[go: up one dir, main page]

TWM655887U - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

Info

Publication number
TWM655887U
TWM655887U TW112214411U TW112214411U TWM655887U TW M655887 U TWM655887 U TW M655887U TW 112214411 U TW112214411 U TW 112214411U TW 112214411 U TW112214411 U TW 112214411U TW M655887 U TWM655887 U TW M655887U
Authority
TW
Taiwan
Prior art keywords
conductive
circuits
edge
circuit board
sub
Prior art date
Application number
TW112214411U
Other languages
Chinese (zh)
Inventor
蔡金保
鄭佩芬
Original Assignee
易華電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 易華電子股份有限公司 filed Critical 易華電子股份有限公司
Priority to TW112214411U priority Critical patent/TWM655887U/en
Publication of TWM655887U publication Critical patent/TWM655887U/en

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

一種軟性電路板,用以解決靠近電路板側緣之線路延伸端易發生彎曲或剝離的問題。包含:一基板,該基板具有一第一邊緣、一第二邊緣及連接該等的二側邊緣,該基板之表面具有一導接區,該導接區靠近該第一邊緣;及一圖案化線路,位於該導接區,該圖案化線路包含沿著該第一邊緣排列之複數個子線路,各子線路包含複數個延伸的導接線路;該複數個子線路之中,與該側邊緣之距離小於或等於一第一距離之該子線路另包含一保護線路;該保護線路與該複數個導接線路的延伸端具有一第二距離。藉此可達成減少短路功效。 A flexible circuit board is used to solve the problem that the extension end of the circuit near the side edge of the circuit board is prone to bending or peeling. It includes: a substrate, the substrate has a first edge, a second edge and two side edges connected thereto, the surface of the substrate has a conductive area, the conductive area is close to the first edge; and a patterned circuit, located in the conductive area, the patterned circuit includes a plurality of sub-circuits arranged along the first edge, each sub-circuit includes a plurality of extended conductive circuits; among the plurality of sub-circuits, the sub-circuit whose distance from the side edge is less than or equal to a first distance further includes a protection circuit; the protection circuit has a second distance from the extension end of the plurality of conductive circuits. This can achieve the effect of reducing short circuits.

Description

軟性電路板 Flexible circuit board

本創作係關於一種電路板,尤其是一種可以減少靠近電路板側邊緣之線路延伸端發生彎曲或剝離的軟性電路板。 This invention relates to a circuit board, and more particularly to a flexible circuit board that can reduce bending or peeling of a line extension end near a side edge of the circuit board.

習知的軟性電路板製造過程中,常利用卷對卷(Roll to roll)工藝進行傳動。具體而言,係藉由輥與輥之旋轉來傳動呈帶狀的軟性基材,該軟性基材中包含多個軟性電路板或軟性電路板之半成品。然而,上述傳動過程中,帶狀軟性基材中與傳動方向大致呈平行的兩側,容易與傳動裝置產生摩擦,當靠近該兩側之側邊緣之線路線寬較小時,便容易導致所製得之軟性電路板中,靠近該兩側之側邊緣之線路延伸端發生彎曲或剝離,進而造成短路。 In the known flexible circuit board manufacturing process, the roll-to-roll process is often used for transmission. Specifically, the flexible substrate in the form of a belt is transmitted by the rotation of rollers, and the flexible substrate contains multiple flexible circuit boards or semi-finished flexible circuit boards. However, in the above transmission process, the two sides of the belt-shaped flexible substrate that are roughly parallel to the transmission direction are prone to friction with the transmission device. When the line width near the side edges of the two sides is small, it is easy to cause the extension end of the line near the side edges of the two sides in the manufactured flexible circuit board to bend or peel off, thereby causing a short circuit.

有鑑於此,習知的軟性電路板確實仍有加以改善之必要。 In view of this, the conventional flexible circuit boards still need to be improved.

為解決上述問題,本創作的目的是提供一種軟性電路板,可以減少靠近該軟性電路板側邊緣之線路延伸端發生彎曲或剝離。 To solve the above problems, the purpose of this invention is to provide a flexible circuit board that can reduce the bending or peeling of the extension end of the line near the side edge of the flexible circuit board.

