TWM665327U - External liquid cooling device - Google Patents

Abstract

A liquid cooling heat dissipation device that can be externally connected is used to dissipate heat for multiple electronic devices and includes: an outer shell and a liquid storage assembly, a water pump assembly and a liquid cooling heat sink all arranged in the outer shell. The outer shell is provided with multiple liquid inlet joints and multiple liquid outlet joints; the liquid storage assembly includes a first liquid storage container and a second liquid storage container, and each liquid inlet joint is connected to the first liquid storage container; the water pump assembly includes a first water pump and multiple second water pumps, each liquid outlet joint is connected to each second water pump, the first liquid storage container is connected to the first water pump, and each second water pump is connected to the second liquid storage container; the liquid cooling heat sink is connected between the first water pump and the second liquid storage container; each electronic device is liquid cooled and heat dissipated by additionally connecting each liquid inlet joint and each liquid outlet joint in an external manner. This can achieve the effect of being highly adaptable and capable of being designed into any shape as required, as well as being able to enhance the heat dissipation capacity of liquid cooling.

Description

External liquid cooling device

This application may be related to liquid cooling of electronic devices such as servers, and in particular to an externally connectable liquid cooling device.

For electronic devices such as servers, heat dissipation is essential. For heat dissipation of such electronic devices, current liquid cooling mainly includes: inside mode, whole cabinet cooling system and immersion cooling.

The internal mode is a liquid cooling system that is directly integrated into the electronic device, and the cooling cycle is completed directly within the machine. However, the disadvantage is that it can only cool one electronic device.

The whole cabinet cooling system is integrated with a large cabinet. After the cooling water passes through multiple electronic devices, it can be taken from the large radiator at the back of the cabinet or to an external chiller for heat dissipation before returning to complete the cycle. However, the disadvantage is that if the user does not need to dissipate heat for the entire cabinet of electronic devices, there is no need to purchase such a large and expensive whole cabinet water cooling solution.

Immersion cooling is completely different from traditional heat dissipation methods. All equipment must be completely updated, and it may even lead to subsequent problems in the care and maintenance of electronic devices.

Therefore, how to overcome the above-mentioned prior art of this application is a major issue that the creator of this application is eager to solve.

The purpose of this application is to provide an external liquid cooling device.

In order to achieve the above-mentioned purpose, the present application provides an externally connectable liquid cooling heat dissipation device for dissipating heat of a plurality of electronic devices and comprising: an outer shell having a containing space and provided with a plurality of liquid inlet connectors and a plurality of liquid outlet connectors; a liquid storage assembly disposed in the containing space and comprising a first liquid storage container and a second liquid storage container, each of the liquid inlet connectors being connected to the first liquid storage container; a water pump assembly disposed in the containing space and comprising It comprises a first water pump and a plurality of second water pumps, each of the liquid outlet connectors is connected to each of the second water pumps, the first liquid storage container is connected to the first water pump, and each of the second water pumps is connected to the second liquid storage container; and a liquid cooling radiator is arranged in the accommodating space and connected between the first water pump and the second liquid storage container; wherein the plurality of electronic devices are liquid cooled and dissipated by additionally connecting each of the liquid inlet connectors and each of the liquid outlet connectors in an external manner.

Compared with the prior art, the present application has the following effects: by being independent and externally connected to the electronic device, it has a high degree of applicability and can be designed into any shape according to the needs; by having the first liquid storage container and the second liquid storage container and the first water pump and the plurality of second water pumps at the same time, it has the effect of being able to improve the liquid cooling heat dissipation capacity and also has the effect of being able to control the liquid inlet and outlet circulation of the plurality of electronic devices individually and independently through the plurality of second water pumps. In addition, it also has the effects of being able to dissipate heat for the plurality of electronic devices at the same time, being suitable for users who do not need to dissipate heat for the entire cabinet of electronic devices, not requiring all equipment to be updated, and being easy in subsequent care and maintenance.

The detailed description and technical contents of this application are described below with the help of drawings. However, the attached drawings are only provided for reference and description and are not used to limit this application.

The present application provides an externally connected liquid cooling device, as shown in FIG1, which is used to be movably arranged in a cabinet (not shown in the figure, such as an electronic device cabinet) like a drawer, so as to provide liquid cooling and heat dissipation for multiple (at least two) electronic devices (not shown in the figure, such as servers, but the present application is not limited to this) in a one-to-many and external manner. Among them, each electronic device can be arranged in the same cabinet (not shown in the figure, such as an electronic device cabinet). FIG1 to FIG4 are shown as a first embodiment, and FIG5 to FIG6 are shown as a second embodiment.

