TWM659163U - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a chamber, a heat dissipation fin set, a heat exchanging fin set and a pump. The chamber includes an inlet and an outlet. The heat dissipation fin set is disposed in the chamber. The heat exchanging fin set is disposed in the chamber and the heat dissipation fin set is disposed between inlet and the heat exchanging fin set. The pump is coupled to the inlet and the outlet to drive heat dissipation liquid flowing into the chamber through the inlet and flowing along a flowing path back to the pump through the outlet.

Description

Heat sink

This disclosure relates to a heat dissipation device.

The loop cooling device currently commonly used at the heat source of electronic devices mainly includes a condensing plate, a loop duct, a heat sink and a cooling liquid. The loop duct is connected between the condensing plate and the heat sink, the cooling liquid flows in the loop duct, the condensing plate is thermally coupled to the heat source, and the heat sink may include cooling fins and/or fans, so that the cooling liquid brings the heat energy from the condensing plate to the heat sink for dissipation, thereby achieving the cooling effect.

However, the above heat dissipation device has the following disadvantages. Usually, the number of loop-type ducts needs to correspond to the number of heat sources to provide heat dissipation for each heat source, thus occupying a larger space, and the loop-type duct is only used for drainage and has no heat dissipation function, so that the heat dissipation device cannot have the advantages of light volume and high heat dissipation efficiency at the same time.

The present disclosure provides a heat dissipation device, which includes a cavity, a heat dissipation fin assembly, a heat exchange fin assembly, and a pump. The cavity includes at least one liquid inlet and at least one liquid outlet. The heat dissipation fin assembly is disposed in the cavity. The heat exchange fin assembly is disposed in the cavity, and the heat dissipation fin assembly is located between the liquid inlet and the heat exchange fin assembly. The pump is coupled to the liquid inlet and the liquid outlet to drive the heat dissipation liquid to flow from the liquid inlet into the cavity and flow back to the pump from the liquid outlet along the flow path.

Based on the above, the heat dissipation device disclosed in the present invention includes a cavity for accommodating heat dissipation liquid, a heat dissipation fin assembly and a heat exchange fin assembly disposed in the cavity, and a pump coupling the liquid inlet and the liquid outlet of the cavity. The heat source can be disposed on the bottom surface of the cavity corresponding to the heat dissipation fin assembly. In this way, the heat energy generated by the heat source can be transferred to the heat dissipation fin assembly above, and the heat dissipation liquid is driven by the pump to enter the cavity from the liquid inlet and flow through the heat dissipation fin assembly to exchange heat with the heat dissipation fin assembly, and then flow through the heat exchange fin assembly to perform secondary heat exchange, and the heat exchange fin assembly is cooled and cooled. The heat dissipation liquid that has cooled down after flowing through the heat exchange fin assembly can then flow back to the pump through the liquid outlet for the next heat dissipation cycle. Therefore, the heat sink disclosed in the present invention can dissipate heat through the heat sink fin assembly and the heat exchange fin assembly during the flow of the heat sink liquid, and can dissipate heat for multiple heat sources at the same time without using multiple ducts to guide the heat sink liquid, thereby reducing the overall volume of the heat sink and promoting the heat dissipation efficiency of the heat sink.

10: Heat source

100: Heat dissipation device

110: Cavity

112: Liquid inlet

114: Liquid outlet

116:Separator

118: Bottom surface

120: Heat sink fin assembly

122: Heat sink fins

130: Heat exchange fin assembly

132: Heat exchange fins

140: Pump

150: External cooling fin assembly

160: Fan

D1, D2: spacing

P1: Flow path

Figure 1 is a three-dimensional schematic diagram of a heat dissipation device according to an embodiment of the present disclosure.

FIG2 is a schematic top view of a heat dissipation device according to an embodiment of the present disclosure.

FIG3 is a three-dimensional schematic diagram of a heat sink fin assembly of a heat sink device according to an embodiment of the present disclosure.

