TWM659878U - Touch module - Google Patents
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- TWM659878U TWM659878U TW113202701U TW113202701U TWM659878U TW M659878 U TWM659878 U TW M659878U TW 113202701 U TW113202701 U TW 113202701U TW 113202701 U TW113202701 U TW 113202701U TW M659878 U TWM659878 U TW M659878U
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Abstract
Description
本創作關於一種觸摸輸入裝置，特別關於一種觸控模組。 This work is about a touch input device, and more particularly about a touch module.
習知的觸控模組為了偵測使用者的觸壓動作據以產生觸壓訊號，設置壓力感應器於觸控模組內部。然而觸控模組的尺寸並沒有一個公定的標準，因此不同廠牌的電腦產品和筆電所搭配需求的觸控模組尺寸並不相同，在觸控模組中的壓力感測元件會因為設置位置的差異而造成感應範圍的誤差。若是觸控模組尺寸較大時，可能會導致設於觸控模組中心區域的壓力感測器無法感測到邊緣區域的觸壓，反之亦然。同時現今的觸控模組內部有許多複雜的元件與線路，在這些複雜的元件與線路中調整並找尋適合的位置去設置壓力感應器也是一項難題。 In order to detect the user's touch action and generate a touch signal, the conventional touch module has a pressure sensor installed inside the touch module. However, there is no standard for the size of the touch module, so the touch module sizes required for different brands of computer products and laptops are different. The pressure sensing element in the touch module will cause errors in the sensing range due to the difference in the setting position. If the size of the touch module is larger, the pressure sensor located in the center area of the touch module may not be able to sense the touch in the edge area, and vice versa. At the same time, there are many complex components and circuits inside the current touch module. It is also a problem to adjust and find a suitable position to set the pressure sensor among these complex components and circuits.
為了解決習知技術的問題，本創作提供一種觸控模組。本創作之觸控模組具有二種壓力感測元件，這二種不同壓力感測元件提供的感應範圍不同，將二種壓力感測元件分別設置在觸控模組內部的不同區域，提升感應範圍最大化，排除單一種類的感應元件的感應死角，減少誤差。同時二種壓力感測元件的感應範圍有重疊的區域能更靈敏地感測到觸壓。再者，壓力感測元件 的設置位置可以依據觸控模組的尺寸進行搭配，設置適合的位置，提高整體元件設置的自由度與感應精確性。 In order to solve the problem of known technology, this invention provides a touch module. The touch module of this invention has two kinds of pressure sensing elements. These two different pressure sensing elements provide different sensing ranges. The two pressure sensing elements are respectively set in different areas inside the touch module to maximize the sensing range, eliminate the sensing blind spots of a single type of sensing element, and reduce errors. At the same time, the overlapping areas of the sensing ranges of the two pressure sensing elements can sense the touch more sensitively. Furthermore, the setting position of the pressure sensing element can be matched according to the size of the touch module, and the appropriate position can be set to improve the freedom of the overall component setting and the sensing accuracy.
為了達到上述目的，本創作提供一種觸控模組，該觸控模組電性連接一訊號處理器，該訊號處理器用於產生一觸壓訊號，該觸控模組包括：一基板，該基板具有一頂面；一第一壓力感測元件，設置於該基板之該頂面；複數第二壓力感測元件，設置於該基板之該頂面，並且該複數第二壓力感測元件與該第一壓力感測元件彼此相隔開來；一觸控板，該觸控板具有一第一區域、一第二區域以及一第三區域，該觸控板設置於該基板上並且覆蓋該第一壓力感測元件以及該複數第二壓力感測元件，該第一區域對應該第一壓力感測元件，該第二區域對應該複數第二壓力感測元件；以及其中，該觸控板之該第一區域受到觸壓時，該第一壓力感測元件產生一第一訊號，該第二區域受到觸壓時，該複數第二壓力感測元件產生一第二訊號，該第三區域受到觸壓時，該第一壓力感測元件產生該第一訊號並且該複數第二壓力感測元件產生該第二訊號。 In order to achieve the above-mentioned purpose, the invention provides a touch module, which is electrically connected to a signal processor, and the signal processor is used to generate a touch signal. The touch module includes: a substrate, the substrate has a top surface; a first pressure sensing element, which is arranged on the top surface of the substrate; a plurality of second pressure sensing elements, which are arranged on the top surface of the substrate, and the plurality of second pressure sensing elements are separated from the first pressure sensing element; a touch panel, the touch panel has a first area, a second area and a third area, and the touch panel is arranged on The substrate covers the first pressure sensing element and the plurality of second pressure sensing elements, the first area corresponds to the first pressure sensing element, and the second area corresponds to the plurality of second pressure sensing elements; and wherein, when the first area of the touch panel is touched, the first pressure sensing element generates a first signal, when the second area is touched, the plurality of second pressure sensing elements generate a second signal, and when the third area is touched, the first pressure sensing element generates the first signal and the plurality of second pressure sensing elements generate the second signal.
