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TWM646997U - Embedded multi-point measurement device platform - Google Patents

Embedded multi-point measurement device platform Download PDF

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Publication number
TWM646997U
TWM646997U TW112207705U TW112207705U TWM646997U TW M646997 U TWM646997 U TW M646997U TW 112207705 U TW112207705 U TW 112207705U TW 112207705 U TW112207705 U TW 112207705U TW M646997 U TWM646997 U TW M646997U
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Taiwan
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device platform
embedded multi
measurement device
point measurement
sensor
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TW112207705U
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Chinese (zh)
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郭嘉旭
陳世宗
劉育達
陳星嶧
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中國鋼鐵股份有限公司
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Priority to TW112207705U priority Critical patent/TWM646997U/en
Publication of TWM646997U publication Critical patent/TWM646997U/en

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Abstract

本創作提供一種埋入式多點量測裝置平台,其用於一電磁鋼片組的加熱固化過程,該埋入式多點量測裝置平台包含:一第一表面,其具有複數個感測器容置槽;一第二表面,其與該第一表面相對,且該第二表面具有複數個導線槽;以及複數個楔形槽,該些楔形槽位於該感測器容置槽中,其中該些楔形槽配置成用以導通該些感測器容置槽與該些導線槽。This invention provides an embedded multi-point measurement device platform, which is used in the heating and curing process of an electromagnetic steel sheet group. The embedded multi-point measurement device platform includes: a first surface with a plurality of sensors. a second surface, which is opposite to the first surface, and the second surface has a plurality of wire grooves; and a plurality of wedge-shaped grooves, the wedge-shaped grooves are located in the sensor receiving groove, wherein The wedge-shaped grooves are configured to connect the sensor receiving grooves and the wire grooves.

Description

埋入式多點量測裝置平台Embedded multi-point measurement device platform

本創作係關於多點量測裝置平台,特別是一種埋入式多點量測裝置平台,其用於一電磁鋼片組的加熱固化過程。This invention relates to a multi-point measurement device platform, especially an embedded multi-point measurement device platform, which is used in the heating and curing process of an electromagnetic steel sheet set.

因應全球政府擬解決地球暖化之目標,電動車儼然成為相當重要之發展。電動車用電磁鋼片組的製程中需要均勻加壓並且加熱固化定形,並且在製程中需要監控溫度、壓力及傾斜角度。然而,這些感測器會安裝在不同位置,這也導致了感測器會影響整個電磁鋼片組的平整度。In response to the goals of global governments to solve global warming, electric vehicles have become a very important development. The manufacturing process of electromagnetic steel sheet packs for electric vehicles needs to be uniformly pressurized and heated to solidify and shape, and the temperature, pressure and tilt angle need to be monitored during the manufacturing process. However, these sensors are installed at different locations, which also causes the sensors to affect the flatness of the entire electromagnetic steel sheet set.

因此,在不影響均勻加壓及不影響整個電磁鋼片組的平整度的情況下,還能即時量測製程中的溫度、壓力及傾斜角度等參數一直都是倍受矚目的議題。Therefore, it has always been a topic of great concern to be able to instantly measure parameters such as temperature, pressure, and tilt angle during the manufacturing process without affecting the uniform pressure and the flatness of the entire electromagnetic steel sheet set.

故,有必要提供一種埋入式多點量測裝置平台,以解决習用技術所存在的問題。Therefore, it is necessary to provide an embedded multi-point measurement device platform to solve the problems existing in the conventional technology.

本創作的目的在於提供一種埋入式多點量測裝置平台,通過埋入式多點量測裝置平台可以即時量測製程中的溫度、壓力及傾斜角度等參數,並且不影響均勻加壓及整個電磁鋼片組的平整度。The purpose of this creation is to provide an embedded multi-point measurement device platform. Through the embedded multi-point measurement device platform, parameters such as temperature, pressure, and tilt angle in the manufacturing process can be measured in real time without affecting the uniform pressure and The flatness of the entire electromagnetic steel sheet set.

