TWM653548U - Wafer cassette inflation detection system - Google Patents
Wafer cassette inflation detection system Download PDFInfo
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- TWM653548U TWM653548U TW112212188U TW112212188U TWM653548U TW M653548 U TWM653548 U TW M653548U TW 112212188 U TW112212188 U TW 112212188U TW 112212188 U TW112212188 U TW 112212188U TW M653548 U TWM653548 U TW M653548U
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- 238000001514 detection method Methods 0.000 title claims abstract description 30
- 239000007789 gas Substances 0.000 claims abstract description 53
- 239000011261 inert gas Substances 0.000 claims abstract description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000011084 recovery Methods 0.000 claims abstract description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 23
- 239000001301 oxygen Substances 0.000 claims description 23
- 229910052760 oxygen Inorganic materials 0.000 claims description 23
- 238000012546 transfer Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 206010021143 Hypoxia Diseases 0.000 claims description 3
- 230000007954 hypoxia Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 58
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005429 filling process Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 206010000372 Accident at work Diseases 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
一種晶圓盒充氣檢測系統,包括:惰性氣體填充管路係連接惰性氣體源與裝載平台的進氣端,惰性氣體填充管路包括有流量計與充填壓力錶;潔淨乾燥空氣充填管路連接潔淨乾燥空氣源與惰性氣體填充管路;氣體回收管路連接於裝載平台的排氣端與氣體回收裝置,氣體回收管路包括有濕度計、排放壓力錶以及真空產生器;排放管路連接裝載平台的排氣端;及控制單元電性連接位於裝載平台的位置感測器、流量計、充填壓力錶、排放壓力錶及濕度計並將前述所感應偵測數值上傳至存取單元。據此,即時監控充填氮氣流量、壓力,及晶圓盒排放氣體壓力值、濕度值。A wafer box inflation detection system includes: an inert gas filling pipeline connecting an inert gas source and an air inlet end of a loading platform, the inert gas filling pipeline including a flow meter and a filling pressure gauge; a clean dry air filling pipeline connecting the clean dry air source and the inert gas filling pipeline; a gas recovery pipeline connecting an exhaust end of the loading platform and a gas recovery device, the gas recovery pipeline including a hygrometer, an exhaust pressure gauge and a vacuum generator; an exhaust pipeline connecting an exhaust end of the loading platform; and a control unit electrically connected to a position sensor, a flow meter, a filling pressure gauge, an exhaust pressure gauge and a hygrometer located on the loading platform and uploading the aforementioned sensed detection values to an access unit. Based on this, the filling nitrogen flow rate and pressure, as well as the wafer box exhaust gas pressure and humidity are monitored in real time.
Description
本創作是充氣檢測系統,主要是應用於裝載平台(load port)於晶圓盒充氣與排氣時執行氣體檢測者。 This invention is an inflation detection system, which is mainly used for performing gas detection when the load port is inflating and exhausting the wafer box.
許多晶圓加工製作以及保存過程中,晶圓對於空氣中的水分、氧氣以及其他空氣中的分子汙染很敏感,例如水分、氧會在晶圓表面形成氧化層或腐蝕,造成其良率下降的問題。在一般晶圓的製程中根據製作需求,會將晶圓放置於晶圓盒內,並在晶圓盒內充填氮氣藉以保護晶圓盒內的晶圓以免受汙染或腐蝕。 During the wafer processing, manufacturing and storage process, wafers are very sensitive to moisture, oxygen and other molecular contamination in the air. For example, moisture and oxygen will form an oxide layer or corrosion on the surface of the wafer, causing the yield to decrease. In the general wafer manufacturing process, according to the manufacturing requirements, the wafer will be placed in a wafer box, and the wafer box will be filled with nitrogen to protect the wafer in the wafer box from contamination or corrosion.