As shown in FIG. 1 to FIG. 4 , a first embodiment of the externally connectable liquid cooling and heat dissipation device (hereinafter referred to as liquid cooling and heat dissipation device) of the present application is shown, which includes: a liquid storage assembly 1, a water pump assembly 2, a liquid cooling radiator 3 and a housing 8.

The outer shell 8 has a plurality of shell plates that surround each other, and these shell plates include a front shell plate 81 and a rear shell plate 82 that are opposite to each other. The outer shell 8 has a receiving space 83 formed between the shell plates that surround each other. In addition, the outer shell 8 is provided with a plurality of liquid inlet connectors C1 and a plurality of liquid outlet connectors C2. In this embodiment, all the liquid inlet connectors C1 and all the liquid outlet connectors C2 are provided on the front shell plate 81, and as shown in the figure, all the liquid inlet connectors C1 and all the liquid outlet connectors C2 are respectively arranged at two opposite locations of the front shell plate 81. It should be noted that each liquid inlet connector C1 and each liquid outlet connector C2 are quick connectors.

The liquid storage assembly 1 is disposed in the accommodating space 83. The liquid storage assembly 1 comprises a first liquid storage container 11 and a second liquid storage container 12 which are independent of each other, and the volume and liquid capacity of the first liquid storage container 11 are larger than those of the second liquid storage container 12. Each liquid inlet connector C1 is connected to the inlet of the first liquid storage container 11 by a liquid delivery tube L1.

The water pump assembly 2 is disposed in the accommodation space 83. The water pump assembly 2 includes a first water pump 21 and a plurality of second water pumps 22, which are all independent, and the volume and water inlet and outlet of the first water pump 21 are larger than those of the second water pump 22. Each liquid outlet connector C2 is connected to the outlet of each second water pump 22 by a liquid infusion pipe L6 (not shown in the figure). The first liquid storage container 11 is connected to the first water pump 21 by a liquid infusion pipe L2, and each second water pump 22 is connected to the aforementioned second liquid storage container 12 by a liquid infusion pipe L5.

The liquid cooling radiator 3 is disposed in the accommodation space 83. The liquid cooling radiator 3 may include only a water cooling radiator 31, or may further include a heat dissipation fan 32. In this embodiment, the water cooling radiator 31 and the heat dissipation fan 32 are simultaneously included as an example for explanation. The water cooling radiator 31 is fixed to the inner surface of the rear shell plate 82, and the heat dissipation fan 32 is fixed to the water cooling radiator 31, so that the heat dissipation fan 32 supplies air to the water cooling radiator 31 and dissipates heat. The water cooling radiator 31 is connected and communicated between the first water pump 21 and the second liquid storage container 12, wherein the first water pump 21 is connected and communicated to the water cooling radiator 31 by a liquid infusion pipe L3, and the second liquid storage container 12 is connected and communicated to the water cooling radiator 31 by a liquid infusion pipe L4.

In detail, one end of each liquid infusion tube L1 is connected to each liquid inlet connector C1, and the other end of the plurality of liquid infusion tubes L1 is respectively connected to the plurality of inlets of the first liquid storage container 11; both ends of the liquid infusion tube L2 are respectively connected to the outlet of the first liquid storage container 11 and the inlet of the first water pump 21; both ends of the liquid infusion tube L3 are respectively connected to the outlet of the first water pump and the inlet of the radiator 31; both ends of the liquid infusion tube L4 are respectively connected to the outlet of the radiator 31 and the inlet of the second liquid storage container 12; one end of the plurality of liquid infusion tubes L5 is respectively connected to the plurality of outlets of the second liquid storage container 12, and the other end of each liquid infusion tube L5 is connected to the inlet of each second water pump 22; one end of each liquid infusion tube L6 is connected to the outlet of each second water pump 22, and the other end of each liquid infusion tube L6 is connected to each liquid outlet connector C2.

In this way, the liquid cooling heat dissipation device of the present application can utilize the liquid inlet connectors C1 and the liquid outlet connectors C2 arranged on the front shell plate 81 to quickly connect the electronic devices, so that the working fluid (not shown in the figure, such as cooling liquid, etc.) flows through the electronic devices respectively to take away the heat energy. The heat energy follows the working fluid through the liquid inlet connectors C1 and flows into the liquid cooling radiator 3 of the liquid cooling heat dissipation device of the present application for heat exchange. The working fluid after heat exchange cooling is then output from the liquid cooling radiator 3 and output through the second water pumps 22 and the liquid outlet connectors C2 and reflux to the electronic devices. In this way, the cycle can simultaneously perform liquid cooling on multiple electronic devices in an external manner.