為了達成上述目的,本創作提供了一種埋入式多點量測裝置平台,其用於一電磁鋼片組的加熱固化過程,該埋入式多點量測裝置平台包含:一第一表面,其具有複數個感測器容置槽;一第二表面,其與該第一表面相對,且該第二表面具有複數個導線槽;以及複數個楔形槽,該些楔形槽位於該感測器容置槽中,其中該些楔形槽配置成用以導通該些感測器容置槽與該些導線槽。In order to achieve the above purpose, the present invention provides an embedded multi-point measuring device platform, which is used in the heating and curing process of an electromagnetic steel sheet group. The embedded multi-point measuring device platform includes: a first surface, It has a plurality of sensor receiving grooves; a second surface, which is opposite to the first surface, and the second surface has a plurality of wire grooves; and a plurality of wedge-shaped grooves, which are located on the sensor In the accommodation groove, the wedge-shaped grooves are configured to connect the sensor accommodation grooves and the wire grooves.

在本創作的一實施例中,任一該楔形槽具有一斜面,該斜面與該第一表面之間具有一夾角,並且該夾角的一角度在10度至40度之間。In an embodiment of the present invention, any of the wedge-shaped grooves has an inclined surface, and an included angle is formed between the inclined surface and the first surface, and the angle of the included angle is between 10 degrees and 40 degrees.

在本創作的一實施例中,該埋入式多點量測裝置平台由一非導磁材料所製成。In an embodiment of the invention, the embedded multi-point measurement device platform is made of a non-magnetic material.

在本創作的一實施例中,該非導磁材料具有一低熱傳導特性。In an embodiment of the present invention, the non-magnetic conductive material has a low thermal conductivity property.

在本創作的一實施例中,該非導磁材料是一耐熱樹脂。In an embodiment of the present invention, the non-magnetic conductive material is a heat-resistant resin.

在本創作的一實施例中,該非導磁材料的一熱傳導係數大於0.4 W/mk。In an embodiment of the present invention, the non-magnetic conductive material has a thermal conductivity coefficient greater than 0.4 W/mk.

在本創作的一實施例中,該埋入式多點量測裝置平台,還包含:複數個壓持塊,該些壓持塊可組裝地設置在該些導線槽中。In an embodiment of the present invention, the embedded multi-point measurement device platform further includes: a plurality of holding blocks, and the holding blocks are assembleably disposed in the wire troughs.

在本創作的一實施例中,該埋入式多點量測裝置平台,還包含:一防脫落樹脂,該防脫落樹脂填入在該些導線槽中。In an embodiment of the present invention, the embedded multi-point measurement device platform further includes: an anti-falling resin, and the anti-falling resin is filled in the wire grooves.

在本創作的一實施例中,該感測器容置槽用以容置一感測器,該感測器的一導線沿該斜面延伸至該導線槽中,且該導線沿該導線槽連接至一外部處理裝置。In an embodiment of the present invention, the sensor accommodating slot is used to accommodate a sensor, a wire of the sensor extends along the slope into the wire trough, and the wire is connected along the wire trough to an external processing device.

在本創作的一實施例中,該感測器容置槽與該感測器皆呈環狀。In an embodiment of the present invention, both the sensor receiving groove and the sensor are annular.

如上所述,通過本創作所提供的埋入式多點量測裝置平台,感測器可以安裝在感測器容置槽,感測器的導線可以通過楔形槽並且沿導線槽連接至外部處理裝置。如此一來,可以在不影響均勻加壓及不影響整個電磁鋼片組的平整度的情況下,即時量測電磁鋼片組製程中的溫度、壓力及傾斜角度等參數。As mentioned above, through the embedded multi-point measurement device platform provided by this invention, the sensor can be installed in the sensor receiving slot, and the wires of the sensor can pass through the wedge-shaped slot and be connected to the external processing along the wire slot. device. In this way, parameters such as temperature, pressure and tilt angle during the manufacturing process of the electromagnetic steel sheet group can be measured in real time without affecting the uniform pressure and the flatness of the entire electromagnetic steel sheet group.