較佳地，該觸控板之該第一區域受到觸壓時產生一第一觸壓點，該第一壓力感測元件感測該第一觸壓點之觸壓力而產生該第一訊號，該觸控板之該第二區域受到觸壓時產生一第二觸壓點，該複數第二壓力感測元件中與該第二觸壓點距離最接近之一該第二壓力感測元件產生該第二訊號，該觸控板之該第三區域受到觸壓時產生一第三觸壓點，該第一壓力感測元件感測該第三觸壓點之觸壓力而產生該第一訊號，並且該複數第二壓力感測元件中與該第三觸壓點距離最接近之一該第二壓力感測元件產生該第二訊號。 Preferably, when the first area of the touch panel is touched, a first touch point is generated, and the first pressure sensing element senses the touch pressure of the first touch point to generate the first signal. When the second area of the touch panel is touched, a second touch point is generated, and one of the plurality of second pressure sensing elements that is closest to the second touch point is sensed by the first pressure sensing element. The force sensing element generates the second signal, and a third touch point is generated when the third area of the touch panel is touched. The first pressure sensing element senses the touch pressure of the third touch point and generates the first signal, and the second pressure sensing element closest to the third touch point among the plurality of second pressure sensing elements generates the second signal.
較佳地，該觸控板之該第一區域受到觸壓產生該第一觸壓點時，該第一觸壓點之觸壓力使該基板產生型變，該第一壓力感測元件感測該基板之型變而產生該第一訊號，該訊號處理器接收該第一訊號並產生該觸壓訊號。 Preferably, when the first area of the touch panel is pressed to generate the first touch point, the pressure of the first touch point causes the substrate to deform, the first pressure sensing element senses the deformation of the substrate and generates the first signal, and the signal processor receives the first signal and generates the touch signal.
較佳地，該觸控板之該第二區域受到觸壓產生該第二觸壓點時，該第二觸壓點之觸壓力使該觸控板往該基板方向靠近，該觸控板與該基板二者之間的距離改變，該複數第二壓力感測元件中與該第二觸壓點距離最接近之該第二壓力感測元件感測該觸控板與該基板的距離改變，產生該第二訊號，該訊號處理器接收該第二訊號並產生該觸壓訊號。 Preferably, when the second area of the touch panel is touched to generate the second touch point, the touch pressure of the second touch point causes the touch panel to approach the substrate, and the distance between the touch panel and the substrate changes. The second pressure sensing element closest to the second touch point among the plurality of second pressure sensing elements senses the change in the distance between the touch panel and the substrate and generates the second signal. The signal processor receives the second signal and generates the touch signal.
較佳地，該觸控板之該第三區域受到觸壓產生該第三觸壓點時，該基板產生型變，同時該觸控板往該基板方向靠近使該觸控板與基板之間的距離改變，該第一壓力感測元件感測該基板之型變，產生該第一訊號，同時該複數第二壓力感測元件中與該第三觸壓點距離最接近之該第二壓力感測元件感測該觸控板與該基板的距離改變，產生該第二訊號。 Preferably, when the third area of the touch panel is touched to generate the third touch point, the substrate is deformed, and the touch panel approaches the substrate to change the distance between the touch panel and the substrate. The first pressure sensing element senses the deformation of the substrate and generates the first signal. At the same time, the second pressure sensing element closest to the third touch point among the plurality of second pressure sensing elements senses the change in the distance between the touch panel and the substrate and generates the second signal.
