TWM652119U - Micro-electromagnetic element, electromagnetic transducer and electronic device - Google Patents

Abstract

A micro-electromagnetic element, an electromagnetic transducer and an electronic device are provided. The micro-electromagnetic element includes at least one element layer. The element layer includes a substrate and multiple conductive segments formed on a front of the substrate. There is a gap between every two adjacent conductive segments. When at least two element layers are provided, the element layers can be inter-superimposed and the conductive segments on each of the element layers will not be intersected. As compared to the conventional coil element, an interactive force applied to between the micro-electromagnetic element and a magnetic element becomes stronger and therefore the size of the micro-electromagnetic element can be smaller.

Description

Microelectromagnetic components, electromagnetic transducers and electronic devices

The invention relates to the field of energy transducing devices, in particular to a micro-electromagnetic element, an electromagnetic transducer and an electronic device.

An electromagnetic transducer is a device that uses the magnetic field generated by an energized conductor to interact with the magnetic field generated by a magnetic element to drive the action of the energized conductor. Electromagnetic transducers are widely used. For example, electromagnetic transducers can be used in speakers to drive diaphragm vibration to drive the speakers to produce sound. Electromagnetic transducers can also be used in solenoid valves to drive valve core movement to drive the solenoid valve to open and close.

In existing electromagnetic transducers, energized conductors generally use coil elements. The coil elements are wound by metal wires. The coil elements are ring-shaped, and magnetic elements (such as magnets) pass through the coil elements or are nested within the coil elements. , the magnetic field lines between the coil element and the magnetic element are radial; since the coil element is annular, it is necessary to consider the gap setting in the 360° direction between the magnetic element and the coil element to avoid collision between the magnetic element and the coil element; therefore The gap between the magnetic element and the coil element will be set larger (for example, the gap between the magnetic element and the coil element in the earphone needs to be at least 1.2mm), and the larger the gap between the magnetic element and the coil element, the greater the gap will be. The magnetic resistance between the coil element and the magnetic element is large, so that the interaction force between the coil element and the magnetic element is reduced; in addition, the magnetic element and the coil element are nested with each other, so that the sizes of the magnetic element and the coil element restrict each other, resulting in The size of one of the magnetic components and the coil component cannot be made very large, which also affects the The interaction force between the coil element and the magnetic element.

The purpose of the present invention is to provide a micro-electromagnetic element, an electromagnetic transducer and an electronic device, with a large interaction force between the micro-electromagnetic element and the magnetic element.

In order to achieve the above purpose, the novel solution is: a micro-electromagnetic component, which includes at least one component layer; the component layer includes a substrate and a plurality of conductive segments disposed on the front side of the substrate, between adjacent conductive segments There is a gap; when the number of the element layers is at least two, each element layer is superimposed on each other, and the conductive segments of each element layer do not cross.

The element layer also includes a positive conductive end and a negative conductive end disposed on the front surface of the substrate. The first end of part or all of the conductive segments of the element layer is connected to the positive conductive end of the element layer. Part or all of the element layer The second end of the conductive segment is connected to the negative conductive end of the element layer.

The conductive segments of the component layer are divided into at least two micro-segment areas, each micro-segment area has multiple conductive segments, and intervals are formed between adjacent micro-segment areas; the component layer also includes the same number as the micro-segment areas. The positive conductive end and the negative conductive end of the element layer are arranged on the front surface of the substrate of the element layer. Each micro line segment area of the element layer is connected to one positive conductive end and one negative conductive end of the element layer. The ends are arranged correspondingly; the first end of part or all of the conductive segments in each micro line segment area is connected to the corresponding positive conductive end of the micro line segment area, and the second end of part or all of the conductive segments in each micro line segment area is connected to the positive conductive end. The corresponding negative conductive end of the micro line segment area is connected.

When the number of the element layers is at least two, the first end of part or all of the conductive segments of a certain element layer is connected to the positive conductive end provided on the substrate of the element layer adjacent to the element layer, and the The second end of some or all of the conductive segments of the element layer is connected to the negative conductive end provided on the substrate of the element layer adjacent to the element layer.

