TWM538874U - Thermostat device for detecting a temperature of a mold - Google Patents

Abstract

A thermostat device includes a base, a first heating module, a fixing mechanism, a first detecting component, and a thermostat module. The base is used for supporting a mold. The first heating module is disposed above the base and spaced from the mold by a distance. The first heating module heats the mold in a non-contacting manner. The fixing mechanism is disposed above the base and for fixing the first heating module. A channel is formed inside the fixing mechanism. The first detecting component is disposed inside the channel. The first heating module is located between the first detecting component and the base. The first detecting component detects heat radiation with a heating radiation wave length emitting from the mold when the first heating module heats the mold. The thermostat module controls a temperature of the mold according to the heat radiation.

Description

Temperature control device for sensing the temperature of the mold

The present invention relates to a temperature control device for sensing and controlling the temperature of a mold, and more particularly to a temperature control device for sensing and controlling the temperature of a mold by a non-contact method.

The existing mold heating device uses a heat conducting plate and an electric heating tube to heat the mold, wherein the electric heating tube is buried in the heat conducting plate, and the heat conducting plate directly contacts the mold when the electric heating tube is heated, so that the heat energy generated by the electric heating tube is uniformly transmitted to the mold. That is to say, the existing mold heating device indirectly heats the mold in a contact manner, but the mold is not directly heated during the heating process, so the heating speed is limited by the material properties (heat transfer coefficient) of the heat conductive plate, and there is no way to effectively Upgrade. In addition, the existing mold heating device is further provided with a temperature sensing element and controls the power of the electric heating tube according to the sensing result of the temperature sensing element to achieve the effect of controlling the temperature of the mold. However, the temperature sensing element is disposed on the heat conducting plate member instead of the mold, so the temperature sensed by the temperature sensing element does not truly reflect the actual temperature of the mold.

Therefore, the present invention provides a temperature control device to solve the above problems.

In order to achieve the above object, the present invention discloses a temperature control device for sensing a temperature of a mold, the temperature control device comprising a base, a first heating module, a fixing mechanism and a first sensing component. The susceptor is configured to support the mold, the first heating module is disposed above the pedestal and spaced apart from the mold, the first heating module heats the mold in a non-contact manner, and the fixing mechanism is disposed at the The first heating element is disposed in the channel, the first sensing element is disposed in the channel, and the first heating module is located at the first sensing element and the base Between the seats, the first sensing element senses one of the heat radiation emitted by the mold through the channel when the first heating module heats the mold.

According to one embodiment of the present invention, the temperature control device further includes a power driver coupled to the first heating module and configured to supply power to the first heating module.

According to one embodiment of the present invention, the temperature control device further includes a sensor and a temperature control module, the sensor is coupled to the first sensing component, and the temperature control module is coupled to the sensor And the power driver, wherein the first sensing component is configured to sense the thermal radiation having a thermal radiation wavelength emitted by the mold and generate a corresponding signal, and the first sensing component is further configured to use the signal Passing to the sensor, the sensor transmits the signal transmitted by the first sensing component to the temperature control module, and the temperature control module controls the power driver to supply power to the first according to the signal transmitted by the sensor Heating module.

According to one embodiment of the present invention, the temperature control module calculates the temperature of the mold according to the signal transmitted by the sensor, and the temperature control module determines that the temperature of the mold reaches a predetermined temperature. The temperature control module controls the power driver to stop supplying power to the first heating module.

According to one embodiment of the present invention, the channel further has a first channel portion and a second channel portion, and the fixing mechanism includes a tube member and a fixing seat, and the tube member is disposed above the base. a first channel portion is formed in the tube member, the first sensing element is disposed in the first channel portion, the fixing seat is disposed between the tube member and the first heating module, and the second channel portion is formed on the fixing portion The seat is open on the side facing the base.

According to one embodiment of the present invention, the temperature control device further includes a cooling water circuit connected to the fixing mechanism and configured to cool the fixing mechanism.

According to one embodiment of the present invention, the first heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are configured to emit infrared rays having an infrared wavelength to the mold.

