TWM648179U - Filtering device for use in clean room - Google Patents

Abstract

A filtering device for a clean room is provided in a clean room used for semiconductor manufacturing processes or a ventilation duct of the clean room. It includes at least one filtering and decontamination plate, an exhaust device and a power supply device. The filtering device The dirt board includes a dirt removal layer. The dirt removal layer has an outer frame on the periphery. The outer frame has two conductive pins, and a energized grid is provided in the outer frame. An organic substance is coated on the surface of the energized grid. An adsorption layer or an inorganic adsorption layer. The organic adsorption layer or the inorganic adsorption layer is used to adsorb organic pollutants or inorganic pollutants in the air of the clean room to prevent the semiconductor from being produced, stored or used in the clean room. , the organic pollutant or the inorganic pollutant causes pollution to the semiconductor or the clean room environment.

Description

Filtration devices for clean rooms

This invention relates to a filtering device for clean rooms, which is installed in a clean room used for semiconductor manufacturing processes or the ventilation duct of the clean room to absorb organic pollutants or inorganic pollutants in the air of the clean room. contaminants. Especially when the clean room is used to produce, store or use semiconductors, it can prevent organic pollutants or inorganic pollutants from contaminating the semiconductor or the clean room environment.

According to the current semiconductor device manufacturing technology, the circuit pattern of the semiconductor device is transferred to the surface of the silicon wafer through a lithography process. Specifically, a light source of a specific wavelength is used to project through a photomask. way to transfer the circuit pattern to the surface of the silicon wafer. In the manufacturing process of semiconductor components, taking the photomask as an example, defects in the photomask will cause distortion or deformation of the circuit pattern on the surface of the silicon wafer, especially the miniaturization of semiconductor components, even if they are only nanometer-sized (for example, 20nm~200nm) Defects will cause damage to semiconductor circuit patterns.

It is known that one of the causes of photomask defects is that the surface of the photomask is contaminated by dust or contamination particles. In order to maintain the quality of the photomask during use, a conventional method is to set a mask on the surface of the photomask. A photomask protective film (pellicle) used to prevent contaminants from falling on the photomask surface and forming pollution particles. However, even with the above-mentioned photomask protective film, it is still impossible to completely avoid contamination of the photomask surface by pollutants in practice. The sources or causes of photomask pollutants include clean rooms, photomasks, etc. storage environment and lithography Pollutants generated in the environment of equipment and chemicals during the manufacturing process and in the inner cavity of the photomask may still enter the inner cavity of the photomask through the vent holes or thin films of the photomask protective film.

On the other hand, the adhesive used to adhere the photomask protective film to the photomask surface and the components contained in the frame adhesive of the photomask itself may also be damaged due to gas outgassing or other factors during the lithography process. Pollutants are generated due to various reasons. Generally speaking, organic pollutants, inorganic pollutants such as ammonia and sulfur oxide compounds or other pollutants will deposit or adhere to the surface of the photomask and gradually form a mist ( haze), when contaminants (such as ammonium sulfate) accumulate to a certain extent, larger crystals or particles will be formed, which will then be focused and transferred together with the circuit pattern of the photomask during the lithography process. to the surface of the silicon wafer, causing distortion or deformation of the circuit pattern. Therefore, how to absorb pollutants more effectively during the use of the photomask to prevent the generation of mist has become one of the problems that the industry is trying to solve.

In order to solve the above problems, this invention coats an electrically heated grid with an adsorption layer for adsorbing pollutants and serves as an air filtering device.

Therefore, this invention proposes a filtering device for a clean room, which includes at least one filtering and decontamination plate, an exhaust device and a power supply device. The filtering and decontamination plate includes a decontamination layer. The decontamination layer has an outer frame on its periphery. The outer frame has two conductive pins, and an electrified grid is provided in the outer frame. The outer frame and the conductive contact The feet and the electrified grid are both made of conductive material. An organic adsorption layer is coated on the surface of the electrified grid, and the filter layer is combined with one or both sides of the decontamination layer. The exhaust device is arranged on one side of the filter and decontamination plate. The power supply device is electrically connected to the conductive pin and the exhaust device to provide the electrical energy required by the decontamination layer and the exhaust device.

