TWM657376U - Wafer grinding equipment with tracking and pick-and-place alignment wafer rack - Google Patents

Abstract

The invention provides a wafer polishing device with the function of tracking and placing and aligning wafer racks, including a plurality of wafer racks, a driving device, a polishing device, a front stage, a rear stage, a transfer device and a control unit, wherein each of the wafer racks is respectively penetrated by a plurality of positioning holes for positioning wafers at intervals, and each of the wafer racks is respectively formed with an identification mark for distinguishing and identifying each of the wafer racks, a first positioning mark for identifying the configuration center of each of the positioning holes, and a hole position mark for identifying each of the positioning holes. The invention can transfer a plurality of wafers at one time, and bind the first configuration mark, the identification mark and the hole position mark corresponding to each of the wafers, so as to form a polishing record that is conducive to tracking the processing history of each of the wafers.

Description

Wafer polishing equipment with tracking and placement of wafer racks

This invention relates to an equipment component used in the wafer polishing process, in particular, a wafer polishing equipment with tracking and placement and alignment of wafer racks.

The wafer polishing equipment includes a plurality of wafer racks, a driving device, a polishing device and a transfer device, wherein each of the wafer racks is arranged on the driving device at intervals along a circular path, the driving device drives each of the wafer racks to run along the circular path in a planetary cycle, and each of the wafer racks rotates around its radial center, each of the wafer racks passes through a plurality of positioning holes, and each of the positioning holes is respectively Used to position and set a wafer, the grinding device has two grinding plates, each of which performs grinding processing on the two surfaces of each wafer set on each wafer rack, each of which is located on two opposite sides of the wafer in the thickness direction, and the transfer device is used to transfer each wafer to each positioning hole, and transfer each wafer away from the wafer rack after completing the grinding process.

The transfer device includes a pick-and-place unit, a processing unit and a robot arm, wherein the pick-and-place unit is arranged at the working end of the robot arm, and the pick-and-place unit includes a vacuum suction cup, a lifting structure and an image capturer, wherein the vacuum suction cup is used to attract and release the wafer, the lifting structure is used to control the lifting of the vacuum suction cup, and the image capturer is used to capture the image of the positioning hole. The processing unit is mainly composed of an electronic circuit with a microprocessor, which is used to run an image recognition program. The processing unit recognizes the image captured by the image capturer and controls the vacuum suction cup, the lifting structure and the robot arm based on the recognition result.

The vacuum suction cup attracts the wafer to be polished, and then the robot arm is actuated to move the pick-and-place unit to the top of the positioning hole where the wafer is predetermined to be set. The image capturer captures the image of the positioning hole. The processing unit identifies whether the wafer is aligned with the positioning hole based on the image. The processing unit controls the robot arm to actuate according to the deviation value of the wafer and the positioning hole, so that the wafer is aligned with the positioning hole. When the processing unit determines that the wafer is aligned with the positioning hole, the lifting structure is controlled to actuate to lower the vacuum suction cup. When the wafer enters the positioning hole, the vacuum suction cup releases the wafer and sets the wafer in the selected positioning hole. The above operations are repeated to set multiple wafers in different positioning holes one by one.

After the polishing process is completed, the transfer device will transfer the polished wafers one by one. When each wafer is transferred from the wafer rack, the transfer device also needs to perform image recognition and alignment, so that the vacuum suction cup can accurately align and attract the wafer, and the wafer can be transferred from the wafer rack and placed in the set position to prepare for the execution of the next process.

The grinding device needs to spend a long time waiting for the transfer device to transfer multiple wafers to be ground to each wafer rack and to transfer multiple wafers that have been ground away between two grinding processes. The overall efficiency of the wafer grinding equipment in performing the grinding process needs to be improved.

Each wafer needs to record its processing history separately. The grinding process of the wafer not only needs to record the grinding time of the grinding wafer, but also needs to record the wafer rack and the positioning hole where the wafer is positioned. The transfer device cannot identify the wafer rack and the positioning hole where each wafer is transferred and positioned, which is not conducive to tracking the processing history of each wafer.

The main purpose of this invention is to provide a wafer polishing device with tracking and placement of wafer racks.