本創作全文所述方向性或其近似用語,例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本創作的各實施例,非用以限制本創作。 The directions or similar terms described in the entire text of this work, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inside", "outside", "side", etc., are mainly for reference to the directions of the attached drawings. Each direction or similar terms are only used to assist in the description and understanding of the various embodiments of this work, and are not used to limit this work.

本創作全文所記載的元件及構件使用「一」或「一個」之量詞, 僅是為了方便使用且提供本創作範圍的通常意義;於本創作中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。 The quantifiers "one" or "a" used in the components and parts described in this work are only for the convenience of use and to provide the general meaning of the scope of this work; in this work, it should be interpreted as including one or at least one, and the concept of a single word also includes the plural case, unless it is obvious that it means otherwise.

本創作的軟性電路板,包含:一基板,該基板具有一第一邊緣、大致平行於該第一邊緣的一第二邊緣及連接該第一邊緣與第二邊緣的二側邊緣,該基板之一表面包含一導接區,該導接區靠近該第一邊緣;及一圖案化線路,位於該表面之該導接區,該圖案化線路包含沿著該第一邊緣排列之複數個子線路,各子線路包含複數個延伸的導接線路;該複數個子線路之中,與該側邊緣之距離小於或等於一第一距離的該子線路另包含一保護線路;該保護線路與該複數個導接線路的延伸端具有一第二距離。 The flexible circuit board of the invention comprises: a substrate having a first edge, a second edge substantially parallel to the first edge, and two side edges connecting the first edge and the second edge; a surface of the substrate comprising a conductive area, the conductive area being close to the first edge; and a patterned circuit located in the conductive area of the surface; the patterned circuit comprising a plurality of sub-circuits arranged along the first edge, each sub-circuit comprising a plurality of extended conductive circuits; among the plurality of sub-circuits, the sub-circuit having a distance from the side edge less than or equal to a first distance further comprises a protection circuit; the protection circuit has a second distance from the extended ends of the plurality of conductive circuits.

據此,本創作的軟性電路板,藉由在靠近軟性電路板側邊緣之圖案化線路中包含一保護線路,可以減少該圖案化線路中的導接線路與傳動裝置直接發生摩擦,因而可以減少靠近該軟性電路板側邊緣之導接線路延伸端發生彎曲或剝離,進而可以減少短路。 Accordingly, the flexible circuit board of this invention includes a protection circuit in the patterned circuit near the side edge of the flexible circuit board, which can reduce the direct friction between the conductive circuit in the patterned circuit and the transmission device, thereby reducing the bending or peeling of the extended end of the conductive circuit near the side edge of the flexible circuit board, thereby reducing short circuits.

其中,該複數個導接線路在遠離該第一邊緣之一側大致呈互相平行,且該保護線路大致垂直於該複數個導接線路。如此,係具有藉由該保護線路保護該複數個導接線路之延伸端的功效。 The plurality of conductive lines are substantially parallel to each other on a side away from the first edge, and the protection line is substantially perpendicular to the plurality of conductive lines. Thus, the protection line can protect the extension ends of the plurality of conductive lines.

其中,該第一距離為5±2mm。如此,係具有保護靠近該軟性電路板側邊緣之導接線路延伸端的功效。 The first distance is 5±2mm. This has the effect of protecting the extended end of the conductive line near the side edge of the flexible circuit board.

其中,該第二距離為0.025±0.005mm。如此,係具有兼具保護效果同時避免該導接線路與該保護線路之間發生非理想的連接的功效。 The second distance is 0.025±0.005mm. In this way, it has the effect of both providing protection and avoiding non-ideal connection between the conductive line and the protective line.

其中,該保護線路的線寬大於該導接線路的線寬。如此,係具有提升保護效果的功效。 The line width of the protection line is greater than the line width of the connection line. This has the effect of improving the protection effect.

