TWM647183U - Heat dissipation pad with noise reduction mechanism - Google Patents
Heat dissipation pad with noise reduction mechanism Download PDFInfo
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- TWM647183U TWM647183U TW112205784U TW112205784U TWM647183U TW M647183 U TWM647183 U TW M647183U TW 112205784 U TW112205784 U TW 112205784U TW 112205784 U TW112205784 U TW 112205784U TW M647183 U TWM647183 U TW M647183U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 6
- 238000001816 cooling Methods 0.000 claims abstract description 65
- 230000004308 accommodation Effects 0.000 claims abstract description 14
- 238000009423 ventilation Methods 0.000 claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 230000001568 sexual effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
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Abstract
本新型為一種具有降噪機制的散熱墊,包括基體、散熱風扇及降噪模組,基體包括承放座及容置腔室,承放座設有與容置腔室相通的通風孔;散熱風扇設置在容置腔室中並且對應於通風孔配置;降噪模組設置在容置腔室中且包括主動降噪控制器、與主動降噪控制器電性連接的揚聲器及麥克風;其中麥克風在接收到散熱風扇所發出的噪音後,透過主動降噪控制器的運作和傳訊,進而從揚聲器發出能夠抵消散熱風扇之噪音的降噪聲響。藉此,能夠克服散熱風扇在運轉中所產生的擾人噪音。The new model is a cooling pad with a noise reduction mechanism, which includes a base body, a cooling fan and a noise reduction module. The base body includes a holding seat and a holding chamber. The holding seat is provided with a ventilation hole communicating with the holding chamber; heat dissipation The fan is arranged in the accommodation chamber and is configured corresponding to the ventilation hole; the noise reduction module is arranged in the accommodation chamber and includes an active noise reduction controller, a speaker and a microphone electrically connected to the active noise reduction controller; wherein the microphone After receiving the noise emitted by the cooling fan, through the operation and communication of the active noise reduction controller, a noise reduction sound that can offset the noise of the cooling fan is emitted from the speaker. This can overcome the disturbing noise generated by the cooling fan during operation.
Description
本新型係關於一種散熱墊的技術領域,尤指一種具有降噪機制的散熱墊。The present invention relates to the technical field of a cooling pad, in particular to a cooling pad with a noise reduction mechanism.
電腦已成為現代人處理工作事務所不可或缺的產品,且為了達到更多使用功能,其所使用的電子元件也愈趨複雜、數量也愈多,如此都會產生熱量而成為所謂的發熱源,並且隨著處理資料的增加、速度的提升等因素的影響下,其所產生的熱量也將大為增加。因此,若不設法有效地將前述熱量移除,其便會使電腦及其內部之電子元件的工作環境溫度升高,相對使其效能變差,嚴重者甚至會使電子元件損壞或造成當機等情況。Computers have become an indispensable product for modern people to handle their work. In order to achieve more functions, the electronic components used have become more complex and more numerous, which will generate heat and become the so-called heat source. And under the influence of factors such as the increase in processing data and the increase in speed, the heat generated will also greatly increase. Therefore, if efforts are not made to effectively remove the aforementioned heat, it will increase the working environment temperature of the computer and its internal electronic components, which will relatively worsen its performance. In severe cases, it may even cause damage to the electronic components or cause a crash. etc.
業界為了解決前述問題,於是開發出供筆記型電腦使用的散熱墊等產品,其主要是將散熱風扇設置於散熱墊內部,透過散熱風扇將前述電子發熱源所產生熱量予以吹離散逸,進而達成散熱之目的,其中以加快散熱風扇的轉速來提供大量的氣流,是最簡易且經濟的作法。然而,此種方法卻存在有較大噪音的產生。In order to solve the above-mentioned problems, the industry has developed products such as cooling pads for notebook computers, which mainly install cooling fans inside the cooling pads, and use the cooling fans to blow away the heat generated by the aforementioned electronic heat sources to achieve the goal. For the purpose of heat dissipation, speeding up the speed of the cooling fan to provide a large amount of airflow is the simplest and most economical method. However, this method produces larger noise.
因此,如何創作出一種克服噪音的散熱墊,則為本創作人所要解決的技術課題。Therefore, how to create a cooling pad that overcomes noise is a technical issue that the author wants to solve.