By this, the exhaust device can start the exhaust to make the air pass through each filter and decontamination plate, and the air may contain fine dust and gaseous organic matter. When the air passes through the filter and decontamination plate, the dust is captured by the filter layer, and the gaseous organic matter is captured by the filter layer. It is adsorbed by the organic adsorption layer. When the gaseous organic matter is eliminated, after the decontamination layer is energized, the outer frame and the electrified grid can be heated to reduce the adsorption force of the organic matter adsorption layer to the gaseous organic matter. In this way, the gaseous organic matter can be taken away through a clean air or an inert gas. Therefore, the organic matter adsorption layer will not continue to accumulate and adhere to the gaseous organic matter, and can be used continuously without reducing the use efficiency.

In a preferred embodiment, the organic matter adsorption layer is one or a combination of silicon polymer material, polyethylene glycol, squalane or ultra-high vacuum grease.

In a preferred embodiment, the silicone polymer material is silicone, polydimethylsiloxane, benzylpolysiloxane, trifluoropropylmethylpolysiloxane or cyanopropylphenylmethyl One or a combination of polysiloxanes.

In a preferred embodiment, the filter and decontamination plates are provided with at least two, and the surfaces of the electrified grids of the filter and decontamination plates are respectively coated with the organic adsorption layer or an inorganic adsorption layer.

In a preferred embodiment, the material of the inorganic adsorption layer includes 1 to 10 weight percent of polymer organic acid and 90 to 99 weight percent of water-based acrylic pressure-sensitive adhesive. Among them, the polymer organic acid can be replaced by an anionic polymer material.

In a preferred embodiment, the filter and decontamination plate further includes at least one filter layer, and the filter layer is combined on one side or both sides of the decontamination layer.

In a preferred embodiment, the filter and decontamination plate is disposed in a ventilation duct connected to a clean room, and the exhaust device is disposed in the ventilation duct close to the clean room. The power supply device includes a power supply, a switch and a circuit protection component. The power supply is electrically connected to the switch and the circuit protection component.

In a preferred embodiment, it further includes a bearing frame with two inner surfaces of the bearing frame There are a plurality of corresponding sets of slots, and each set of slots is used to assemble a filter and decontamination plate. There is a ventilation inlet at the front end of the carrier frame, and a ventilation outlet at the rear end. The ventilation outlet faces the dust-free room, the exhaust device is assembled at the ventilation outlet.

10:Filter and decontamination plate

1: Decontamination layer

11:Outer frame

12: Conductive pins

13: energized grid

131: Organic matter adsorption layer

132: Inorganic adsorption layer

14:First side

15:Second side

2:Filter layer

3:Exhaust device

4: Power supply device

41:Power supply

42: switch

43:Circuit protection components

5: Bearing frame

51:Slot

511:Trough wall

52:Ventilation entrance

53:Ventilation outlet

6: Blowing device

A: Ventilation duct

B: Clean room

C:Air

C1: fine dust

C2: The first pollutant

C3: Second pollutant

[Picture 1] is a three-dimensional exploded view of the various parts of the filter device used in clean rooms.

[Figure 2] is a three-dimensional exploded schematic diagram of the structure of the decontamination layer and filter layer of the filter device used in clean rooms in other embodiments of this invention.

[Figure 3] is a schematic cross-sectional view of the decontamination layer and filter layer of the filter device used in clean rooms of this invention combined into a filter decontamination plate.

[Picture 4] is a schematic side view of the plurality of filtering and decontamination plates installed in the ventilation duct of the filtration device used in the clean room of this invention.

[Figure 5] is a simple circuit diagram of the configuration of the power supply device of the filtration device used in the clean room.

[Figure 6] is a three-dimensional schematic diagram of the plurality of filtering and decontamination plates and the exhaust device of the filtration device used in the clean room installed on a bearing frame.

[Figure 7] is a schematic diagram of the cross-sectional operation of the exhaust device used in the filter device of the clean room to implement exhaust.

