TWM505148U - Adjustable heating temperature structure of three-electromagnetic heating head - Google Patents

Description

Adjustable heating temperature structure of three electromagnetic heating head

The present invention relates to an adjustable heating temperature structure of a three-electromagnetic heating head, in particular to a structure for adjusting the heating temperature of each electromagnetic heating head to a printed circuit by adjusting the distance between the three electromagnetic heating heads.

A conventional double-electromagnetic heating head, such as the PCT Patent Publication No. WO 2112/052877 A2, "Method of Bonding a Stacked Layer for Manufacturing Printed Circuits by Electromagnetic Induction", which discloses: by electromagnetic induction To join the methods for fabricating the stacked layers (19, 20) of printed circuits. This electromagnetic induction is particularly related to the magnetic flux locally induced by a plurality of electrically conductive spacers (25) disposed along a peripheral region (22) of the multilayer stack (18). By using this method, magnetic fluxes having opposite directions can be induced in individual regions of the surrounding area, so that maximum energy efficiency can be achieved during the bonding process. The invention further includes an inductive head and an engagement device for carrying out the method.

However, the conventional double electromagnetic heating head can achieve maximum energy efficiency during the joining process, but the electromagnetic heating head has a fixed U shape, and the distance between the electromagnetic heating cannot be adjusted, resulting in a fixed heating temperature to the printed circuit. Can not be adjusted, only the heating circuit can be heated and bonded at a fixed heating temperature, and the heating and bonding of the printed circuit requires at least four sets of double electromagnetic heating at a time. The head heats the printed circuit at the same time. If the heating temperature of each set of double electromagnetic heating heads is the same, there will be no damage to the printed circuit, but usually each set of double electromagnetic heating heads will cause each due to iron loss and magnetic loss. The electromagnetic heating temperature generated by the double electromagnetic heating head will be different. Some are too high and too low. If it is too high, it will damage the printed circuit. If it is too low, the heating adhesive temperature will be insufficient, resulting in damage to the printed circuit board and production yield. Lowering is quite inconvenient.

It can be seen that there are still many shortcomings in the above-mentioned household items, which is not a good designer and needs to be improved.

In view of this, the creator of this case has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the author of this case has finally achieved a practical and practical creation.

The main purpose of the present invention is to provide an adjustable heating temperature structure of a three-electromagnetic heating head, which is a three-electromagnetic heating head of a circuit board bonding device, which can adjust the distance between the three electromagnetic heating heads and adjust each The heating temperature of the three electromagnetic heating heads to the printed circuit.

According to the above purpose, the adjustable heating temperature structure of the three electromagnetic heating heads of the present invention mainly comprises: a circuit board bonding device, a plurality of sensing bonding heads and a plurality of magnetic guiding heads; wherein the sensing bonding heads respectively Each of the selected portions of the circuit board bonding apparatus has a body, and the base body is provided with three accommodating grooves communicating with the side, the bottom end of the three accommodating grooves has an opening, and the three accommodating grooves A magnetic conductive block is disposed in each of the magnetic conductive blocks, so that each of the magnetic conductive blocks can be displaced up and down in each of the receiving grooves, and an electromagnetic coil is disposed on the magnetic conductive block in the center of the central body, and the electromagnetic coil and the circuit board are bonded to the circuit board. Electrically connecting, the circuit board bonding device supplies power to the electromagnetic coil, and generates heated magnetic lines, and the two sides of the body The magnetic conductive block is placed on the two sides of the electromagnetic coil, and can be displaced up and down in each of the accommodating grooves, so that the heating magnetic lines of the electromagnetic coil can be conducted downward through the three magnetic conductive blocks, and the seat The body is respectively provided with a screw hole at the upper end of the three-receiving groove, and each of the three screw holes is provided with a screwing component, so that the rotation of each screwing component can adjust the longitudinal (upward or downward) position of each of the magnetic conductive blocks; The magnetic heads are respectively disposed under the corresponding inductive bonding heads of the circuit board bonding device, and have a body. The base body is provided with three accommodating slots communicating with the sides, and the upper end of the three receiving slots has an opening, and the opening A magnetic conductive block is respectively disposed in the three accommodating grooves, so that the side edges of the three magnetic conductive blocks are closely attached to each other, and the upper and lower portions of the three magnetic conductive blocks can be displaced, and the electromagnetic magnetic lines of the electromagnetic coil are transmitted downward. And passing through the three magnetic conductive blocks, and returning to the electromagnetic coil, forming a heating and bonding of the circuit board between the inductive bonding head and the magnetic head, and the base body is respectively disposed at the bottom end of the three receiving slots a screw hole, wherein each of the three screw holes is provided with a screwing element, so that each of the turns The component can adjust the longitudinal (upward or downward) position of each of the magnetic blocks; thereby, in use, the multi-layer circuit board to be bonded can be placed on the gap between the inductive bonding head and the magnetic head. The composite magnetic circuit board is heated and bonded by the heating magnetic line of the electromagnetic coil; when the heating temperature of each of the induction bonding heads is inconsistent, when the heating temperature is adjusted, the respective screwing elements can be adjusted to adjust the magnetic conductive blocks upward or downward. The position is such that the heating temperatures of the inductive bonding heads are all the same, so that the heating temperature is not too high, causing damage to the printed circuit board, or the heating temperature is too low, resulting in insufficient heating and bonding temperature of the laminated circuit board. Achieved the goal of increasing production yield and reducing production costs.