To achieve the above-mentioned purpose, the invention adopts the following technical solutions: a wafer polishing device with tracking and placement of wafer racks, including a plurality of wafer racks, a driving device, a polishing device, a front stage, a rear stage, a transfer device and a control unit, wherein each of the wafer racks is arranged at intervals on the driving device, and each of the wafer racks is respectively spaced through a plurality of positioning holes, and each of the positioning holes is respectively used for A wafer is positioned, and the grinding device is arranged above the driving device, and is used to grind each wafer; each wafer rack is formed with an identification mark, and each identification mark is used to distinguish and identify each wafer rack; each wafer rack is formed with a first positioning mark, and the first positioning mark is used to identify the configuration center of each positioning hole; each wafer rack is formed with a plurality of hole position marks, and each hole position mark is used to identify the center of each positioning hole; The marks are respectively adjacent to each positioning hole, and each hole position mark is used to distinguish and identify each positioning hole; the front stage cooperates with the number and configuration relationship of each positioning hole of each wafer rack to form several first configuration structures and several first configuration marks for setting the wafer to be polished, and each first configuration mark is used to distinguish and identify each first configuration structure, and the front stage forms a second positioning mark, and the second positioning mark is used to identify the configuration center of each first configuration structure; the rear stage cooperates with the number and configuration relationship of each positioning hole of each wafer rack to form several second configuration structures for setting the polished wafer, and the rear stage forms a third positioning mark, and the third positioning mark is used to identify the configuration center of each second configuration structure; The The transfer device includes a pick-and-place unit and a robot arm, wherein the pick-and-place unit is arranged at the working end of the robot arm, and the pick-and-place unit includes an adjustment module, a plurality of lifters, a plurality of suction cup modules and an image capturer, wherein the adjustment module is connected to the robot arm and has a driven rotational setting seat, and each of the lifters is arranged at intervals on the radial periphery of the setting seat around the rotation center of the setting seat. Each of the lifters is connected to each of the suction cup modules, so that each of the lifters drives each of the suction cup modules to move up and down to approach or move away from each of the wafers. Each of the suction cup modules includes at least one vacuum suction cup for sucking and releasing the wafer. The image capturer is connected to the adjustment module for capturing images. The control unit is mainly composed of an electronic circuit, which includes a programmable controller. , a storage medium and a microprocessor, wherein the programmable controller and the storage medium are electrically connected to the microprocessor respectively, the programmable controller is electrically connected to the pick-and-place unit and the robot arm, the storage medium is a readable and writable memory medium for storing the grinding records of each wafer, the microprocessor is electrically connected to the image capturer; the microprocessor runs an image recognition program to recognize the The image capturer captures the image of the wafer rack, and based on the recognition result, the programmable controller controls the robot arm and the pick-and-place unit, so as to place or take out multiple wafers at one time. The microprocessor binds each wafer, and the first configuration mark, the identification mark and the hole mark corresponding to each wafer are set to form multiple grinding records corresponding to each wafer.

By means of this innovative structural form and technical features, compared with the previous technology, this invention can transfer multiple wafers to the selected wafer rack at one time. After the grinding process is completed, multiple wafers can be taken out from the wafer rack at one time, thereby improving the overall efficiency of the grinding process. In addition, this invention can record the first configuration mark of the first configuration structure set for each wafer, the identification mark corresponding to the wafer rack, and the hole position mark corresponding to the positioning hole, and bind and combine the identity code of each wafer to form the grinding record, which is conducive to tracking the processing history of each wafer and achieving practical progress.

10: Wafer rack

11: Positioning hole

12: Identification mark

13: First positioning mark

14: Hole marking

20: Driving device

30: Grinding device

40: Front desk

41: First configuration structure

42: First configuration mark

43: Second positioning mark

50: Backstage

51: Second configuration structure

52: Second configuration mark

53: Third positioning mark

60:Transfer device

61: Pick and place unit

62: Robotic arm

63: Working end

64: Adjustment module

642:Setting seat

65: Lifter

652: Air cylinder

654: Piston rod

66: Suction cup module

662: Vacuum suction cup

664: Positioning frame

67: Image Capture

70: Control unit

71: Programmable Controller

72: Storage media

73: Microprocessor

90: Wafer

Figure 1 is a three-dimensional schematic diagram of the partial structure of the first embodiment of the present invention.

