the second condensing unit 4 into the liquid first fluid F1 can be increased, so as to improve the effect of the two-phase immersion cooling system in cooling the electronic devices 10. It is worth noting that in this embodiment, the number of the third condensing units 7 can be only one or more than two, and the aforementioned effect of improving the cooling of the electronic devices 10 can also be achieved.

Referring to FIG. 10 , a fourth embodiment of the novel two-phase immersion cooling system comprises three cooling tanks 2 as described in the first embodiment, three first condensing units 3 as described in the first embodiment (see FIG. 3 ), three second condensing units 4 as described in the first embodiment, three piping units 5 as described in the first embodiment, a liquid storage tank 6 as described in the first embodiment (see FIG. 1 ), two liquid distribution pipes 8 respectively connected between two adjacent cooling tanks 2, two third condensing units 7 respectively connected between two adjacent second condensing units 4, and two liquid distribution valves 9 respectively installed on the liquid distribution pipes 8. The liquid distribution pipe 8 is used to allow the liquid first fluid F1 in the cooling tanks 2 to circulate with each other. According to the connecting pipe principle, the liquid distribution pipe 8 can keep the liquid levels of the liquid first fluid F1 in the cooling tanks 2 at the same level.

In the fourth embodiment, if the electronic device 10 in any cooling tank 2 is to be taken out (see FIG. 4 ), the liquid dispensing valve 9 connected to the cooling tank 2 needs to be closed, and the liquid storage barrel 6 is connected to the cooling tank 2 and the aforementioned operation steps are followed to take out the electronic device 10.

It should be particularly noted that in the fourth embodiment, the number of cooling tanks 2, the number of first condensing units 3, the number of second condensing units 4, the number of pipeline units 5, the number of liquid storage barrels 6, the number of third condensing units 7, the number of liquid distribution pipes 8, and the number of liquid distribution valves 9 can be adjusted according to the number of electronic devices 10 to be cooled. In other words, when the number of electronic devices 10 to be cooled is larger, the number of cooling tanks 2 can be increased. Or when the efficiency of the condensation effect needs to be enhanced, the number of third condensing units 7 can be increased.

11 and 12 , a fifth embodiment of the novel two-phase immersion cooling system comprises two cooling tanks 2 as described in the first embodiment, two first condensing units 3 as described in the first embodiment (see FIG3 ), two second condensing units 4 as described in the first embodiment, a piping unit 5, a liquid storage tank 6 as described in the first embodiment (see FIG1 ), four third condensing units 7 as described in the fourth embodiment, a liquid distribution pipe 8, and a liquid distribution valve 9.

The difference between the fourth embodiment and the fifth embodiment of the two-phase immersion cooling system is that the cooling tanks 2 and the second condensing units 4 in the fourth embodiment are connected in series, while in the fifth embodiment, the cooling tanks 2 and the second condensing units 4 are connected in parallel.

It should be particularly noted that in the fifth embodiment, the pipeline unit 5 includes four gas delivery pipes 51, two liquid return pipes 52, four gas isolation valves 54 respectively disposed on the gas delivery pipes 51, and two liquid isolation valves 55 disposed on the liquid return pipes 52. Two of the gas delivery pipes 51 are respectively connected to the gas outlets 25 (see FIG. 4 ) of one of the cooling tanks 2 and one of the gas inlets 43 (see FIG. 4 ) of each of the second condensing units 4, and the other two of the gas delivery pipes 51 are respectively connected to the gas outlets 25 of another cooling tank 2 and another of the gas inlets 43 of each of the second condensing units 4. The gas delivery pipes 51 are used to deliver the first fluid F1 in the gas state in the cooling tanks 2 to the second condensing units 4. One end of the liquid return pipes 52 is respectively connected to the liquid outflow ports 44 (see FIG. 7 ) of the second condensing units 4, and the other ends of the liquid return pipes 52 are interconnected and respectively connected to the liquid return ports 26 (see FIG. 3 ) of the cooling tanks 2. The liquid return pipes 52 are used to deliver the first fluid F1 converted into liquid in the second condensing units 4 back to the cooling tanks 2.