[Figure 8] is a cross-sectional schematic diagram of the filtering operation of the multi-filter decontamination plate of the filtration device used in a clean room.

[Figure 9] is a schematic cross-sectional view of the filter device used in clean rooms of this invention to eliminate dust or pollutants through the blower device.

Other technical contents, features and functions of this invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this creation belongs.

As used herein, the articles "a," "an," and "any" refer grammatically to one or more than one (i.e., at least one) item unless a specific number is specified. For example, "an element" means one element or more than one element.

Please refer to Figure 1. Figure 1 is a three-dimensional exploded view of each component structure of the filter device used in clean rooms. As shown in the figure, it includes two decontamination layers 1, two filter layers 2, an exhaust device 3 and a power supply device 4. The clean room may be a clean room where semiconductors are produced or used, a semiconductor storage environment, or any environment where one or a plurality of semiconductors are produced, stored or used. The semiconductor may be, for example, but not limited to, a photomask.

In this embodiment, the decontamination layer 1 has a flat outer frame 11 around the periphery. The outer frame 11 has two conductive pins 12 , and a conductive grid 13 is provided in the outer frame 11 . The outer frame 11 , the conductive pins 12 and the conductive grid 13 are all grid-shaped planes made of conductive material, such as but not limited to copper. In an actual example, the two conductive pins 12 are the positive electrode and the negative electrode respectively, which are electrically connected to the power supply device 4, and among the plurality of decontamination layers 1, the conductive pins 12 of each decontamination layer 1 are connected in series. The conductive pins 12 of each decontamination layer 1 may also be electrically connected to the power supply device 4 in a parallel manner. Due to the principle of electric heating, the outer frame 11 and the electrified grid 13 can be heated after being powered on, and the heating is used for decontamination. The surface of the energized grid 13 is coated with There are adsorption layers of pollutants, and the electrified grids 13 of the two decontamination layers 1 are respectively coated with different adsorption layers.

The adsorption layer for adsorbing pollutants includes an organic adsorption layer 131 and an inorganic adsorption layer 132. The organic adsorption layer 131 and the inorganic adsorption layer 132 are respectively coated on the surfaces of the electrified grids 13 of two different decontamination layers 1. In an actual example, the organic matter adsorption layer 131 is used to adsorb gaseous organic matter. The organic matter adsorption layer 131 is made of silicone polymers. The silicone polymer materials include, but are not limited to, silicone gel and polydiethylene. Polysiloxane (Polydimethylsiloxane, PDMS), phenylmethyl polysiloxane (including 50% phenyl phenyl and 50% methyl methyl), trifluoropropylmethyl polysiloxane (trifluoropropylmethyl polysiloxane; including 50% trifluoropropyl and 50% methyl), cyanopropylphenylmethyl polysiloxane (contains 50% cyanopropyl cyanopropyl and 50% phenylmethyl). In addition to silicon polymer materials, the organic matter adsorption layer 131 can also be polyethylene glycol (PEG), squalane (squalane) or ultra-high vacuum grease (Apiezon L); the inorganic matter adsorption layer 132 is made of To adsorb gaseous inorganic matter. In an actual example, the inorganic adsorption layer 132 is as in the Republic of China patent applied for by the applicant: a composition for absorbing pollutants in photomask protective film adhesive (Announcement No. I789737), specifically including 1 to 10 wt. Percent (wt%) of polymer organic acid and 90~99% by weight (wt%) of water-based acrylic pressure-sensitive adhesive. The polymer organic acid is polyacrylic acid (polyacrylic acid, PAA) or polymethacrylic acid (poly(methacrylic acid), PMMA). The polymeric organic acid can also be replaced by anionic polymer material. The anionic polymer material is poly(4-vinylbenzoic acid) or polystyrene sulphonic acid. acid resin).