Figure 2 is a partial top view of the first embodiment of the present invention.

Figure 3 is a partial enlarged view of Figure 2, showing the first positioning mark and the hole position mark.

Figure 4 is a partial enlarged view of Figure 2, showing the second positioning mark and the first configuration mark.

Figure 5 is a partial enlarged view of Figure 2, showing the third positioning mark and the second configuration mark.

Figure 6 is a partial three-dimensional diagram of the first embodiment of the present invention, showing another perspective of the pick-and-place unit.

Figure 7 is a cross-sectional view of the pick-and-place unit of the first embodiment of the present invention.

Figure 8 is a circuit block diagram of the transfer device of the first embodiment of the present invention.

FIG9 is a flow chart of the method for carrying out wafer placement in the first embodiment of the present invention.

Figure 10 is a three-dimensional schematic diagram of placing a wafer on a wafer rack in the first embodiment of the present invention.

Figure 11 is a top view schematic diagram of adjusting the state of the wafer alignment positioning holes in the first embodiment of the present invention.

Figure 12 is a three-dimensional schematic diagram of the partial structure of the second embodiment of the present invention, showing the robot arm and the transfer device.

Figure 13 is a partially enlarged top view of the wafer rack of the third embodiment of the present invention.

The figures show embodiments of the present invention, but these embodiments are for illustrative purposes only and are not limited to this structure in patent applications.

As shown in FIGS. 1 to 8 , a wafer polishing device for tracking and placing and aligning wafer racks includes a plurality of wafer racks 10, a driving device 20, a polishing device 30, a front stage 40, a rear stage 50, a transfer device 60, and a control unit 70, wherein each of the wafer racks 10 is arranged at intervals on the driving device 20, and the driving device 20 is used to drive each of the wafer racks 10 to cyclically operate, and each of the wafer racks 10 performs a rotational action while cyclically operating, and each of the wafer racks 10 is respectively spaced through a plurality of positioning holes. 11. In this example, the positioning holes 11 are arranged equidistantly. Each positioning hole 11 is used to position a wafer 90. The grinding device 30 is arranged above the driving device 20 and is used to grind each wafer 90 arranged on each wafer rack 10. The driving device 20 and the grinding device 30 are familiar to people in the relevant technical field, and the driving device 20 and the grinding device 30 have no necessary correlation with the technical features of this creation. The specific structure of the driving device 20 and the grinding device 30 will not be described in detail.

Each wafer rack 10 is formed with an identification mark 12, each identification mark 12 is used to distinguish and identify each wafer rack 10, each wafer rack 10 is formed with a first positioning mark 13, each first positioning mark 13 is used to identify the configuration center of each positioning hole 11, in this example, each first positioning mark 13 is located at the radial center of each wafer rack 10, each positioning hole 11 is arranged around the first positioning mark 13, each wafer rack 10 is formed with a plurality of hole position marks 14, each hole position mark 14 is adjacent to each positioning hole 11, each hole position mark 14 is used to distinguish and identify each positioning hole 11.

The identification mark 12, the first positioning mark 13 and each hole position mark 14 can be selected as numbers, text, graphics or a combination thereof. Different wafer racks 10 have different identification marks 12. In this example, numbers are selected as the identification marks 12. The first positioning mark 13 and the hole position mark 14 are selected as holes that penetrate the wafer rack 10, and each hole position mark 14 is selected as a hole with a different aperture.

The front stage 40 cooperates with the number and arrangement of the positioning holes 11 of each wafer rack 10 to form a plurality of first arrangement structures 41 and a plurality of first arrangement marks 42 for setting the wafer 90 to be polished. Each first arrangement mark 42 is used to distinguish and identify each first arrangement structure 41. The front stage 40 forms a second positioning mark 43, and the second positioning mark 43 is used to identify the arrangement center of each first arrangement structure 41.

The rear stage 50 cooperates with the number and arrangement of the positioning holes 11 of each wafer rack 10 to form a plurality of second arrangement structures 51 for setting the polished wafer 90 at intervals. The rear stage 50 forms a third positioning mark 53, and the third positioning mark 53 is used to identify the arrangement center of each second arrangement structure 51.