According to one embodiment of the present invention, the present invention further discloses that the mold is heated by the infrared rays to generate heat radiation having a wavelength of heat radiation.

According to one embodiment of the present invention, the infrared wavelength is 1 to 4 micrometers, and the thermal radiation wavelength is 8 to 14 micrometers.

According to another embodiment of the present invention, the temperature control device further includes a second heating module and a second sensing component, wherein the second heating module is disposed in the base, wherein the first The heating module is configured to heat an upper side of the mold, the second heating module is configured to heat the mold opposite to a lower side of the upper side, and the second sensing component is mounted in the base, the second sensing component The temperature of the mold is sensed when the second heating module heats the mold.

According to one embodiment of the present invention, the base further includes a heat conducting plate and a frame for uniformly conducting thermal energy to the mold, and the second heating module is disposed in the frame.

According to one embodiment of the present invention, the second heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are configured to emit infrared rays having an infrared wavelength to the frame.

According to one embodiment of the present invention, the present invention further discloses that the infrared wavelength is 1-4 micrometers.

According to one embodiment of the present invention, the temperature control device further includes a plurality of electric heating tubes, and the plurality of electric heating tubes are embedded in the base.

According to another embodiment of the present invention, the temperature control device further includes an adjustment seat disposed above the fixing mechanism, the adjustment seat is configured to drive the fixing mechanism to move to adjust the fixing mechanism and One of the spacing of the base.

In summary, the present invention utilizes the first heating module to heat the mold in a non-contact manner, and utilizes the first sensing element disposed in the channel to sense the thermal radiation having the wavelength of thermal radiation emitted by the mold, and reuses The temperature control module calculates the temperature of the mold according to the heat radiation sensed by the first sensing component, so the novel can not only rapidly heat the mold at a high temperature, but also accurately measure the mold temperature.

Please refer to FIG. 1 to FIG. 3 . FIG. 1 is a schematic view showing the appearance of a temperature control device 1 according to a first embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the temperature control device 1 according to the first embodiment of the present invention. FIG. A functional block diagram of the temperature control device 1 of the first embodiment of the present invention. As shown in FIG. 1 to FIG. 3 , the temperature control device 1 includes a base 10 , a first heating module 11 , a second heating module 12 , a fixing mechanism 13 , an adjustment seat 14 , and a first sense The measuring component 15 , a second sensing component 16 , a cooling water circuit 17 , a sensor 18 , a power driver 19 , and a temperature control module 20 .

The susceptor 10 is configured to support a mold 3. The first heating module 11 is disposed above the susceptor 10 and spaced apart from the mold 3. The first heating module 11 heats the upper side 30 of the mold 3 in a non-contact manner. The mechanism 13 is disposed above the base 10 and is configured to fix the first heating module 11 . The first sensing component 15 is disposed in the fixing mechanism 13 and is configured to sense one of the heat radiation H1 emitted by the upper side 31 of the mold 3 . The second heating module 12 is disposed in the base 10 and heats the lower side 31 of the mold 3 opposite to the upper side 30 in an indirect heating manner. The second sensing element 16 is mounted in the base 10 for indirect sensing. The temperature of the lower side 31 of the mold 3. The adjusting seat 14 is disposed above the fixing mechanism 13 for driving the fixing mechanism 13 to adjust the distance between the fixing mechanism 13 and the base 10 according to the height of the mold 3. The cooling water path 17 is connected to the fixing mechanism 13 and used for The fixing mechanism 13 is cooled to avoid overheating damage of the first sensing element 15.

The sensor 18 is coupled to the first sensing component 15 and the temperature control module 19 and is configured to transmit a signal generated by the first sensing component 15 to the temperature control module 19, and the power driver 19 is coupled to the first heating module. The group 11 and the temperature control module 19, the temperature control module 19 controls the power source driver 19 to supply power to the first heating module 11 according to the signal transmitted from the sensor 18. However, the connection relationship of the novel electrical components is not limited thereto. In other embodiments, the sensor 18 can also be coupled to the first sensing component 15 , the second sensing component 16 , and the temperature control module 19 . The power driver 19 can also be coupled to the first heating module 11 and the second. The heating module 12 and the temperature control module 19, the sensor 18 respectively transmits a first signal generated by the first sensing component 15 and a second signal generated by the second sensing component 16 to the temperature control module 19, The temperature control module 19 supplies power to the first heating module 11 and the second heating module 12 according to the first signal transmitted from the sensor 18 and the second signal control power driver 19.

