TWM659025U - Electronic device - Google Patents
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- TWM659025U TWM659025U TW113205345U TW113205345U TWM659025U TW M659025 U TWM659025 U TW M659025U TW 113205345 U TW113205345 U TW 113205345U TW 113205345 U TW113205345 U TW 113205345U TW M659025 U TWM659025 U TW M659025U
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- 239000000463 material Substances 0.000 description 2
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Abstract
Description
本案是有關於一種電子裝置。This case relates to an electronic device.
現有的電子裝置,例如筆記型電腦,其對於機殼與主機板(或相關電路板)的組裝工藝仍須藉由螺絲等額外的鎖固件方能順利地將二者結合在一起。舉例來說,通常會在主機板上形成多個開孔,在機殼上形成多個螺柱,再將螺絲穿過開孔而鎖至螺柱,以完成電路板與機殼的結合。In existing electronic devices, such as laptops, the assembly process of the case and the motherboard (or related circuit board) still requires additional fasteners such as screws to smoothly combine the two. For example, a plurality of openings are usually formed on the motherboard, a plurality of studs are formed on the case, and screws are then passed through the openings and locked to the studs to complete the combination of the circuit board and the case.
但,上述組裝工藝明顯會對操作者帶來對應的困擾與不便。舉例來說,除了需要在機殼上成型出相關的結構(如前述之螺柱)之外,操作者也需藉助工具來完成上述結合,且螺絲的類型或數量還會隨著適配性或結合性的不同而相應地增加。如此一來,工序的繁雜程度增加,對於操作者的負擔明顯提高,無論是在操作方面或是管理方面,都存在相當的失誤風險。However, the above assembly process will obviously bring corresponding troubles and inconveniences to the operator. For example, in addition to the need to form relevant structures (such as the aforementioned studs) on the casing, the operator also needs to use tools to complete the above combination, and the type or number of screws will increase accordingly with the different adaptability or combination. In this way, the complexity of the process increases, the burden on the operator is significantly increased, and there is a considerable risk of error in both operation and management.
本案提供一種電子裝置,其對機殼與電路板提供無螺絲/免工具固定結構,以對電路板與機殼提供快速拆裝效果。The invention provides an electronic device, which provides a screwless/tool-free fixing structure for a casing and a circuit board, so as to provide a quick disassembly and assembly effect for the circuit board and the casing.
本案的電子裝置,包括機殼與電路板。機殼具有卡勾與凸件。電路板具有第一定位開口與第二定位開口。卡勾穿過第一定位開口而扣持電路板,凸件抵接於第二定位開口的側緣,以使電路板固定至機殼。The electronic device of the present invention comprises a housing and a circuit board. The housing has a hook and a protrusion. The circuit board has a first positioning opening and a second positioning opening. The hook passes through the first positioning opening to hold the circuit board, and the protrusion abuts against the side edge of the second positioning opening to fix the circuit board to the housing.
基於上述,在電子裝置的電路板與機殼的組裝過程中,機殼以卡勾穿過電路板的第一定位開口而扣持電路板,再加上機殼的凸件抵接於電路板的第二定位開口的側緣,即可完成上述組裝作業。簡單地說,電路板與機殼通過上述機構設置,而得以免除需以螺絲鎖固的現有技術,以提供構件快速拆裝的效果並有效地簡化工藝且降低操作者的負擔。Based on the above, during the assembly process of the circuit board and the housing of the electronic device, the housing uses a hook to pass through the first positioning opening of the circuit board to hold the circuit board, and the protrusion of the housing abuts against the side edge of the second positioning opening of the circuit board to complete the above assembly operation. In short, the circuit board and the housing are freed from the need for screw locking in the prior art through the above mechanism, so as to provide the effect of rapid disassembly and assembly of components, effectively simplify the process and reduce the burden on the operator.