較佳地，該第三區域中之該第三觸壓點受到觸壓，該第一壓力感測元件產生之該第一訊號之訊號強度大於該第二壓力感測元件產生之該第二訊號之訊號強度時，該訊號處理器接收該第一訊號並產生該觸壓訊號，該第一壓力感測元件產生之該第一訊號之訊號強度小於該第二壓力感測元件產生之該第二訊號之訊號強度時，該訊號處理器接收該第二訊號並產生該觸壓訊號。 Preferably, when the third touch point in the third area is touched, and the signal strength of the first signal generated by the first pressure sensing element is greater than the signal strength of the second signal generated by the second pressure sensing element, the signal processor receives the first signal and generates the touch signal; when the signal strength of the first signal generated by the first pressure sensing element is less than the signal strength of the second signal generated by the second pressure sensing element, the signal processor receives the second signal and generates the touch signal.
較佳地，該第三區域中之該第三觸壓點受到觸壓，該訊號處理器同時接收該第一訊號以及該第二訊號並產生該觸壓訊號。 Preferably, the third touch point in the third area is touched, and the signal processor simultaneously receives the first signal and the second signal and generates the touch signal.
較佳地，該觸控板具有一接觸平面，該接觸平面具有一觸控板中心區域以及一外周緣，該接觸平面位於該基板上方且與該基板之該頂面平 行，該第一區域對應該觸控板中心區域，該第二區域對應該外周緣，該第三區域位於該觸控板中心區域與該外周緣之間。 Preferably, the touch panel has a contact plane, the contact plane has a touch panel center area and an outer periphery, the contact plane is located above the substrate and parallel to the top surface of the substrate, the first area corresponds to the touch panel center area, the second area corresponds to the outer periphery, and the third area is located between the touch panel center area and the outer periphery.
較佳地，該基板之該頂面具有一基板中心區域以及一外圍部，該外圍部環繞該基板中心區域，該第一壓力感測元件設置於該基板中心區域，該複數第二壓力感測元件分別設置於該外圍部。 Preferably, the top surface of the substrate has a substrate central area and a peripheral portion, the peripheral portion surrounds the substrate central area, the first pressure sensing element is disposed in the substrate central area, and the plurality of second pressure sensing elements are respectively disposed in the peripheral portion.
較佳地，該基板之該頂面之該基板中心區域對應該觸控板之該第一區域，該頂面之該外圍部對應該觸控板之該第二區域。 Preferably, the central area of the substrate on the top surface of the substrate corresponds to the first area of the touch panel, and the peripheral portion of the top surface corresponds to the second area of the touch panel.
較佳地，該觸控板具有一底面以及一電路層，該觸控板之該底面位於該基板上方並且對應該基板之該頂面，該電路層設置於該觸控板之該底面並且對應該第一壓力感測元件以及該第二壓力感測元件。 Preferably, the touch panel has a bottom surface and a circuit layer, the bottom surface of the touch panel is located above the substrate and corresponds to the top surface of the substrate, and the circuit layer is arranged on the bottom surface of the touch panel and corresponds to the first pressure sensing element and the second pressure sensing element.
較佳地，該觸控模組具有一微控制器，該微控制器設置於該觸控板，該微控制器電性連接該第一壓力感測元件、該複數第二壓力感測元件以及該訊號處理器。 Preferably, the touch module has a microcontroller, which is disposed on the touch panel and electrically connected to the first pressure sensing element, the plurality of second pressure sensing elements and the signal processor.
較佳地，該第一壓力感測元件為微機電壓力感測器，該複數第二壓力感測元件為電容式壓力感測器。 Preferably, the first pressure sensing element is a micro-electromechanical pressure sensor, and the plurality of second pressure sensing elements are capacitive pressure sensors.
以下茲舉本創作較佳實施例並搭配圖式進行說明。 The following is a list of the best implementation examples of this creation and illustrates them with diagrams.