在晶圓製作過程中,透過搬運系統將晶圓盒(FOUP)放置於裝載埠(load port),當裝載埠的閘門與晶圓盒開啟時,晶圓盒與外界形成相通狀態,此時外界的氣體湧入晶圓盒內,改變晶圓盒內之前被控制的濕度、含氧濃度,便無法有效控制晶圓盒內的尚未被移出的晶圓其表面的相對濕度在施作條件範圍內。部分廠家的裝載埠在出廠時雖配置有對晶圓盒充填氮氣的相關套件或是日後加裝形式,但該等裝載埠與用戶的後端系統(軟體)有整合不易的問題,以致用戶無法準確掌握在裝載埠時對晶圓盒充填氮氣時了解晶圓盒內部氣體、濕度上監控。此外,裝載埠與晶圓傳送設備進行日常的檢查以及維修保養時,因內部 環境有充填氮氣因素,以致相關技術人員進入該等設備容易發生缺氧危險。為了前述問題相關業者必須開發出具有系統整合以及安全機制的系統。 During the wafer manufacturing process, the wafer box (FOUP) is placed in the loading port through the handling system. When the gate of the loading port and the wafer box are opened, the wafer box is connected to the outside world. At this time, the external gas rushes into the wafer box, changing the previously controlled humidity and oxygen concentration in the wafer box, and it is impossible to effectively control the relative humidity of the surface of the wafers that have not been removed from the wafer box within the range of the operating conditions. Although some manufacturers' loading ports are equipped with related kits for filling nitrogen into the wafer box when leaving the factory or in the form of future installation, these loading ports are difficult to integrate with the user's back-end system (software), so that users cannot accurately monitor the gas and humidity inside the wafer box when the wafer box is filled with nitrogen at the loading port. In addition, during routine inspections and maintenance of the loading port and wafer transfer equipment, the internal environment is filled with nitrogen, which makes it easy for relevant technical personnel to enter such equipment and suffer from oxygen deficiency. In order to solve the above problems, relevant companies must develop a system with system integration and safety mechanisms.
本創作是一種晶圓盒充氣檢測系統,其包括有惰性氣體填充管路、潔淨乾燥空氣充填管路、氣體回收管路、排放管路以及控制單元,其中:該惰性氣體填充管路係連接惰性氣體源與裝載平台的進氣端之間,該惰性氣體填充管路包括有流量計與充填壓力錶;該潔淨乾燥空氣充填管路一端連接潔淨乾燥空氣源,該潔淨乾燥空氣充填管路另一端連接於該惰性氣體填充管路並位於該充填壓力錶與該裝載平台之間;該氣體回收管路連接於該裝載平台的排氣端與氣體回收裝置,該氣體回收管路包括有濕度計、排放壓力錶以及真空產生器;該排放管路一端連接該裝載平台的該排氣端,另一端則排放於環境;該控制單元電性連接位於該裝載平台的位置感測器;又,該控制單元分別電性連接該流量計、該充填壓力錶、該排放壓力錶及該濕度計並將前述所感應偵測數值上傳至存取單元;本創作沿用原有的該裝載平台並提供該晶圓盒充氣檢測系統安裝,將前述偵測數值上傳,特別是從該裝載平台上的晶圓盒抽取回收氣體的濕度值以及管路中的流量值。 The invention is a wafer box inflation detection system, which includes an inert gas filling pipeline, a clean dry air filling pipeline, a gas recovery pipeline, an exhaust pipeline and a control unit, wherein: the inert gas filling pipeline is connected between the inert gas source and the air inlet end of the loading platform, and the inert gas filling pipeline includes a flow meter and a filling pressure gauge; one end of the clean dry air filling pipeline is connected to the clean dry air source, and the other end of the clean dry air filling pipeline is connected to the inert gas filling pipeline and is located between the filling pressure gauge and the loading platform; the gas recovery pipeline is connected to the exhaust end of the loading platform and the gas recovery device, and the The gas recovery pipeline includes a hygrometer, an exhaust pressure gauge and a vacuum generator; one end of the exhaust pipeline is connected to the exhaust end of the loading platform, and the other end is discharged to the environment; the control unit is electrically connected to the position sensor located on the loading platform; and the control unit is electrically connected to the flow meter, the filling pressure gauge, the exhaust pressure gauge and the hygrometer respectively and uploads the aforementioned sensed detection values to the access unit; this creation uses the original loading platform and provides the wafer box inflation detection system for installation, and uploads the aforementioned detection values, especially the humidity value of the recovered gas extracted from the wafer box on the loading platform and the flow value in the pipeline.