In this embodiment, a channel 130 is formed in the fixing mechanism 13. The first sensing component 15 is disposed in the channel 130, and the first heating module 11 is located between the first sensing component 15 and the pedestal 10. The measuring element 15 senses the heat radiation H1 emitted by the upper side 30 of the mold 3 via the passage 130 when the first heating module 11 heats the mold 3. Specifically, the channel 130 has a first channel portion 1301 and a second channel portion 1302. The fixing mechanism 13 includes a tube member 131 and a fixing base 132. The tube member 131 is disposed above the base 10 and located at the base 10 and the adjusting base. The first channel portion 1301 is disposed in the tube member 131, the first sensing element 15 is disposed in the first channel portion 1301, and the fixing seat 132 is disposed between the tube member 131 and the first heating module 11 for fixing The first heating module 11 and the second channel portion 1302 are formed in the fixing base 132 and open on a side facing the base 10, and the first sensing element 15 senses the mold via the first channel portion 1301 and the second channel portion 1302. 3 The heat radiation H1 emitted from the upper side 30 is connected to the fixing seat 132 of the fixing mechanism 13. During the heating process, the cooling water path 17 is connected with a cooling water for cooling the fixing seat 132, thereby avoiding the first heating mode. The heat generated by the group 11 is conducted to the first sensing element 15 via the fixing block 132 and the tube member 131 to cause damage to the first sensing element 15. In addition, in this embodiment, the first heating module 11 includes four infrared heating tubes 110, and four infrared heating tubes 110 are respectively used to emit infrared rays to the upper side 30 of the mold 3, but the first heating module of the present invention 11 is not limited to this, depending on the design needs.

Furthermore, the susceptor 10 includes a heat conducting plate 100 and a frame 101. The second heating module 12 is disposed in the frame 101. The second heating module 12 heats the frame 101 in a non-contact manner. The heat conducting plate 100 is used to The thermal energy is uniformly transmitted to the lower side 31 of the mold 3, that is, the second heating module 12 heats the lower side 31 of the mold 3 in an indirect heating manner, and the second sensing element 16 is disposed between the heat conducting plate 100 and the frame 101 to indirectly The temperature of the lower side 31 of the mold 3 is measured. In addition, in this embodiment, the second heating module 12 includes four infrared heating tubes 120, and four infrared heating tubes 120 are respectively used to emit infrared rays to the frame 101, but the second heating module 12 of the present invention is not Limited to this, it depends on the design needs.

Please refer to FIG. 3 and FIG. 4 , which is a schematic diagram of the temperature control device 1 of the first embodiment of the present invention in an operating state. As shown in FIGS. 3 and 4, when the temperature control device 1 is to be used to heat the mold 3 to a predetermined temperature, the user can first operate the temperature control module 20 to control the power source driver 19 to the first heating module 11. The first heating module 11 sends infrared IR1 to the mold 3 to heat the upper side 30 of the mold 3. At this time, the user can additionally operate the second heating module 12 to emit infrared IR2 toward the frame 101 and indirectly through the heat conducting plate 100. The lower side 31 of the mold 3. As the temperature of the mold 3 gradually rises, the upper side 30 of the mold 3 emits heat radiation H1 having a temperature corresponding thereto, and the first sensing element 15 senses the heat radiation H1 through the first passage portion 1301 and the second passage portion 1302, and Generate a corresponding signal. Then, the first sensing component 15 transmits the signal to the sensor 18, and the sensor 18 transmits the signal transmitted by the first sensing component 15 to the temperature control module 20, and the temperature control module 20 transmits the signal according to the sensor 18. The signal calculates the temperature of the mold 3, so that the temperature control device 1 can instantly grasp the temperature of the mold 3 at any time during the heating process, and adjust the temperature control power source 19 according to the temperature calculated by the temperature control module 20. The power of the first heating module 11. For example, when the temperature control module 20 determines that the temperature of the mold 3 is close to the predetermined temperature, the temperature control module 20 controls the power source driver 19 to reduce the power of the first heating module 11; when the temperature control module 20 determines the mold 3 When the temperature reaches the predetermined temperature, the temperature control module 20 controls the power source driver 19 to stop supplying power to the first heating module 11.