其中,該導接線路的線寬為小於或等於0.012mm。如此,係 具有縮小元件尺寸功效。 The line width of the conductive line is less than or equal to 0.012 mm. This has the effect of reducing the size of the component.

其中,該保護線路的線寬為0.025±0.005mm。如此,係具有提升保護效果的功效。 The line width of the protection circuit is 0.025±0.005mm. This has the effect of improving the protection effect.

其中,相鄰二個該保護線路之間的最短距離為0.02±0.005mm。如此,係具有兼具保護效果同時避免相鄰二個該保護線路之間發生非理想的連接的功效。 Among them, the shortest distance between two adjacent protection circuits is 0.02±0.005mm. In this way, it has the effect of both protection effect and avoiding non-ideal connection between two adjacent protection circuits.

其中,該複數個導接線路的延伸端並未連接於該保護線路。如此,有利於蝕刻製程中蝕刻液或清洗液等的流動,係具有提升蝕刻品質的功效。 The extension ends of the plurality of conductive lines are not connected to the protection line. This is beneficial to the flow of etching liquid or cleaning liquid during the etching process, and has the effect of improving the etching quality.

其中,位於該子線路最外二側的二個該導接線路中,其中一個該導接線路的延伸端連接於該保護線路。如此,係具有保護靠近該軟性電路板側邊緣之導接線路延伸端的功效。 Among them, the extension end of one of the two conductive lines located on the outermost two sides of the sub-circuit is connected to the protection line. In this way, it has the effect of protecting the extension end of the conductive line close to the side edge of the flexible circuit board.

其中,相鄰二個該子線路中,連接於該保護線路的該導接線路係位於該子線路之相同側。如此,係具有保護靠近該軟性電路板側邊緣之導接線路延伸端的功效。 Among them, in the two adjacent sub-circuits, the conductive line connected to the protection line is located on the same side of the sub-circuits. In this way, it has the effect of protecting the extended end of the conductive line close to the side edge of the flexible circuit board.

其中,相鄰二個該子線路中,連接於該保護線路的該導接線路係位於該子線路之不同側。如此,係具有保護靠近該軟性電路板側邊緣之導接線路延伸端的功效。 Among the two adjacent sub-circuits, the conductive line connected to the protection line is located on different sides of the sub-circuits. In this way, it has the effect of protecting the extended end of the conductive line close to the side edge of the flexible circuit board.

1:基板 1: Substrate

1a:表面 1a: Surface

11:第一邊緣 11: The first edge

12:第二邊緣 12: The second edge

13:側邊緣 13: Side edge

14:導接區 14: Conducting area

15:傳動孔 15: Transmission hole

2:圖案化線路 2: Patterned circuit

2a:子線路 2a: Sub-circuit

21:導接墊 21: Conductive pad

22:導接線路 22: Conducting lines

23:保護線路 23: Protect the line

d1:第一距離 d1: first distance

d2:第二距離 d2: second distance

d3:第三距離 d3: third distance

X,Y:方向 X,Y: direction

W1:線寬 W1: Line width

W2:線寬 W2: Line width

A:標示用方框 A: Marking box

〔第1圖〕本創作一較佳實施例之軟性電路板的上視圖。 [Figure 1] A top view of a flexible circuit board of a preferred embodiment of this invention.

〔第2圖〕如第1圖所示的A局部之圖案化線路第一實施例構造圖。 [Figure 2] A structural diagram of the first embodiment of the patterned circuit of the A part shown in Figure 1.

〔第3圖〕如第1圖所示的A局部之圖案化線路第二實施例構造圖。 [Figure 3] A structural diagram of the second embodiment of the patterned circuit of the A part shown in Figure 1.

〔第4圖〕如第1圖所示的A局部之圖案化線路第三實施例構造圖。 [Figure 4] A structural diagram of the third embodiment of the patterned circuit of the A part shown in Figure 1.