FIG4 is a three-dimensional schematic diagram of a heat exchange fin assembly of a heat dissipation device according to an embodiment of the present disclosure.

FIG5 is a schematic side view of a heat dissipation device according to an embodiment of the present disclosure.

The above-mentioned and other technical contents, features and effects of this disclosure will be clearly presented in the detailed description of each embodiment with reference to the following drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used for explanation, not for limiting this disclosure. In addition, in the following embodiments, the same or similar components will use the same or similar labels.

FIG. 1 is a three-dimensional schematic diagram of a heat dissipation device according to an embodiment of the present disclosure. FIG. 2 is a top view schematic diagram of a heat dissipation device according to an embodiment of the present disclosure. The heat dissipation device 100 of the present disclosure can be applied to electronic devices such as laptops, tablet computers, and desktop computers to dissipate heat from heat sources such as central processing units (CPUs) and graphics processing units (GPUs) in the electronic devices. Please refer to FIG. 1 and FIG. 2 at the same time. In some embodiments, the heat dissipation device 100 may include a cavity 110, a heat dissipation fin assembly 120, a heat exchange fin assembly 130, and a pump 140. In one embodiment, the materials of the components such as the cavity 110, the heat dissipation fin assembly 120, and the heat exchange fin assembly 130 may include materials with high thermal conductivity such as metals. Furthermore, the cavity 110, the heat sink fin assembly 120, and the heat exchange fin assembly 130 can be integrally formed, for example, by a computer numerical control (CNC) milling machine, a planer, or metal stamping. In other embodiments, the heat sink fin assembly 120 and the heat exchange fin assembly 130 can also be pre-fabricated and then fixed in the cavity 110 by welding or other methods. The present disclosure does not limit the manufacturing method of the heat sink 100. In the present embodiment, the heat sink fin assembly 120 and the heat exchange fin assembly 130 can be a skived fin assembly, but the present disclosure is not limited thereto.

In one embodiment, the cavity 110 may include a frame as shown in FIG. 1 and a cover covering the frame to form a cavity for containing a heat dissipation liquid (such as water). It should be noted that in order to clearly present the internal structure of the cavity 110, the cover is presented in a perspective manner. In this embodiment, the cavity 110 may include a liquid inlet 112 and a liquid outlet 114, so that the heat dissipation liquid can enter the cavity 110 from the liquid inlet 112 for circulation, and then flow out of the cavity 110 from the liquid outlet 114. In this embodiment, at least the frame of the cavity 110 can be integrally formed by a CNC milling machine or metal stamping technology, but the present disclosure is not limited thereto.

In some embodiments, the pump 140 is coupled to the liquid inlet 112 and the liquid outlet 114 to drive the heat dissipation liquid to flow from the liquid inlet 112 into the cavity 110 and flow along the flow path P1 in the cavity 110 for heat exchange, and then flow back to the pump 140 from the liquid outlet 114. In this embodiment, the pump 140 can be a micro pump. For example, the width of the pump 140 is about 40 to 45 millimeters (mm), the length is about 50 to 55 mm, and the height is about 5.5 to 6 mm, but the present disclosure is not limited thereto.

In some embodiments, the heat sink fin assembly 120 and the heat exchange fin assembly 130 are both disposed in the cavity 110. Specifically, the heat sink fin assembly 120 can be disposed near the liquid inlet 112, and the heat exchange fin assembly 130 can be disposed farther from the liquid inlet 112 than the heat sink fin assembly 120. In other words, the heat sink fin assembly 120 is located between the liquid inlet 112 and the heat exchange fin assembly 130. The above relative positions refer to the flow path P1 of the heat dissipation liquid in the cavity 110 (as shown by the dotted arrow in FIG. 2 ). That is to say, the heat dissipation liquid flows along the flow path P1 in the cavity 110, first passing through the heat dissipation fin assembly 120 and then passing through the heat exchange fin assembly 130.