It is to be noted that, since the first sensing element 15 is located in the channel 130, the infrared IR1 emitted by the first heating module 11 does not easily affect the sensing of the first sensing element 15 via the channel 130 during heating. result. In addition, the infrared rays IR1 and IR2 emitted by the first heating module 11 and the second heating module 12 respectively have an infrared wavelength, and the infrared wavelength is preferably 1 to 4 micrometers, and the first sensing element 15 senses The heat radiation H1 has a thermal radiation wavelength, and the thermal radiation wavelength may preferably be 8 to 14 micrometers. In other words, the two infrared rays IR1, IR2 and the first heating module 11 and the second heating module 12 emit The thermal radiation H1 sensed by the sensing element 15 has different wavelength ranges, respectively, so that even when the infrared IR1 is inadvertently reflected into the channel 130, the first sensing element 15 can only sense 8~ The thermal radiation H1 in the 14 micron wavelength range makes the sensing result more accurate without being affected by the infrared IR1.

Please refer to Fig. 5. Fig. 5 is a schematic view showing the appearance of the temperature control device 1' of the second embodiment of the present invention. The difference between the temperature control device 1' of the second embodiment and the temperature control device 1 of the first embodiment is only that the temperature control device 1' includes a plurality of electric heating tubes 12' instead of the second heating module 12, and the plurality of heating The tube 12' is embedded in the susceptor 10, and the components having the same reference numerals in the embodiment have the same structure and function, and will not be described again.

Compared with the prior art, the present invention utilizes the first heating module to heat the mold in a non-contact manner, and the first sensing element disposed in the channel senses the thermal radiation having the wavelength of thermal radiation emitted by the mold, and then The temperature control module calculates the temperature of the mold according to the heat radiation sensed by the first sensing component. Therefore, the novel model can not only rapidly heat the mold at a high temperature, but also accurately measure the mold temperature, thereby achieving the effect of accurately controlling the mold temperature. The above description is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made by the scope of the present patent application should fall within the scope of the present invention.

1, 1'‧‧‧ temperature control device
10‧‧‧ Pedestal
100‧‧‧heat conducting plate
101‧‧‧Frame
11‧‧‧First heating module
110‧‧‧Infrared heating tube
12‧‧‧Second heating module
120‧‧‧Infrared heating tube
12'‧‧‧Electric heat pipe
13‧‧‧Fixed institutions
130‧‧‧ channel
1301‧‧ First Channel Department
1302‧‧‧Second Channel Department
131‧‧‧ Pipe fittings
132‧‧‧ fixed seat
14‧‧‧ adjustment seat
15‧‧‧First sensing element
16‧‧‧Second sensing element
17‧‧‧Cooling waterway
18‧‧‧ Sensor
19‧‧‧Power Driver
20‧‧‧temperature control module
3‧‧‧Mold
30‧‧‧ upper side
31‧‧‧Underside
H1‧‧‧Heat radiation
IR1, IR2‧‧‧ infrared

Fig. 1 is a schematic view showing the appearance of a temperature control device according to a first embodiment of the present invention. Fig. 2 is a partial cross-sectional view showing the temperature control device of the first embodiment of the present invention. Fig. 3 is a functional block diagram of the temperature control device of the first embodiment of the present invention. Fig. 4 is a schematic view showing the temperature control device of the first embodiment of the present invention in an operating state. Fig. 5 is a schematic view showing the appearance of a temperature control device according to a second embodiment of the present invention.

