TWM663393U - Three-dimensional temperature plate joint structure - Google Patents

Abstract

The present application is a three-dimensional temperature-averaging plate joint structure, including a shell, a heat pipe, a capillary structure and a working fluid. The shell includes a first shell plate and a second shell plate, a cavity is formed between the first shell plate and the second shell plate, a through hole is provided in the second shell plate, and a concave groove is provided around the outer periphery of the through hole; the heat pipe is provided corresponding to the through hole and has an open end, a flange is provided at the open end, and the flange is accommodated in the concave groove, wherein the heat pipe is combined with the second shell plate through the flange and the welding product in the concave groove; the capillary structure is arranged in the cavity and attached to the shell; the working fluid is arranged in the cavity. In this way, not only is the combination stable and strong, but also it can prevent low-melting-point solder from entering the cavity and affecting the transmission of the working fluid.

Description

Three-dimensional temperature plate joint structure

This application relates to a heat dissipation technology field, particularly to a three-dimensional temperature balancing plate joint structure.

The existing three-dimensional temperature averaging plate structure mainly includes a temperature averaging plate and a plurality of heat pipes. The heat pipes are arranged vertically on the temperature averaging plate at intervals, and the cavity inside the temperature averaging plate is interconnected with the chambers of the heat pipes to achieve rapid heat conduction and heat dissipation performance through the change of vapor-liquid phase.

However, although the existing three-dimensional heat spreader structure has heat conduction and heat dissipation performance, there are the following problems to be solved in the actual use process. Since the heat pipes and the heat spreader are combined through solder such as copper paste or solder paste, it is easy to cause looseness and other undesirable conditions due to vibration during assembly or transportation. In addition, during the manufacturing process, copper paste or solder paste is easy to enter the cavity, thereby affecting or blocking the transmission path of the internal working fluid, thereby reducing its heat conduction and heat dissipation performance.

In view of this, the applicant has focused on the above-mentioned shortcomings of the existing technology and has conducted intensive research and applied theoretical knowledge to try its best to solve the above-mentioned problems, which has become the goal of the applicant's improvement.

One of the purposes of this application is to provide a three-dimensional temperature equalizing plate joint structure, which is not only stable and strong, but also can prevent low melting point solder from entering the cavity and affecting the transmission of the working fluid.

In order to achieve the above-mentioned purpose, the present application provides a three-dimensional temperature-averaging plate joint structure, including a shell, a plurality of heat pipes, a capillary structure and a working fluid, the shell including a first shell plate and a second shell plate corresponding to the first shell plate and sealed in close contact, a cavity is formed between the first shell plate and the second shell plate, a plurality of through holes are provided in the second shell plate, and a capillary structure is provided around the outer periphery of each through hole. The heat pipes are respectively arranged corresponding to the through holes, each heat pipe has an open end, a flange is arranged at the open end, each flange is respectively accommodated in the recessed groove, wherein each heat pipe is combined with the second shell plate through a welding product in the flange and the recessed groove; the capillary structure is arranged in the cavity and attached to the shell; the working fluid is arranged in the cavity.

This application also has the following effects: it can avoid blocking the movement path of the internal working fluid during the processing because the low melting point solder such as copper paste or solder paste is heated and melted and blocks the pores of the capillary structure. The thermal effect of the manufacturing process is small and the deformation of the workpiece is small. The firmness and reliability after the combination are extremely good.

The detailed description and technical contents of this application are described below with the help of drawings. However, the attached drawings are only provided for reference and description and are not used to limit this application.

Please refer to FIG. 1 to FIG. 7 , the present application provides a three-dimensional temperature-averaging plate joint structure, which mainly includes a housing 10 , a plurality of heat pipes 20 , a capillary structure 30 and a working fluid 40 .

Please refer to FIG. 5 and FIG. 7 , the shell 10 mainly includes a first shell plate 11 and a second shell plate 12. The first shell plate 11 and the second shell plate 12 are made of materials with good thermal conductivity such as copper, aluminum, magnesium or their alloys. The first shell plate 11 mainly includes a bottom plate 111 and a surrounding plate 112 that is bent and extended upward from the periphery of the bottom plate 111. A fold 113 is extended outward from one end of the surrounding plate 112 away from the bottom plate 111.