Two of the third condensing units 7 are connected to two sides of one of the second condensing units 4 , respectively, and the other two of the third condensing units 7 are connected to two sides of another second condensing unit 4 .

The liquid distribution pipe 8 is connected to the cooling tanks 2 to allow the first fluid F1 in the cooling tanks 2 to circulate with each other. The liquid distribution valve 9 is installed on the liquid distribution pipe 8.

In summary, the novel two-phase immersion cooling system condenses the first fluid F1 evaporated into liquid state in turn through the fin condensation modules 32 of the first condensation unit 3 and the main condensation tube 42 of the second condensation unit 4, so that the first fluid F1 is converted from gaseous state to liquid state and mixed with the first fluid F1 in liquid state in the cooling tank 2 to reduce its temperature, thereby improving the cooling efficiency of the entire device, and thus can truly achieve the purpose of the novel system.

However, the above is only an example of the implementation of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the present patent.

10: Electronic device 2: Cooling tank 21: Frame 22: Side plate 23: Side cooling channel 24: Side cover plate 25: Gas outlet 26: Liquid return port 27: First condensing space 28: Input and output port 281: Power interface 282: Signal connection interface 29: Observation window 20: Perforation 3: First condensing unit 31: Top plate 32: Fin condensing module 33: Upper cooling channel 34: Upper cover plate 35: Cover plate 36: Upper cooling connecting pipe 37: Bracket 371: Fixing plate 372: Mounting plate 373: Converging protrusion 38: Fin 381: Connecting piece 382: Condenser piece 383: Converging protrusion 384: Gas flow hole 39: Indium sheet 4: Second condensing unit 41: Main box 411: Second condensing space 42: Main condenser pipe 43: Gas inlet 44: Liquid outlet 45: Volume expansion device 451: Fixed frame 452: Telescopic bag 5: Pipeline unit 51: Gas delivery pipe 52: Liquid return pipe 531: Liquid extraction pipe 532: Liquid return pipe 533: Extraction connection pipe 534: Return connection pipe 54: Gas isolation valve 55: Liquid isolation valve 56: Fan 57: Extraction pump 58: Return pump 6: Liquid storage tank 7: Third condensing unit 71: Sub-tank 8: Liquid distribution pipe 9: Liquid distribution valve F1: First fluid

Figure 1 is a three-dimensional diagram of a first embodiment of the novel two-phase immersion cooling system; Figure 2 is a three-dimensional diagram of the first embodiment from another perspective, in which a liquid storage tank is omitted; Figure 3 is a three-dimensional exploded diagram of a cooling tank and a first condensing unit of the first embodiment; Figure 4 is a cross-sectional schematic diagram of the first embodiment; Figure 5 is an incomplete three-dimensional exploded diagram of a fin condensing module and a top plate of the first embodiment; Figure 6 is an incomplete bottom-up schematic diagram of several fin condensing modules of the first embodiment; Figure 7 is a partial enlarged diagram of Figure 4; Figure 8 is a three-dimensional exploded diagram of a first condensing unit of a second embodiment of the novel two-phase immersion cooling system; Figure 9 is a three-dimensional diagram of a third embodiment of the novel two-phase immersion cooling system; FIG. 10 is a perspective view of a fourth embodiment of the novel two-phase immersion cooling system; FIG. 11 is a perspective view of a fifth embodiment of the novel two-phase immersion cooling system; and FIG. 12 is a perspective view of the fifth embodiment from another perspective.