The positive conductive end and the negative conductive end are respectively provided with positive conductive holes and negative conductive holes.

When the number of the element layers is at least two, the positive conductive ends and negative conductive ends of adjacent element layers are connected to each other so that the adjacent element layers are connected in series or in parallel.

The substrate of at least one component layer is provided with a magnetic conductor.

The substrate of the component layer is made of silicon, ceramics, glass, sapphire, laser direct structuring (LDS) plastic, germanium, gallium arsenide, indium phosphide, gallium nitride, silicon carbide, or double-dry nitride. One of the following: BT, Ajinomoto Building Film (ABF), bakelite, fiberglass, plastic or zinc selenide.

Each conductive segment of the element layer has a linear segment structure, and each conductive segment of the element layer is parallel to each other.

An electromagnetic transducer, which includes at least one magnetic element for generating a driving magnetic field and a micro-electromagnetic element as described above; the micro-electromagnetic element is movably arranged in the driving magnetic field; when each conductive section of the micro-electromagnetic element passes through When electric current is applied, the micro-electromagnetic element will interact with the driving magnetic field generated by the magnetic element to cause the micro-electromagnetic element to move.

The number of the magnetic elements is two, and the two magnetic elements are divided into a first magnetic element and a second magnetic element; the first magnetic element and the second magnetic element are arranged oppositely, so that there is a gap between the first magnetic element and the second magnetic element. The generated driving magnetic field is a parallel magnetic field.

The energizing current direction of part or all of the conductive segments of the micro-electromagnetic element is arranged to intersect with the magnetic field direction of the driving magnetic field.

The current direction of each conductive segment of the micro-electromagnetic element is the same, and the direction of the current of each conductive segment of the micro-electromagnetic element is perpendicular to the direction of the magnetic field of the driving magnetic field.

The electromagnetic transducer also includes a shell; the magnetic element is arranged inside the shell; and the micro-electromagnetic element is movably arranged in the shell.

The housing is made of magnetically permeable material.

An electronic device includes the electromagnetic transducer as described above.

After adopting the above solution, the new micro-electromagnetic element can be used instead of the existing coil element, and the new micro-electromagnetic element has a sheet structure. In this way, when the new micro-electromagnetic element and the magnetic element cooperate with each other, the magnetic element is in a micron state. side of the electromagnetic element, so that when the micro-electromagnetic element and the magnetic element interact, only the gap setting in one direction needs to be considered, which helps to reduce the gap between the micro-electromagnetic element and the magnetic element, which in turn helps to make the micro-electromagnetic element The interaction force between the electromagnetic element and the magnetic element is large, which also helps to reduce the size of the micro-electromagnetic element; in addition, when the micro-electromagnetic element and the magnetic element of the present invention cooperate with each other, the magnetic element is located on the side of the micro-electromagnetic element, so that The installation constraints between the micro-electromagnetic elements and the magnetic elements are small, so that the sizes of the micro-electromagnetic elements and the magnetic elements can be independently increased, which in turn helps to increase the interaction force between the micro-electromagnetic elements and the magnetic elements.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

S: micro speaker

S1: diaphragm

T: electromagnetic transducer

T1: First magnetic element

T2: Second magnetic element

T3: Shell

C: Micro electromagnetic components

1: Component layer

11:Substrate

12: Conductive section

120: Micro line segment area

13: Positive conductive end

131:Positive conductive hole

14: Negative conductive terminal

141: Negative conductive hole

15: Magnetic conductor

Figure 1 is a schematic structural diagram of Embodiment 1 of the new micro-electromagnetic element; Figure 2 is a schematic structural diagram of Embodiment 2 of the new micro-electromagnetic element; Figure 3 is a schematic structural diagram of Embodiment 3 of the new micro-electromagnetic element. ; Figure 4 is a schematic structural diagram of Embodiment 4 of the new micro-electromagnetic element; Figure 5 is a schematic structural diagram of Embodiment 5 of the micro-electromagnetic element of the present invention; Figure 6 is a structural schematic diagram of Embodiment 6 of the micro-electromagnetic element of the present invention. Exploded view; Figure 7 is a schematic structural diagram of Embodiment 7 of the new micro-electromagnetic element; Figure 8 is a schematic diagram of the new electromagnetic transducer; and Figure 9 is a schematic structural diagram of the new electronic device of the present invention.