爲了讓本創作之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本創作較佳實施例,並配合所附圖式,作詳細說明如下。再者,本創作所提到的方向用語,例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本創作,而非用以限制本創作。In order to make the above and other purposes, features, and advantages of the present invention more obvious and easy to understand, the following will give a detailed description of the preferred embodiments of the present invention and the accompanying drawings. Furthermore, the directional terms mentioned in this creation, such as up, down, top, bottom, front, back, left, right, inside, outside, side, around, center, horizontal, transverse, vertical, longitudinal, axial, Radial, uppermost or lowermost, etc., are only directions with reference to the attached drawings. Therefore, the directional terms used are used to explain and understand this creation, rather than to limit this creation.

現在請參照第1圖至第6圖,第1圖是本創作實施例的一埋入式多點量測裝置平台的一立體示意圖,第2圖是第1圖實施例的一俯視圖,第3圖是第1圖實施例的一仰視圖,第4圖是第1圖實施例的一立體剖視圖,第5圖是實際應用第1圖實施例一立體示意圖,第6圖是實際應用第1圖實施例一立體分解圖。本實施例所提供的一種埋入式多點量測裝置平台100,其用於一電磁鋼片組10的加熱固化過程。該埋入式多點量測裝置平台100包含:一第一表面110、一第二表面120、複數個楔形槽130及複數個壓持塊140。Now please refer to Figures 1 to 6. Figure 1 is a three-dimensional schematic view of an embedded multi-point measurement device platform according to an embodiment of this invention. Figure 2 is a top view of the embodiment of Figure 1. Figure 3 Figure 1 is a bottom view of the embodiment of Figure 1, Figure 4 is a perspective cross-sectional view of the embodiment of Figure 1, Figure 5 is a perspective view of the embodiment of Figure 1 in practical application, Figure 6 is a practical application of Figure 1 Embodiment 1 Three-dimensional exploded view. This embodiment provides an embedded multi-point measurement device platform 100, which is used in the heating and curing process of an electromagnetic steel sheet group 10. The embedded multi-point measurement device platform 100 includes: a first surface 110, a second surface 120, a plurality of wedge-shaped grooves 130 and a plurality of holding blocks 140.

該第一表面110具有複數個感測器容置槽112。The first surface 110 has a plurality of sensor receiving slots 112 .

該第二表面120與該第一表面110相對,且該第二表面120具有複數個導線槽122。The second surface 120 is opposite to the first surface 110 , and the second surface 120 has a plurality of wire grooves 122 .

該些楔形槽130位於該感測器容置槽112中,其中該些楔形槽130配置成用以導通該些感測器容置槽112與該些導線槽122。任一該楔形槽130具有一斜面132,該斜面132與該第一表面110之間具有一夾角A,並且該夾角A的一角度在10度至40度之間。該感測器容置槽112用以容置一感測器(未示出),該感測器的一導線(未示出)沿該斜面132延伸至該導線槽122中,且該導線沿該導線槽122連接至一外部處理裝置(未示出)。該感測器容置槽112與該感測器的外型對應,例如該感測器容置槽112與該感測器皆呈環狀。在其它實施例中,該感測器容置槽112與該感測器可以為其它可行的形狀。此外,該感測器可以是溫度感測器、壓力感測器、角度感測器或是其它感測器。該外部處理裝置可以處理該些感測器所傳輸的信號,該外部處理裝置可以一電腦、一平板電腦、一智慧手機或是其它具有相似功效的處理裝置。The wedge-shaped grooves 130 are located in the sensor accommodating grooves 112 , wherein the wedge-shaped grooves 130 are configured to connect the sensor accommodating grooves 112 and the wire grooves 122 . Each wedge-shaped groove 130 has an inclined surface 132, and an included angle A is formed between the inclined surface 132 and the first surface 110, and the included angle A is between 10 degrees and 40 degrees. The sensor accommodating slot 112 is used to accommodate a sensor (not shown). A wire (not shown) of the sensor extends along the slope 132 into the wire slot 122, and the wire extends along the slope 132. The wire duct 122 is connected to an external processing device (not shown). The sensor accommodating groove 112 corresponds to the shape of the sensor. For example, the sensor accommodating groove 112 and the sensor are both ring-shaped. In other embodiments, the sensor receiving groove 112 and the sensor may have other feasible shapes. In addition, the sensor may be a temperature sensor, a pressure sensor, an angle sensor or other sensors. The external processing device can process the signals transmitted by the sensors. The external processing device can be a computer, a tablet computer, a smart phone or other processing devices with similar functions.