FIG5 is a schematic side view of a heat sink according to an embodiment of the present disclosure. Please refer to FIG1 and FIG5. In this embodiment, a heat source (such as the heat source 10 shown in FIG5) can be arranged at a position corresponding to the heat sink fin assembly 120 on the bottom surface of the cavity 110 and thermally coupled thereto. In other words, the position corresponding to the heat sink fin assembly 120 on the bottom surface of the cavity 110 can include a heat source setting portion (approximately equivalent to the dotted line area surrounding the heat sink fin assembly 120 as shown in FIG1), and the heat source 10 can be attached to the heat source setting portion via a colloid such as a thermal interface material. In this embodiment, the heat sink fin assembly 120 and the heat source setting portion at least partially overlap when viewed from the top view.

With such a configuration, the heat energy generated by the heat source 10 can be transferred to the upper heat sink fin assembly 120, and the heat sink liquid enters the chamber 110 from the liquid inlet 112 along the flow path P1 and flows through the heat sink fin assembly 120 to exchange heat with the heat sink fin assembly 120. Afterwards, the heat sink liquid that has been heated up after the heat exchange with the heat sink fin assembly 120 flows through the heat exchange fin assembly 130 to exchange heat with it, and the heat sink liquid that has been cooled down after flowing through the heat exchange fin assembly 130 flows out of the chamber 110 through the liquid outlet 114 and flows back to the pump 140 to perform the next heat dissipation cycle. In this embodiment, the number of heat sink fin assemblies 120 can be multiple (shown as two but not limited to this), and the corresponding bottom surfaces can form thermal coupling with different heat sources 10 respectively, that is, the heat sink device of this embodiment can simultaneously cool multiple heat sources 10. In addition, the number of heat exchange fin assemblies 130 can also be multiple (shown as two but not limited to this) to cool the heat dissipation liquid multiple times. This disclosure does not limit the number and configuration of the heat sink fin assemblies 120 and the heat exchange fin assemblies 130.

2 , in some embodiments, the heat sink fin assembly 120 includes a plurality of heat sink fins 122 , and the heat exchange fin assembly 130 includes a plurality of heat exchange fins 132 . In this embodiment, a distance D1 between the heat sink fins 122 is smaller than a distance D2 between the heat exchange fins 132 . With such configuration, when the cooling liquid flows through the cooling fin assembly 120, the flow rate is slow due to the small spacing D1 between the cooling fins 122, so that the cooling liquid and the cooling fins 122 can fully exchange heat. When the cooling liquid flows through the heat exchange fin assembly 130, the flow resistance is low due to the large spacing D2 between the heat exchange fins 132, so only a micro pump 140 with a small power is needed to drive the cooling liquid to flow through the heat exchange fin assembly 130 to complete the entire heat cycle, thereby reducing the overall volume of the cooling device 100.

FIG3 is a three-dimensional schematic diagram of a heat sink fin assembly of a heat sink according to an embodiment of the present disclosure. Referring to FIG2 and FIG3, in some embodiments, the cavity 110 further includes a partition plate 116, which is disposed between the liquid inlet 112 and the liquid outlet 114 to separate the liquid inlet 112 and the liquid outlet 114, and the partition plate 116 extends and distributes in the cavity 110 to define a flow path P1 as shown in FIG2 in the cavity 110. In other words, the partition plate 116 can define a heat sink flow channel for the heat dissipation liquid to flow in the cavity 110.

FIG. 4 is a three-dimensional schematic diagram of a heat exchange fin assembly of a heat sink according to an embodiment of the present disclosure. FIG. 5 is a side view schematic diagram of a heat sink according to an embodiment of the present disclosure. Please refer to FIG. 4 and FIG. 5 at the same time. In this embodiment, the heat sink 100 may further include an external cooling fin assembly 150, which is disposed on the bottom surface 118 of the cavity 110, and the external cooling fin assembly 150 is disposed at a position corresponding to the heat exchange fin assembly 130. In other words, when viewed from the top view, the heat exchange fin assembly 130 overlaps with the external cooling fin assembly 150.