請參閱圖1本創作第一較佳實施例之觸控模組與電腦裝置之立體圖，圖2本創作第一較佳實施例之觸控模組之立體圖，以及圖3本創作第一較佳實施例之觸控模組之立體分解圖。本創作之觸控模組1可設置於電腦設備C中。觸控模組1電性連接一訊號處理器D，訊號處理器D用於產生一觸壓訊號D1(示於圖7A、7B、7C)。訊號處理器D可設置在電腦設備C中或是設置於觸控模組1中，本創作以訊號處理器D設置在電腦設備C中並電性連接觸控模組1為例進行說明。 Please refer to Figure 1 for a three-dimensional diagram of the touch module and the computer device of the first preferred embodiment of this creation, Figure 2 for a three-dimensional diagram of the touch module of the first preferred embodiment of this creation, and Figure 3 for a three-dimensional exploded diagram of the touch module of the first preferred embodiment of this creation. The touch module 1 of this creation can be set in the computer device C. The touch module 1 is electrically connected to a signal processor D, and the signal processor D is used to generate a touch signal D1 (shown in Figures 7A, 7B, and 7C). The signal processor D can be set in the computer device C or in the touch module 1. This creation is explained by taking the signal processor D being set in the computer device C and electrically connected to the touch module 1 as an example.
本創作之觸控模組1包括一基板10、一第一壓力感測元件20、複數第二壓力感測元件30以及一觸控板40，基板10具有一頂面11。第一壓力感測元件20以及複數第二壓力感測元件30設置於基板10的頂面11，且複數第二壓力感測元件30與第一壓力感測元件20彼此相隔開來，較佳地，複數第二壓力感測元件30圍繞第一壓力感測元件20並且彼此相隔。觸控板40設置於基板10上並且覆蓋第一壓力感測元件20以及複數第二壓力感測元件30。 The touch module 1 of the invention includes a substrate 10, a first pressure sensing element 20, a plurality of second pressure sensing elements 30 and a touch panel 40. The substrate 10 has a top surface 11. The first pressure sensing element 20 and the plurality of second pressure sensing elements 30 are disposed on the top surface 11 of the substrate 10, and the plurality of second pressure sensing elements 30 are separated from the first pressure sensing element 20. Preferably, the plurality of second pressure sensing elements 30 surround the first pressure sensing element 20 and are separated from each other. The touch panel 40 is disposed on the substrate 10 and covers the first pressure sensing element 20 and the plurality of second pressure sensing elements 30.
本創作較佳實施例的第二壓力感測元件30共有6個，分別設置在不同位置，依照位置不同再各別標示獨立的元件標號，以利說明。複數第二壓 力感測元件30分別包括為位於左上的第二壓力感測元件30a、位於中間上方的第二壓力感測元件30b、位於右上的第二壓力感測元件30c、位於右下的第二壓力感測元件30d、位於中間下方的第二壓力感測元件30e，以及位於左下的第二壓力感測元件30f。 The second pressure sensing elements 30 of the preferred embodiment of the invention are 6 in total, which are respectively arranged at different positions. The second pressure sensing elements 30 are marked with independent element numbers according to the different positions for the convenience of explanation. The plurality of second pressure sensing elements 30 include a second pressure sensing element 30a located at the upper left, a second pressure sensing element 30b located at the upper middle, a second pressure sensing element 30c located at the upper right, a second pressure sensing element 30d located at the lower right, a second pressure sensing element 30e located at the lower middle, and a second pressure sensing element 30f located at the lower left.
基板10的頂面11具有一基板中心區域111以及一外圍部112。外圍部112環繞基板中心區域111。第一壓力感測元件20設置於基板中心區域111，複數第二壓力感測元件30分別設置於外圍部112。 The top surface 11 of the substrate 10 has a substrate central area 111 and a peripheral portion 112. The peripheral portion 112 surrounds the substrate central area 111. The first pressure sensing element 20 is disposed in the substrate central area 111, and the plurality of second pressure sensing elements 30 are respectively disposed in the peripheral portion 112.
觸控板40具有一接觸平面41、一底面42、一電路層43、一第一區域401、一第二區域402以及一第三區域403。觸控板40的接觸平面41具有一觸控板中心區域411以及一外周緣412，外周緣412圍繞觸控板中心區域411。接觸平面41位於基板10的上方並且與基板10平行。 The touch panel 40 has a contact plane 41, a bottom surface 42, a circuit layer 43, a first area 401, a second area 402, and a third area 403. The contact plane 41 of the touch panel 40 has a touch panel center area 411 and an outer periphery 412, and the outer periphery 412 surrounds the touch panel center area 411. The contact plane 41 is located above the substrate 10 and is parallel to the substrate 10.
