TWM650096U - Shielding structure of electrical connector - Google Patents
Shielding structure of electrical connector Download PDFInfo
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- TWM650096U TWM650096U TW112208984U TW112208984U TWM650096U TW M650096 U TWM650096 U TW M650096U TW 112208984 U TW112208984 U TW 112208984U TW 112208984 U TW112208984 U TW 112208984U TW M650096 U TWM650096 U TW M650096U
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- 230000005540 biological transmission Effects 0.000 claims description 7
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- 238000003032 molecular docking Methods 0.000 abstract description 23
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Abstract
本創作係為一種電連接器之屏蔽構造,包括:一絕緣本體,其舌板前緣向後依序設有呈鏤空狀之複數第一對接槽、複數第二對接槽及複數限位槽;一高速端子組,其包括穿設於該絕緣本體中之接地端子、第一信號對端子及第二信號對端子;一低速端子組,其包括穿設於該絕緣本體中位於該接地端子與該第一信號對端子之間的第三信號對端子,以及位於該接地端子與該第二信號對端子之間的第四信號對端子;一屏蔽端子,其包括有一基板且該基板二側轉折形成穿設於該些限位槽中之側板,該二側板穿設處分別位於該第一信號對端子與該第三信號對端子之間,以及該第二信號對端子與該第四信號對端子之間,而該屏蔽端子之該二側板於鄰近該舌板後端處延伸有外露於該絕緣本體後側之一接地腳,而該基板中具有向外抵接於互配連接器的金屬殼體內壁處之抵持部。 The invention is a shielding structure of an electrical connector, which includes: an insulating body, the front edge of the tongue plate of which is provided with a plurality of first hollow-shaped first docking grooves, a plurality of second docking grooves and a plurality of limiting grooves in sequence; a high-speed A terminal set, which includes a ground terminal, a first signal pair terminal and a second signal pair terminal inserted through the insulating body; a low-speed terminal set, which includes a ground terminal and the first signal pair inserted through the insulating body. a third signal pair terminal between the signal pair terminals, and a fourth signal pair terminal between the ground terminal and the second signal pair terminal; a shielding terminal including a base plate with two sides of the base plate turned to form a through-hole In the side plates in the limiting grooves, the penetration points of the two side plates are respectively located between the first pair of signal terminals and the third pair of signal terminals, and between the second pair of signal terminals and the fourth pair of signal terminals. , and the two side plates of the shielding terminal extend adjacent to the rear end of the tongue plate with a ground pin exposed on the rear side of the insulating body, and the base plate has an inner wall of the metal shell that abuts outwardly on the mating connector Department of resistance.
Description
本創作係有關於一種電連接器之屏蔽構造,尤指一種電連接器中高速端子組之第一信號對端子與第二信號對端子於傳輸高頻信號時所產生電磁波,可透過位於二者之間的屏蔽端子加以屏蔽及吸收,而屏蔽端子消除電磁波之第一路徑為藉由抵持部將所吸收電磁波轉換形成電流傳導至互配連接器之金屬殼體中,而金屬殼體所接收電流再導引至所連接預設第一電路板之接地區或第一電子產品之金屬外殼中進行消弭;屏蔽端子消除電磁波之第二路徑為透過屏蔽端子之二接地腳,將電磁波轉換形成電流傳導至預設第二電路板或第二電子產品之金屬外殼中進行消弭,透過第一路徑及第二路徑便可達到消除高速端子於傳輸高頻信號時所產生串音干擾及電磁波干擾問題。 This invention relates to a shielding structure of an electrical connector, and specifically refers to an electromagnetic wave generated when the first signal pair terminal and the second signal pair terminal of a high-speed terminal set in an electrical connector transmit high-frequency signals, which can pass through the two The shielding terminals between them are shielded and absorbed, and the first path for the shielding terminals to eliminate electromagnetic waves is to convert the absorbed electromagnetic waves into currents through the resisting portion and conduct them to the metal shell of the mating connector, and the metal shell receives The current is then directed to the grounding area of the connected first circuit board or the metal shell of the first electronic product for elimination; the second path for the shielding terminal to eliminate electromagnetic waves is to convert the electromagnetic waves into current through the two grounding pins of the shielding terminal. It is conducted to the preset second circuit board or the metal casing of the second electronic product for elimination. Through the first path and the second path, the crosstalk interference and electromagnetic wave interference problems generated by high-speed terminals when transmitting high-frequency signals can be eliminated.