The second shell plate 12 mainly includes a top plate 121 . The second shell plate 12 is closely connected and sealed with the fold 113 of the first shell plate 11 through the top plate 121 , so as to form a cavity A between the first shell plate 11 and the second shell plate 12 .

Continuing to refer to FIG. 1 to FIG. 3, a plurality of through holes 122 are provided at intervals on the inner side of the top plate 121 of the second housing plate 12, and a recessed groove 123 is provided on the outer periphery of each through hole 122. The recessed groove 123 has an inner peripheral surface 1231, and a convex bump 124 higher than the outer surface of the top plate 121 is formed at the position corresponding to the recessed groove 123. In addition, a ring wall 125 extends upward from the periphery of each through hole 122.

Each heat pipe 20 is respectively provided corresponding to each through hole 122. Each heat pipe 20 has an open end 21 and a closed end 22. A flange 211 is provided at the open end 21. The flange 211 has an outer peripheral surface 212. Each flange 211 is respectively accommodated in each recessed groove 123, and the lower surface of the flange 211 is flush with or lower than the inner surface of the top plate 121 of the second housing plate 12. The flange 211 of this embodiment extends from the open end 21 of the heat pipe 20 in an expanded manner, and the flange 211 is arranged perpendicular to the center line of the heat pipe 20.

During the joining, the closed end 22 of the heat pipe 20 is passed through the through hole 122 and the ring wall 125 of the second shell 12, and the flange 211 is embedded in the recessed groove 123. A welding product W is formed between the outer peripheral surface 212 of the flange 211 and the inner peripheral surface 1231 of the recessed groove 123 by laser welding equipment (not shown), so that each heat pipe 20 is joined to the second shell 12. This embodiment uses laser brazing to perform welding, which is not only easy to use in combination with computer control, CAD/CAM, etc., but also convenient to be incorporated into the production line, and is also a welding method suitable for robotic arms. During operation, a high-intensity laser beam heats the linear solder to melt it and fix it between the inner circumference 1231 of the recessed groove 123 and the outer circumference 212 of the flange 211. The melted metal cools and crystallizes to form a welding product W, which can be joined almost without melting the base material, and the joining strength and joining speed are twice or more than that of ordinary spot welding.

Next, solder is applied to the heat pipe 20 and the annular wall 127 by soft soldering or brazing, and the solder is heated to fill the space between the heat pipe 20 and the annular wall 125, thereby forming a sealing layer S. Soft soldering uses paste zinc, tin, and lead as solder; brazing uses paste copper, aluminum, and magnesium as solder.

Please continue to refer to FIG. 4 to FIG. 7. The capillary structure 30 is disposed in the aforementioned cavity A and can be made of a material with good capillary adsorption, such as a metal woven mesh, porous sintered powder, or fiber bundle. Its shape is roughly similar to the shape of the aforementioned shell 10. The capillary structure 30 of this embodiment mainly includes a lower capillary structure 31 and an upper capillary structure 32, wherein the lower capillary structure 31 is attached to the first shell plate 11 and is fixed to the inner surface of the first shell plate 11 by a heat diffusion welding process; the upper capillary structure 32 is attached to the second shell plate 12 and is fixed to the inner surface of the second shell plate 12 by a heat diffusion welding process. In addition, a plurality of through holes 321 are respectively provided on the upper capillary structure 32, and the through holes 321 of the upper capillary structure 32 roughly correspond to the configuration of the heat pipe 20, and the capillary structure of the upper capillary structure 32 and the heat pipe 20 are in contact with each other.

The working fluid 40 can be pure water, which is injected into the aforementioned cavity A and subjected to a degassing and sealing process, so that the cavity A is formed into a vacuum chamber.

In one embodiment, the three-dimensional temperature-averaging plate joint structure of the present application further includes a plurality of supporting columns 50 , each supporting column 50 is disposed at intervals in the cavity A and is vertically disposed between the first shell plate 11 and the second shell plate 12 .

