TWM646176U - Electronic device - Google Patents

Abstract

An electronic device comprising a frame, a main board, an expansion element, and a heat dissipation element is provided. The frame has a locating surface facing the inside of the frame, and the locating surface has an opening. The main board is disposed on the locating surface. The main board has a front surface and a rear surface facing the locating surface. The rear surface has at least a slot disposed thereon, which is exposed through the opening. The expansion element is detachably inserted into the at least one slot. The heat dissipation element is disposed at the outside of the frame and crossing the opening.

Description

electronic device

This case is about an electronic device, especially a computer host.

In order to expand the functionality of a computer, it is a common practice to install expansion devices (such as storage devices, graphics cards, etc.) on the motherboard.

Current motherboard configurations place storage devices (such as M.2 solid-state drives) near the PCIe slots. Since PCIe slots are often used to install graphics cards, the graphics card installed in the PCIe slot will affect the heat dissipation design and space of the storage device. The waste heat generated by the graphics card will remain around the storage device, worsening the heat dissipation of the storage device and affecting its performance. Operational efficiency.

In addition, as the performance of storage devices (such as M.2 solid-state drives) increases, heat dissipation issues also arise. At present, a common practice is to directly configure the heat sink on the storage device. However, these storage devices with built-in heat sinks are often incompatible with existing motherboard architectures, and the heat sinks need to be removed before they can be installed on the motherboard.

This application provides an electronic device, which includes a frame, a motherboard, an expansion component and a heat dissipation component. The frame has a mounting surface, which faces the inside of the frame and has an opening. The motherboard is disposed on the mounting surface and has a front and a back. The back faces the mounting surface and is provided with at least one slot, and at least one slot is exposed to the opening. The expansion component is detachably installed in at least one slot. The heat dissipation element is located outside the frame and spans the opening.

In this case, the expansion components are placed on the back of the motherboard, and heat dissipation components are set up in the openings of the frame to dissipate heat from the expansion components. In this way, more space can be created inside the electronic device for installing expansion components, and the heat dissipation components can be used Dissipate heat for expansion components and improve the problem of traditional expansion components being unable to install heat sinks due to height or space limitations. In addition, locating the expansion components on the back of the motherboard can also prevent the expansion components from interacting with other devices (such as graphics cards and central processing units) installed on the front of the motherboard, which is beneficial to improving the overall performance of the electronic device.

The specific implementation of this case will be described in more detail below with reference to the schematic diagrams. The advantages and features of this case will become clearer from the following description and patent application scope. It should be noted that the diagrams are in a very simplified form and use imprecise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of this case.

The first figure is a three-dimensional schematic diagram of an electronic device 100 provided according to an embodiment of the present invention. The second figure is a schematic three-dimensional view of the electronic device 100 in the first figure from another perspective. The third figure is a schematic three-dimensional view of the electronic device 100 in the second figure without a heat dissipation component. The electronic device 100 may be a computer host, a server, or other electronic devices equipped with a motherboard. The figure shows a computer host for illustration.

As shown in the figure, the electronic device 100 includes a frame 120, a motherboard 140, at least one expansion component 160, a heat dissipation component 180 and a housing 190.

The frame 120 is the skeleton of the electronic device 100 and has an inner side S1 and an outer side S2. A cover plate (not shown) is provided on the frame 120 to form the housing of the electronic device 100 . The frame 120 has a mounting surface A1 suitable for mounting the motherboard 140 . The mounting surface A1 faces the inner side S1 of the frame 120, and has an opening 122 on the mounting surface A1.

The motherboard 140 is located on the mounting surface A1 and has a front surface 140a and a back surface 140b. The back surface 140b of the motherboard 140 faces the mounting surface A1, and the front surface 140a faces away from the mounting surface A1. The front surface 140a of the motherboard 140 has a CPU slot 142 and a plurality of PCIe slots 144, which are used to insert a CPU (not shown) and a graphics card respectively. In addition, a plurality of expansion component slots 146 are provided on the back 140b of the motherboard 140 at positions corresponding to the openings 122, which are suitable for inserting expansion components 160. As shown in the figure, a total of eight expansion device slots 146 are provided on the back 140b of the motherboard 140 (only one of them is marked in the figure), and up to eight expansion devices 160 can be inserted therein.

The expansion component 160 is inserted into the expansion component slot 146 on the backside 140b of the motherboard 140, that is, the backside 140b of the motherboard 140 corresponds to the position corresponding to the opening 122. The expansion component 160 protrudes from the back 140b of the motherboard 140 and extends into the opening 122 . In this embodiment, a total of eight expansion components 160 are inserted, and only one of them is marked in the figure.