為讓本創作之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本創作之較佳實施例,並配合所附圖式作詳細說明;此外,在不同圖式中標示相同符號者視為相同,會省略其說明。 In order to make the above and other purposes, features and advantages of this creation more clearly understood, the following article specifically cites the preferred implementation examples of this creation and provides detailed descriptions with the attached drawings; in addition, the same symbols in different drawings are considered the same and their descriptions will be omitted.

請參照第1圖所示,其係本創作軟性電路板一較佳實施例,係包含一基板1及一圖案化線路2,該圖案化線路2位於該基板1的一表面上靠近一邊緣之一側。 Please refer to Figure 1, which is a preferred embodiment of the flexible circuit board of the present invention, comprising a substrate 1 and a patterned circuit 2, wherein the patterned circuit 2 is located on a surface of the substrate 1 near one side of an edge.

該基板1沿著X方向具有一第一邊緣11及一第二邊緣12,該第一邊緣11及該第二邊緣12大致呈直線且彼此平行。該基板1另具有連接該第一邊緣11及該第二邊緣12的二側邊緣13。該基板1之一表面1a具有一導接區14,該導接區14位於該表面1a上靠近該第一邊緣11之一側。 The substrate 1 has a first edge 11 and a second edge 12 along the X direction, and the first edge 11 and the second edge 12 are substantially straight lines and parallel to each other. The substrate 1 also has two side edges 13 connecting the first edge 11 and the second edge 12. A surface 1a of the substrate 1 has a conductive area 14, and the conductive area 14 is located on one side of the surface 1a close to the first edge 11.

該表面1a另可以包含有例如:晶片設置區、支撐金屬區、或其他的導接區等等,本創作不予限制。該基板1另可以具有複數個傳動孔15,該複數個傳動孔15分別位於該基板1上靠近二該側邊緣13處,用以配合傳動裝置以進行該基板1之傳動。 The surface 1a may also include, for example, a chip placement area, a supporting metal area, or other conductive areas, etc., which are not limited by the present invention. The substrate 1 may also have a plurality of transmission holes 15, which are respectively located on the substrate 1 near the two side edges 13, and are used to cooperate with the transmission device to transmit the substrate 1.

該基板1之材料可以為聚醯亞胺(polyimide,PI)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)或其他適當的軟性絕緣材料,本創作不予限制。 The material of the substrate 1 can be polyimide (PI), polyethylene terephthalate (PET) or other appropriate soft insulating materials, and this invention is not limited to this.

請參照第1、2圖所示,該圖案化線路2可以位於該導接區14,如第2圖所示,係該圖案化線路2之第一實施例,該圖案化線路2包含複數個子線路2a。該複數個子線路2a係沿著該第一邊緣11排列(亦即,沿著X方向排列)。各子線路2a可以包含複數個導接墊21及複數個導接線路22, 例如可以為每一個導接墊21延伸形成一個導接線路22之態樣,亦可以為其他態樣,本創作不予限制。該複數個導接線路22大致沿著遠離該第一邊緣11之方向延伸(亦即,沿著垂直於X方向的一Y方向延伸)以形成一延伸端,較佳地,該複數個導接線路22大致呈互相平行,以及,該複數個導接線路22之延伸端在該Y方向上大致呈對齊。 Please refer to Figures 1 and 2. The patterned circuit 2 can be located in the conductive area 14. As shown in Figure 2, it is a first embodiment of the patterned circuit 2. The patterned circuit 2 includes a plurality of sub-circuits 2a. The plurality of sub-circuits 2a are arranged along the first edge 11 (that is, arranged along the X direction). Each sub-circuit 2a can include a plurality of conductive pads 21 and a plurality of conductive circuits 22. For example, each conductive pad 21 can be extended to form a conductive circuit 22. Other embodiments are also possible, and this invention is not limited thereto. The plurality of conductive lines 22 extend substantially in a direction away from the first edge 11 (i.e., extend in a Y direction perpendicular to the X direction) to form an extension end. Preferably, the plurality of conductive lines 22 are substantially parallel to each other, and the extension ends of the plurality of conductive lines 22 are substantially aligned in the Y direction.