The following is a specific embodiment to illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this description can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this creation are only simple illustrations and are not depictions based on actual size, as stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific embodiments.

As shown in Figures 1 to 7, the present invention discloses a micro-electromagnetic element C, which includes at least one element layer 1; the element layer 1 includes a substrate 11 and a plurality of conductive segments 12 provided on the front side of the substrate 11 , there is a gap between adjacent conductive segments 12; when the number of element layers 1 of the microelectromagnetic element C is at least two, the element layers 1 are overlapped with each other, and the conductive segments 12 of each element layer 1 do not intersect. The conductive segments 12 of the element layer 1 of the present invention can be manufactured using semiconductor processes such as plating, metallization, development and etching, so that the manufacturing accuracy of the conductive segments 12 is high, and the line widths and gaps between the conductive segments 12 are high. Can be made very small, so that more conductive segments can be provided on a smaller substrate 11 12, making the size of the micro-electromagnetic element C small; the conductive section 12 of the element layer 1 of the present invention can also be made using a printed circuit board (PCB) manufacturing process; and the material of the substrate 11 of the element layer 1 can be silicon or ceramics. , glass, sapphire, laser direct structuring (LDS) plastic, germanium, gallium arsenide, indium phosphide, gallium nitride, silicon carbide, bismaleimide triazine (BT), flavor One of Ajinomoto Build-up film (ABF), bakelite, fiberglass, plastic or zinc selenide. When this new type uses silicon wafer, germanium wafer, gallium nitride, second-generation semiconductor, third-generation semiconductor as the main structure, or uses chemical vapor deposition process to process the element layer 1, the thickness of the element layer 1 is required to be 0.0001~ 20 microns, and the ratio of the line width to the line spacing of the conductive segment 12 is greater than 0.3. And when this new type is based on printed circuit board, IC carrier board, glass carrier board or modified version of semi-additive process (Modified Semi-Additive Processes, MSAP), semi-additive process (Semi-Additive Processes, SAP), When processing the component layer 1 using a thick copper process or a tenting process, the thickness of the component layer 1 is required to be 0.1 to 80 microns, and the ratio of the line width to the line spacing of the conductive segment 12 is greater than 0.3.

As shown in Figure 1, in the first embodiment of the new micro-electromagnetic element C, each conductive segment 12 of the element layer 1 has a straight-line segment structure, and each conductive segment 12 of the element layer 1 is parallel to each other. This arrangement can The direction of the energizing current of each conductive section 12 of the element layer 1 is the same, so that the micro-electromagnetic element C is strongly affected by the magnetic field and reduces unnecessary energy loss; each conductive section 12 of the element layer 1 can be arranged at equal intervals, where The line width of the conductive segment 12 and the spacing between adjacent conductive segments 12 are on the micron level, and the line length of the conductive segment 12 can be on the millimeter level, so that the size of the microelectromagnetic component C is small; as shown in Figure 1, in the present invention In the first embodiment of the micro-electromagnetic element C, the element layer 1 also includes a positive conductive end 13 and a negative conductive end 14 disposed on the front surface of the substrate 11, and the first ends of all conductive sections 12 of the element layer 1 are connected to The positive conductive end 13 of the element layer 1 is connected, and the second end of all the conductive sections 12 of the element layer 1 is connected to the negative conductive end 14 of the element layer 1; the positive conductive end 13 and the negative conductive end 14 are used to connect to the external power supply. The positive and negative electrodes are used to electrically connect the conductive segments 12 of each element layer 1, so that each conductive segment 12 of the element layer 1 can be connected to current at the same time by setting the positive conductive end 13 and the negative conductive end 14; positive conductivity terminal 13 and negative The conductive end 14 may be respectively provided with positive conductive holes 131 and negative conductive holes 141 for connecting external current. It should be noted that in the present invention, the first end of the partial conductive section 12 of the element layer 1 can also be connected to the positive conductive end 13 of the element layer 1 , and the second end of the partial conductive section 12 of the element layer 1 can be connected to the positive conductive end 13 of the element layer 1 . The negative conductive end 14 is connected, which also facilitates the conductive section 12 to receive external current through the positive conductive end 13 and the negative conductive end 14 .