Thus, the liquid cooling heat dissipation device of the present application, which is small and fully equipped, is not only connected to the electronic device by external connection, but also exists independently of the electronic device. Therefore, the present application has a highly applicable effect that can be designed into any shape according to the needs. In addition, the present application has a first liquid storage container 11 and a second liquid storage container 12, and a first water pump 21 and a plurality of second water pumps 22 at the same time, so that the liquid cooling heat dissipation capacity can be improved, and the plurality of second water pumps 22 can be used to control the liquid inlet and outlet circulation of a plurality of electronic devices individually and independently. In addition, the present application can also dissipate heat for a plurality of electronic devices at the same time, and is suitable for users who do not need to dissipate heat for a whole cabinet of electronic devices, and even do not need to update all the equipment as a whole, and there is no problem of subsequent maintenance and repair.

It should be noted that the heat dissipation fan 32 may be a single fan (not shown in the figure), or may include a plurality of fan units 321 as shown in the figure. In this embodiment, the description is made by taking the case where the plurality of fan units 321 are included.

In addition, the liquid cooling heat dissipation device of the present application may also include a power supply 6, which is disposed in the accommodating space 83 to supply power to all components in the outer shell 8 that require electricity (for example: the water pump assembly 2 and the liquid cooling heat sink 3, etc.).

As shown in FIG4 , the first embodiment of the liquid cooling heat dissipation device of the present application may further include a controller 5 and a first temperature sensor T1. The first temperature sensor T1 is disposed in the aforementioned infusion pipe L2 to sense the temperature of the working fluid in the infusion pipe L2. The controller 5 is disposed in the accommodation space 83 and is electrically connected to the first temperature sensor T1, the heat dissipation fan 32, the first water pump 21 and each second water pump 22. By sensing the temperature of the working fluid that has been charged with heat energy, the controller 5 can control the output of the heat dissipation fan 32, the first water pump 21 and the second water pump 22. Preferably, it may also include a plurality of second temperature sensors T2, each second temperature sensor T2 being disposed in each of the aforementioned infusion pipes L6 to sense the temperature of the working fluid in each infusion pipe L6. In this way, by sensing the temperature of the working fluid that already carries heat energy with the first temperature sensor T1 and sensing the temperature of each cooled working fluid with each second temperature sensor T2, the controller 5 can control the output of the heat dissipation fan 32, the first water pump 21 and the second water pump 22.

In addition, the first embodiment of the liquid cooling heat dissipation device of the present application may also include a plurality of flow sensors F and a plurality of pressure sensors P. Each flow sensor F and each pressure sensor P is disposed in each of the aforementioned infusion tubes L6 to sense the flow rate and water pressure of the working fluid in the infusion tubes L6 to further improve the accuracy of liquid cooling heat dissipation.

It may even further include a plurality of filter units 4, each of which is disposed in each of the aforementioned liquid infusion tubes L1 to filter the working fluid flowing into each of the liquid infusion tubes L1.

As shown in FIG. 5 and FIG. 6, the second embodiment of the liquid cooling heat dissipation device of the present application is substantially the same as the first embodiment, except that all the liquid inlet joints C1 and all the liquid outlet joints C2 are disposed on the rear housing plate 82, and as shown in the figure, all the liquid inlet joints C1 and all the liquid outlet joints C2 are centrally arranged at an avoidance portion (without component symbols) of the rear housing plate 82 away from the location of the liquid cooling heat sink 3. In addition, the second embodiment has all the effects of the first embodiment.

It should also be noted that a small tablet computer 811 can be embedded in the front shell panel 81, so that all components in the outer shell 8 can be controlled by the tablet computer 811, and all data sensed by the aforementioned sensors (including flow, pressure and temperature) can be displayed; an emergency switch 812 can also be provided on the front shell panel 81, so that in an emergency, the emergency switch 812 can be operated to stop the entire operation of the liquid cooling device of the present application.

In summary, the external liquid cooling device of this application can achieve the expected purpose and effect, and can solve the deficiencies of the previous technology, so a patent application is filed.

The above is only the preferred feasible embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the description and drawings of the present application are also included in the scope of the rights of the present application and shall be stated.

1: Liquid storage assembly 11: First liquid storage container 12: Second liquid storage container 2: Water pump assembly 21: First water pump 22: Second water pump 3: Liquid cooling radiator 31: Water cooling radiator 32: Cooling fan 321: Fan unit 4: Filter unit 5: Controller 6: Power supply 8: Housing 81: Front housing 811: Tablet computer 812: Emergency switch 82: Rear housing 83: Storage space C1: Liquid inlet connector C2: Liquid outlet connector F: Flow sensor L1, L2, L3, L4, L5, L6: Liquid infusion tube P: Pressure sensor T1: First temperature sensor T2: Second temperature sensor

FIG1 is a front perspective schematic diagram of the first embodiment of the liquid cooling device of the present application.