In practice, the organic matter adsorption layer 131 or the inorganic matter adsorption layer 132 can be coated on the surface of the electrified grid 13 by any method such as tool brushing, spraying or soaking. This embodiment is not limited thereto. As long as the organic matter adsorption layer 131 or the inorganic matter adsorption layer 132 is attached to the surface of the electrified grid 13 and will not easily separate or fall off, it means that the organic matter adsorption layer 131 is coated on the surface of the electrified grid 13 in this embodiment. And the inorganic substance adsorption layer 132 is coated on the surface of the energized grid 13 .

In this embodiment, the filter layer 2 is made of fiber mesh, such as but not limited to non-woven fabric.

The combination of the decontamination layer 1 and the filter layer 2 is described below. The filter layer 2 is coupled to the outside of the dirt removal layer 1. In the embodiment of FIG. 1, the filter layer 2 is coupled to the first side 14 of the dirt removal layer 1. In other embodiments, please refer to Figure 2 . Figure 2 is a three-dimensional exploded schematic diagram of the structure of the decontamination layer 1 and the filter layer 2 in other embodiments. As shown in the figure, the filter layer 2 is combined with the first side 14 and the second side 15 of the decontamination layer 1 . In practice, the filter layer 2 can be combined with the decontamination layer 1 through any means such as screws, quick-release parts, buckles, nails or adhesives. This embodiment is not limited here, as long as the filter layer 2 is combined with the decontamination layer 1 On layer 1, it will not easily separate or fall off, which means that the filter layer 2 of this embodiment is combined with the outside of the dirt removal layer 1. The first side 14 or the second side 15 refers to the side where dust or pollutants (gaseous organic matter or gaseous inorganic matter) pass through the decontamination layer 1. In other words, the first side 14 or the second side 15 of the decontamination layer 1 It is the side through which fine dust or pollutants can pass. The first side 14 and the second side 15 are two opposite surfaces. In other embodiments, the organic adsorption layer 131 or the inorganic adsorption layer 132 of the decontamination layer 1 can also absorb fine dust. Therefore, the decontamination layer 1 does not need to be combined with the filter layer 2 .

Next, please refer to Figure 3. Figure 3 is a schematic cross-sectional view of the decontamination layer 1 and the filter layer 2 combined to form the filter decontamination plate 10. As shown in the figure, the decontamination layer 1 becomes a filter decontamination plate 10 after being combined with the filter layer 2. Therefore, in this embodiment, the two decontamination layers 1 are respectively combined with the two filter layers 2 to have two filter decontamination plates. Plate 10.

Please refer to Figure 4. Figure 4 is a schematic side view of two filter and decontamination plates 10 installed in a ventilation duct A. As shown in the figure, in this embodiment, the plurality of filtering and decontamination plates 10 are arranged in a ventilation duct. In the passage A, the ventilation duct A is connected to a clean room B. An exhaust device 3 is provided in the ventilation duct A close to the clean room B. The exhaust device 3 is electrically connected to the power supply device 4 .

The design of the power supply device 4 can be seen in Figure 5. Figure 5 is a simple circuit diagram of the configuration of the power supply device 4. As shown in the figure, the power supply device 4 is electrically connected to the conductive pins 12 of each decontamination layer 1 and the exhaust device 3 to provide the decontamination layer 1 and exhaust The electrical energy required by device 3. The power supply device 4 includes a circuit configuration connected to a power supply 41, a switch 42 and a circuit protection element 43. The power supply 41 can be a commercial power supply or a battery. This embodiment is not limited here. The switch 42 is used to turn on or off the power supply. 41, and the circuit protection component 43 is used to protect the safety of the circuit, such as but not limited to a leakage circuit breaker, a fuseless switch, a knife switch, an electromagnetic switch or a miniature circuit breaker.