按,現今電子科技快速發展,使各式各樣之電子裝置皆已普及於社會中的各個角落,並隨著科技的愈發達,電腦、筆記型電腦、智慧型手機等電子產品的發展趨勢亦朝運算功能強、傳輸速度快及體積輕、薄、短、小的方向邁進,而電子產品內部之連接器體積大小及高度便需要隨之更為小型化且精密,整體結構強度也需加強,並因應目前電子產品之發展趨勢,便發展出各種不同型式之連接器。 According to the rapid development of electronic technology nowadays, various electronic devices have been popularized in every corner of society. As technology becomes more and more developed, the development trend of electronic products such as computers, laptops, and smart phones also increases. Moving towards strong computing power, fast transmission speed, and light, thin, short, and small size, the size and height of the connectors inside electronic products need to be smaller and more precise, and the overall structural strength also needs to be strengthened. In response to the current development trends of electronic products, various types of connectors have been developed.
再者,由於目前行動裝置之連接器除了設計越來越微小化之外,對於傳輸速度及頻寬的要求也越來越高,相形之下高頻訊號傳輸所產生的問題更是層出不窮,並隨著連接器微小化和傳輸速度大幅提升,其端子組的數目增多且分佈也更為密集,極容易因相鄰端子間過於接近而造成高頻訊號傳輸時之電磁波及串音干擾等,未來還會隨著半導體製程的進步,使連接器本身之訊號干擾問題將會更加嚴重,對於高頻連接器而言,在許多訊號完整性的問題中,電磁波干擾(EMI)的大小與電子產品內部系統接地區域如何設計具有極大的關係,以USB3.1 TYPE-A連接器而言,包含位於對接後端之二根低速端子(D+、D-)及電源/接地端子(VBUS、GND),以及位於對接後端之四根高速端子(SSTX+、SSTX-、SSRX+、SSRX-)及位於中央處之接地端子,當高速端子於傳輸高頻信號時易造成串音干擾及電磁波干擾現象,致使高頻傳輸無法達到預定的標準,如何解決前述問題則有待從事此行業者加以研究及克服。 Furthermore, as the connectors of current mobile devices are becoming smaller and smaller in design, the requirements for transmission speed and bandwidth are also getting higher and higher. In contrast, problems caused by high-frequency signal transmission are endless, and As connectors become miniaturized and transmission speeds increase significantly, the number of their terminal groups increases and their distribution becomes more dense. It is extremely easy for adjacent terminals to be too close to each other, causing electromagnetic waves and crosstalk interference during high-frequency signal transmission. In the future, With the advancement of semiconductor manufacturing processes, the problem of signal interference in the connector itself will become more serious. For high-frequency connectors, among many signal integrity problems, the size of electromagnetic interference (EMI) is closely related to the internal structure of electronic products. How the system grounding area is designed has a great relationship. For the USB3.1 TYPE-A connector, it includes two low-speed terminals (D+, D-) and power/ground terminals (VBUS, GND) at the back end of the docking, and The four high-speed terminals (SSTX+, SSTX-, SSRX+, SSRX-) located at the back end of the docking station and the ground terminal located in the center can easily cause crosstalk interference and electromagnetic wave interference when transmitting high-frequency signals, resulting in high-frequency The transmission cannot meet the predetermined standards. How to solve the aforementioned problems needs to be studied and overcome by those engaged in this industry.
故,創作人有鑑於上述之問題與缺失,乃蒐集相關資料,經由多方評估及考量,始設計出此種電連接器之屏蔽構造之創作誕生。 Therefore, in view of the above-mentioned problems and deficiencies, the creator collected relevant information, and after multiple evaluations and considerations, he came up with the creation of the shielding structure of this electrical connector.