10: Electronic devices

2: Cooling tank

21:Frame

22: Side panels

23: Side cooling channel

24: Side cover

25: Gas outlet

27: First condensation space

3: First condensation unit

31: Top plate

32: Fin condensation module

34: Upper cover plate

4: Second condensation unit

41: Main box

411: Second condensation space

42: Main condenser pipe

43: Gas inlet

45: Volume expansion device

451:Fixed bracket

452: Telescopic sac

5: Pipeline unit

51: Gas delivery pipe

52: Liquid return pipe

54: Gas isolation valve

55:Liquid isolation valve

56: Fan

F1: First fluid

Claims (15)

A two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises: A cooling tank for containing a first fluid, wherein the electronic devices are accessible and immersed in the first fluid, and the cooling tank comprises at least one gas flow outlet and a liquid return port; A first condensation unit is disposed in the cooling tank and is located above the first fluid in liquid state; A second condensation unit is configured to be independent of the cooling tank and has at least one gas flow inlet and a liquid flow outlet; and A pipeline unit, including at least one gas delivery pipe and at least one liquid return pipe, the at least one gas delivery pipe connects the gas flow outlet of the cooling tank and the gas flow inlet of the second condensing unit, the at least one gas delivery pipe is used to deliver the first fluid in the gas state in the cooling tank to the second condensing unit, the at least one liquid return pipe connects the liquid flow outlet of the second condensing unit and the liquid return port of the cooling tank, the at least one liquid return pipe is used to deliver the first fluid converted into liquid in the second condensing unit back to the cooling tank. A two-phase immersion cooling system as described in claim 1, wherein one of the first condensing unit and the second condensing unit includes a plurality of fin condensing modules, and the other of the first condensing unit and the second condensing unit includes a main condenser for circulating a third fluid, each fin condensing module has a bracket and a plurality of fins installed on the bracket at intervals, each fin has a condensing sheet portion and a plurality of arc-shaped converging protrusions formed at the bottom of the condensing sheet portion. A two-phase immersion cooling system as described in claim 2, wherein the fins of each fin condensing module are disposed on both sides of the bracket and are arranged in a staggered manner, and between two adjacent fin condensing modules on the left and right, the adjacent fins are also arranged in a staggered manner. A two-phase immersion cooling system as described in claim 2, wherein each fin of each fin condensing module also has a connecting plate portion connected to the condensing plate portion and mounted on the bracket, and each fin condensing module also includes a plurality of indium plates respectively mounted between the bracket and the connecting plate portions of the fins. A two-phase immersion cooling system as described in claim 2, wherein the first condensing unit and the second condensing unit include one of the fin condensing modules and further include a top plate for mounting a bracket for the fin condensing modules, an upper cooling channel formed on the upper surface of the top plate and for circulating a second fluid, and an upper cover plate sealed to the upper cooling channel. A two-phase immersion cooling system as described in claim 5, wherein the bracket of each fin condensing module is L-shaped and has a fixing plate arranged on the lower surface of the top plate, and a mounting plate extending downward from the fixing plate and for mounting the fins, and each fin condensing module also includes an indium plate mounted between the fixing plate and the top plate. A two-phase immersion cooling system as described in claim 2, wherein the first condensing unit and the second condensing unit include one of the fin condensing modules and further include a plurality of top plates for mounting brackets of the fin condensing modules, and a plurality of upper cooling connecting pipes respectively formed on the top plates and for circulating a second fluid. A two-phase immersion cooling system as described in claim 1, wherein the second condensing unit further includes a main box body formed with the gas inlet and the liquid outlet, and a volume expansion device mounted on and connected to the main box body, the volume expansion device having a fixed frame mounted on the main box body, and a telescopic bag connected to the main box body, one end of the telescopic bag is fixedly mounted on the fixed frame, and the other end of the telescopic bag can be moved relative to the fixed frame so that the telescopic bag can be extended to accommodate more of the first fluid in a gaseous state. The two-phase immersion cooling system as described in claim 1 also includes a liquid storage tank connected to the cooling tank and used to store the first fluid. The piping unit also includes a liquid extraction pipe and a liquid return pipe installed at the bottom of the cooling tank, an extraction connecting pipe connected to the liquid storage tank and detachably connected to the liquid extraction pipe, a