In an example, please refer to Figure 6. Figure 6 is a schematic three-dimensional view of two filtering and decontamination plates 10 and the exhaust device 3 installed on a bearing frame 5. As shown in the figure, the carrier 5 is a hollow shell and is arranged in a ventilation duct A connected to the clean room B. There are a plurality of sets of corresponding slots 51 on both inner surfaces of the carrier frame 5 , and each set of corresponding slots 51 is used to assemble a filter and decontamination plate 10 . In the example of Figure 6, two groove walls 511 protrude from the inner side of the carrier 5, and the slot 51 is formed between the two groove walls 511. In other examples, the slot 51 can also be It is formed by being recessed on the inner surface of the carrier frame 5 (not shown in the figure). In a practical example, each set of corresponding slots 51 is located on the inner side of the left and right sides of the carrier 5 respectively, and the left and right sides of a filter and decontamination plate 10 can be inserted into the left slots respectively. 51 and the right slot 51 to complete the assembly of the slot 51 and the filter and decontamination plate 10. By analogy, a plurality of the filter and decontamination plates 10 are assembled in the corresponding slots 51 of each group. Then, there is a ventilation inlet 52 at the front end of the carrier frame 5 and a ventilation outlet 53 at the rear end. The ventilation outlet 53 faces the clean room B, and the exhaust device 3 is assembled at the ventilation outlet 53. In practice, the exhaust device 3 can be assembled on the ventilation outlet 53 through any method such as threads, latches, quick-release parts, buckles, nails, adhesives or electric welding. This embodiment does not Limitation, as long as the exhaust device 3 is assembled at the ventilation outlet 53 and will not be easily separated or dropped, it falls into the category of the exhaust device 3 being assembled at the ventilation outlet 53 of this embodiment. In addition, the power supply device 4 can be assembled inside or outside the bearing frame 5, or can be assembled in the ventilation duct A or the clean room B (the illustration of this embodiment only shows the assembly in the clean room B). This is not limited.

In terms of actual operation, please refer to Figure 7. Figure 7 is a schematic diagram of the cross-sectional operation of the ventilation device 3 of this invention when performing ventilation. As shown in the figure, after the switch 42 is activated, the power supply 41 can supply electric energy to the decontamination layer 1 and the exhaust device 3 . After the ventilation device 3 is powered on, the ventilation can be started, and the ventilation device 3 is assembled at the ventilation outlet 53. Therefore, after the ventilation is started, the external air is drawn to the ventilation outlet 53 through the ventilation inlet 52, and then discharged out of the ventilation outlet 53. Clean room B. When the air is drawn from the ventilation inlet 52 to the ventilation outlet 53 , the air will pass through each filter and decontamination plate 10 in sequence. Practically, the air in clean room B can be recirculated back to ventilation duct A.

Next, please refer to Figure 8. Figure 8 is a schematic cross-sectional view of the filtration and decontamination plate 10 of this invention when performing filtration. As shown in the figure, in practice, the air C in clean room B may contain fine dust C1, first pollutant C2, and second pollutant C3. The first pollutant C2 is a gaseous organic matter, and the second pollutant C3 It is ammonia (gaseous inorganic matter). When the air C passes through the filter and decontamination plate 10, the fine dust C1 is captured by the filter layer 2, the first pollutant C2 is adsorbed by the organic matter adsorption layer 131, and the second pollutant C3 is adsorbed by the inorganic matter. Part of the dust C1 that is adsorbed by the adsorption layer 132 but not captured by the filter layer 2 can also be adsorbed by the organic matter adsorption layer 131 or the inorganic matter adsorption layer 132 to achieve the purpose of adsorbing and filtering the first pollutant C2 and the second pollutant C3. In this way, fine dust C1, gaseous organic matter and ammonia can be filtered out at the same time. It is worth mentioning that the filter and decontamination plates 10 can be selected and replaced. For example, if there are more gaseous organic matter in a place, more filter and decontamination plates 10 coated with organic matter adsorption layers 131 can be used. In other words, if there is more ammonia in the place, more filter and decontamination plates 10 coated with the inorganic substance adsorption layer 132 can be used.