本創作主要為一種電連接器之屏蔽構造,包括:一絕緣本體,其舌板前緣向後依序設有呈鏤空狀之複數第一對接槽、複數第二對接槽及複數限位槽;一高速端子組,其包括穿設於該絕緣本體中之接地端子、第一信號對端子及第二信號對端子;一低速端子組,其包括穿設於該絕緣本體中位於該接地端子與該第一信號對端子之間的第三信號對端子,以及位於該接地端子與該第二信號對端子之間的第四信號對端子;一屏蔽端 子,其包括有一基板且該基板二側轉折形成穿設於該些限位槽中之側板,該二側板穿設處分別位於該第一信號對端子與該第三信號對端子之間,以及該第二信號對端子與該第四信號對端子之間,而該屏蔽端子之該二側板於鄰近該舌板後端處延伸有外露於該絕緣本體後側之一接地腳,而該基板中具有向外抵接於互配連接器的金屬殼體內壁處之抵持部。藉由前述構成,高速端子組之第一信號對端子與第二信號對端子於傳輸高頻信號時所產生電磁波,可透過位於二者之間的屏蔽端子加以屏蔽及吸收,而屏蔽端子消除電磁波之第一路徑為藉由抵持部將所吸收電磁波轉換形成電流傳導至互配連接器之金屬殼體中,而金屬殼體所接收電流再導引至所連接預設第一電路板之接地區或第一電子產品之金屬外殼中進行消弭;屏蔽端子消除電磁波之第二路徑為透過屏蔽端子之二接地腳,將電磁波轉換形成電流傳導至預設第二電路板或第二電子產品之金屬外殼中進行消弭,透過第一路徑及第二路徑便可達到消除高速端子於傳輸高頻信號時所產生串音干擾及電磁波干擾問題。 This invention is mainly a shielding structure of an electrical connector, which includes: an insulating body, the front edge of the tongue plate of which is provided with a plurality of hollow-shaped first docking grooves, a plurality of second docking grooves and a plurality of limiting grooves in sequence; a high-speed A terminal set, which includes a ground terminal, a first signal pair terminal and a second signal pair terminal inserted through the insulating body; a low-speed terminal set, which includes a ground terminal and the first signal pair inserted through the insulating body. a third signal pair terminal between the signal pair terminals, and a fourth signal pair terminal between the ground terminal and the second signal pair terminal; a shielding terminal The sub-unit includes a base plate and two sides of the base plate are turned to form side plates that pass through the limiting grooves, and the penetration points of the two side plates are respectively located between the first pair of signal terminals and the third pair of signal terminals, and Between the second signal pair terminal and the fourth signal pair terminal, a ground pin exposed on the rear side of the insulating body extends from the two side plates of the shielding terminal adjacent to the rear end of the tongue plate, and in the substrate It has a resisting portion that abuts outwardly against the inner wall of the metal housing of the mating connector. With the above structure, the electromagnetic waves generated by the first signal pair terminal and the second signal pair terminal of the high-speed terminal group when transmitting high-frequency signals can be shielded and absorbed by the shielding terminal located between them, and the shielding terminal eliminates the electromagnetic waves. The first path is to convert the absorbed electromagnetic wave into a current through the resisting part and conduct it to the metal shell of the mating connector, and the current received by the metal shell is then directed to the connection of the connected first circuit board. area or the metal shell of the first electronic product; the second path for the shielding terminal to eliminate the electromagnetic wave is to convert the electromagnetic wave into a current through the two ground pins of the shielding terminal and conduct it to the preset second circuit board or the metal of the second electronic product. Elimination is carried out in the casing. Through the first path and the second path, the problems of crosstalk interference and electromagnetic wave interference generated by high-speed terminals when transmitting high-frequency signals can be eliminated.
本創作之次要目的在於該絕緣本體外部更組裝有一屏蔽殼體,該屏蔽殼體具有鄰近該舌板前緣之對接側與遠離該舌板前緣之組裝側,該屏蔽殼體之該組裝側係供一背板做一卡合固定。 The secondary purpose of this invention is to assemble a shielding case outside the insulating body. The shielding case has a butt side adjacent to the front edge of the tongue plate and an assembly side away from the front edge of the tongue plate. The assembly side of the shielding case is Provide a back plate for snap-fastening.
本創作之另一目的在於該絕緣本體之該舌板更向後延伸有一架高體,穿設於該舌板中之該接地端子、該第一信號對端子、該第二信號對端子、該第三信號對端子及該第四信號對端子於該架高體中轉折向下後各自水平延伸有呈外露之焊接部。 Another object of this invention is that the tongue plate of the insulating body further extends rearward with a tall body, which penetrates the ground terminal, the first signal pair terminal, the second signal pair terminal, and the third signal pair terminal in the tongue plate. The three signal pair terminals and the fourth signal pair terminal are turned downward in the elevated body and each has an exposed welding portion extending horizontally.