As shown in Figure 2, in the second embodiment of the new micro-electromagnetic element C, each conductive section 12 of the element layer 1 also has a straight-line segment structure, and the conductive section 12 of the element layer 1 is divided into at least two Micro-segment regions 120. Each micro-segment region 120 has multiple conductive segments 12, and intervals are formed between adjacent micro-segment regions 120; the line width of the conductive segments 12 is on the micron level, and the line length of the conductive segments 12 is on the millimeter level. , the spacing between the conductive segments 12 of each micro line segment area 120 is micron level, so the size of the micro electromagnetic element C is small; as shown in Figure 2, in the second embodiment of the new micro electromagnetic element C, so The element layer 1 also includes the same number of positive conductive terminals 13 and negative conductive terminals 14 as the micro-segment area 120. Each of the positive conductive terminals 13 and negative conductive terminals 14 of the element layer 1 is disposed on the front surface of the substrate 11 of the element layer 1. Each micro-line segment area 120 of the element layer 1 is arranged corresponding to a positive conductive end 13 and a negative conductive end 14 of the element layer 1; wherein, the first end of all the conductive segments 12 of each micro-line segment area 120 is connected to the micro-line segment. The positive conductive end 13 corresponding to the area 120 is connected, and the second end of all the conductive segments 12 of each micro line segment area 120 is connected to the negative conductive end 14 corresponding to the micro line segment area 120; in this way, in the implementation of the new micro electromagnetic element C In the second example, the positive conductive end 13 and the negative conductive end 14 can facilitate the simultaneous access of each conductive segment 12 of the micro line segment area 120 to current; similarly, the positive conductive end 13 and the negative conductive end 14 are respectively provided with positive conductive holes. 131 and negative conductive hole 141 for accessing external current. It should be noted that in the present invention, the first end of the partial conductive segment 12 of each micro line segment region 120 can be connected to the corresponding positive conductive end 13 of the micro line segment region 120, and the partial conductive segment 12 of each micro line segment region 120 can be connected to the corresponding positive conductive end 13 of the micro segment region 120. The second end is connected to the corresponding negative conductive end 14 of the micro line segment region 120, which also facilitates the partial conductive segments 12 of the micro line segment region 120 to receive external current through the positive conductive end 13 and the negative conductive end 14.

As shown in Figures 3 to 5, in the third embodiment of the new micro-electromagnetic element C, the actual In Embodiment 4 and Embodiment 5, the shape of each conductive segment 12 of the element layer 1 may be different. The conductive segment 12 may have a straight line segment structure, a diagonal segment structure, a broken line segment structure, a curved segment structure, or other structures. Each conductive segment 12 may have a different shape. Segments 12 are not required to be parallel to each other. It should be noted that the shape and layout of the micro-electromagnetic element C of the present invention can be various. As long as the conductive sections 12 of the micro-electromagnetic element C are supplied with current, each conductive section 12 can receive a force in the same direction under the action of an external magnetic field. That's it, so that the micro-electromagnetic element C can move under the action of an external magnetic field.