In one embodiment, as shown in the figure, the size (such as length and width) of the opening 122 is larger than the size (such as the length and width) of the expansion component 160 to facilitate accommodating the expansion component 160 and ensure that the expansion component 160 can obtain sufficient space for heat dissipation. , and the expansion component 160 can be dissipated through the opening 122 . In one embodiment, the expansion component 160 may be an M.2 device, such as an M.2 solid state drive. The expansion component 160 appears as a plate-like structure, lying flat on the back 140b of the motherboard 140, and has a heat source 162 (such as a chip) on the expansion component 160.

The heat dissipation element 180 is disposed on the outer side S2 of the frame 120, that is, at a position facing away from the mounting surface A1. The heat dissipation element 180 is installed at the opening 122 and dissipates heat to the expansion element 160 (especially the heat source 162 on the expansion element 160) through the opening 122. In one embodiment, the heat dissipation component 180 can directly contact the expansion component 160 and dissipate heat from the expansion component 160 through heat conduction. However, this case is not limited to this. In other embodiments, the heat dissipation component 180 may also include a cooling fan to dissipate heat from the expansion component 160 through heat convection. For details, see the embodiments corresponding to the fourth and fifth figures.

In one embodiment, as shown in the figure, the heat dissipation element 180 includes a heat dissipation fin 182 . The heat sink 182 has a first side 1822 and a second side 1824 opposite to each other. The first side 1822 and the second side 1824 are fixed to the outer surface of the frame 120 by screws, so that the heat sink 182 is set up in the opening 122 and the heat sink 182 is close to the heat source 162 on the expansion component 160 ( such as a chip) for heat dissipation. However, this case is not limited to this. Opposite sides of the heat sink 182 can also be fixed to the frame 120 in a detachable fixing manner such as a snapping method or a magnetic attraction method.

In one embodiment, the electronic device 100 further includes a housing 190 . The housing 190 is installed on the backside 140b of the frame 120 corresponding to the mounting surface A1, and covers the heat dissipation component 180 to prevent foreign matter from entering and causing damage to the motherboard 140 or the expansion component 160.

The fourth figure is a three-dimensional schematic diagram of an electronic device 500 provided according to another embodiment of the present invention.

Compared with the heat dissipation element 180 in the embodiment of the first figure which only has a heat sink 182 to provide heat dissipation function, the heat dissipation element 580 of this embodiment includes a heat sink 582 (drawn with dotted lines in the figure) and two fans 584 . The heat sink 582 is provided on the outer side S2 of the frame 520 and is installed on the opening 522 . The heat sink 582 can be fixed to the frame 520 through screw locking.

The heat sink 582 has two notches 5826 . The two notches 5826 are arranged along the longitudinal direction of the heat sink 582, and the shape of the notch 5826 corresponds to the shape of the fan 584, and is suitable for installing the fan 584 to provide active heat dissipation.

In this embodiment, two fans 584 are installed on the heat sink 582 to provide active heat dissipation for the expansion component 160 and the back 140b of the motherboard 140, but the present case is not limited thereto. In other embodiments, if the width of the opening 522 is narrow, only one fan 584 can be provided on the heat sink 582 .

Other components of the electronic device 500 in this embodiment are similar to the embodiment in the first figure, and will not be described again here.

The fifth figure is a three-dimensional schematic diagram of an electronic device 700 provided according to another embodiment of the present invention. Figure 6 shows an enlarged view of area B in Figure 5.

Compared with the embodiment in the first figure, the opposite sides of the heat sink 182 are fixed to the frame 120 by screw locking. The heat dissipation element 780 of this embodiment is also a heat sink 782 with an opposite first side. 7822 and a second side 7824. However, the first side 7822 of the heat dissipation element 780 is pivotally connected to the frame 720 through a pivot mechanism 784, and the second side 7824 is detachably fixed to the frame 720 through a fixing mechanism 786. The fixing mechanism 786 used in this embodiment is a fastening mechanism, which includes a fastening groove 7862 provided on the frame 720 and a fastener 7864 provided on the second side 7824 of the heat dissipation element 780 .

The fastener 7864 is rotatably provided on the second side 7824 of the heat dissipation element 780, and the opposite sides of the fastener 7864 respectively have a fastening portion 7864a and an operating portion 7864b. The engaging portion 7864a is used to engage with the engaging groove 7862 to fix the heat dissipation element 780 . The operating portion 7864b is used to unlock the fastener 7864.