該圖案化線路2之材料可以為銅、鎳、金及其他金屬或合金,並可以藉由蝕刻製程來設置於該基板1上,本創作不予限制。該圖案化線路2可以係用於測試電路板製造品質之線路,但不限於此。該導接線路22之線寬W1可以為小於或等於0.012mm。 The material of the patterned circuit 2 can be copper, nickel, gold and other metals or alloys, and can be set on the substrate 1 by etching process, which is not limited by this invention. The patterned circuit 2 can be a circuit used to test the manufacturing quality of the circuit board, but is not limited to this. The line width W1 of the conductive line 22 can be less than or equal to 0.012mm.

請參照第1、2圖所示,沿著該第一邊緣11排列的該複數個子線路2a之中,與該側邊緣13之距離小於或等於一第一距離d1的該子線路2a另包含一保護線路23。較佳地,該保護線路23大致呈直線狀,且與該複數個導接線路22的延伸端具有一第二距離d2,較佳地,該保護線路23大致垂直於該複數個導接線路22。藉由該保護線路23可以減少該導接線路22與傳動裝置直接發生摩擦以保護該導接線路22,進而可以減少靠近該側邊緣13之該導接線路22的該延伸端發生彎曲或剝離。 As shown in Figures 1 and 2, among the plurality of sub-circuits 2a arranged along the first edge 11, the sub-circuit 2a whose distance from the side edge 13 is less than or equal to a first distance d1 further includes a protection circuit 23. Preferably, the protection circuit 23 is substantially straight and has a second distance d2 from the extension ends of the plurality of conductive circuits 22. Preferably, the protection circuit 23 is substantially perpendicular to the plurality of conductive circuits 22. The protection circuit 23 can reduce direct friction between the conductive circuit 22 and the transmission device to protect the conductive circuit 22, thereby reducing bending or peeling of the extension end of the conductive circuit 22 near the side edge 13.

該保護線路23之材料可以為銅、鎳、金及其他金屬或合金,並可以藉由蝕刻製程來設置於該基板1上,本創作不予限制。該保護線路23之線寬W2可以大於該導接線路22之線寬W1,該保護線路23之線寬W2較佳為0.025±0.005mm,藉此可以提升保護效果。 The material of the protection circuit 23 can be copper, nickel, gold and other metals or alloys, and can be set on the substrate 1 by etching process, and this invention is not limited. The line width W2 of the protection circuit 23 can be greater than the line width W1 of the conductive line 22, and the line width W2 of the protection circuit 23 is preferably 0.025±0.005mm, thereby improving the protection effect.

該第一距離d1較佳為5±2mm,如此,係可以減少靠近該側邊緣13之該複數個導接線路22的該延伸端發生彎曲或剝離,進而可以減少短路情形。 The first distance d1 is preferably 5±2 mm, so that the extension ends of the plurality of conductive lines 22 near the side edge 13 can be reduced from bending or peeling, thereby reducing short circuits.

該第二距離d2較佳為0.025±0.005mm,如此,係可以避免該 保護線路23距離該導接線路22的延伸端過遠而造成保護效果不足;並且,可以避免該保護線路23距離該導接線路22的延伸端過近而在蝕刻製程中蝕刻不完全,導致該複數個導接線路22與該保護線路23之間發生非理想的連接,進而造成短路。 The second distance d2 is preferably 0.025±0.005mm, so that the protection circuit 23 can be prevented from being too far away from the extension end of the conductive circuit 22, resulting in insufficient protection effect; and the protection circuit 23 can be prevented from being too close to the extension end of the conductive circuit 22, resulting in incomplete etching during the etching process, resulting in non-ideal connection between the plurality of conductive circuits 22 and the protection circuit 23, thereby causing a short circuit.