The transfer device 60 is used to transfer each wafer 90 between the front stage 40, the wafer rack 10 and the back stage 50, and includes a pick-and-place unit 61 and a robot arm 62, wherein the pick-and-place unit 61 is disposed at the working end 63 of the robot arm 62, and the robot arm 62 is used to drive the pick-and-place unit 61 to approach or move away from a selected wafer rack 10.

The pick-and-place unit 61 includes an adjustment module 64, a plurality of lifters 65, a plurality of suction cup modules 66, and an image capturer 67. The adjustment module 64 is connected to the robot arm 62 and has a driven rotational mounting base 642. The lifters 65 are disposed at intervals on the radial periphery of the mounting base 642 around the rotation center of the mounting base 642. The lifters 65 are respectively connected to the suction cup modules 66. , each lifter 65 drives each suction cup module 66 to move up and down, approaching or moving away from each wafer 90. Each suction cup module 66 includes three vacuum suction cups 662 for sucking and releasing the wafer 90. The number of vacuum suction cups 662 constituting the suction cup module 66 can be increased or decreased as needed, and each suction cup module 66 has one vacuum suction cup 662.

The image capturer 67 is connected to the adjustment module 64 and is used to capture images of the wafer rack 10, the front stage 40 and the back stage 50. In this example, a camera lens with a photosensitive element (not shown) is selected as the image capturer 67. Specific examples of the photosensitive element include a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS).

The control unit 70 is mainly composed of an electronic circuit. The control unit 70 can be optionally set at an appropriate position of the wafer polishing equipment. It includes a programmable controller 71, a storage medium 72 and a microprocessor 73. The programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73 respectively. The programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robot arm 62. The storage medium 72 is a readable and writable memory medium for storing the polishing records of each wafer 90. The microprocessor 73 is electrically connected to the image capture device 67.

The microprocessor 73 runs an image recognition program to recognize the image captured by the image capturer 67, and controls the robot 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result, so as to place multiple wafers 90 to be polished on the selected wafer rack 10 at one time, and take out multiple wafers 90 that have been polished from the selected wafer rack 10 at one time. The microprocessor 73 also binds each wafer 90, the first configuration mark 42 corresponding to each wafer 90, the identification mark 12 and the hole mark 14, to form multiple polishing records corresponding to each wafer 90.

As shown in FIGS. 9 to 11 , the method for placing and picking a wafer using the aforementioned wafer polishing equipment with tracking and placing and picking a wafer rack includes the following steps: the placing and picking unit takes the wafer: the robot arm 62 drives the placing and picking unit 61 to the space above the front stage 40, and the control unit 70 controls the transfer device 60 to calibrate each of the suction cup modules 66 based on the result of recognizing the image of the front stage 40 captured by the image capturer 67. The microprocessor 73 respectively positions the wafers 90 to be polished which are pre-configured in the first configuration structures 41, and records the first configuration marks 42 corresponding to the wafers 90. Then, the control unit 70 controls the vacuum suction cups 662 of the suction cup modules 66 to respectively attract the corresponding wafers 90, and the control unit 70 records the first configuration marks 42 corresponding to the wafers 90.

The process of the transfer device 60 calibrating each suction cup module 66 relative to each wafer 90 is mainly as follows: the transfer device 60 moves to align the center of the pick-and-place unit 61 with the second positioning mark 43, and then the control unit 70 controls the adjustment module 64 based on the difference in alignment between each wafer 90 and each suction cup module 66, so that the setting seat 642 rotates or does not rotate, so that each suction cup module 66 is aligned with each wafer 90.

The pick-and-place unit aligns the wafer rack: the robot arm 62 drives the pick-and-place unit 61 to move to the space above the selected wafer rack 10, the image capturer 67 captures the identification mark 12 of the wafer rack 10, the microprocessor 73 runs the image recognition program, identifies and records the wafer rack 10 where each wafer 90 is placed, and the image capturer 67 captures the image of the first positioning mark 13 of the wafer rack 10 The microprocessor 73 identifies the first positioning mark 13 and calculates the distance deviation between the pick-and-place unit 61 and the first positioning mark 13 in the axial direction. Then, the control unit 70 controls the robot arm 62 to move or not to move to compensate for the distance deviation. The pick-and-place unit 61 and the first positioning mark 13 are aligned up and down. The image capturer 67 captures the positioning holes 11 of the wafer rack 10. The microprocessor 73 recognizes the image and calculates the angle deviation between each positioning hole 11 and each suction cup module 66 based on the first positioning mark 13 as the center. Then the control unit 70 controls the adjustment module 64 to rotate or not rotate the setting seat 642 to compensate for the angle deviation. Each suction cup module 66 is respectively aligned with each positioning hole 11. 1 forms an upper and lower alignment, and accordingly, the control unit 70 can control the transfer device 60 to calibrate the alignment of each suction cup module 66 relative to each positioning hole 11 based on the result of recognizing the image of the wafer rack 10 captured by the image capturer 67, and the control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of each positioning hole 11 corresponding to each wafer 90.