In addition, when in use, a heat dissipation fin assembly 60 is sleeved on each heat pipe 20 to enhance the heat dissipation performance of the overall structure.

The above description is only the preferred embodiment of the present application and is not intended to limit the patent scope of the present application. Other equivalent variations that utilize the patent spirit of the present application should all fall within the patent scope of the present application.

10: Shell 11: First Shell Plate 111: Bottom Plate 112: Enclosure Plate 113: Folding Edge 12: Second Shell Plate 121: Top Plate 122: Through Hole 123: Concave Groove 1231: Inner Surface 124: Convex Hull 125: Ring Wall 20: Heat Pipe 21: Open End 211: Flange 212: Outer Surface 22: Closed End 30: Capillary Structure 31: Lower Capillary Structure 32: Upper Capillary Structure 321: Perforation 40: Working Fluid 50: Support Column 60: Heat Dissipation Fin Assembly A: Cavity S: Sealing Layer W: welding products

FIG. 1 is an exploded view of the second housing plate and each heat pipe of the present application.

FIG. 2 is an appearance diagram of the second shell plate and the heat pipe assembly of this application.

FIG3 is a cross-sectional view of the second shell plate and each heat pipe assembly and an enlarged view of a local area of the present application.

Figure 4 is a diagram showing the decomposition of the capillary structure after the second shell and each heat pipe are combined in this application.

FIG. 5 is an exploded view of the three-dimensional temperature equalizing plate joint structure of this application.

FIG6 is an appearance diagram of the three-dimensional temperature equalizing plate joint structure of this application.

FIG. 7 is a cross-sectional view of the three-dimensional temperature equalizing plate joint structure assembly of the present application.

12: Second shell plate

121: Top plate

1231: Inner Surface

124: Convex hull

125: Ring Wall

20: Heat pipe

211:France

212: Outer surface

S: Sealing layer

W: welding products

Claims (10)

A three-dimensional temperature-averaging plate joint structure includes: a shell, including a first shell plate and a second shell plate sealed and sealed to the first shell plate, a cavity is formed between the first shell plate and the second shell plate, a plurality of through holes are provided in the second shell plate, and a concave groove is provided around the outer periphery of each through hole; a plurality of heat pipes, which are respectively arranged to pass through the through holes, each heat pipe has an open end, a flange is provided at the open end, and each flange is respectively accommodated in each concave groove, wherein each heat pipe is combined with the second shell plate through a welding product in the flange and the concave groove; a capillary structure, which is arranged in the cavity and attached to the shell; and a working fluid, which is arranged in the cavity. A three-dimensional temperature-averaging plate joint structure as described in claim 1, wherein the welding product is formed by a laser welding method. A three-dimensional temperature-averaging plate joint structure as described in claim 1, wherein the recessed groove has an inner peripheral surface, the flange has an outer peripheral surface, and the welding product is formed between the outer peripheral surface and the inner peripheral surface. A three-dimensional temperature-averaging plate joint structure as described in claim 1, wherein the second shell plate includes a top plate, and a convex bulge higher than the outer surface of the top plate is formed at a position corresponding to each of the recessed grooves. A three-dimensional temperature-averaging plate joint structure as described in claim 4, wherein the lower surface of the flange is flush with or lower than the inner surface of the top plate of the second shell plate. A three-dimensional temperature-averaging plate joint structure as described in claim 1, wherein the flange extends from the open end of the heat pipe in an expanded manner, and the flange and the center line of the heat pipe are vertically arranged. As described in claim 1, a three-dimensional temperature-averaging plate joint structure has a ring wall extending around each through hole, and each heat pipe penetrates through each ring wall. A three-dimensional temperature-averaging plate joint structure as described in claim 7, wherein a sealing layer is provided between each heat pipe and each surrounding wall. The three-dimensional temperature-averaging plate joint structure as described in claim 8, wherein the sealing layer is formed by a soft soldering method or a hard soldering method. The three-dimensional temperature-averaging plate joint structure as described in claim 1 further includes a plurality of supporting columns, each of which is spaced apart in the cavity and vertically disposed between the first shell plate and the second shell plate.