如第2圖所示,相鄰二個該保護線路23之間的最短距離為一第三距離d3,該第三距離d3較佳為0.02±0.005mm,如此,係可以避免相鄰二個該保護線路23距離過近而在蝕刻製程中蝕刻不完全,導致相鄰二個該保護線路23之間發生非理想的連接,進而影響蝕刻製程中蝕刻液或清洗液等的流動而影響蝕刻品質;並且,可以避免該保護線路23長度過短而造成保護效果不足。 As shown in Figure 2, the shortest distance between two adjacent protection circuits 23 is a third distance d3, and the third distance d3 is preferably 0.02±0.005mm. In this way, it is possible to avoid the two adjacent protection circuits 23 being too close to each other and incomplete etching during the etching process, resulting in an undesirable connection between the two adjacent protection circuits 23, thereby affecting the flow of etching liquid or cleaning liquid during the etching process and affecting the etching quality; and it is possible to avoid the protection circuit 23 being too short and causing insufficient protection effect.

如第2圖所示,在第一實施例中,該複數個導接線路22的延伸端並未連接於該保護線路23,亦即,該保護線路23為虛設線路。藉此,有利於蝕刻製程中蝕刻液或清洗液等的流動。 As shown in FIG. 2, in the first embodiment, the extension ends of the plurality of conductive lines 22 are not connected to the protection line 23, that is, the protection line 23 is a dummy line. This facilitates the flow of etching liquid or cleaning liquid during the etching process.

請參照第3圖所示,係該圖案化線路2之第二實施例,本實施例與上述的第一實施例大致相同,在本實施例中,位於該子線路2a最外二側的二個該導接線路22中,其中一個該導接線路22的延伸端連接於該保護線路23;亦即,位於最外二側的二個該導接線路22中,其中一個該導接線路22可以形成L字型或左右顛倒之L字型。且相鄰二個該子線路2a中,連接於該保護線路23的該導接線路22係位於該子線路2a之相同側,該相鄰二個保護線路23之間的該第三距離d3,同樣可以為0.02±0.005mm。 Please refer to FIG. 3, which is a second embodiment of the patterned circuit 2. This embodiment is roughly the same as the first embodiment described above. In this embodiment, one of the two conductive circuits 22 located on the outermost sides of the sub-circuit 2a has an extended end connected to the protection circuit 23; that is, one of the two conductive circuits 22 located on the outermost sides can form an L-shape or an inverted L-shape. In addition, the conductive circuits 22 connected to the protection circuit 23 of the two adjacent sub-circuits 2a are located on the same side of the sub-circuit 2a, and the third distance d3 between the two adjacent protection circuits 23 can also be 0.02±0.005mm.

請參照第4圖所示,係該圖案化線路2的第三實施例,本實施例與上述的第二實施例大致相同,在本實施例中,相鄰二個該子線路2a中,連接於該保護線路23的該導接線路22係位於該子線路2a之不同側。且相鄰二個該保護線路23之間的該第三距離d3,同樣可以為0.02±0.005mm。 Please refer to FIG. 4, which is a third embodiment of the patterned circuit 2. This embodiment is substantially the same as the second embodiment described above. In this embodiment, in two adjacent sub-circuits 2a, the conductive circuit 22 connected to the protection circuit 23 is located on different sides of the sub-circuits 2a. And the third distance d3 between the two adjacent protection circuits 23 can also be 0.02±0.005mm.

值得一提的是,前述第一實施例之該複數個導接線路22的延伸端與該保護線路23之間無連接關係的態樣、第二實施例之相鄰二個該子線路2a中連接於該保護線路23的該導接線路22分別位於相同側的態樣,及第三實施例之相鄰二個該子線路2a中連接於該保護線路23的該導接線路22分別位於不同側的態樣亦可以互相組合;亦即,該圖案化線路2中,亦可以同時包含如第一實施例、第二實施例或第三實施例之該子線路2a形態。 It is worth mentioning that the aforementioned first embodiment in which the extension ends of the plurality of conductive lines 22 are not connected to the protection line 23, the second embodiment in which the conductive lines 22 connected to the protection line 23 in two adjacent sub-circuits 2a are located on the same side, and the third embodiment in which the conductive lines 22 connected to the protection line 23 in two adjacent sub-circuits 2a are located on different sides can also be combined with each other; that is, the patterned circuit 2 can also include the sub-circuit 2a forms of the first embodiment, the second embodiment or the third embodiment at the same time.