圖1是依據本案一實施例的電子裝置的示意圖。圖2是圖1的電子裝置的部分構件示意圖。圖3A與圖3B分別繪示圖2的機殼與電路板。請同時參考圖1與圖2,其中以圖2為參考基準而提供直角座標X-Y-Z,同時將其套用至後續圖式,以利於後續的構件描述。在本實施例中,電子裝置100,在此以筆記型電腦為例但不以此為限,其包括機殼110與電路板120,其中本實施例是以筆記型電腦的主機與設置其內的主機板為例,且機殼110具有彼此相對的外表面S1與內表面S2,外表面S1即是筆記型電腦的鍵盤、觸控板所暴露之表面,且供螢幕閉闔於主機時承靠之用,如圖1所示,而內表面S2則是面對筆記型電腦的主機內部空間。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of some components of the electronic device of FIG. 1 . FIG. 3A and FIG. 3B respectively illustrate the housing and the circuit board of FIG. 2 . Please refer to FIG. 1 and FIG. 2 simultaneously, wherein the rectangular coordinates X-Y-Z are provided with reference to FIG. 2 and are applied to the subsequent drawings to facilitate the subsequent component description. In the present embodiment, the
在本實施例中,機殼110具有卡勾113與凸件114。電路板120具有第一定位開口121、122與第二定位開口123,其中藉由卡勾113穿過第一定位開口121、122而扣持電路板120,且藉由凸件114抵接於第二定位開口123的側緣123a、123b、123c,即能讓電路板120固定至機殼110。反之,解除上述構件的扣持與抵接關係,即能順利地將電路板120與機殼110分離。In this embodiment, the
圖3A與圖3B分別繪示圖2的機殼與電路板。請先參考圖2與圖3B,詳細來說,本實施例的機殼110包括部件111與部件112,其中部件111具有前述之外表面S1且例如是塑膠材質的外觀部件,而部件112具有前述之內表面S2,且例如是金屬材質的內部支架或支撐板。本實施例的卡勾113與凸件114即是以成型(或設置)於部件112上為例,但不以此為限。舉例來說,於其他實施例中,卡勾113與凸件114也可改為成型(或設置)於部件111,或部件111、112是塑膠材質的一體成型結構,或部件111、112是金屬材質的一體成型結構。FIG. 3A and FIG. 3B respectively illustrate the housing and circuit board of FIG. 2 . Please refer to FIG. 2 and FIG. 3B . In detail, the
如圖3B所示,卡勾113包括從部件112朝正Z軸方向延伸出的連接部113a,以及從連接部113a朝正Y軸方向延伸出的勾部113b。在此,為了便於描述後續的構件對應關係,故將卡勾113的延伸方向定義為勾部113b的朝向,也就是朝向正Y軸方向。在實際製作時,本實施例的卡勾113例如是從金屬材質的部件112進行沖壓、彎折而成。再者,本實施例的第一定位開口121、122呈擴孔,且其擴展方向是沿著Y軸,因此能將擴孔的擴展方向與卡勾113的延伸方向視為一致。在此,擴孔的目的在於供卡勾113能在其中移動,因此如圖3A所示,第一定位開口121是開放輪廓,而第一定位開口122是封閉輪廓,但均在Y軸上具備可供卡勾113移動的空間而符合前述擴孔結構之特徵。As shown in FIG. 3B , the
請同時參考圖2、圖3A與圖3B,如此一來,在組裝過程中,操作者對電路板120施予沿Y軸滑動,即能讓卡勾113落入第一定位開口121、122,並在第一定位開口121、122中持續地沿Y軸滑動,而最終使勾部113b沿Z軸扣持在電路板120的表面S3上。在此,電路板120具有彼此相對的兩個表面S3、S4,而第一定位開口121、122連通在表面S3、S4之間。卡勾113從機殼110的內表面S2延伸出,以利於卡勾113的勾部113b扣持電路板120的表面S3時,讓電路板120的表面S4承靠在內表面S2上。另需提及的是,在符合前述卡勾113與第一定位開口121、122相對運動所需條件之下,本實施例並未限制第一定位開口121、122在電路板120上的位置與數量,即第一定位開口121、122可位於電路板120的周緣(例如第一定位開口121)或內部(例如第一定位開口122)。Please refer to FIG. 2, FIG. 3A and FIG. 3B at the same time. In this way, during the assembly process, the operator slides the
再者,本實施例的卡勾113還具有凸起113c,電路板120還具有接地部124,且機殼110的部件112例如是金屬材質而具有導電性,以在卡勾113扣持電路板120的表面S3時,能通過凸起113c抵接且電性連接於接地部124,而使機殼110能對電路板120提供接地效果。Furthermore, the
另一方面,如圖3B所示,本實施例的凸件114例如是將金屬材質的部件112進行沖壓而突出於內表面S2上。同時參考圖2、圖3A與圖3B,凸件114適配於第二定位開口123,如圖3A所示,第二定位開口123位於電路板120的周緣、呈開放輪廓且具有三個側緣123a、123b、123c,其中側緣123c鄰接在側緣123a、123b之間,且開放方向是朝向正Y軸方向。據以當凸件114落入第二定位開口123時,凸件114會抵接於側緣123a、123b、123c而產生定位效果。On the other hand, as shown in FIG3B , the