When the user needs to disassemble the expansion component 160, he only needs to move the operating portion 7864b of the fastener 7864 to disengage the fastening portion 7864a from the fastening groove 7862, thereby unlocking the fixing mechanism 786. Subsequently, the heat dissipation element 780 is turned outward with the pivot mechanism 784 as the rotation axis (that is, toward the direction away from the motherboard 140), so that the expansion element 160 on the back 140b of the motherboard 140 is exposed to facilitate disassembly and expansion. Element 160. When the user needs to install the expansion component 160, he only needs to unlock the fixing mechanism 786, and use the pivot mechanism 784 as the rotation axis to flip the heat dissipation component 780 outwards, so that the expansion component slot 146 on the back 140b of the motherboard 140 can be installed. Exposed. In this way, the user can disassemble and install the expansion component 160 without removing the entire heat dissipation component 780 , which facilitates the disassembly and assembly of the expansion component 160 .

In this case, the expansion component 160 is placed on the back 140b of the motherboard 140, and the heat dissipation components 180, 580, 780 are installed in the openings 122, 522, 722 of the frames 120, 520, 720 to dissipate heat from the expansion component 160. In this way, the expansion component 160 can be The electronic devices 100, 500, and 700 generate more space for installing the expansion components 160, and the heat dissipation components 180, 580, and 780 can be used to dissipate the heat of the expansion components 160, thereby improving the efficiency of the traditional expansion components 160 due to height or space limitations. Problem with installing heat sink. In addition, disposing the expansion component 160 on the back 140b of the motherboard 140 can also prevent the expansion component 160 from interfering with other devices (such as graphics cards and central processing units) disposed on the front 140a of the motherboard 140, which is beneficial to improving the electronic device 100 , 500, 700 overall effectiveness.

The above are only preferred embodiments of this case and do not impose any restrictions on this case. Any technical personnel in the technical field who make any form of equivalent substitution or modification to the technical means and technical content disclosed in this case shall not deviate from the technical means of this case. It is still within the scope of protection of this case.

100,500,700: Electronic devices

120,520,720:Frame

122,522,722:Open

140: Motherboard

140a:front

140b: Back

142:CPU slot

144: PCIe slot

146: Expansion component slot

160: Expansion components

162:Heat source

180,580,780: cooling element

182,582,782:Heat sink

1822,7822: first side

1824,7824:Second side

190: Shell

5826: Gap 584:Fan 784: Pivot mechanism 786: Fixed mechanism 7862:Latching groove 7864:Fasteners 7864a: Fastening part 7864b:Operation Department S1:Inside S2: Outside A1: Installation surface

The first figure is a three-dimensional schematic diagram of an electronic device provided according to an embodiment of the present application; The second figure is a three-dimensional schematic diagram of the electronic device in the first figure corresponding to another perspective; The third figure is a schematic three-dimensional view of the electronic device in the second figure without a heat dissipation component; The fourth figure is a three-dimensional schematic diagram of an electronic device provided according to another embodiment of the present invention; The fifth figure is a three-dimensional schematic diagram of an electronic device provided according to another embodiment of the present application; and Figure 6 shows an enlarged view of area B in Figure 5.

100: Electronic devices

120:Frame

122:Open your mouth

140: Motherboard

140b: Back

180: Cooling element

182:Heat sink

1822: First side

1824: Second side

190: Shell

S1:Inside

S2: Outside

Claims (10)

An electronic device containing: A frame having a mounting surface facing the inside of the frame and having an opening; A motherboard is provided on the mounting surface and has a front and a back. The back faces the mounting surface and is provided with at least one slot, and the at least one slot is exposed to the opening; An expansion component is removably provided in the at least one slot; and A heat dissipation element is located outside the frame and spans the opening. The electronic device as claimed in claim 1, wherein the size of the opening is larger than the size of the expansion component. The electronic device of claim 1, wherein at least a portion of the expansion component extends into the opening. The electronic device as claimed in claim 1, wherein the expansion component is an M.2 device. The electronic device as claimed in claim 1, wherein the front surface has a CPU slot and a PCIe slot. The electronic device according to claim 1 further includes a casing, which is disposed outside the frame and covers the heat dissipation element. The electronic device as claimed in claim 1, wherein the heat dissipation element is a heat sink. The electronic device of claim 1, wherein the heat dissipation element includes a heat sink and at least one fan, and the heat sink has at least one notch suitable for installing the at least one fan. The electronic device as claimed in claim 7, wherein the heat sink is fixed to the frame by screw locking. The electronic device of claim 7, wherein the heat sink has an opposite first side and a second side, the first side is pivotally connected to the frame, and the second side is detachably fixed to the frame. frame.

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