綜上所述,本創作的軟性電路板,藉由在靠近軟性電路板側邊緣之圖案化線路中包含一保護線路,可以減少該圖案化線路中的導接線路與傳動裝置直接發生摩擦,因而可以減少靠近該軟性電路板側邊緣之導接線路延伸端發生彎曲或剝離,進而可以減少短路。 In summary, the flexible circuit board of the present invention includes a protection circuit in the patterned circuit near the side edge of the flexible circuit board, which can reduce the direct friction between the conductive circuit in the patterned circuit and the transmission device, thereby reducing the bending or peeling of the extended end of the conductive circuit near the side edge of the flexible circuit board, thereby reducing short circuits.

雖然本創作已利用上述較佳實施例揭示,然其並非用以限定本創作,任何熟習此技藝者在不脫離本創作之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本創作所保護之技術範疇,因此本創作之保護範圍當包含後附之申請專利範圍所記載的文義及均等範圍內之所有變更。又,上述之數個實施例能夠組合時,則本創作包含任意組合的實施態樣。 Although this creation has been disclosed using the above preferred embodiments, they are not used to limit this creation. Any person familiar with this art can make various changes and modifications to the above embodiments within the spirit and scope of this creation, and they are still within the technical scope protected by this creation. Therefore, the protection scope of this creation should include all changes within the meaning and equivalent scope recorded in the attached patent application scope. In addition, when the above several embodiments can be combined, this creation includes any combination of implementations.

2:圖案化線路 2: Patterned circuit

2a:子線路 2a: Sub-circuit

21:導接墊 21: Conductive pad

22:導接線路 22: Conducting lines

23:保護線路 23: Protect the line

d2:第二距離 d2: second distance

d3:第三距離 d3: third distance

W1:線寬 W1: Line width

W2:線寬 W2: Line width

X,Y:方向 X,Y: direction

Claims (12)