透過上述系統架構配置下,可以即時監控以及獲得充填過程中的氮氣流量、充填過程中的壓力,以及從晶圓盒排放氣體的管間壓力值,以及取得從晶圓盒向外排放的氣體濕度值,因此透過前述安裝運作下對於過往裝載埠沒有氣體充填或是有氣體持續充填而未有監控數值作為判斷的設備,可以讓用戶可以準確得知當下位於裝載平台的晶圓盒其目前氣體充填交換狀況。 Through the above system architecture configuration, the nitrogen flow rate and pressure during the filling process, as well as the inter-tube pressure value of the gas discharged from the wafer box, can be monitored and obtained in real time. The humidity value of the gas discharged from the wafer box can also be obtained. Therefore, through the above installation and operation, for the equipment that has no gas filling in the past loading port or has continued to fill the gas without monitoring values as a judgment, users can accurately know the current gas filling and exchange status of the wafer box currently located on the loading platform.
10:裝載平台 10: Loading platform
11:進氣端 11: Intake end
12:排氣端 12: Exhaust end
20:晶圓盒 20: Wafer box
30:晶圓傳送設備 30: Wafer transfer equipment
40:存取單元 40: Access unit
100:惰性氣體填充管路 100: Inert gas filling pipeline
101:惰性氣體源 101: Inert gas source
102:流量計 102: Flow meter
103:充填壓力錶 103:Filling pressure gauge
104:第一比例閥 104: First proportional valve
105:第一截止閥 105: First stop valve
106:氣缸閥 106: Cylinder valve
107:過濾器 107:Filter
200:潔淨乾燥空氣充填管路 200: Clean and dry air filling pipeline
201:潔淨乾燥空氣源 201: Clean and dry air source
202:第二截止閥 202: Second stop valve
203:常開電磁閥 203: Normally open solenoid valve
300:氣體回收管路 300: Gas recovery pipeline
301:氣體回收裝置 301: Gas recovery device
302:濕度計 302: Humidity meter
303:排放壓力錶 303: Discharge pressure gauge
304:真空產生器 304: Vacuum generator
400:排放管路 400: discharge pipe
500:控制單元 500: Control unit
501:位置感測器 501: Position sensor
510:外部螢幕 510: External screen
520:緊急開關 520: Emergency switch
600:安全裝置 600: Safety device
601:含氧感測器 601: Oxygen sensor
602:開門感測器 602: Door opening sensor
603:含氧螢幕 603: Oxygen screen
604:電磁門鎖 604: Magnetic door lock
700:分支管路 700: Branch pipeline
701:第二比例閥 701: Second proportional valve
702:常關電磁閥 702: Normally closed solenoid valve
第一圖係本創作系統方塊示意圖。 The first picture is a block diagram of this creative system.
第二圖係本創作系統架構示意圖。 The second picture is a schematic diagram of the creative system architecture.