Please refer to FIG. 2 and FIG. 5 again. In this embodiment, the heat dissipation device 100 may further include a fan 160, whose air outlet faces the external cooling fin assembly 150. With such a configuration, when the heat dissipation liquid that has heated up after heat exchange with the heat dissipation fin assembly 120 flows through the heat exchange fin assembly 130, it can not only undergo secondary heat exchange through the heat exchange fin assembly 130, but also transfer heat energy to the external cooling fin assembly 150 to further dissipate the heat to the outside. In addition, the cooling airflow provided by the fan 160 can further cool the external cooling fin assembly 150, thereby further promoting the cooling efficiency of the heat dissipation liquid.

In summary, the heat dissipation device disclosed herein includes a cavity for accommodating heat dissipation liquid, a heat dissipation fin assembly and a heat exchange fin assembly disposed in the cavity, and a pump coupling the liquid inlet and the liquid outlet of the cavity. The heat source can be disposed on the bottom surface of the cavity corresponding to the heat dissipation fin assembly. In this way, the heat energy generated by the heat source can be transferred to the heat dissipation fin assembly above, and the heat dissipation liquid is driven by the pump to enter the cavity from the liquid inlet and flow through the heat dissipation fin assembly to exchange heat with the heat dissipation fin assembly, and then flow through the heat exchange fin assembly to exchange heat for the second time. The heat dissipation liquid that has been cooled down by flowing through the heat exchange fin assembly can then flow back to the pump through the liquid outlet for the next heat dissipation cycle. Therefore, the heat sink disclosed in the present invention can dissipate heat through the heat sink fin assembly and the heat exchange fin assembly during the flow of the heat sink liquid, and can dissipate heat for multiple heat sources at the same time without using multiple ducts to guide the heat sink liquid, thereby reducing the overall volume of the heat sink and promoting the heat dissipation efficiency of the heat sink.

100: Heat dissipation device

110: Cavity

112: Liquid inlet

114: Liquid outlet

116:Separator

120: Heat sink fin assembly

122: Heat sink fins

130: Heat exchange fin assembly

132: Heat exchange fins

140: Pump

Claims (10)

A heat dissipation device includes: a cavity including at least one liquid inlet and at least one liquid outlet; a heat dissipation fin assembly disposed in the cavity; a heat exchange fin assembly disposed in the cavity, and the heat dissipation fin assembly is located between the liquid inlet and the heat exchange fin assembly; and a pump coupled to the liquid inlet and the liquid outlet to drive a heat dissipation liquid to flow from the liquid inlet into the cavity and flow back to the pump from the liquid outlet. A heat sink as described in claim 1, wherein the spacing between the multiple heat sink fins of the heat sink fin assembly is smaller than the spacing between the multiple heat exchange fins of the heat exchange fin assembly. A heat dissipation device as described in claim 1, wherein the cavity, the heat dissipation fin assembly and the heat exchange fin assembly are integrally formed. A heat dissipation device as described in claim 1, wherein the cavity further includes a partition plate, which is disposed between the liquid inlet and the liquid outlet and extends and is distributed in the cavity to define a flow path in the cavity. The heat dissipation device as described in claim 1 further includes an external cooling fin assembly disposed on the bottom surface of the cavity and corresponding to the heat exchange fin assembly. A heat sink as described in claim 5, wherein the heat exchange fin assembly overlaps the external cooling fin assembly when viewed from the top view. The heat dissipation device as described in claim 5 further includes a fan, whose air outlet faces the external cooling fin assembly. A heat dissipation device as described in claim 1, wherein the heat dissipation fin assembly includes a plurality of heat dissipation fin assemblies, and the heat exchange fin assembly includes a plurality of heat exchange fin assemblies. A heat dissipation device as described in claim 1, wherein the bottom surface of the cavity includes a heat source setting portion for attaching a heat source. A heat dissipation device as described in claim 9, wherein the heat dissipation fin assembly overlaps with the heat source setting portion in the orthographic projection direction.

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