本創作之再一目的在於該屏蔽端子為呈『U』字型或倒『U 』字型之板體所構成,且該屏蔽端子之該基板係可屏蔽該接地端子、該第三信號對端子及該第四信號對端子之頂側或底側於高速傳輸所產生電磁波。 Another purpose of this creation is that the shielding terminal is in a "U" shape or an inverted "U" shape. ‖-shaped plate body, and the base plate of the shielding terminal can shield the top or bottom side of the ground terminal, the third signal pair terminal and the fourth signal pair terminal from electromagnetic waves generated during high-speed transmission.
1:絕緣本體 1: Insulating body
11:舌板 11: Tongue plate
111:第一對接槽 111: First docking slot
112:第二對接槽 112: Second docking slot
113:限位槽 113:Limit slot
12:架高體 12: Elevated body
2:高速端子組 2:High speed terminal group
21:接地端子 21: Ground terminal
211:對接部 211: docking department
212:焊接部 212:Welding Department
22:第一信號對端子 22: First signal pair terminal
221:對接部 221: docking department
222:焊接部 222:Welding Department
23:第二信號對端子 23: Second signal pair terminal
231:對接部 231: docking department
232:焊接部 232:Welding Department
3:低速端子組 3: Low speed terminal group
31:第三信號對端子 31: The third signal pair terminal
311:對接部 311: docking department
312:焊接部 312:Welding Department
32:第四信號對端子 32: The fourth signal pair terminal
321:對接部 321: docking department
322:焊接部 322:Welding Department
4:屏蔽端子 4: Shield terminal
41:基板 41:Substrate
411:抵持部 411: Resistance Department
42:側板 42:Side panel
421:接地腳 421: Ground pin
5:屏蔽殼體 5: Shielding shell
51:對接側 51: docking side
52:組裝側 52:Assembly side
6:背板 6:Back panel
7:互配連接器 7: Intermateable connector
71:金屬殼體 71:Metal shell
〔第1圖〕係為本創作電連接器之立體外觀圖。 [Picture 1] is a three-dimensional appearance of the electrical connector of this invention.
〔第2圖〕係為本創作電連接器之另一視角立體外觀圖。 [Picture 2] is another three-dimensional view of the electrical connector of this invention.
〔第3圖〕係為本創作電連接器之立體分解圖。 [Picture 3] is a three-dimensional exploded view of the electrical connector of this invention.
〔第4圖〕係為本創作電連接器之另一視角立體分解圖。 [Picture 4] is an exploded three-dimensional view of the electrical connector of this invention from another perspective.
〔第5圖〕係為本創作高速端子組、低速端子組及屏蔽端子組裝後之立體圖。 [Picture 5] is a three-dimensional view of the high-speed terminal set, low-speed terminal set and shielding terminal of this creation after assembly.
〔第6圖〕係為本創作電連接器與互配連接器對接前之側視剖面圖。 [Figure 6] is a side cross-sectional view of the electrical connector of this invention before it is connected to the mating connector.
〔第7圖〕係為本創作電連接器與互配連接器對接後之側視剖面圖。 [Figure 7] is a side cross-sectional view of the electrical connector of this invention after mating with the mating connector.