FIG. 2 is a front perspective schematic diagram of the first embodiment of the liquid cooling device of the present application at different top view angles.

FIG3 is a rear perspective schematic diagram of the first embodiment of the liquid cooling device of the present application.

FIG. 4 is a schematic plan view of the first embodiment of the liquid cooling device of the present application when viewed from above.

FIG5 is a rear perspective schematic diagram of the second embodiment of the liquid cooling device of the present application.

FIG6 is a schematic plan view of the second embodiment of the liquid cooling device of the present application when viewed from above.

1: Liquid storage components

11: First liquid storage container

2: Water pump assembly

21: First water pump

22: Second water pump

3: Liquid cooling radiator

31: Water cooling radiator

32: Cooling fan

321: Fan unit

5: Controller

6: Power supply

8: Shell

81:Front shell

811: Tablet computer

812: Emergency switch

82: Rear shell panel

83: Storage space

C1: Liquid inlet connector

C2: Liquid outlet connector

Claims (12)

An externally connectable liquid cooling device is used to dissipate heat for a plurality of electronic devices and includes: a housing having a storage space and provided with a plurality of liquid inlet connectors and a plurality of liquid outlet connectors; a liquid storage assembly disposed in the storage space and including a first liquid storage container and a second liquid storage container, each of the liquid inlet connectors being connected to the first liquid storage container; a water pump assembly disposed in the storage space and including a first water pump and a plurality of second water pumps, each of the liquid outlet connectors being connected to each of the second water pumps, the first liquid storage container being connected to the first water pump, and each of the second water pumps being connected to the second liquid storage container; and a liquid cooling radiator disposed in the storage space and connected between the first water pump and the second liquid storage container; Wherein, each of the electronic devices is externally connected to each of the liquid inlet connectors and each of the liquid outlet connectors to perform liquid cooling and heat dissipation. An externally connectable liquid cooling heat dissipation device as described in claim 1, wherein the liquid cooling heat sink comprises a water cooling radiator connected between the first water pump and the second liquid storage container. An externally connectable liquid cooling heat dissipation device as described in claim 2, wherein the liquid cooling heat sink further comprises a heat dissipation fan, which is disposed on the water cooling radiator. An externally connectable liquid cooling heat dissipation device as described in claim 1, wherein the outer shell has a front shell plate and a rear shell plate opposite to each other, and the plurality of liquid inlet connectors and the plurality of liquid outlet connectors are all disposed on the front shell plate. An externally connectable liquid cooling heat dissipation device as described in claim 1, wherein the outer shell has a front shell plate and a rear shell plate opposite to each other, and the plurality of liquid inlet connectors and the plurality of liquid outlet connectors are all disposed on the rear shell plate. The externally connectable liquid cooling device as described in claim 1 further includes a first temperature sensor. A liquid infusion tube is connected between the first liquid storage container and the first water pump. The first temperature sensor senses the temperature of the liquid in the liquid infusion tube. The externally connectable liquid cooling device as described in claim 6 further includes a plurality of second temperature sensors, wherein a liquid infusion tube is connected between each of the second water pumps and each of the liquid outlet connectors, and each of the second temperature sensors senses the temperature of the liquid in each of the liquid infusion tubes. The externally connectable liquid cooling device as described in claim 1 further includes a plurality of flow sensors, wherein a liquid infusion tube is connected between each of the second water pumps and each of the liquid outlet connectors, and each of the flow sensors senses the flow of the liquid in each of the liquid infusion tubes. The externally connectable liquid cooling device as described in claim 1 further includes a plurality of pressure sensors, wherein a liquid infusion tube is connected between each of the second water pumps and each of the liquid outlet connectors, and each of the pressure sensors senses the water pressure of the liquid in each of the liquid infusion tubes. The externally connectable liquid cooling heat dissipation device as described in claim 1 further includes a plurality of filter units, each of which has a liquid infusion tube connected between the liquid inlet connector and the first liquid storage container, and each of the filter units is disposed in each of the liquid infusion tubes. The externally connectable liquid cooling heat dissipation device as described in claim 1 further includes a controller disposed in the accommodation space, and the controller is electrically connected to the liquid cooling heat sink, the first water pump and each of the second water pumps. An externally connectable liquid cooling heat dissipation device as described in claim 1, wherein each of the liquid inlet connectors and each of the liquid outlet connectors are quick connectors.