Next, after the decontamination layer 1 is energized, the outer frame 11 and the energized grid 13 can be heated. When the heating temperature reaches above 40°C (for example, but not limited to 40°C~60°C, including 40°C, 41°C , 42°C, 43°C, 44°C, 45°C, 46°C, 47°C, 48°C, 49°C, 50°C, 51°C, 52°C, 53°C, 54°C, 55°C, 56°C, 57°C, 58°C, 59°C, 60°C), which can reduce the adsorption force of the organic matter adsorption layer 131 and the inorganic matter adsorption layer 132 for the fine dust C1, the first pollutant C2 or the second pollutant C3. At that time, please refer to Figure 9 as well. Figure 9 is a schematic cross-sectional view of the invention using a blowing device 6 to eliminate fine dust C1, first pollutant C2 and second pollutant C3. As shown in the figure, clean air is blown toward the outer frame 11 and the electrified grid 13 through a blowing device 6 . The fine dust C1, the first pollutant C2 and the second pollutant C3 can be easily taken away from the inorganic adsorption layer 132 with reduced adsorption force, so as to eliminate the fine dust C1, the first pollutant C2 and the second pollutant C3. Purpose. The clean air may be filtered air without pollutants, or it may be an inert gas (such as but not limited to nitrogen).

The present invention has been disclosed through the above-mentioned embodiments, which are only some of the better embodiments of the present invention. However, they are not used to limit the present invention. Anyone who is familiar with this technical field and has ordinary knowledge can understand the foregoing technology of the present invention. features and embodiments, and any equivalent changes or modifications made without departing from the spirit and scope of the present invention are still within the scope of the present invention, and the patent protection scope of the present invention must be defined by the claims attached to this specification. Whichever prevails.

1: Decontamination layer

11:Outer frame

12: Conductive pins

13: energized grid

131: Organic matter adsorption layer

132: Inorganic adsorption layer

2:Filter layer

3:Exhaust device

4: Power supply device

Claims (10)

A filtering device for a clean room, including: at least one filtering and decontaminating plate. The filtering and decontaminating plate includes: a decontaminating layer. The decontaminating layer has an outer frame around the periphery, and the outer frame has two conductive pins. And a energized grid is provided in the outer frame. The outer frame, the conductive pins and the energized grid are all made of conductive materials. An organic adsorption layer is coated on the surface of the energized grid; a ventilation The device is arranged on one side of the filter and decontamination plate; and a power supply device is electrically connected to the conductive pin and the exhaust device. As claimed in claim 1, the filtration device for a clean room, wherein the organic matter adsorption layer is one of silicon polymer materials, polyethylene glycol, squalane or ultra-high vacuum grease. For example, the filter device for clean rooms of claim 2, wherein the silicone polymer material is silicone gel, polydimethylsiloxane, benzylpolysiloxane, trifluoropropylmethylpolysiloxane or One of the cyanopropylphenylmethylpolysiloxanes. For example, the filtration device for clean rooms according to claim 1, wherein the filter decontamination plates are provided with at least two, and the surfaces of the electrified grids of the filter decontamination plates are respectively coated with the organic adsorption layer or an inorganic adsorption layer. layer. For example, in claim 4, the filter device used in a clean room is made of a material for the inorganic adsorption layer that includes 1 to 10 weight percent of polymeric organic acid and 90 to 99 weight percent of water-based acrylic pressure-sensitive adhesive. For example, in claim 5, the filter device for use in a clean room can be replaced with an anionic polymer material. As claimed in claim 1, the filter device for a clean room, wherein the filter and decontamination plate further includes at least one filter layer, and the filter layer is combined on one side or both sides of the decontamination layer. The filter device for a clean room according to claim 1, wherein the filter decontamination plate is disposed in a ventilation duct connected to a clean room, and the exhaust device is disposed in the ventilation duct close to the clean room s position. As claimed in claim 1, the filter device for a clean room, wherein the power supply device includes a power supply, a switch and a circuit protection component, and the power supply is electrically connected to the switch and the circuit protection component. For example, the filtration device for a clean room according to claim 9 further includes a carrying frame, with a plurality of corresponding sets of slots on both inner surfaces of the carrying frame, and each set of the slots is used to assemble one of the filtering devices. The dirty board has a ventilation inlet at the front end of the carrier frame and a ventilation outlet at the rear end. The ventilation outlet faces a clean room, and the exhaust device is assembled at the ventilation outlet.

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