As shown in Figure 6, in the sixth embodiment of the new micro-electromagnetic element C, each conductive segment 12 of the element layer 1 has a straight-line segment structure, and each conductive segment 12 of the element layer 1 is parallel to each other. This arrangement can The direction of the energizing current of each conductive section 12 of the element layer 1 is the same, so that the micro-electromagnetic element C is strongly affected by the magnetic field and reduces unnecessary energy loss; each conductive section 12 of the element layer 1 can be arranged at equal intervals, where The line width of the conductive segments 12 and the spacing between adjacent conductive segments 12 are on the micron level, and the line length of the conductive segments 12 can be on the millimeter level, so that the size of the microelectromagnetic element C is small. As shown in FIG. 6 , in the sixth embodiment of the new microelectromagnetic element C, when the number of the element layers 1 is at least two or more, the third conductive section 12 of part or all of a certain element layer 1 One end is connected to the positive conductive end 13 provided on the substrate 11 of the element layer 1 adjacent to the element layer, and the second end of part or all of the conductive section 12 of the element layer 1 is adjacent to the element layer 1 The negative conductive end 14 provided on the substrate of the element layer 1 is connected; the arrangement of the present invention can facilitate the series and/or parallel connection of each conductive section 12 of a certain element layer 1, so that each conductive section 12 of the element layer 1 Current can be connected at the same time.

As shown in Figure 7, in the seventh embodiment of the new micro-electromagnetic element C, the substrate 11 of at least one element layer 1 of the micro-electromagnetic element C is provided with a magnetic conductor 15. When the micro-electromagnetic element C is energized, The magnetic conductor 15 can reduce the magnetic resistance of the micro-electromagnetic element C and strengthen the magnetic field lines of the magnetic field generated by the micro-electromagnetic element C, thereby increasing the intensity of the magnetic field generated by the micro-electromagnetic element C.

In the present invention, when the number of element layers 1 of the micro-electromagnetic element C is at least two, the positive conductive ends 13 and the negative conductive ends 14 of adjacent element layers 1 can be connected to each other, and then the adjacent elements Layer 1 is connected in parallel or in series, so that the conductive segments 12 of each element layer 1 can receive current at the same time. In the present invention, when the conductive section 12 of each element layer 1 of the micro-electromagnetic element C is connected to a current, the micro-electromagnetic element C can interact with an external magnetic field, so that the micro-electromagnetic element C is subjected to ampere force and causes the micro-electromagnetic element C to move.

In the present invention, the micro-electromagnetic element C of the invention includes at least one element layer 1 so that the micro-electromagnetic element C has a sheet-like structure as a whole. In this way, when the micro-electromagnetic element C of the invention cooperates with the magnetic element, the magnetic element is in a micro-structure. side of the electromagnetic element C, so that when avoiding the interaction between the micro-electromagnetic element C and the magnetic element, only the gap setting in one direction needs to be considered, which helps to reduce the gap between the micro-electromagnetic element C and the magnetic element, and thereby has It helps to make the interaction force between the micro-electromagnetic element C and the magnetic element large, and also helps to reduce the size of the micro-electromagnetic element C; in addition, when the new micro-electromagnetic element C and the magnetic element cooperate with each other, the magnetic element is in side of the micro-electromagnetic element, so that the installation constraints between the micro-electromagnetic element C and the magnetic element are small, so that the sizes of the micro-electromagnetic element C and the magnetic element can be independently increased, which in turn helps to make the micro-electromagnetic element C and the magnetic element The interaction between them is large.

As shown in Figure 8, the present invention also discloses an electromagnetic transducer T, which includes at least one magnetic element for generating a driving magnetic field and the above-mentioned micro-electromagnetic element C; the number of magnetic elements can be two, two The magnetic element is divided into a first magnetic element T1 and a second magnetic element T2. A driving magnetic field is generated between the first magnetic element T1 and the second magnetic element T2; the micro-electromagnetic element C is movablely arranged between the first magnetic element T1 and the second magnetic element T2. between the second magnetic elements T2, so that the micro-electromagnetic element C is movable and disposed in the driving magnetic field.