本新型之一目的,在於提供一種具有降噪機制的散熱墊,其是透過降噪模組的設置,從而能夠克服散熱風扇在運轉中所產生的擾人噪音。One purpose of the present invention is to provide a cooling pad with a noise reduction mechanism, which can overcome the disturbing noise generated by the cooling fan during operation through the arrangement of the noise reduction module.
為了達成上述之目的,本新型提供一種具有降噪機制的散熱墊,包括一基體、至少一散熱風扇及一降噪模組,該基體包括一承放座及形成在該承放座內部的一容置腔室,該承放座設有與該容置腔室相通的複數通風孔;該散熱風扇設置在該容置腔室中並且對應於各該通風孔配置;該降噪模組設置在該容置腔室中,該降噪模組包括一主動降噪控制器、與該主動降噪控制器電性連接的一揚聲器及與該主動降噪控制器電性連接的一麥克風;其中該麥克風在接收到該散熱風扇所發出的噪音後,透過該主動降噪控制器的運作和傳訊,進而從該揚聲器發出能夠抵消該散熱風扇之噪音的一降噪聲響。In order to achieve the above purpose, the present invention provides a cooling pad with a noise reduction mechanism, which includes a base body, at least one cooling fan and a noise reduction module. The base body includes a holding base and a heat sink formed inside the holding base. The accommodation chamber is provided with a plurality of ventilation holes communicating with the accommodation chamber; the cooling fan is arranged in the accommodation chamber and is configured corresponding to each ventilation hole; the noise reduction module is arranged in In the accommodation chamber, the noise reduction module includes an active noise reduction controller, a speaker electrically connected to the active noise reduction controller, and a microphone electrically connected to the active noise reduction controller; wherein the After the microphone receives the noise emitted by the cooling fan, through the operation and communication of the active noise reduction controller, a noise reduction sound that can offset the noise of the cooling fan is emitted from the speaker.
本新型還具有以下功效,透過麥克風與主動降噪控制器和揚聲器分離的設置,使得麥克風能夠鄰近於散熱風扇配置,藉以更準確地偵得噪音源和實施反制。藉由支撐組件的設置,基體能夠因應使用者的需求調整出不同的仰角。This new model also has the following functions. By separating the microphone from the active noise reduction controller and the speaker, the microphone can be placed close to the cooling fan, so as to more accurately detect the noise source and implement countermeasures. Through the setting of the supporting components, the base can be adjusted to different elevation angles according to the user's needs.
有關本新型之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本新型加以限制者。The detailed description and technical content of the present invention are described below with reference to the drawings. However, the attached drawings are only for reference and illustration and are not intended to limit the present invention.
請參閱圖1至圖3所示,本新型提供一種具有降噪機制的散熱墊,其主要包括一基體10、至少一散熱風扇20及一降噪模組30。Referring to FIGS. 1 to 3 , the present invention provides a cooling pad with a noise reduction mechanism, which mainly includes a