請參閱第一、二圖所示,圖中揭示一種晶圓盒充氣檢測系統,其應用於裝載平台10包括有惰性氣體填充管路100、潔淨乾燥空氣充填管路200、氣體回收管路300、排放管路400以及控制單元500,其中:該惰性氣體填充管路100係連接惰性氣體源101(廠房設施提供)與裝載平台10的進氣端11之間,該惰性氣體填充管路100包括有流量計102與充填壓力錶103,由惰性氣體源101將氮氣經惰性氣體填充管路100、裝載平台10填充至晶圓盒20內,前述充填壓力錶103主要是偵測管路中的氣體壓力,前述流量計102是偵測管路中的氣體流量;該潔淨乾燥空氣充填管路200一端連接潔淨乾燥空氣源201(廠房設施提供),該潔淨乾燥空氣充填管路200另一端連接於該惰性氣體填充管路100並位於該充填壓力錶103與該裝載平台10之間;該氣體回收管路300連接於該裝載平台10的排氣端12以及氣體回收裝置301,該氣體回收管路300包括有濕度計302、排放壓力錶303以及真空產生器304,晶圓盒20內的氣體經裝載平台10排出至氣體回收裝置301;前述排放管路400一端連接該裝載平台10的該排氣端12,另一端則排放於環境(室內或室外);該控制單元500電性連接位於該裝載平台10的位置感測器501;又,該控制單元500分別電性連接該流量計102、該充填壓力錶103、該排放壓力錶303及該濕度計302並將前述所感應偵測數值上傳至存取單元40,前述
存取單元40可為監控電腦;本創作沿用原有的該裝載平台10並提供該晶圓盒充氣檢測系統安裝,將前述偵測數值上傳,特別是從該裝載平台10上的晶圓盒20抽取回收氣體的濕度值以及管路中的氮氣流量值。
Please refer to the first and second figures, which disclose a wafer box gas filling detection system, which is applied to a
透過上述系統架構配置下,可以即時監控晶圓盒20以及獲得充填過程中管間的氮氣流量、充填過程中的壓力,以及從晶圓盒20排放氣體的管間壓力值,以及取得從晶圓盒20向外排放的氣體濕度值,因此透過前述安裝運作下對於過往裝載埠沒有氣體充填或是有氣體持續充填而未有監控數值作為判斷的設備,可以讓用戶可以準確得知當下位於裝載平台10的晶圓盒20其目前氣體充填交換狀況。更可將前述檢測數值上傳至存取單元40,便於日後各批號的追蹤查驗。
Through the above system architecture configuration, the
必須說明的是,於第一、二圖式中以虛線繪製表示控制單元500與各構件電性連接。
It must be noted that the dashed lines in the first and second figures indicate that the
進一步詳細說明本創作晶圓盒充氣檢測系統細部技術特徵以及彼此之間所產生運作上效用。進一步包括有安全裝置600並電性連接該控制單元500藉由該安全裝置600停止填充氮氣避免發生缺氧風險;該安全裝置600包括有安裝於晶圓傳送設備30並對其內部感應偵測的含氧感測器601。透過前述系統及結構配置下,可以讓控制單元500透過含氧感測器601對晶圓傳送設備30內部進行含氧量監控。
The detailed technical features of the invention wafer box inflation detection system and the operational effects produced by each other are further described in detail. It further includes a
本實施例中,該安全裝置600包括有開門感測器602用以感應偵測該晶圓傳送設備30的門板是否被開啟。透過前述系統及結構配置下,可以讓控制單元500透過開門感測器602判斷晶圓傳送設備30的門板目前為關閉狀態還是被開啟狀態。
In this embodiment, the
本實施例中,該安全裝置600包括有含氧螢幕603,其用以顯示該含氧感測器601所偵測到該晶圓傳送設備30內部的含氧量,以及顯示該晶圓傳送設備30的門板為開啟還是關閉,本實施例含氧螢幕603是安裝於晶圓傳送設備30靠近門板位置,相關於人員欲開啟門板時可以目視可見。透過前述配置下,可以供用戶(維護人員)開啟門板前事先判斷晶圓傳送設備30內部的含氧量,以免進入後發生缺氧的意外工安事故。亦可透過含氧螢幕603進行含氧量設定,例如檢測到低於含氧量設定值時發出警示,由含氧螢幕603內建或外接的燈光、蜂鳴器發出警示。
In this embodiment, the
本實施例中,該安全裝置600包括有固定於地面的電磁門鎖604,且該電磁門鎖604對應該晶圓傳送設備30的門板外側位置形成限制。透過前述配置下,電磁門鎖604於平時常態下是限制門板被向外開啟,如有開啟門板的需求時,需在晶圓傳送設備30內部達到允許含氧量之上,才可由控制單元500解鎖而暫時不限制門板,用戶才能進入晶圓傳送設備30內部,藉以避免發生工安意外。
In this embodiment, the