觸控板40的第一區域401對應接觸平面41的觸控板中心區域411，並且第一區域401對應第一壓力感測元件20(示於圖6)。第二區域402對應接觸平面41的外周緣412，並且第二區域402對應複數第二壓力感測元件30(示於圖6)。第三區域403位於對應觸控板中心區域411與外周緣412二者之間的區域。 The first area 401 of the touch panel 40 corresponds to the touch panel center area 411 of the touch plane 41, and the first area 401 corresponds to the first pressure sensing element 20 (shown in FIG. 6 ). The second area 402 corresponds to the outer periphery 412 of the touch plane 41, and the second area 402 corresponds to the plurality of second pressure sensing elements 30 (shown in FIG. 6 ). The third area 403 is located in the area between the touch panel center area 411 and the outer periphery 412.
觸控板40的底面42位於基板10的上方並對應基板10的頂面11。電路層43設至於觸控板40的底面42並且對應並覆蓋第一壓力感測元件20以及複數第二壓力感測元件30。觸控模組1具有一微控制器M，微控制器M設置於觸控板40，並且微控制器M電性連接第一壓力感測元件20、複數第二壓力感測元件30以及訊號處理器D。 The bottom surface 42 of the touch panel 40 is located above the substrate 10 and corresponds to the top surface 11 of the substrate 10. The circuit layer 43 is provided on the bottom surface 42 of the touch panel 40 and corresponds to and covers the first pressure sensing element 20 and the plurality of second pressure sensing elements 30. The touch module 1 has a microcontroller M, which is provided on the touch panel 40 and is electrically connected to the first pressure sensing element 20, the plurality of second pressure sensing elements 30 and the signal processor D.
從以上說明中可知，基板10的頂面11的基板中心區域111能夠對應到觸控板40的第一區域401，基板10的頂面11的外圍部112能夠對應觸控板40的第二區域402。因此設置在基板中心區域111的第一壓力感測元件20能靈敏感測到觸控板40的第一區域401中的觸壓力。設置於外圍部112的複數第二壓力感 測元件30能靈敏感測到觸控板40的第二區域402中的觸壓力。同時，第一壓力感測元件20與複數第二壓力感測元件30的感測範圍皆能擴及到第三區域403，因此第三區域403中的觸壓力能夠同時被第一壓力感測元件20與複數第二壓力感測元件30所探知。 As can be seen from the above description, the substrate central area 111 of the top surface 11 of the substrate 10 can correspond to the first area 401 of the touch panel 40, and the outer peripheral portion 112 of the top surface 11 of the substrate 10 can correspond to the second area 402 of the touch panel 40. Therefore, the first pressure sensing element 20 disposed in the substrate central area 111 can sensitively detect the touch pressure in the first area 401 of the touch panel 40. The plurality of second pressure sensing elements 30 disposed in the outer peripheral portion 112 can sensitively detect the touch pressure in the second area 402 of the touch panel 40. At the same time, the sensing ranges of the first pressure sensing element 20 and the plurality of second pressure sensing elements 30 can be extended to the third area 403, so the touch pressure in the third area 403 can be detected by the first pressure sensing element 20 and the plurality of second pressure sensing elements 30 at the same time.
續說明本創作之第一壓力感測元件20與複數第二壓力感測元件30的感測原理。參閱圖4A本創作第一較佳實施例之第一壓力感測元件示意圖、圖4B本創作第一較佳實施例之第一壓力感測元件示意圖，圖5A本創作第一較佳實施例之第二壓力感測元件示意圖，以及圖5B係本創作第一較佳實施例之第二壓力感測元件示意圖。 The sensing principle of the first pressure sensing element 20 and the plurality of second pressure sensing elements 30 of the present invention will be described below. See FIG. 4A for a schematic diagram of the first pressure sensing element of the first preferred embodiment of the present invention, FIG. 4B for a schematic diagram of the first pressure sensing element of the first preferred embodiment of the present invention, FIG. 5A for a schematic diagram of the second pressure sensing element of the first preferred embodiment of the present invention, and FIG. 5B for a schematic diagram of the second pressure sensing element of the first preferred embodiment of the present invention.