該些壓持塊140可組裝地設置在該些導線槽122中,該些壓持塊140可以防止該些感測器脫落,使該些感測器保持在所需的位置。在其它實施中,該些壓持塊140可以尤其它方式取代。例如,一防脫落樹脂(未示出),其中該防脫落樹脂填入在該些導線槽122中,藉此防止該些感測器脫落,使該些感測器保持在所需的位置。The pressing blocks 140 can be assembled in the wire grooves 122, and the pressing blocks 140 can prevent the sensors from falling off and keep the sensors in required positions. In other implementations, the holding blocks 140 can be replaced in other ways. For example, an anti-falling resin (not shown) is used, wherein the anti-falling resin is filled in the wire grooves 122, thereby preventing the sensors from falling off and keeping the sensors in required positions.

此外,該埋入式多點量測裝置平台100可以由一非導磁材料所製成,並且該非導磁材料具有低熱傳導特性,例如,該非導磁材料的一熱傳導係數大於0.4 W/mk。具體來說,該非導磁材料是一耐熱樹脂,例如聚醚醚酮(polyetheretherketone,PEEK)。應當理解的是,該壓持塊140及該防脫落樹脂也可以是非導磁材料並且具有低熱傳導特性。在一些實施例中,該埋入式多點量測裝置平台100、該壓持塊140與該防脫落樹脂可以為相同材料,例如皆為聚醚醚酮所製成。In addition, the embedded multi-point measurement device platform 100 can be made of a non-magnetic permeable material, and the non-magnetic permeable material has low thermal conductivity properties. For example, the non-magnetic permeable material has a thermal conductivity coefficient greater than 0.4 W/mk. Specifically, the non-magnetic conductive material is a heat-resistant resin, such as polyetheretherketone (PEEK). It should be understood that the holding block 140 and the anti-falling resin can also be non-magnetic conductive materials and have low thermal conductivity properties. In some embodiments, the embedded multi-point measurement device platform 100 , the holding block 140 and the anti-falling resin can be made of the same material, for example, they are all made of polyetheretherketone.

以第5圖及第6圖為例來說明,在製作一電磁鋼片組10時,一上壓板件20與一下壓板件30可以與一壓合機(未示出)連接。本創作所提供的一個埋入式多點量測裝置平台100設置在該上壓板件20與該電磁鋼片組10之間,並且另一個埋入式多點量測裝置平台100設置在該電磁鋼片組10與該下壓板件30之間。具體來說,在第6圖中,上方的該埋入式多點量測裝置平台100的該第一表面朝下與該電磁鋼片組10接觸,而下方的的該埋入式多點量測裝置平台100的該第一表面朝上與該電磁鋼片組10接觸。在該電磁鋼片組10的加熱固化過程中,該壓合機通過該上壓板件20與該下壓板件30可以均勻地對該電磁鋼片組10加壓。設置在兩個埋入式多點量測裝置平台100中的感測器可以在加熱固化過程即時地量測該電磁鋼片組10的上部及下部的溫度、壓力及傾斜角度等參數。由於埋入式多點量測裝置平台100與該電磁鋼片組10接觸的第一表面不會有突出的感測器,再加上感測器的導線內嵌於埋入式多點量測裝置平台100中,因此感測器不會影響均勻加壓更不會影響整個電磁鋼片組的平整度。Taking Figures 5 and 6 as examples, when manufacturing an electromagnetic steel sheet group 10, an upper pressing plate member 20 and a lower pressing plate member 30 can be connected to a laminating machine (not shown). An embedded multi-point measuring device platform 100 provided by the present invention is disposed between the upper pressure plate member 20 and the electromagnetic steel sheet group 10, and another embedded multi-point measuring device platform 100 is disposed on the electromagnetic steel sheet assembly 10. between the steel sheet group 10 and the lower pressing plate member 30 . Specifically, in FIG. 6 , the first surface of the embedded multi-point measuring device platform 100 on the upper side is in contact with the electromagnetic steel sheet group 10 downward, while the embedded multi-point measuring device platform 100 on the lower side is in contact with the electromagnetic steel sheet group 10 downward. The first surface of the measuring device platform 100 is in contact with the electromagnetic steel sheet group 10 upward. During the heating and solidification process of the electromagnetic steel sheet group 10 , the laminating machine can uniformly pressurize the electromagnetic steel sheet group 10 through the upper pressing plate member 20 and the lower pressing plate member 30 . Sensors provided in the two embedded multi-point measurement device platforms 100 can instantly measure parameters such as temperature, pressure and tilt angle of the upper and lower parts of the electromagnetic steel sheet set 10 during the heating and curing process. Since the first surface of the embedded multi-point measurement device platform 100 in contact with the electromagnetic steel sheet group 10 does not have a protruding sensor, and the wires of the sensor are embedded in the embedded multi-point measurement device In the device platform 100, the sensor will not affect the uniform pressure and will not affect the flatness of the entire electromagnetic steel sheet set.