基體10主要包括一承放座11及一下板12,承放座11具有一上板111及自上板111向下彎折延伸的一圍板113,下板12是對應於圍板113連接,以在承放座11和下板12內部形成有一容置腔室13,在上板111設有與容置腔室13相通的複數通風孔112。在下板12則設有複數通槽121,以與容置腔室13相互連通,另在下板12的一側設有複數凸體122,各凸體122是呈等間距設置。The
散熱風扇20是設置在容置腔室13中並且對應於各通風孔112配置,本實施例之散熱風扇20的數量為兩個,但不以此為限,其也可以是單一個數。各散熱風扇20是呈間隔排列的固定在上板111下方。The
降噪模組30是設置在容置腔室13中,且其主要包括一主動降噪控制器(Active Noise Cancellation, ANC)31、與主動降噪控制器31電性連接的一揚聲器32及與主動降噪控制器31電性連接的一麥克風33。The
本實施例的降噪模組30還包括一電路板34,其中主動降噪控制器31、揚聲器32和麥克風33是透過電路板34上的電路實現電性連接。其中麥克風33包括一參考麥克風331和一誤差麥克風332(如圖3所示)。其中電路板34的電力來源是自散熱風扇20所提供。The
本新型具有降噪機制的散熱墊可以提供給一筆記型電腦(圖未示出)置放,其中散熱風扇20會依據風扇控制訊號來運作,風扇控制訊號之值越大,散熱風扇20中的馬達轉速越快,散熱效果越強,但也會產生較大噪音。在一實施例中,風扇控制訊號可為一脈波頻寬調變(Pulse Width Modulation, PWM)之方波訊號,透過改變其工作週期(duty cycle)來調整散熱風扇20中的馬達轉速。散熱風扇20在運作時的噪音源來自馬達轉動造成的空氣流,其中窄頻成份可能源自於由扇葉運動所產生體積位移之厚度噪音,或由扇葉表面之變動性負載力(有軸向之升力與風扇面之拉力)所造成的葉片通過頻率(blade passing frequency, BPF)噪音。由於葉片通過頻率及相關諧波與在每一扇葉通過固定參考點時產生之壓力擾動有關,當扇葉尖端產生週期性壓力波時就會產生特定的窄頻噪音。另一方面,當空氣流流經扇葉時,會從扇葉的邊界層(boundary layer)或葉片尖端兩側剝離而形成交替的渦流,此種現象稱為渦流剝離(vortex shedding)。渦流剝離會使扇葉兩側流體的瞬間速度不同,在不同流體速度下扇葉兩側受到的瞬間壓力也不同,因此會使扇葉發生振動而產生特定的寬頻噪音。The novel cooling pad with a noise reduction mechanism can be provided for a laptop computer (not shown). The
其中參考麥克風331是設置在接近散熱風扇20中各扇葉的位置,用來擷取散熱風扇20運轉時所產生的噪音,並將量測到之一寬頻噪音訊號傳送至主動降噪控制器31,其中寬頻噪音訊號包含散熱風扇20運作時所產生氣流噪音的寬頻噪音頻譜。在一實施例中,參考麥克風331可為一數位式微機電系統(Micro Electro Mechanical System, MEMS)麥克風,其具備高耐熱、高抗振和高抗射頻干擾等性能。The
其中誤差麥克風332用來擷取散熱風扇20之各扇葉運轉時的整體噪音,並輸出相對應之誤差訊號至主動降噪控制器31,其中噪音訊號代表在各扇葉運轉期間欲消除的噪音訊號。由於散熱風扇20為主要噪音源,誤差麥克風332可設置在接近散熱風扇20位置,其中參考麥克風331和主動降噪控制器31之間的距離大於誤差麥克風332和主動降噪控制器31之間的距離。誤差麥克風332可透過一主要路徑和一次級路徑來偵測噪音:主要路徑相關於散熱風扇20和誤差麥克風332之間的訊號傳遞路徑,透過主要路徑會擷取到噪音訊號;而次級路徑相關於揚聲器32和誤差麥克風332間的訊號傳遞路徑,透過次級路徑會擷取到相關反相噪音訊號之一校正後反相噪音訊號。更詳細地說,誤差麥克風332所輸出之誤差訊號為噪音訊號和校正後反相噪音訊號之間的差值,誤差訊號之值越小代表降噪效果越好。在一實施例中,誤差麥克風332可為一數位式MEMS麥克風,其具備高耐熱、高抗振和高抗射頻干擾等性能。然而,誤差麥克風332之種類並不限定本新型之範疇。The
其中主動降噪控制器31可接收一同步訊號、從參考麥克風331接收寬頻噪音訊號,以及從誤差麥克風332接收誤差訊號,其中同步訊號包含相關散熱風扇20之結構(例如各風扇葉片數)和運作設定(例如在不同模式下馬達轉速)之資訊。依據同步訊號及寬頻噪音訊號,主動降噪控制器31可計算出散熱風扇20在實際運作時所產生噪音中的寬頻帶噪音;依據同步訊號及誤差訊號,主動降噪控制器31可計算出散熱風扇20在實際運作時所產生噪音中的窄頻帶噪音。依據計算出的寬頻帶噪音和窄頻帶噪音,主動降噪控制器31可依此提供揚聲器控制訊號以驅動揚聲器32,使得揚聲器32提供之反相噪音訊號能有效地抵消噪音信號,亦即盡量讓誤差訊號降至0。The active
其中揚聲器32是一種可將電子訊號轉換成聲音訊號的電子元件,通常包括振膜(diaphragm)和由電磁鐵和音圈所組成的驅動電路。揚聲器32可依據主動降噪控制器31提供之一揚聲器控制訊號來運作,當揚聲器控制訊號之電流通過音圈時,音圈即隨著電流的頻率振動,而和音圈相連的振膜當然也就跟著振動,進而推動周圍的空氣振動以產生一降噪聲響。在本新型實施例中,揚聲器32之振膜會可依據揚聲器控制訊號來產生一反相噪音訊號。The
在一實施例中,本新型具有降噪機制的散熱墊還包括一支撐組件40,其一端是樞接在基體10的一側邊,另一端則可彎折的抵頂在基體10的另一側邊,藉以使基體10形成一傾斜狀,支撐組件40主要包括一第一支撐件41和一第二支撐件42,第一支撐件41的兩端分別樞接基體10和第二支撐件42的一端,第二支撐件42的另一端則可選擇性地止擋在前述各凸體122中的其中之一凸體122,從而使基體10能夠呈現出不同的仰角。
In one embodiment, the novel cooling pad with noise reduction mechanism further includes a
