TWM592070U - Copper alloy heat dissipation structure with polished surface - Google Patents

Abstract

The present invention discloses a copper alloy heat dissipation structure with a polished surface, including a heat dissipation body. The heat dissipation body has a first grinding surface and a second grinding surface opposite to each other. The first grinding surface is formed with heat dissipation fins. The maximum height roughness Rz on the second abrasive surface is 1.5 μm to 5.4 μm.

Description

Copper alloy heat dissipation structure with abrasive surface

This creation relates to a heat dissipation structure, specifically a copper alloy heat dissipation structure with a polished surface.

In order to achieve better heat dissipation performance, some heat sinks are made of copper alloys, but copper alloys manufactured by powder metallurgy are usually porous. In the manufacturing process, many factors will affect the final pore size of the porous metal material, such as the fineness, distribution, shape and sintering temperature of the powder selected. FIG. 1 schematically shows a heat sink 1A made of a copper alloy, which is formed with surface pores 11A, so that voids 13A (such as voids) of solder 12A (such as As shown in Figure 2), the yield of solder joints is greatly reduced.

In view of this, the inventor of this creation has been engaged in the development and design of related products for many years, and feels that the above-mentioned deficiencies can be improved. It is especially dedicated to research and cooperate with the application of academic principles. Finally, he proposes a reasonable design and effectively improves the above-mentioned deficiencies. .

The main purpose of this creation is to provide a copper alloy heat dissipation structure with a polished surface to solve the above problems.

In order to solve the above technical problems, a technical solution adopted in this work is to provide a copper alloy heat dissipation structure with a polished surface, including: a heat dissipation body having a first grinding surface and a second grinding opposite On the surface, heat dissipation fins are formed on the first grinding surface, and the maximum height roughness Rz on the second grinding surface is 1.5 μm to 5.4 μm.

In a preferred embodiment, the average length Rsm of the roughness curve on the second abrasive surface is 0.05 mm to 0.50 mm.

In a preferred embodiment, the heat dissipation body is made of porous copper alloy.

In a preferred embodiment, the heat dissipation body includes nickel, chromium, cobalt, and copper.

In a preferred embodiment, the first grinding surface and the second grinding surface are formed by grinding.

Therefore, the copper alloy heat dissipation structure with a polished surface provided by this creation has opposite first and second polished surfaces through the heat dissipation body, and the maximum height roughness Rz on the second polished surface is 1.5 μm to 5.4 μm. The surface holes of the heat dissipation body can be effectively eliminated, so that the solder voids can also be effectively eliminated after soldering, so that the yield of solder joints is further improved. In addition, the average length Rsm of the roughness curve on the second polishing surface is 0.05 mm to 0.50 mm. In addition to producing more detailed polishing results, a stable and regular surface condition helps stabilize the yield of solder joints.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the drawings provided are for reference and explanation only, and are not intended to limit this creation.

The following is a description of the embodiments disclosed in this creation by specific specific examples. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments. The details in this specification can also be based on different views and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings in this creation are only a schematic illustration, not based on actual size, and are declared in advance. The following embodiments will further describe the relevant technical content of the creation, but the disclosed content is not intended to limit the protection scope of the creation.

Please refer to FIG. 3, a copper alloy heat dissipation structure with a polished surface provided for the creation. As shown in the figure, the copper alloy heat dissipation structure with an abrasive surface provided according to this creation has a heat dissipation body 1.

The heat dissipation body 1 is preferably made of copper alloy, but may also be made of aluminum alloy, magnesium alloy, and titanium alloy.

In this embodiment, the heat dissipation body 1 is made of copper alloy and has excellent thermal conductivity. Further, the copper alloy for manufacturing the heat dissipation body 1 may include nickel (Ni), chromium (Cr), cobalt (Co), copper (Cu), and inevitable impurities. The so-called unavoidable impurities refer to substances that exist in the raw materials or are unavoidably mixed in the manufacturing process, but do not affect the characteristics of the copper alloy, so they are allowed impurities.

In detail, the copper alloy may include, for example, 1.5 to 3.6% by weight of nickel, 0.20 to 0.40% by weight of chromium, and 0.01 to 0.15% by weight of cobalt, which has the effect of ensuring the strength of the copper alloy. In addition, the copper alloy may also include zinc (Zn) in a weight ratio of 0.05% to 3.0%, which has the effect of improving the yield of solder joints.

Furthermore, the shape and thickness of the heat dissipation body 1 are not particularly limited, and can be appropriately changed according to actual needs. In this embodiment, the heat dissipation body 1 includes a first grinding surface 11 and a second grinding surface 12 opposed to each other.