請參閱第1至5圖所示,各別為本創作電連接器之立體外觀圖、另一視角立體外觀圖、立體分解圖、另一視角立體分解圖及高速端子組、低速端子組及屏蔽端子組裝後之立體圖,由圖中可清楚看出,本創作電連接器主要包括一絕緣本體1、一高速端子組2、一低速端子組3及一屏蔽端子4,其詳細結構與連接關係如下:
Please refer to Figures 1 to 5, which are respectively a three-dimensional appearance view, a three-dimensional appearance view from another perspective, an exploded perspective view, an exploded perspective view from another perspective, and the high-speed terminal set, low-speed terminal set and shielding of the electrical connector of this invention. From the three-dimensional view of the terminal assembly, it can be clearly seen from the figure that the electrical connector of this invention mainly includes an insulating
該絕緣本體1之舌板11前緣向後依序設有呈鏤空狀之複數第一對接槽111、複數第二對接槽112及複數限位槽113。
The front edge of the
該高速端子組2包括穿設於該絕緣本體1中位於中央處之接
地端子21,以及位於該接地端子21二側之第一信號對端子22及第二信號對端子23,該接地端子21、該第一信號對端子22及該第二信號對端子23之對接部(211、221、231)係位於該些第一對接槽111中。
The high-speed terminal set 2 includes a central connector inserted through the insulating
該低速端子組3包括穿設於該絕緣本體1中位於該接地端子21與該第一信號對端子22之間的第三信號對端子31,以及位於該接地端子21與該第二信號對端子23之間的第四信號對端子32,該第三信號對端子31及該第四信號對端子32之對接部(311、321)係位於該些第二對接槽112中。
The low-speed terminal set 3 includes a third
該屏蔽端子4包括有一基板41且該基板41二側轉折形成穿設於該些限位槽113中之側板42,該二側板42穿設處分別位於該第一信號對端子22與該第三信號對端子31之間,以及該第二信號對端子23與該第四信號對端子32之間,而該屏蔽端子4之該二側板42於鄰近該舌板11後端處延伸有外露於該絕緣本體1後側之一接地腳421,而該基板41中具有向外抵接於預設互配連接器7的金屬殼體71內壁處之抵持部411。
The shielding
上述該絕緣本體1外部更組裝有一屏蔽殼體5,該屏蔽殼體5具有鄰近該舌板11前緣之對接側51與遠離該舌板11前緣之組裝側52,該屏蔽殼體5之該組裝側52係供一背板6做一卡合固定,而該屏蔽殼體5與該背板6皆為金屬材料所構成,可有效屏蔽高速端子組2與低速端子組3於傳輸信號時之各種角度的電磁波。
The above-mentioned
上述該絕緣本體1之該舌板11更向後延伸有一架高體12,穿設於該舌板11中之該接地端子21、該第一信號對端子22、該第二信號對端子23、該第三信號對端子31及該第四信號對端子32於該架高體12中轉折向
下後各自水平延伸有呈外露之焊接部(212、222、232、312、322)。
The
前述電連接器規格係指USB3.1 TYPE-A之插座連接器,各端子對應本創作之符號標示為:接地端子21之腳位定義為(GND_DRAIN);第一信號對端子22之腳位定義為(SSTX+、SSTX-);第二信號對端子23之腳位定義為(SSRX+、SSRX-);第三信號對端子31之腳位定義為(VBUS、D-);第四信號對端子32之腳位定義為(GND、D+),與本創作電連接器對應接合之互配連接器7係指規格為USB3.1 TYPE-A之插頭連接器。
The aforementioned electrical connector specifications refer to the USB3.1 TYPE-A socket connector. The symbols corresponding to each terminal of this creation are: the pin definition of the
上述該屏蔽端子4為呈『U』字型(圖中未示)或倒『U』字型之板體所構成,且該屏蔽端子4之該基板41係可屏蔽該接地端子21、該第三信號對端子31及該第四信號對端子32之頂側或底側於高速傳輸所產生電磁波;而該屏蔽端子4之該抵持部411係為彈片或凸塊(圖中未示)所構成;而該屏蔽端子4係為透過埋入射出工法(Insert Molding),或是由該架高體12處透過預設推移治具(圖中未示)之推移成型於該絕緣本體1中。前述屏蔽端子4於實施結構中雖為呈倒『U』字型之板體,但透過將絕緣本體1設計變更亦可使呈『U』字型之屏蔽端子4固定於其中。更進一步,亦可將屏蔽端子4設計為內部為中空狀之長矩形體並於頂面及底板皆設有抵持部411,便可使屏蔽端子4之抵持部411同時接觸於互配電連接器7(如第7圖所示)之金屬殼體71上、下內壁處,此等屏蔽端子4之簡易變化應納入本創作保護範圍中。
The above-mentioned
上述該高速端子組2與該低速端子組3係為透過埋入射出工法成型於該絕緣本體1中。
The above-mentioned high-
欲將本創作之電連接器進行組裝時,較佳做法為將高速端子組2、該低速端子組3及屏蔽端子4係為透過埋入射出工法成型於絕緣本體1中,續將絕緣本體1之舌板11對位於屏蔽殼體5之組裝側52做一推移穿置,最後將背板6對位於屏蔽殼體5之組裝側52透過卡扣(未標示)及扣槽(未標示)做一卡合固定,藉由前述方法來達成目的。
When assembling the electrical connector of the present invention, a preferred method is to mold the high-speed terminal set 2, the low-speed terminal set 3 and the shielding
本創作之主要特點在於電連接器中高速端子組2之第一信號對端子22與第二信號對端子23於傳輸高頻信號時所產生電磁波,可透過位於二者之間的屏蔽端子4加以屏蔽及吸收,而屏蔽端子4消除電磁波之第一路徑為藉由抵持部411將所吸收電磁波轉換形成電流傳導至互配連接器7之金屬殼體71中,而金屬殼體71所接收電流再導引至所連接預設第一電路板之接地區(圖中未示)或第一電子產品之金屬外殼(圖中未示)中進行消弭;屏蔽端子4消除電磁波之第二路徑為透過屏蔽端子4之二接地腳421,將電磁波轉換形成電流傳導至預設第二電路板(圖中未示)或第二電子產品之金屬外殼(圖中未示)中進行消弭,透過第一路徑及第二路徑便可達到消除高速端子於傳輸高頻信號時所產生串音干擾及電磁波干擾問題。本創作應用於電連接器製造領域中,具有極佳的實用性,故提出專利申請以尋求專利權之保護。