圖4是圖2的機殼與電路板的俯視圖。圖5A至圖5D分別是圖4沿剖線B-B’的剖視圖。基於前述的構件配置,在此提供圖5A至圖5D的局部剖視以敘明電路板120與機殼110的組裝過程。如圖4所取剖線B-B’,其通過一個卡勾113與第一定位開口121,以及凸件114與第二定位開口123。FIG. 4 is a top view of the housing and circuit board of FIG. 2 . FIG. 5A to FIG. 5D are cross-sectional views taken along the section line B-B′ of FIG. 4 . Based on the aforementioned component configuration, partial cross-sectional views of FIG. 5A to FIG. 5D are provided here to illustrate the assembly process of the
請先參考圖5A與圖5B,在圖5A中,操作者通過將電路板120置於卡勾113上方並驅動電路板120朝負Y軸方向移動而開始組裝工序,直至圖5B所示,電路板120的第一定位開口121套入卡勾113(或可視為卡勾113落入第一定位開口121)。接著,操作者繼續驅動電路板120朝負Y軸方向移動,並同時向下(負Z軸方向)施壓於電路板120,以讓卡勾113在第一定位開口121中移動,直至電路板120在第一定位開口121的周邊結構被卡勾113鎖扣持,而如圖5C所示。需說明的是,由於此時在第二定位開口123處的周邊結構仍抵靠在凸件114上,且因電路板120具彈性,因此可在瞬間受力而彎折變形。最終,操作者維持前述施壓並繼續驅動電路板120朝負Y軸方向移動,而讓第二定位開口123套合且扣持於凸件114。屆此,即完成電路板120與機殼110的組裝工序。Please refer to FIG. 5A and FIG. 5B first. In FIG. 5A , the operator starts the assembly process by placing the
請參考圖5D並對照圖2,機殼110與電路板120能進行有效地組裝結合,即在於卡勾113與第一定位開口121、122以及凸件114與第二定位開口123共同產生X-Y平面上的定位,而卡勾113與第一定位開口121、122還產生沿X-Y平面之法線方向(即Z軸方向)的定位,其中於組裝後,電路板120是平行於或座落於X-Y平面。進一步地說,凸件114與第二定位開口123經由側緣123a、123b而產生第一軸向(X軸)的定位,而卡勾113與第一定位開口121、122以及凸件114與第二定位開口123共同產生第二軸向(Y軸)的定位,且卡勾113與第一定位開口121、122還產生沿第三軸向(Z軸)的定位。第一軸向、第二軸向與第三軸向彼此正交,且電路板120平行於或座落於由第一軸向與第二軸向所構成的平面(X-Y平面)。Please refer to FIG. 5D and compare it with FIG. 2 . The
更進一步地說,卡勾113的連接部113a會抵接至第一定位開口121的側緣121a(第一定位開口122亦同,在此省略),而凸件114抵接於第二定位開口123的側緣123c。如此一來,雖然在第一定位開口121處無法阻擋電路板120朝正Y軸方向移動,但第二定位開口123卻正好以側緣123c阻擋電路板120前述移動,反之亦然,進而使電路板120與機殼110達到Y軸方向的定位及扣持效果。如此,便能搭配凸件114與第二定位開口123而產生X-Y平面的定位效果。Specifically, the connecting
圖6是本案另一實施例的電路板與機殼的局部示意圖。請參考圖6並對照圖2,有別於圖2所示實施例中,第二定位開口123是開放輪廓,本實施例的第二定位開口223則是封閉輪廓而具有依序鄰接的四個側緣223a、223c、223b、223d。如此一來,凸件214的外型輪廓抵接於側緣223a、223c、223b、223d而得以完全適配於第二定位開口223。據此,僅以凸件214與第二定位開口223便能提供X軸的定位與Y軸的定位,而達到X-Y平面的定位效果。FIG6 is a partial schematic diagram of a circuit board and a housing of another embodiment of the present invention. Please refer to FIG6 and compare it with FIG2. Unlike the embodiment shown in FIG2, in which the second positioning opening 123 is an open profile, the second positioning opening 223 of the present embodiment is a closed profile and has four
綜上所述,在本案的上述實施例中,在電子裝置的電路板與機殼的組裝過程中,機殼以卡勾穿過電路板的第一定位開口而扣持電路板,再加上機殼的凸件抵接於電路板的第二定位開口的側緣,即可完成上述組裝作業。In summary, in the above-mentioned embodiment of the present case, during the assembly process of the circuit board and the case of the electronic device, the case uses a hook to pass through the first positioning opening of the circuit board to hold the circuit board, and the protrusion of the case abuts against the side edge of the second positioning opening of the circuit board to complete the above-mentioned assembly operation.