參閱圖4A以及4B，說明第一壓力感測元件20的感測方式。圖4A為觸控板40未被觸壓狀態，此狀態時，基板10並不會產生型變，因此設置在基板10上的第一壓力感測元件20不會產生訊號。圖4B顯示觸控板40被觸壓時，觸壓力使基板10產生些微的彎曲變形，第一壓力感測元件20感測10基板的型變而產生訊號。 Refer to Figures 4A and 4B to explain the sensing method of the first pressure sensing element 20. Figure 4A shows the touch panel 40 is not touched. In this state, the substrate 10 does not deform, so the first pressure sensing element 20 disposed on the substrate 10 does not generate a signal. Figure 4B shows that when the touch panel 40 is touched, the pressure causes the substrate 10 to bend slightly, and the first pressure sensing element 20 senses the deformation of the substrate 10 and generates a signal.
參閱圖5A以及5B，說明複數第二壓力感測元件30的感測方式，圖中僅顯示其中單一個第二壓力感測元件30a為例說明，其他的第二壓力感測元件30b、30c、30d、30e、30f也可達成同樣的效果。圖5A為觸控板40未被觸壓狀態，此狀態時，觸控板40與基板10上的第二壓力感測元件30二者之間維持一第一距離S1。當使用者U觸壓觸控板40時，觸壓力使觸控板40往基板10方向靠近，使觸控板40與基板10二者之間的距離改變，導致觸控板40與基板10上的第二壓力感測元件30二者之間的距離縮小成為一第二距離S2，第二壓力感測元件30感測距離改變，而產生訊號。 Referring to FIG. 5A and FIG. 5B , the sensing method of the plurality of second pressure sensing elements 30 is described. The figure shows only a single second pressure sensing element 30a as an example. The other second pressure sensing elements 30b, 30c, 30d, 30e, and 30f can also achieve the same effect. FIG. 5A shows the touch panel 40 in an untouched state. In this state, the touch panel 40 and the second pressure sensing element 30 on the substrate 10 maintain a first distance S1. When the user U touches the touch panel 40, the touch pressure causes the touch panel 40 to approach the substrate 10, causing the distance between the touch panel 40 and the substrate 10 to change, resulting in the distance between the touch panel 40 and the second pressure sensing element 30 on the substrate 10 to shrink to a second distance S2. The second pressure sensing element 30 senses the distance change and generates a signal.
本創作使用之第一壓力感測元件20為微機電壓力感測器，複數第二壓力感測元件30為電容式壓力感測器。 The first pressure sensing element 20 used in this invention is a micro-electromechanical pressure sensor, and the plurality of second pressure sensing elements 30 are capacitive pressure sensors.
進一步說明本創作的觸壓感測方式，請參閱圖6本創作第一較佳實施例之觸控模組之平面示意圖，圖7A本創作第一較佳實施例之壓力感測流程示意圖，圖7B本創作第一較佳實施例之壓力感測流程示意圖，以及圖7C本創作第一較佳實施例之壓力感測流程示意圖。 For further explanation of the touch sensing method of the present invention, please refer to FIG6 for a schematic diagram of the touch module of the first preferred embodiment of the present invention, FIG7A for a schematic diagram of the pressure sensing process of the first preferred embodiment of the present invention, FIG7B for a schematic diagram of the pressure sensing process of the first preferred embodiment of the present invention, and FIG7C for a schematic diagram of the pressure sensing process of the first preferred embodiment of the present invention.
參閱圖6與圖7A。觸控板40的第一區域401受到觸壓時，會在第一區域401產生一第一觸壓點4011，此時第一觸壓點4011的觸壓力會使基板10產生型變(示於圖4B)，第一壓力感測元件20感測到型變而產生一第一訊號201。微控制器M將第一訊號201傳遞至訊號處理器D，訊號處理器D接收第一訊號201並產生觸壓訊號D1。 Refer to Figure 6 and Figure 7A. When the first area 401 of the touch panel 40 is pressed, a first pressure point 4011 is generated in the first area 401. At this time, the pressure of the first pressure point 4011 causes the substrate 10 to deform (as shown in Figure 4B). The first pressure sensing element 20 senses the deformation and generates a first signal 201. The microcontroller M transmits the first signal 201 to the signal processor D, and the signal processor D receives the first signal 201 and generates a pressure signal D1.