As shown in FIG. 8 , in the present invention, when each conductive section 12 of the micro-electromagnetic element C is supplied with current, the micro-electromagnetic element C will interact with the driving magnetic field to cause the micro-electromagnetic element C to move. When each conductive section 12 of the micro-electromagnetic element C is supplied with a forward current or a reverse current, the driving magnetic field acts on the micro-electromagnetic element C, so that the micro-electromagnetic element C is subjected to an ampere perpendicular to the direction of the current and the direction of the magnetic field of the driving magnetic field. Force, this Ampere force drives the micro-electromagnetic element C to move, and this Ampere force satisfies the formula: F=ΣB‧I‧L; Where F is the Ampere force, B is the magnetic field strength of the driving magnetic field, I is the current of the conductive section 12, and L is the line length of the conductive section 12; when the direction of the current of the conductive section 12 changes, the direction of the Ampere force also changes accordingly. Change, so that when the current direction of the conductive section 12 repeatedly changes in the opposite direction (for example, the current of the conductive section 12 is alternating current), the micro-electromagnetic element C will reciprocate. In the present invention, the direction of the energizing current of the conductive section 12 intersects the direction of the magnetic field of the driving magnetic field, so that the micro-electromagnetic element C moves under the action of the driving magnetic field; preferably, each conductive section of the micro-electromagnetic element C The direction of the energizing current of each conductive section 12 of the micro-electromagnetic element C is the same, and the direction of the energizing current of each conductive section 12 of the micro-electromagnetic element C is set perpendicularly to the direction of the magnetic field of the driving magnetic field. This arrangement can maximize the Ampere force experienced by the micro-electromagnetic element C, so that the micro-electromagnetic element C The interaction force between C and magnetic components is large. The first magnetic element T1 and the second magnetic element T2 can be arranged oppositely so that the driving magnetic field is a parallel magnetic field, which also helps to increase the interaction force between the micro-electromagnetic element C and the magnetic element.

As shown in Figure 8, the new electromagnetic transducer T of the present invention may also include a housing T3, which is used to carry the first magnetic element T1, the second magnetic element T2 and the micro-electromagnetic element C; wherein the first magnetic element T1 The second magnetic element T2 and the second magnetic element T2 are respectively arranged on opposite sides of the housing T3. That is, the magnetic element of the new electromagnetic transducer T is arranged inside the housing T3, and the micro-electromagnetic element C is movably arranged in the housing T3. The material of the housing T3 can be a magnetically permeable material. In this way, the degree of magnetization in the housing T3 can be adjusted by selecting magnetically permeable materials with different magnetic permeabilities, which in turn helps to improve the connection between the microelectromagnetic element C and the magnetic element. The interaction force is strong.

The present invention also discloses an electronic device, which includes the above-mentioned electromagnetic transducer T; as shown in FIG. 9 , the electronic device can be a micro-speaker S. The micro-speaker S specifically includes a diaphragm S1 and the above-mentioned electromagnetic transducer. transducer T, in which the diaphragm S1 is combined with the micro-electromagnetic element C of the electromagnetic transducer T. When the micro-electromagnetic element C moves, it will drive the diaphragm S1 to move, thereby producing sound; wherein the conductivity of the micro-electromagnetic element C can be controlled The size and direction of the energizing current in segment 12 control the size and direction of the vibration of diaphragm S1, thereby changing the frequency and volume of the sound. It should be noted that, The electronic device can also be a micro motor, that is, the new electromagnetic transducer T can also be applied to a micro motor, and the micro motor can be a linear motor or a rotor motor.

The contents disclosed above are only the preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

C: Micro electromagnetic components

1: Component layer

11:Substrate

12: Conductive section

13: Positive conductive end

131:Positive conductive hole

14: Negative conductive terminal

141: Negative conductive hole

Claims (16)