本實施例中,該控制單元500電性連接有外部螢幕510,該外部螢幕510顯示前述流量計102所感應偵測的充填惰性氣體流量、該充填壓力錶103所感應偵測的充填惰性氣體壓力值、該排放壓力錶303所感應偵測的排放氣體壓力值、該濕度計302所感應偵測的排放氣體濕度值,以及顯示位於該裝載平台10的晶圓盒20其代碼。可以透過裝載平台10上的掃描器(圖中未示)對晶圓盒20掃描或感應偵測條碼後,將條碼資訊傳送至控制單元500,既可讓此晶圓盒20於裝載平台10上充填氣體時對應到前述各感應偵測數值,達到即時顯示並取得該晶圓盒20在裝載平台10的充填氣體以及排放氣體的各項感應偵測的數值。透過前述運
作下,用戶得以即時得知目前充填氣體以及排放氣體的各項參數,例如各晶圓盒20即時的流量、壓力、濕度等是否符合適宜的參數要件。
In this embodiment, the
本實施例中,該惰性氣體填充管路100包括有第一比例閥104、第一截止閥105、氣缸閥106與過濾器107;該第一比例閥104位於該流量計102與該第一截止閥105之間;而該充填壓力錶103位於該第一比例閥104與該第一截止閥105之間;該氣缸閥106位於該第一截止閥105與該過濾器107之間。前述第一比例閥104可以手動或由控制單元500控制調整管路輸送氮氣的流量。前述第一截止閥105可供可以手動或由控制單元500控制潔淨乾燥空氣源201是否流入惰性氣體填充管路100。前述過濾器107係將管路經過氣體過濾。
In this embodiment, the inert
本實施例中,該潔淨乾燥空氣充填管路200包括有第二截止閥202與常開電磁閥203;該第二截止閥202位於該潔淨乾燥空氣源201與該常開電磁閥203之間,該常開電磁閥203連接該第一截止閥105。前述第二截止閥202可供手動或由控制單元500控制潔淨乾燥空氣源201是否流入潔淨乾燥空氣充填管路200。
In this embodiment, the clean dry
本實施例中,進一步包括有緊急開關520設置於晶圓傳送設備30外周側靠近門板位置並電性連接該控制單元500,用以停止經惰性氣體填充管路100輸送氮氣至裝載平台10。
In this embodiment, an
進一步包括有分支管路700其兩端分別連接該惰性氣體填充管路100與該氣體回收管路300的該真空產生器304;該分支管路700包括有第二比例閥701、常關電磁閥702,該常關電磁閥702位於該第二比例閥701與該真空產生器304之間。前述第二比例閥701可以手動或由控制單元500控制來調整管路輸送
氮氣的流量。藉由分支管路700提供真空產生器304產生真空,而得以將氣體回收。前述常關電磁閥702可於控制單元500的命令下切換為導通狀態。
Further, a
10:裝載平台 10: Loading platform
30:晶圓傳送設備 30: Wafer transfer equipment
100:惰性氣體填充管路 100: Inert gas filling pipeline
200:潔淨乾燥空氣充填管路 200: Clean and dry air filling pipeline
300:氣體回收管路 300: Gas recovery pipeline
400:排放管路 400: discharge pipe
500:控制單元 500: Control unit
600:安全裝置 600: Safety device
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112212188U TWM653548U (en) | 2023-11-10 | 2023-11-10 | Wafer cassette inflation detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112212188U TWM653548U (en) | 2023-11-10 | 2023-11-10 | Wafer cassette inflation detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM653548U true TWM653548U (en) | 2024-04-01 |
Family
ID=91619341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112212188U TWM653548U (en) | 2023-11-10 | 2023-11-10 | Wafer cassette inflation detection system |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM653548U (en) |
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2023
- 2023-11-10 TW TW112212188U patent/TWM653548U/en unknown
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