1‧‧‧temperature control device

10‧‧‧ Pedestal

100‧‧‧heat conducting plate

101‧‧‧Frame

11‧‧‧First heating module

12‧‧‧Second heating module

13‧‧‧Fixed institutions

130‧‧‧ channel

1301‧‧ First Channel Department

1302‧‧‧Second Channel Department

131‧‧‧ Pipe fittings

132‧‧‧ fixed seat

14‧‧‧ adjustment seat

15‧‧‧First sensing element

16‧‧‧Second sensing element

17‧‧‧Cooling waterway

3‧‧‧Mold

30‧‧‧ upper side

31‧‧‧Underside

H1‧‧‧Heat radiation

IR1, IR2‧‧‧ infrared

Claims (15)

A temperature control device for sensing a temperature of a mold, comprising: a base for supporting the mold; a first heating module disposed above the base and spaced apart from the mold, the first The heating module heats the mold in a non-contact manner; a fixing mechanism is disposed above the base for fixing the first heating module, a passage is formed in the fixing mechanism; and a first sensing component is The first heating module is disposed between the first sensing component and the base, and the first sensing component senses the first heating module when the mold is heated. One of the heat radiation emitted by the mold. The temperature control device of claim 1, further comprising a power driver coupled to the first heating module and configured to supply power to the first heating module. The temperature control device of claim 2, further comprising: a sensor coupled to the first sensing component; and a temperature control module coupled to the sensor and the power driver, wherein the first sensing The component is configured to sense the thermal radiation having a thermal radiation wavelength emitted by the mold and generate a corresponding signal, and the first sensing component is further configured to transmit the signal to the sensor, the sensor The signal transmitted by the sensing component is transmitted to the temperature control module, and the temperature control module controls the power driver to supply power to the first heating module according to the signal transmitted by the sensor. The temperature control device of claim 3, wherein the temperature control module calculates the temperature of the mold according to the signal transmitted by the sensor, and when the temperature control module determines that the temperature of the mold reaches a predetermined temperature The temperature control module controls the power driver to stop supplying power to the first heating module. The temperature control device of claim 1, wherein the channel has a first channel portion and a second channel portion, and the fixing mechanism comprises: a tube member disposed above the base, the first channel portion being formed on The first sensing element is disposed in the first channel portion; and a fixing seat is disposed between the tube member and the first heating module, the second channel portion is formed in the fixing seat and is open On the side facing the base. The temperature control device of claim 1, further comprising a cooling water circuit connected to the fixing mechanism and configured to cool the fixing mechanism. The temperature control device of claim 1, wherein the first heating module comprises a plurality of infrared heating tubes, and the plurality of infrared heating tubes are configured to emit infrared rays having an infrared wavelength to the mold. The temperature control device of claim 7, wherein the mold is heated by the infrared rays to generate heat radiation having a wavelength of a thermal radiation. The temperature control device according to claim 8, wherein the infrared wavelength is 1 to 4 μm, and the thermal radiation wavelength is 8 to 14 μm. The temperature control device of claim 1, further comprising: a second heating module disposed in the base, wherein the first heating module is configured to heat an upper side of the mold, the second heating module The second sensing element is mounted in the base, and the second sensing element senses the mold when the second heating module heats the mold. The temperature. The temperature control device of claim 10, wherein the base comprises a heat conducting plate and a frame for uniformly conducting thermal energy to the mold, and the second heating module is disposed in the frame. The temperature control device of claim 11, wherein the second heating module comprises a plurality of infrared heating tubes, and the plurality of infrared heating tubes are configured to emit infrared rays having an infrared wavelength to the frame. The temperature control device of claim 12, wherein the infrared wavelength is 1 to 4 microns. The temperature control device of claim 1, further comprising a plurality of electric heating tubes embedded in the base. The temperature control device of claim 1, further comprising an adjustment seat disposed above the fixing mechanism, the adjustment seat is configured to drive the fixing mechanism to move to adjust a distance between the fixing mechanism and the base .