The pick-and-place unit places the wafer: the control unit 70 controls each suction cup module 66 to release each wafer 90 into each positioning hole 11, thereby placing a wafer 90 corresponding to each positioning hole 11 of each wafer rack 10, and operating the driving device 20 and the grinding device 30 to complete the grinding process of each wafer 90.

By repeating the aforementioned steps of the pick-and-place unit taking up the wafer, the pick-and-place unit aligning the wafer rack, and the pick-and-place unit placing the wafer, the wafers 90 to be polished can be placed in the positioning holes 11 of the wafer racks 10 in a multi-piece placement manner. Accordingly, the driving device 20 and the polishing device 30 can be operated to complete the polishing process of each wafer 90.

Wafer alignment by the pick-and-place unit: After the grinding process is completed, the robot arm 62 drives the pick-and-place unit 61 to move to the space above the selected wafer rack 10. The control unit 70 controls the transfer device 60 to calibrate the alignment of each suction cup module 66 relative to each wafer 90 that has been polished and is disposed on each wafer rack 10 based on the result of identifying the image of the wafer rack 10 captured by the image capturer, and the control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of each positioning hole 11 corresponding to each wafer 90.

The transfer device transfers the wafer: each suction cup module 66 attracts each wafer 90, and then each suction cup module 66 drives each wafer 90 to rise and leave the wafer rack 10, and then the robot arm 62 drives the pick-and-place unit 61 to move to the top of the backstage 50. The control unit 70 controls the transfer device 60 to calibrate the positioning of each suction cup module 66 relative to each second configuration structure 51 based on the result of identifying the image captured by the image capturer 67, and the pick-and-place unit 61 releases each polished wafer 90 to each second configuration structure 51 of the backstage 50.

Storing grinding records: The microprocessor 73 binds the identification code of each wafer 90, the first configuration mark 42, the identification mark 12 and the hole mark 14 corresponding to each wafer 90, to form a plurality of grinding records corresponding to each wafer 90, and the storage medium 72 stores each grinding record.

The transfer device 60 can transfer and place multiple wafers 90 arranged on the front stage 40 on the selected wafer rack 10 at one time. After the polishing device 30 completes the polishing process, the transfer device 60 can take out multiple wafers 90 from the wafer rack 10 at one time and transfer and place them on the rear stage 50. Thus, the time spent on placing and taking out the wafers 90 can be shortened, thereby improving the overall efficiency of the wafer polishing equipment in performing the polishing process.

When each wafer 90 is placed on the selected wafer rack 10 and each wafer 90 is taken out from the wafer rack 10, the transfer device 60 can identify the first configuration structure 41, the wafer rack 10 and the positioning hole 11 respectively configured for each wafer 90, record the first configuration mark 42 of the first configuration structure 41 set for each wafer 90, the identification mark 12 corresponding to the wafer rack 10 and the hole position mark 14 corresponding to the positioning hole 11, and bind and combine the identity code of each wafer 90 to form the polishing record stored in the storage medium 72, which is conducive to tracking the processing history of each wafer 90.

Furthermore, the backstage 50 forms a plurality of second configuration marks 52, each of which is used to distinguish and identify each of the second configuration structures 51.

In the step of transferring the wafer by the pick-and-place unit, the control unit 70 records the second configuration mark 52 of each second configuration structure 51 corresponding to each wafer 90, and the microprocessor 73 further binds the second configuration mark 52 used to identify the second configuration structure 51 set on each wafer 90 to become the grinding record corresponding to each wafer 90.