For the sake of your review, you can make a further understanding and understanding of the purpose, shape, structure and function of the creation, and the examples are as follows:

10‧‧‧Circuit board bonding equipment

20‧‧‧Induction joint head

30‧‧‧Guide head

21‧‧‧ body

23‧‧‧ accommodating slots

231‧‧‧ openings

24‧‧‧Magnetic block

22‧‧‧Electromagnetic coil

232‧‧‧ screw holes

25‧‧‧Spiral components

31‧‧‧

33‧‧‧ accommodating slots

331‧‧‧ openings

34‧‧‧Magnetic block

40‧‧‧Multilayer printed circuit board

332‧‧‧ screw holes

35‧‧‧ screw components

G‧‧‧ gap

41‧‧‧Plywood

42‧‧‧ boards

The first figure is a schematic view of the appearance of the circuit board bonding device of the adjustable heating temperature structure of the three electromagnetic heating heads.

The second figure is a schematic plan view of the induction joint head and the magnetic head of the adjustable heating temperature structure of the three electromagnetic heating heads.

The third figure is a schematic diagram of the action of the adjustable heating temperature structure of the three electromagnetic heating heads.

This creation is related to a "three-electromagnetic heating head adjustable heating temperature structure", please refer to the figures 1 and 2, which mainly include: a circuit board bonding device 10, a plurality of sensing bonding heads 20 and a plurality of The magnetic head 30.

The inductive bonding heads 20 are respectively disposed at the selected portions of the circuit board bonding apparatus 10, and have a body 21, and the housing body 21 is provided with three accommodating slots 23 communicating with the sides thereof. The bottom end of the slot 23 has an opening 231, and a magnetic conductive block 24 is disposed in each of the three receiving slots 23, so that each of the magnetic conductive blocks 24 can be displaced up and down in each of the receiving slots 23, the housing 21 An electromagnetic coil 22 is disposed on the central magnetic block 24, and the electromagnetic coil 22 is electrically connected to the circuit board bonding device 10, so that the circuit board bonding device 10 supplies power to the electromagnetic coil 22, and generates a heated magnetic field line. The two magnetic guides 24 of the two sides of the electromagnetic coil 22 are placed on the two sides of the electromagnetic coil 22, and can be displaced up and down in the accommodating grooves 23, so that the magnetic lines of force of the electromagnetic coil 22 can pass through the three magnetic fluxes. Block 24 is conducted downward.

Further, the base body 21 is respectively provided with a screw hole 232 at the upper end of the three accommodating slots 23, and a screwing member 25 is respectively disposed in the three screw holes 232, so that the rotation of each screwing member 25 can adjust the longitudinal direction of each of the magnetic conductive blocks 24. (up or down) position.

The magnetic heads 30 are respectively disposed under the corresponding inductive bonding heads 20 of the circuit board bonding apparatus 10, and have a body 31, and the base 31 is provided The three accommodating slots 33 have an opening 331, and the three accommodating slots 33 are respectively provided with a magnetic conductive block 34, so that the three magnetic conductive blocks 34 are affixed to the side. Together, the upper and lower displacements of the three accommodating grooves 33 can be performed, and the heating magnetic lines for conducting the electromagnetic coil 22 downward can be transmitted back to the electromagnetic coil 22 via the three magnetic conductive blocks 34 to form The inductive bonding head and the circuit board 40 between the magnetic heads can be thermally bonded.

Further, the base body 31 is respectively provided with a screw hole 332 at a bottom end of the three accommodating groove 33, and a screwing member 35 is respectively disposed in the three screw holes 332, so that the screw members 35 can be adjusted to adjust the magnetic conductive blocks 34. The position of the portrait (up or down).

By the composition of the above components, please refer to the second and third figures. In use, the multi-layer printed circuit board 40 to be bonded can be placed on the gap G between the inductive bonding head 20 and the magnetic head 30. The multi-layer printed circuit board 40 is heat-bonded by the heated magnetic lines of the electromagnetic coil 22.

When the heating temperatures of the inductive bonding heads 20 are inconsistent, when the heating temperature needs to be adjusted, the respective screwing elements 25, 35 can be adjusted to adjust the positions of the magnetizing blocks 24, 34 upward or downward to heat the inductive bonding heads 20. The temperatures are the same.

In this way, the heating temperature is not too high, and the printed circuit board is damaged, or the heating temperature is too low, and the heating and bonding temperature of the multi-layer printed circuit board 40 is insufficient, thereby achieving a reduction in the production yield and a drastic reduction. The effectiveness and purpose of production costs.