參閱圖6與圖7B。觸控板40的第二區域402受到觸壓時，在第二區域402產生一第二觸壓點4021，第二觸壓點4021的觸壓力使觸控板40往基板10(示於圖5B)方向靠近，觸控板40與基板10二者間的距離改變，同時在複數第二壓力感測元件30中與第二觸壓點4021的距離位置最接近的是位於右上的第二壓力感測元件30c，因此第二壓力感測元件30c會靈敏地感測到觸控板40與基板10的距離改變，並產生一第二訊號301。微控制器M將第二訊號301傳遞至訊號處理器D，訊號處理器D接收第二訊號301並產生觸壓訊號D1。 Refer to Figure 6 and Figure 7B. When the second area 402 of the touch panel 40 is touched, a second touch point 4021 is generated in the second area 402. The touch pressure of the second touch point 4021 causes the touch panel 40 to approach the substrate 10 (shown in Figure 5B), and the distance between the touch panel 40 and the substrate 10 changes. At the same time, the second pressure sensing element 30c located at the upper right is the closest to the second touch point 4021 among the plurality of second pressure sensing elements 30. Therefore, the second pressure sensing element 30c will sensitively sense the change in the distance between the touch panel 40 and the substrate 10 and generate a second signal 301. The microcontroller M transmits the second signal 301 to the signal processor D, and the signal processor D receives the second signal 301 and generates a touch signal D1.
參閱圖6與圖7C。觸控板40的第三區域403受到觸壓時，在第三區域403產生一第三觸壓點4031，第三觸壓點4031的觸壓力使基板10產生型變，同時使觸控板40往基板10(示於圖5B)方向靠近，第一壓力感測元件20感測到型變而產生第一訊號201，並且與第三觸壓點4031的距離最接近的第二壓力感測元件30a感測到觸控板40與基板10的距離改變，產生第二訊號301。 See Figure 6 and Figure 7C. When the third area 403 of the touch panel 40 is touched, a third touch point 4031 is generated in the third area 403. The touch pressure of the third touch point 4031 causes the substrate 10 to deform and the touch panel 40 to move closer to the substrate 10 (shown in Figure 5B). The first pressure sensing element 20 senses the deformation and generates a first signal 201. The second pressure sensing element 30a closest to the third touch point 4031 senses the change in the distance between the touch panel 40 and the substrate 10 and generates a second signal 301.
由於第三區域403受到觸壓時，第一壓力感測元件20與複數第二壓力感測元件30二者皆可感測到第三區域403，因此第三區域403中第三觸壓點4031的觸壓將會同時產生第一訊號201以及第二訊號301。此時，若第一壓力感 測元件20產生的第一訊號201的訊號強度大於第二壓力感測元件30a產生的第二訊號301的訊號強度時，則微控制器M傳遞較強的第一訊號201至訊號處理器D，訊號處理器D接收並產生觸壓訊號D1。若第一壓力感測元件20產生的第一訊號201的訊號強度小於第二壓力感測元件30a產生的第二訊號301的訊號強度時，微控制器M傳遞較強的第二訊號301至訊號處理器D，訊號處理器D接收並產生觸壓訊號D1。另外，微控制器M也可以不判斷第一訊號201與第二訊號301的二者訊號強弱，同時將第一訊號201與第二訊號301一起傳遞至訊號處理器D，訊號處理器D也可接收並產生觸壓訊號D1。 Since the first pressure sensing element 20 and the plurality of second pressure sensing elements 30 can both sense the third area 403 when the third area 403 is touched, the touch of the third touch point 4031 in the third area 403 will simultaneously generate the first signal 201 and the second signal 301. At this time, if the signal strength of the first signal 201 generated by the first pressure sensing element 20 is greater than the signal strength of the second signal 301 generated by the second pressure sensing element 30a, the microcontroller M transmits the stronger first signal 201 to the signal processor D, and the signal processor D receives and generates the touch signal D1. If the signal strength of the first signal 201 generated by the first pressure sensing element 20 is less than the signal strength of the second signal 301 generated by the second pressure sensing element 30a, the microcontroller M transmits the stronger second signal 301 to the signal processor D, which receives and generates a touch signal D1. In addition, the microcontroller M may not determine the signal strength of the first signal 201 and the second signal 301, and transmit the first signal 201 and the second signal 301 to the signal processor D at the same time, and the signal processor D may also receive and generate a touch signal D1.
上所述僅為本創作的較佳實施例，凡其他未脫離本創作所揭示的精神下所完成的等效改變或修飾，均應包含于本創作的範圍內。 The above is only the best implementation example of this creation. Any other equivalent changes or modifications that do not deviate from the spirit revealed by this creation should be included in the scope of this creation.