Each suction cup module 66 further includes a positioning frame 664, each vacuum suction cup 662 is respectively arranged on the positioning frame 664, each lifter 65 is mainly composed of a pneumatic cylinder 652, and the piston rod 654 of each pneumatic cylinder 652 is reciprocated axially along the up and down direction. Each piston rod 654 is respectively connected to the corresponding positioning frame 664, so that each suction cup module 66 moves up and down.

As shown in FIG12 , the main difference between the second embodiment and the first embodiment is that the type of the robot arm 62 is different.

As shown in FIG13 , the main difference between the third embodiment and the first embodiment is that each hole mark 14 is a hole of different shapes.

10: Wafer rack

11: Positioning hole

12: Identification mark

20: Driving device

40: Front desk

41: First configuration structure

43: Second positioning mark

50: Backstage

51: Second configuration structure

53: Third positioning mark

62: Robotic arm

90: Wafer

Claims (2)

A wafer polishing device with tracking and placement of wafer racks includes a plurality of wafer racks, a driving device, a polishing device, a front stage, a rear stage, a transfer device and a control unit, wherein each of the wafer racks is arranged on the driving device at intervals, each of the wafer racks is respectively penetrated by a plurality of positioning holes at intervals, each of the positioning holes is respectively used to set and position a wafer, and the polishing device is arranged on the driving device. The drive device is used to grind each wafer; each wafer rack is formed with an identification mark, each identification mark is used to distinguish and identify each wafer rack, each wafer rack is formed with a first positioning mark, the first positioning mark is used to identify the configuration center of each positioning hole, each wafer rack is formed with a plurality of hole position marks, each hole position mark is adjacent to each positioning hole, each hole The positioning marks are used to distinguish and identify each positioning hole; the front stage cooperates with the number and configuration relationship of each positioning hole of each wafer rack to form a plurality of first configuration structures and a plurality of first configuration marks for setting the wafer to be ground, each of which is used to distinguish and identify each first configuration structure, and the front stage forms a second positioning mark, and the second positioning mark is used to identify the configuration center of each first configuration structure; the rear stage cooperates with the number and configuration relationship of each positioning hole of each wafer rack to form a plurality of second configuration structures for setting the wafer after grinding, and the rear stage forms a third positioning mark, and the third positioning mark is used to identify the configuration center of each second configuration structure; the transfer device includes a pick-and-place unit and a robot arm, wherein the pick-and-place unit is arranged at the working end of the robot arm, and the pick-and-place unit includes an adjustment module, a plurality of lifters, a plurality of suction cup modules and an image capturer, wherein the adjustment module is connected to the robot arm and has a driven rotational mounting base, and the rotation centers of the lifters are arranged at intervals on the radial periphery of the mounting base around the rotation centers of the mounting base, and the lifters are divided into The control unit is connected to each suction cup module, and each lifter is used to drive each suction cup module to move up and down to approach or move away from each wafer. Each suction cup module includes at least one vacuum suction cup for sucking and releasing the wafer. The image capturer is connected to the adjustment module and is used to capture images. The control unit is mainly composed of an electronic circuit, which includes a programmable controller, a storage medium, and a control unit. The present invention relates to a device for manufacturing a wafer polishing machine and a microprocessor, wherein the programmable controller and the storage medium are electrically connected to the microprocessor respectively, the programmable controller is electrically connected to the pick-and-place unit and the robot arm, the storage medium is a readable and writable memory medium for storing the polishing records of each wafer, and the microprocessor is electrically connected to the image capturer; the microprocessor runs an image recognition program to recognize the image capture The image of the wafer rack captured by the picker is captured, and based on the recognition result, the robot arm and the pick-and-place unit are controlled by the programmable controller to place or take out multiple wafers at one time. The microprocessor binds each wafer, and the first configuration mark, the identification mark and the hole mark corresponding to each wafer are set to form multiple grinding records corresponding to each wafer. As described in claim 1, the wafer polishing equipment with tracking and placement of wafer racks, wherein the backstage forms a plurality of second configuration marks, each of which is used to distinguish and identify each of the second configuration structures; the microprocessor binds each of the wafers, the first configuration mark, the identification mark, the hole mark and the second configuration mark corresponding to each of the wafers, to form a plurality of polishing records corresponding to each of the wafers.

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