Referring to FIGS. 2 and 4 again, the method for adjusting the heating temperature of each of the inductive bonding heads 20 is to rotate the respective screwing members 25 and 35 in the left or right direction so that the respective screwing members 25 and 35 push the respective magnetic conductive members. The blocks 24 and 34 are moved upward or downward, so that the closer the end surface of each of the magnetic conductive blocks 24 and 34 is to the multi-layer printed circuit board 40, the higher the heating temperature is, and the further away from the multi-layer printed circuit board 40, the lower the heating temperature is utilized; In this adjustment method, the heating temperatures of the sensing joint heads 20 are all uniform.

Referring to FIG. 2 again, the multi-layer printed circuit board 40 is formed by sandwiching a plurality of layers of plywood 41 between the plurality of circuit boards 42. The multi-layer printed circuit board 40 is laminated by the inductive bonding head 20. After the plywood 41 and the plurality of circuit boards 42 are bonded to each other, the correct position of the upper and lower sides can be positioned without running off or offset, and then a press machine (not shown) is used to press up and down. That is, a multilayer circuit board is formed.

Please refer to the second and third figures. The screwing element 35 can be a non-metallic material (such as engineering plastic material), so that it can be non-magnetic, without affecting the conduction of the heating magnetic line.

Referring to FIGS. 2 and 3 again, each of the magnetic conductive blocks 24 and 34 may be a magnetically conductive material.

The adjustable heating temperature structure of the three electromagnetic heating heads provided by the present invention has the following advantages when compared with the conventional techniques described above:

1. Each of the three electromagnetic heating heads of a circuit board bonding device can adjust the distance between the three electromagnetic heating heads, adjust the heating temperature of each three electromagnetic heating heads to the printed circuit, and make the electromagnetic heating of each electromagnetic heating head. The heating temperature is the same.

The above description is only the best embodiment of the present invention, but the structural features of the present creation are not limited thereto, and any one who is familiar with the skill of the art can easily change or modify it in the field of creation. In the following patent scope of this case.

10‧‧‧Circuit board bonding equipment

20‧‧‧Induction joint head

30‧‧‧Guide head

21‧‧‧ body

23‧‧‧ accommodating slots

231‧‧‧ openings

24‧‧‧Magnetic block

22‧‧‧Electromagnetic coil

232‧‧‧ screw holes

25‧‧‧Spiral components

31‧‧‧

33‧‧‧ accommodating slots

331‧‧‧ openings

34‧‧‧Magnetic block

40‧‧‧Multilayer printed circuit board

332‧‧‧ screw holes

35‧‧‧ screw components

G‧‧‧ gap

41‧‧‧Plywood

42‧‧‧ boards

Claims (4)

An adjustable heating temperature structure of a three-electromagnetic heating head, comprising: a circuit board bonding device; a plurality of inductive bonding heads respectively disposed at selected portions of the circuit board bonding device, and having a body The base body is provided with three accommodating slots, and the bottom end of the three accommodating slots has an opening, and the three accommodating slots are respectively provided with a magnetic conductive block, so that each of the magnetic conductive blocks can be The upper and lower displacements of the accommodating groove are provided with an electromagnetic coil on the magnetic conductive block in the center of the block, and the electromagnetic coil is electrically connected with the circuit board bonding device, so that the circuit board bonding device supplies power to the electromagnetic coil to generate heating The magnetic field lines, the magnetic blocks of the two sides of the body are attached to the two sides of the electromagnetic coil, and can be displaced up and down in each of the accommodating grooves, so that the heating magnetic lines of the electromagnetic coil can pass through the three guides The magnetic block is guided downwardly, and the base body is respectively provided with a screw hole at the upper end of the three accommodating slots, and a screwing component is respectively disposed in the three screw holes, so that the rotation of each screwing component can adjust the longitudinal direction of each magnetic conductive block ( Position up or down); The magnetic heads are respectively disposed under the corresponding inductive bonding heads of the circuit board bonding device, and have a body. The base body is provided with three accommodating slots communicating with the sides, and the upper ends of the three receiving slots Having an opening, and a magnetic conductive block is disposed in each of the three accommodating grooves, so that the three magnetic blocks are affixed to each other, and can be displaced up and down in the three accommodating grooves to make the electromagnetic coil The heated magnetic field line that is transmitted downward can be transmitted back to the electromagnetic coil through the three magnetic conductive blocks to form a heat-bonding bond between the inductive bonding head and the circuit board between the magnetic conductive heads, and the body is in the three-conductor The bottom end of the groove is respectively provided with a screw hole, and each of the three screw holes is provided with a screwing component, so that the rotation of each screw component can adjust the longitudinal (upward or downward) position of each magnetic block; Adjusting the position of each magnetic block up or down by screwing the components The heating temperature of each of the inductive bonding heads is uniform. The adjustable heating temperature structure of the electromagnetic heating head according to claim 1, wherein the multi-layer printed circuit board is composed of several layers of plywood sandwiched between the plurality of circuit boards. The adjustable heating temperature structure of the electromagnetic heating head according to the first aspect of the patent application, wherein the screwing component is a screw of engineering plastic material. For example, the adjustable heating temperature structure of the three electromagnetic heating heads mentioned in the first aspect of the patent application, wherein each of the magnetic conductive blocks is a magnetic conductive material.