1:觸控模組 1: Touch module
10:基板 10: Substrate
11:頂面 11: Top
20:第一壓力感測元件 20: First pressure sensing element
30:第二壓力感測元件 30: Second pressure sensing element
30a:第二壓力感測元件 30a: Second pressure sensing element
30b:第二壓力感測元件 30b: Second pressure sensing element
30c:第二壓力感測元件 30c: Second pressure sensing element
30d:第二壓力感測元件 30d: Second pressure sensing element
30e:第二壓力感測元件 30e: Second pressure sensing element
30f:第二壓力感測元件 30f: Second pressure sensing element
40:觸控板 40: Touch panel
41:接觸平面 41: Contact plane
42:底面 42: Bottom
43:電路層 43: Circuit layer
111:基板中心區域 111: Central area of substrate
112:外圍部 112: Outer periphery
201:第一訊號 201: First signal
301:第二訊號 301: Second signal
401:第一區域 401: First area
402:第二區域 402: Second area
403:第三區域 403: The third area
411:觸控板中心區域 411: Touch panel center area
412:外周緣 412: Periphery
4011:第一觸壓點 4011: First contact point
4021:第二觸壓點 4021: Second contact point
4031:第三觸壓點 4031: Third contact point
C:電腦設備 C: Computer equipment
D:訊號處理器 D:Signal processor
D1:觸壓訊號 D1: Touch signal
M:微控制器 M: Microcontroller
S1:第一距離 S1: First distance
S2:第二距離 S2: Second distance
U:使用者 U: User
圖1係本創作第一較佳實施例之觸控模組與電腦裝置之立體圖。 Figure 1 is a three-dimensional diagram of the touch module and computer device of the first preferred embodiment of this invention.
圖2係本創作第一較佳實施例之觸控模組之立體圖。 Figure 2 is a three-dimensional diagram of the touch module of the first preferred embodiment of this invention.
圖3係本創作第一較佳實施例之觸控模組之立體分解圖。 Figure 3 is a three-dimensional exploded view of the touch module of the first preferred embodiment of this invention.
圖4A係本創作第一較佳實施例之第一壓力感測元件示意圖。 Figure 4A is a schematic diagram of the first pressure sensing element of the first preferred embodiment of the present invention.
圖4B係本創作第一較佳實施例之第一壓力感測元件示意圖。 Figure 4B is a schematic diagram of the first pressure sensing element of the first preferred embodiment of the present invention.
圖5A係本創作第一較佳實施例之第二壓力感測元件示意圖。 Figure 5A is a schematic diagram of the second pressure sensing element of the first preferred embodiment of the present invention.
圖5B係本創作第一較佳實施例之第二壓力感測元件示意圖。 Figure 5B is a schematic diagram of the second pressure sensing element of the first preferred embodiment of the present invention.
圖6係本創作第一較佳實施例之觸控模組之平面示意圖。 Figure 6 is a plan view of the touch module of the first preferred embodiment of this invention.
圖7A係本創作第一較佳實施例之壓力感測流程示意圖。 Figure 7A is a schematic diagram of the pressure sensing process of the first preferred embodiment of this invention.
圖7B係本創作第一較佳實施例之壓力感測流程示意圖。 Figure 7B is a schematic diagram of the pressure sensing process of the first preferred embodiment of the present invention.
圖7C係本創作第一較佳實施例之壓力感測流程示意圖。 Figure 7C is a schematic diagram of the pressure sensing process of the first preferred embodiment of the present invention.
1:觸控模組 1: Touch module
10:基板 10: Substrate
11:頂面 11: Top
40:觸控板 40: Touch panel
41:接觸平面 41: Contact plane
401:第一區域 401: First area
402:第二區域 402: Second area
403:第三區域 403: The third area
411:觸控板中心區域 411: Touch panel center area
412:外周緣 412: Periphery
Claims (13)
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| TW113202701U TWM659878U (en) | 2024-03-18 | 2024-03-18 | Touch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113202701U TWM659878U (en) | 2024-03-18 | 2024-03-18 | Touch module |
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| Publication Number | Publication Date |
|---|---|
| TWM659878U true TWM659878U (en) | 2024-09-01 |
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