一種軟性電路板,包含:一基板,該基板具有一第一邊緣、大致平行於該第一邊緣的一第二邊緣及連接該第一邊緣與第二邊緣的二側邊緣,該基板之一表面包含一導接區,該導接區靠近該第一邊緣;及一圖案化線路,位於該表面之該導接區,該圖案化線路包含沿著該第一邊緣排列之複數個子線路,各子線路包含複數個延伸的導接線路;該複數個子線路之中,與該側邊緣之距離小於或等於一第一距離的該子線路另包含一保護線路;該保護線路與該複數個導接線路的延伸端具有一第二距離。 A flexible circuit board comprises: a substrate having a first edge, a second edge substantially parallel to the first edge, and two side edges connecting the first edge and the second edge; a surface of the substrate comprising a conductive area, the conductive area being close to the first edge; and a patterned circuit located in the conductive area of the surface; the patterned circuit comprising a plurality of sub-circuits arranged along the first edge, each sub-circuit comprising a plurality of extended conductive circuits; among the plurality of sub-circuits, the sub-circuit having a distance from the side edge less than or equal to a first distance further comprises a protection circuit; the protection circuit has a second distance from the extended ends of the plurality of conductive circuits. 如請求項1之軟性電路板,其中,該複數個導接線路在遠離該第一邊緣之一側大致呈互相平行,且該保護線路大致垂直於該複數個導接線路。 A flexible circuit board as claimed in claim 1, wherein the plurality of conductive lines are substantially parallel to each other on a side away from the first edge, and the protection line is substantially perpendicular to the plurality of conductive lines. 如請求項1之軟性電路板,其中,該第一距離為5±2mm。 A flexible circuit board as claimed in claim 1, wherein the first distance is 5±2 mm. 如請求項1之軟性電路板,其中,該第二距離為0.025±0.005mm。 A flexible circuit board as claimed in claim 1, wherein the second distance is 0.025±0.005 mm. 如請求項1之軟性電路板,其中,該保護線路的線寬大於該導接線路的線寬。 A flexible circuit board as claimed in claim 1, wherein the line width of the protection line is greater than the line width of the conductive line. 如請求項1之軟性電路板,其中,該導接線路的線寬為小於或等於0.012mm。 A flexible circuit board as claimed in claim 1, wherein the line width of the conductive line is less than or equal to 0.012 mm. 如請求項1之軟性電路板,其中,該保護線路的線寬為0.025±0.005mm。 For example, in the flexible circuit board of claim 1, the line width of the protection line is 0.025±0.005mm. 如請求項1之軟性電路板,其中,相鄰二個該保護線路之間的最短距離為0.02±0.005mm。 For example, in the flexible circuit board of claim 1, the shortest distance between two adjacent protection circuits is 0.02±0.005mm. 如請求項1之軟性電路板,其中,該複數個導接線路的延伸端並未連接於該保護線路。 A flexible circuit board as claimed in claim 1, wherein the extension ends of the plurality of conductive lines are not connected to the protection line. 如請求項1之軟性電路板,其中,位於該子線路最外二側的二個該導接線路中,其中一個該導接線路的延伸端連接於該保護線路。 A flexible circuit board as claimed in claim 1, wherein, among the two conductive lines located on the outermost sides of the sub-circuit, an extended end of one of the conductive lines is connected to the protection line. 如請求項10之軟性電路板,其中,相鄰二個該子線路中,連接於該保護線路的該導接線路係位於該子線路之相同側。 As in claim 10, the flexible circuit board, wherein in two adjacent sub-circuits, the conductive line connected to the protection line is located on the same side of the sub-circuits. 如請求項10之軟性電路板,其中,相鄰二個該子線路中,連接於該保護線路的該導接線路係位於該子線路之不同側。 As in claim 10, the flexible circuit board, wherein in two adjacent sub-circuits, the conductive line connected to the protection line is located on different sides of the sub-circuits.
TW112214411U 2023-12-29 2023-12-29 Flexible printed circuit board TWM655887U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW112214411U TWM655887U (en) 2023-12-29 2023-12-29 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112214411U TWM655887U (en) 2023-12-29 2023-12-29 Flexible printed circuit board

Publications (1)

Publication Number Publication Date
TWM655887U true TWM655887U (en) 2024-05-21

Family

ID=92075704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112214411U TWM655887U (en) 2023-12-29 2023-12-29 Flexible printed circuit board

Country Status (1)

Country Link
TW (1) TWM655887U (en)

Similar Documents

Publication Publication Date Title
US20080253074A1 (en) Flexible printed circuit board with alignment marks in particular positions
TWI531288B (en) Flexible printed circuit board with gold fingers and method for manufacturing same
TWI749268B (en) Chip packaging structure and circuit pin structure
KR20220054102A (en) Flexible printed circuit board, cof module and electronic device comprising the same
CN106879161A (en) Printed circuit board (PCB) including buckled zone
TWM655887U (en) Flexible printed circuit board
US9332627B2 (en) Thermal dissipating module
KR101091889B1 (en) A flexible printed circuit board
CN103118480A (en) Flexible printed circuit board
KR20230062252A (en) Flexible printed circuit board, cof module and electronic device comprising the same
WO2017113797A1 (en) Flexible circuit board and mobile terminal
CN114760750A (en) Flexible circuit board
KR20240124704A (en) Flexible printed circuit board, cof module and electronic device comprising the same
CN204859740U (en) flexible circuit board
CN211090139U (en) PCB circuit board
CN115866874A (en) Flexible printed circuit board, COF module, and electronic device including the same
CN109168255B (en) Flexible circuit board structure and LCD module
CN111448650B (en) Integrated circuit devices and electronic devices
CN211352603U (en) Flexible circuit board
US20250210418A1 (en) Semiconductor package and package module including the same
WO2022205506A1 (en) Display panel
JP2012074492A (en) Film substrate
KR102723451B1 (en) Flexible printed circuit board, cof module and electronic device comprising the same
CN218041891U (en) FPC plate structure of single face contact
CN207995491U (en) Anti-break FPC gold finger structure