再者,卡勾與凸件還進一步地通過第二定位開口的開放輪廓或封閉輪廓,而達到不同的定位效果。在一實施例中,第二定位開口是開放輪廓,因此凸件除了與第二定位開口達成第一軸向的定位之外,還需搭配卡勾與第一定位開口的結構抵接,而完成第二軸向的定位。在另一實施例中,第二定位開口是封閉輪廓,因此僅以凸件與第二定位開口的結構適配關係即能完成平面的定位。Furthermore, the hook and the protrusion can further achieve different positioning effects through the open contour or the closed contour of the second positioning opening. In one embodiment, the second positioning opening is an open contour, so the protrusion not only achieves positioning in the first axial direction with the second positioning opening, but also needs to cooperate with the hook to abut the structure of the first positioning opening to complete the positioning in the second axial direction. In another embodiment, the second positioning opening is a closed contour, so the plane positioning can be completed only by the structural adaptation relationship between the protrusion and the second positioning opening.
但,無論何者,電路板與機殼通過上述機構設置,皆能順利地取得三維空間的定位效果,據以達到所需的結合卡扣目的的前提下,還進一步地免除需以螺絲鎖固的現有技術,以對電子裝置提供構件快速拆裝的效果並有效地簡化工藝且降低操作者的負擔。However, no matter which one, the circuit board and the housing can smoothly obtain the three-dimensional spatial positioning effect through the above-mentioned mechanism setting, thereby achieving the required combination and buckling purpose, and further eliminating the need for screw locking in the existing technology, so as to provide the electronic device with the effect of rapid component disassembly and assembly, effectively simplify the process and reduce the burden on the operator.
100:電子裝置
110:機殼
111、112:部件
113:卡勾
114、214:凸件
120:電路板
121、122:第一定位開口
121a、122a、123a、123b、123c:側緣
123、223:第二定位開口
223a、223b、223c、232d:側緣
124:接地部
B-B’:剖線
S1:外表面
S2:內表面
S3、S4:表面
X-Y-Z:直角座標
100: electronic device
110:
圖1是依據本案一實施例的電子裝置的示意圖。 圖2是圖1的電子裝置的部分構件示意圖。 圖3A與圖3B分別繪示圖2的機殼與電路板。 圖4是圖2的機殼與電路板的俯視圖。 圖5A至圖5D分別是圖4沿剖線B-B’的剖視圖。 圖6是本案另一實施例的電路板與機殼的局部示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of some components of the electronic device of FIG. 1 . FIG. 3A and FIG. 3B respectively illustrate the housing and circuit board of FIG. 2 . FIG. 4 is a top view of the housing and circuit board of FIG. 2 . FIG. 5A to FIG. 5D are cross-sectional views of FIG. 4 along section line B-B’. FIG. 6 is a partial schematic diagram of a circuit board and housing of another embodiment of the present invention.
110:機殼 110: Chassis
111、112:部件 111, 112: Parts
113:卡勾 113: Hook
114:凸件 114: convex parts
120:電路板 120: Circuit board
121、122:第一定位開口 121, 122: First positioning opening
121a、122a、123a、123b、123c:側緣 121a, 122a, 123a, 123b, 123c: side edge
123:第二定位開口 123: Second positioning opening
124:接地部 124: Grounding part
S1:外表面 S1: External surface
S2:內表面 S2: Inner surface
S3:表面 S3: Surface
X-Y-Z:直角座標 X-Y-Z: Cartesian coordinates
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113205345U TWM659025U (en) | 2024-05-24 | 2024-05-24 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113205345U TWM659025U (en) | 2024-05-24 | 2024-05-24 | Electronic device |
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| Publication Number | Publication Date |
|---|---|
| TWM659025U true TWM659025U (en) | 2024-08-01 |
Family
ID=93261007
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| Application Number | Title | Priority Date | Filing Date |
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| TW113205345U TWM659025U (en) | 2024-05-24 | 2024-05-24 | Electronic device |
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| TW (1) | TWM659025U (en) |
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2024
- 2024-05-24 TW TW113205345U patent/TWM659025U/en unknown
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