A micro-electromagnetic component including: at least one component layer; Wherein, each component layer includes a substrate and a plurality of conductive segments disposed on the front surface of the substrate, wherein there are gaps between adjacent conductive segments; Wherein, when the number of the element layers is at least two or more, the multiple element layers are superimposed on each other, and the conductive segments of each element layer do not intersect. The microelectromagnetic element according to claim 1, wherein the element layer further includes a positive conductive end and a negative conductive end disposed on the front surface of the substrate, and a first conductive section of part or all of the element layer One end is connected to the positive conductive end of the element layer, and a second end of part or all of the conductive segments of the element layer is connected to the negative conductive end of the element layer. The micro-electromagnetic element according to claim 1, wherein the conductive segments of the element layer are divided into at least two micro-segment regions, each micro-segment region has multiple conductive segments, and gaps are formed between adjacent micro-segment regions. ; Wherein, the component layer also includes a positive conductive terminal and a negative conductive terminal with the same number as the at least two micro-line segment areas, and each positive conductive terminal and negative conductive terminal of the component layer are disposed on the substrate of the component layer On the front side, each micro-line segment area of the element layer is arranged corresponding to the positive conductive end and the negative conductive end of the element layer; Wherein, a first end of part or all of the conductive segments in each micro line segment area is connected to the positive conductive end corresponding to the micro line segment area, and a second end of part or all of the conductive segments in each micro line segment area is connected to The negative conductive end corresponding to the micro line segment area is connected. The microelectromagnetic element according to claim 1, characterized in that when the number of the element layers is at least two or more, a first end of part or all of the conductive segments of a certain element layer is in contact with the element layer. A positive conductive terminal provided on a substrate of an adjacent component layer is connected, and a second end of part or all of the conductive segments of the component layer is connected to a negative conductive terminal provided on a substrate of the component layer adjacent to the component layer connection. The microelectromagnetic component according to any one of claims 2 to 4, wherein the positive conductive end and the negative conductive end are respectively provided with a positive conductive hole and a negative conductive hole. The microelectromagnetic element according to any one of claims 2 to 4, wherein when the number of the element layers is at least two or more, the positive conductive end and the negative conductive end of adjacent element layers are connected to each other. This enables adjacent component layers to be connected in series or parallel. The microelectromagnetic element according to claim 1, wherein the substrate of the at least one element layer is provided with a magnetic conductor. The microelectromagnetic element according to claim 1 or 7, wherein the material of the substrate of the element layer is silicon, ceramic, glass, sapphire, laser direct forming plastic, germanium, gallium arsenide, indium phosphide, nitrogen One of gallium, silicon carbide, bismaleimide-triazine (BT), Ajinomoto structural film (ABF), bakelite, glass fiber, plastic or zinc selenide. The microelectromagnetic element according to claim 1 or 7, wherein each conductive segment of the element layer has a linear segment structure, and the plurality of conductive segments of each element layer are parallel to each other. An electromagnetic transducer, including at least one magnetic element for generating a driving magnetic field and the micro-electromagnetic element as described in claim 1; the micro-electromagnetic element is movably arranged in the driving magnetic field; when each of the micro-electromagnetic elements When a current flows through the conductive section, the micro-electromagnetic element will interact with the driving magnetic field generated by the magnetic element to cause the micro-electromagnetic element to move. The electromagnetic transducer according to claim 10, wherein the number of the magnetic elements is two, and the two magnetic elements are divided into a first magnetic element and a second magnetic element; wherein the first magnetic element and the The second magnetic element is arranged oppositely, so that the driving magnetic field generated between the first magnetic element and the second magnetic element is a parallel magnetic field. The electromagnetic transducer according to claim 10 or 11, wherein the energizing current direction of part or all of the conductive segments of the micro-electromagnetic element is arranged to intersect with the magnetic field direction of the driving magnetic field. The electromagnetic transducer according to claim 12, wherein the energizing current direction of each conductive segment of the micro-electromagnetic element is the same, and the energizing current direction of each conductive segment of the micro-electromagnetic element is consistent with the magnetic field direction of the driving magnetic field. Vertical setting. The electromagnetic transducer according to claim 10, further comprising a casing; the magnetic element is disposed inside the casing; and the micro-electromagnetic element is movably disposed in the casing. The electromagnetic transducer according to claim 14, wherein the material of the housing is a magnetically permeable material. An electronic device, including the electromagnetic transducer according to claim 10.

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