如上所述,通過本創作所提供的埋入式多點量測裝置平台,感測器可以安裝在感測器容置槽,感測器的導線可以通過楔形槽並且沿導線槽連接至外部處理裝置。如此一來,可以在不影響均勻加壓及不影響整個電磁鋼片組的平整度的情況下,即時量測電磁鋼片組製程中的溫度、壓力及傾斜角度等參數。As mentioned above, through the embedded multi-point measurement device platform provided by this invention, the sensor can be installed in the sensor receiving slot, and the wires of the sensor can pass through the wedge-shaped slot and be connected to the external processing along the wire slot. device. In this way, parameters such as temperature, pressure and tilt angle during the manufacturing process of the electromagnetic steel sheet group can be measured in real time without affecting the uniform pressure and the flatness of the entire electromagnetic steel sheet group.

雖然本創作已以較佳實施例揭露,然其並非用以限制本創作,任何熟習此項技藝之人士,在不脫離本創作之精神和範圍內,當可作各種更動與修飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者爲準。Although this invention has been disclosed in preferred embodiments, it is not intended to limit this invention. Any person familiar with this art can make various changes and modifications without departing from the spirit and scope of this invention. Therefore, this invention The scope of protection shall be subject to the scope of the patent application attached.

10:電磁鋼片組 20:上壓板件 30:下壓板件 100:埋入式多點量測裝置平台 110:第一表面 112:感測器容置槽 120:第二表面 122:導線槽 130:楔形槽 132:斜面 140:壓持塊 A:夾角 10:Electromagnetic steel sheet set 20: Upper pressure plate 30: Press down the plate 100: Embedded multi-point measurement device platform 110: First surface 112: Sensor storage slot 120: Second surface 122:Conductor 130: Wedge groove 132: Incline 140: Holding block A: Angle

第1圖是本創作實施例的一埋入式多點量測裝置平台的一立體示意圖。 第2圖是第1圖實施例的一俯視圖。 第3圖是第1圖實施例的一仰視圖。 第4圖是第1圖實施例的一立體剖視圖。 第5圖是實際應用第1圖實施例一立體示意圖。 第6圖是實際應用第1圖實施例一立體分解圖。 Figure 1 is a three-dimensional schematic diagram of an embedded multi-point measurement device platform according to an embodiment of the present invention. Figure 2 is a top view of the embodiment of Figure 1. Figure 3 is a bottom view of the embodiment of Figure 1. Figure 4 is a perspective cross-sectional view of the embodiment of Figure 1; Figure 5 is a three-dimensional schematic diagram of a practical application of the embodiment of Figure 1. Figure 6 is a three-dimensional exploded view of a practical application of the embodiment of Figure 1.