return connecting pipe connected to the liquid storage tank and detachably connected to the liquid return pipe, at least one gas isolation valve installed on the gas delivery pipe, and a liquid isolation valve installed on the liquid return pipe. A two-phase immersion cooling system as described in claim 1, wherein the cooling tank further includes a frame provided with at least one gas flow outlet, a plurality of side panels sealingly covered around the frame, a plurality of side cooling channels respectively formed on the outer surfaces of the side panels, and a plurality of side cover panels respectively sealed to the side cooling channels, wherein one of the side panels is provided with the liquid return port, and the side cooling channels are used for allowing a second fluid to circulate. The two-phase immersion cooling system as described in claim 1 also includes at least one third condensing unit connected to the second condensing unit, and includes a liquid flow outlet, and the piping unit includes a plurality of liquid return pipes, one of which connects the liquid flow outlet of the second condensing unit with the liquid return port of the cooling tank, and another of which connects the liquid flow outlet of the third condensing unit with one of the liquid return pipes. A two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises: A plurality of cooling tanks for accommodating a first fluid, wherein the plurality of electronic devices are grouped together and are respectively and accesibly disposed in the cooling tanks and immersed in the first fluid, and each cooling tank comprises at least one gas flow outlet and a liquid return port; A plurality of first condensing units are respectively disposed in the cooling tanks, and each first condensing unit is located above the first fluid in liquid state; A plurality of second condensing units are configured to be independent of the cooling tanks and interconnected, and each second condensing unit has at least one gas flow inlet and a liquid flow outlet; A plurality of pipeline units, corresponding to the cooling tanks and the first condensing units and the second condensing units, respectively, each pipeline unit includes at least one gas delivery pipe and a liquid return pipe, the at least one gas delivery pipe connects the gas flow outlet of the corresponding cooling tank and the gas flow inlet of the second condensing unit, the at least one gas delivery pipe is used to deliver the first fluid in the corresponding cooling tank in the gas state to the second condensing unit, the liquid return pipe connects the liquid flow outlet of the corresponding second condensing unit and the liquid return port of the cooling tank, the liquid return pipe is used to deliver the first fluid converted into liquid in the corresponding second condensing units back to the cooling tank; and Several liquid distribution pipes are respectively connected to two adjacent cooling tanks to allow the first fluid in the cooling tanks to circulate between each other. The two-phase immersion cooling system as described in claim 12 also includes a plurality of third condensing units, each of which is connected between two adjacent second condensing units. A two-phase immersion cooling system is suitable for cooling a plurality of electronic devices, and comprises: Two cooling tanks for containing a first fluid, wherein a plurality of electronic devices are respectively and arbitrarily arranged in the cooling tanks and immersed in the first fluid, and each cooling tank comprises two gas flow outlets and a liquid return port; Two first condensation units are respectively arranged in the cooling tanks and located above the first fluid in liquid state; Two second condensation units are configured to be independent of the cooling tanks, and each second condensation unit has two gas flow inlets and a liquid flow outlet; A pipeline unit includes four gas delivery pipes and two liquid return pipes, two of the gas delivery pipes are respectively connected to the gas flow outlets of one of the cooling tanks and one of the gas flow inlets of the second condensing units, and the other two of the gas delivery pipes are respectively connected to the gas flow outlets of another cooling tank and another of the gas flow inlets of the second condensing units. The delivery pipe is used to transport the first fluid in the gaseous state in the cooling tanks to the second condensing units, one end of the liquid return pipes is respectively connected to the liquid outflow outlets of the second condensing units, and the other ends of the liquid return pipes are interconnected and respectively connected to the liquid return ports of the cooling tanks. The liquid return pipes are used to transport the first fluid converted into liquid in the second condensing units back to the cooling tanks; and A liquid distribution pipe is connected to the cooling tanks to allow the first fluid in the cooling tanks to circulate with each other. The two-phase immersion cooling system as described in claim 14 further includes at least two third condensation units, one of which is connected to both sides of one of the second condensation units, and the other of which is connected to both sides of the other second condensation unit.