The heat dissipation fins 111 are formed on the first abrasive surface 11, but the shape of the heat dissipation fins 111 is not limited. Moreover, both the heat dissipation body 1 and the heat dissipation fins 111 can be integrally formed, or the heat dissipation body 1 and the heat dissipation fins 111 can be separately formed, and then the two can be joined through welding, stamping, and other processes. In this embodiment, the heat dissipation fins 111 on the heat dissipation body 1 and its first grinding surface 11 are formed in an integrated manner. Further, the heat dissipation fins 111 can be formed by machining (cutting, grinding).

The second polishing surface 12 is a surface formed on the side of the heat dissipation body 1 through a polishing process. Therefore, a certain range of plastic deformation can be guided through a specific grinding process to eliminate surface holes on the side of the heat dissipation body 1 and form a lower surface roughness, so as to improve the yield of solder joints.

Please refer to Figure 4 and Figure 5 together. FIG. 4 schematically shows the maximum height roughness Rz of the roughness curve of the second abrasive surface 12 of the present embodiment, and the average length Rsm of the roughness curve.

Further, the maximum height roughness Rz on the second polishing surface 12 of this embodiment is 1.5 μm to 5.4 μm. If it is within this range, the surface holes can be effectively eliminated, and the voids of the solder 13 can also be effectively eliminated after soldering, and the yield of solder joints is improved (as shown in FIG. 5). If the maximum height roughness Rz exceeds 5.4 μm, it is difficult to achieve the range of the average length Rsm of the roughness curve described below.

Furthermore, the average length Rsm of the roughness curve on the second grinding surface 12 of this embodiment is 0.05 mm to 0.50 mm. If it is within this range, the resulting second polishing surface 12 produces a more detailed polishing result. If the average length Rsm of the roughness curve exceeds 0.50 mm, the distance between the tips of the surface protrusions becomes larger, and it is difficult to achieve the range of the above-mentioned maximum height roughness Rz.

In addition, various polishing processes can be considered to form the maximum height roughness Rz of the roughness curve of the second polishing surface 12 and the average length Rsm of the roughness curve.

Furthermore, various grinding tools can be considered for use, such as Face mill, which is made of Tungsten carbide steel or Bull end mill, which is made of tungsten steel ( Tungsten steel), but the grinding tools and their materials are not limited to the above.

In summary, the copper alloy heat dissipation structure provided with a polished surface provided by this work has a first polished surface 11 and a second polished surface 12 opposed to each other through the heat dissipation body 1, and the maximum height roughness Rz on the second polished surface 12 is 1.5μm～5.4μm, the surface holes of the heat dissipation body 1 can be effectively eliminated, so that the voids of the solder 13 after soldering can also be effectively eliminated, so that the yield of solder joints is further improved. In addition, the average length Rsm of the roughness curve on the second grinding surface 12 is 0.05 mm to 0.50 mm, which can produce a more detailed grinding result.

The above is only a preferred and feasible embodiment of this creation, and it is not intended to limit the scope of the patent of this creation. Any changes and modifications made in accordance with the patent scope of this creation shall fall within the scope of this creation.

[Knowledge Technology] 1A: radiator 11A: Surface hole 12A: Solder 13A: Empty [This creation] 1: cooling body 11: The first grinding surface 111: cooling fins 12: Second grinding surface 13: Solder Rz: Maximum height roughness Rsm: average length

FIG. 1 schematically shows a conventional heat sink.

FIG. 2 schematically shows a heat sink and solder of the conventional technology.

FIG. 3 schematically shows the copper alloy heat dissipation structure with a polished surface of the present creation.

FIG. 4 schematically shows the maximum height roughness of the roughness curve of the second abrasive surface of the present invention, and the average length of the roughness curve.

Fig. 5 schematically shows the copper alloy heat dissipation structure and solder of the present invention with an abrasive surface.

1: cooling body

11: The first grinding surface

111: cooling fins

12: Second grinding surface

Claims (5)

A copper alloy heat dissipation structure with a polished surface includes: a heat dissipation body, the heat dissipation body having a first grinding surface and a second grinding surface opposite to each other, a heat dissipation fin is formed on the first grinding surface, and the first The maximum height roughness Rz on the second grinding surface is 1.5μm～5.4μm. The copper alloy heat dissipation structure with a polished surface as described in item 1 of the patent application range, wherein the average length Rsm of the roughness curve on the second polished surface is 0.05 mm to 0.50 mm. A copper alloy heat dissipation structure with a polished surface as described in item 1 of the patent application range, wherein the heat dissipation body is made of a porous copper alloy. The copper alloy heat dissipation structure with a polished surface as described in item 3 of the patent application scope, wherein the heat dissipation body includes nickel, chromium, cobalt, and copper. The copper alloy heat dissipation structure with a polished surface as described in item 1 of the patent scope, wherein the first polished surface and the second polished surface are formed by polishing.

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