100:埋入式多點量測裝置平台 100: Embedded multi-point measurement device platform

110:第一表面 110: First surface

112:感測器容置槽 112: Sensor storage slot

120:第二表面 120: Second surface

122:導線槽 122:Conductor

130:楔形槽 130: Wedge groove

132:斜面 132: Incline

140:壓持塊 140: Holding block

A:夾角 A: Angle

Claims (10)

一種埋入式多點量測裝置平台,其用於一電磁鋼片組的加熱固化過程,該埋入式多點量測裝置平台包含: 一第一表面,其具有複數個感測器容置槽; 一第二表面,其與該第一表面相對,且該第二表面具有複數個導線槽;以及 複數個楔形槽,該些楔形槽位於該感測器容置槽中,其中該些楔形槽配置成用以導通該些感測器容置槽與該些導線槽。 An embedded multi-point measuring device platform is used for the heating and curing process of an electromagnetic steel sheet group. The embedded multi-point measuring device platform includes: a first surface having a plurality of sensor receiving slots; a second surface opposite the first surface, and the second surface has a plurality of wire grooves; and A plurality of wedge-shaped grooves are located in the sensor accommodating groove, wherein the wedge-shaped grooves are configured to connect the sensor accommodating grooves and the wire grooves. 如請求項1所述之埋入式多點量測裝置平台,其中任一該楔形槽具有一斜面,該斜面與該第一表面之間具有一夾角,並且該夾角的一角度在10度至40度之間。The embedded multi-point measurement device platform as claimed in claim 1, wherein any of the wedge-shaped grooves has an inclined surface, and there is an included angle between the inclined surface and the first surface, and an angle of the included angle is between 10 degrees and between 40 degrees. 如請求項1所述之埋入式多點量測裝置平台,其中該埋入式多點量測裝置平台由一非導磁材料所製成。The embedded multi-point measurement device platform as claimed in claim 1, wherein the embedded multi-point measurement device platform is made of a non-magnetic conductive material. 如請求項3所述之埋入式多點量測裝置平台,其中該非導磁材料具有一低熱傳導特性。The embedded multi-point measurement device platform as claimed in claim 3, wherein the non-magnetic conductive material has a low thermal conductivity property. 如請求項4所述之埋入式多點量測裝置平台,其中該非導磁材料是一耐熱樹脂。The embedded multi-point measurement device platform as claimed in claim 4, wherein the non-magnetic conductive material is a heat-resistant resin. 如請求項4所述之埋入式多點量測裝置平台,其中該非導磁材料的一熱傳導係數大於0.4 W/mk。The embedded multi-point measurement device platform as described in claim 4, wherein the non-magnetic conductive material has a thermal conductivity greater than 0.4 W/mk. 如請求項1所述之埋入式多點量測裝置平台,還包含:複數個壓持塊,該些壓持塊可組裝地設置在該些導線槽中。The embedded multi-point measurement device platform as described in claim 1 also includes: a plurality of holding blocks, and the holding blocks are assembleably disposed in the wire troughs. 如請求項1所述之埋入式多點量測裝置平台,還包含:一防脫落樹脂,該防脫落樹脂填入在該些導線槽中。The embedded multi-point measurement device platform as described in claim 1 also includes: an anti-falling resin filled in the wire troughs. 如請求項2所述之埋入式多點量測裝置平台,其中該感測器容置槽用以容置一感測器,該感測器的一導線沿該斜面延伸至該導線槽中,且該導線沿該導線槽連接至一外部處理裝置。The embedded multi-point measurement device platform as claimed in claim 2, wherein the sensor receiving slot is used to accommodate a sensor, and a wire of the sensor extends along the slope into the wire slot. , and the wire is connected to an external processing device along the wire trough. 如請求項9所述之埋入式多點量測裝置平台,其中該感測器容置槽與該感測器皆呈環狀。The embedded multi-point measurement device platform as claimed in claim 9, wherein both the sensor receiving groove and the sensor are annular.
TW112207705U 2023-07-21 2023-07-21 Embedded multi-point measurement device platform TWM646997U (en)

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