請參閱圖4所示,本實施例的降噪模組30A除了具備有前述降噪模組30的大部分技術特徵外,其中麥克風33是與主動降噪控制器31和揚聲器32分離設置,此麥克風33是透過一導接線35與電路板34電性連接,如此麥克風33則可以鄰近於散熱風扇20所處位置設置,藉以更精確地掌握其所發出的噪音。Please refer to FIG. 4 . In addition to having most of the technical features of the aforementioned
請參閱圖5所示,本實施例的降噪模組30B除了具備有前述降噪模組30的大部分技術特徵外,其中麥克風33和導接線35都是複數,每一個麥克風33透過每一條導接線35與電路板34電性連接,如此各麥克風33則依據實際的使用需求,分別佈設在各散熱風扇20之間和散熱風扇20的一側邊。Please refer to Figure 5. In addition to having most of the technical features of the
以上所述僅為本新型之較佳實施例,並非用以限定本新型之專利範圍,其他運用本新型之專利精神的等效變化,均應俱屬本新型之專利範圍。The above descriptions are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Other equivalent changes that apply the patent spirit of the present invention shall all fall within the patent scope of the present invention.
10:基體
11:承放座
111:上板
112:通風孔
113:圍板
12:下板
121:通槽
122:凸體
13:容置腔室
20:散熱風扇
30、30A、30B:降噪模組
31:主動降噪控制器
32:揚聲器
33:麥克風
331:參考麥克風
332:誤差麥克風
34:電路板
35:導接線
40:支撐組件
41:第一支撐件
42:第二支撐件
10:Matrix
11: Holding seat
111:On the board
112: Ventilation hole
113:hoarding
12: Lower board
121:Through slot
122:convex body
13: Accommodation chamber
20: Cooling
圖1 係本新型具有降噪機制的散熱墊組合剖視圖。Figure 1 is a cross-sectional view of the new cooling pad assembly with noise reduction mechanism.
圖2 係本新型具有降噪機制的散熱墊之另一方向組合剖視圖。Figure 2 is a combined cross-sectional view from another direction of the new cooling pad with noise reduction mechanism.
圖3 係本新型之降噪模組與散熱風扇方塊圖。Figure 3 is a block diagram of the new noise reduction module and cooling fan.
圖4 係本新型之另一實施例組合剖視圖。Figure 4 is an assembled cross-sectional view of another embodiment of the present invention.
圖5 係本新型之又一實施例組合剖視圖。Figure 5 is an assembled cross-sectional view of yet another embodiment of the present invention.
10:基體 10:Matrix
11:承放座 11: Holding seat
111:上板 111:On the board
112:通風孔 112: Ventilation hole
113:圍板 113:hoarding
12:下板 12: Lower board
121:通槽 121:Through slot
122:凸體 122:convex body
13:容置腔室 13: Accommodation chamber
20:散熱風扇 20: Cooling fan
30:降噪模組 30: Noise reduction module
31:主動降噪控制器 31:Active noise reduction controller
32:揚聲器 32: Speaker
33:麥克風 33:Microphone
34:電路板 34:Circuit board
40:支撐組件 40:Support components
41:第一支撐件 41:First support member
42:第二支撐件 42:Second support member
Claims (10)
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| TW112205784U TWM647183U (en) | 2023-06-07 | 2023-06-07 | Heat dissipation pad with noise reduction mechanism |
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| Publication Number | Publication Date |
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| TWM647183U true TWM647183U (en) | 2023-10-11 |
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2023
- 2023-06-07 TW TW112205784U patent/TWM647183U/en unknown
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