The main feature of this invention is that the electromagnetic waves generated by the first
上所述僅為本創作之較佳實施例而已,非因此即侷限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本創作之專利範圍內,合予陳明。 The above descriptions are only preferred embodiments of this invention, and do not limit the patent scope of this invention. Therefore, any simple modifications and equivalent structural changes made by using the contents of the description and drawings of this invention should be similarly included in This creation is within the scope of the patent and is hereby stated.
綜上所述,本創作上述電連接器之屏蔽構造於使用時,為確實能達到其功效及目的,故本創作誠為一實用性優異之創作,為符合新 型專利之申請要件,爰依法提出申請,盼審委早日賜准本案,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 To sum up, the shielding structure of the above-mentioned electrical connector of this invention can indeed achieve its effect and purpose when used. Therefore, this invention is truly a creation with excellent practicality and is in line with the new The application requirements for a type patent must be filed in accordance with the law. We hope that the review committee will approve this case as soon as possible to protect the creator's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write a letter and give instructions. The creator will try his best to cooperate and realize his moral integrity. Convenience.
1:絕緣本體 1: Insulating body
11:舌板 11: Tongue plate
111:第一對接槽 111: First docking slot
112:第二對接槽 112: Second docking slot
113:限位槽 113:Limit slot
12:架高體 12: Elevated body
2:高速端子組 2:High speed terminal group
21:接地端子 21: Ground terminal
211:對接部 211: docking department
212:焊接部 212:Welding Department
22:第一信號對端子 22: First signal pair terminal
221:對接部 221: docking department
222:焊接部 222:Welding Department
23:第二信號對端子 23: Second signal pair terminal
231:對接部 231: docking department
232:焊接部 232:Welding Department
3:低速端子組 3: Low speed terminal group
31:第三信號對端子 31: The third signal pair terminal
311:對接部 311: docking department
312:焊接部 312:Welding Department
32:第四信號對端子 32: The fourth signal pair terminal
321:對接部 321: docking department
322:焊接部 322:Welding Department
4:屏蔽端子 4: Shield terminal
41:基板 41:Substrate
411:抵持部 411: Resistance Ministry
42:側板 42:Side panel
421:接地腳 421: Ground pin
5:屏蔽殼體 5: Shielding shell
51:對接側 51: docking side
52:組裝側 52:Assembly side
6:背板 6:Back panel
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112208984U TWM650096U (en) | 2023-08-23 | 2023-08-23 | Shielding structure of electrical connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112208984U TWM650096U (en) | 2023-08-23 | 2023-08-23 | Shielding structure of electrical connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM650096U true TWM650096U (en) | 2024-01-01 |
Family
ID=90455534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112208984U TWM650096U (en) | 2023-08-23 | 2023-08-23 | Shielding structure of electrical connector |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM650096U (en) |
-
2023
- 2023-08-23 TW TW112208984U patent/TWM650096U/en unknown
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