TWM591528U - Electroplating holder - Google Patents

Abstract

The present disclosure provides an electroplating holder. The electroplating holder includes a body having a quadrilateral window. The quadrilateral window defines an inner peripheral surface of the body. A flange is extended from the inner peripheral surface of the body to the quadrilateral window. For each edge corresponding to the quadrilateral window, at least one conductor is disposed on the flange.

Description

Electroplating fixture

The present disclosure relates to an electroplating jig, in particular to an electroplating jig for electroplating square substrates.

In the semiconductor packaging process, it is often necessary to apply a metal layer on the substrate to further form circuit layers with different functions. There are many methods for applying a metal layer on a substrate, and electroplating is one of them.

In the prior art, the substrates to be electroplated are mostly circular. Therefore, the fixtures used in electroplating are mostly designed for circular substrates. However, when the substrate to be electroplated is square, the prior art electroplating jigs designed for circular substrates cannot be applied.

In view of this, the purpose of the present disclosure is to provide an electroplating jig for electroplating square substrates.

The present disclosure provides an electroplating jig including a main body with a quadrangular hollow portion. The quadrangular hollow portion has an inner peripheral surface, and the quadrangular hollow portion extends the flange inward on the inner peripheral surface. Each side of the corresponding quadrilateral hollow portion is provided with at least one conductor on the flange.

In some embodiments, each side of the corresponding quadrilateral hollow portion is provided with two electrical conductors on the flange.

In some embodiments, each conductor includes a plurality of pins.

In some embodiments, each conductor includes a comb structure.

In some embodiments, a power input assembly is provided on the main body, and the power input assembly is electrically connected to the electrical conductor.

In some embodiments, the power input assembly includes a power input element and a plurality of conductive wires. The power input element is electrically connected to the conductor through the conductive wire.

In some implementations, the main body is provided with a plurality of grooves, and the conductive wires are embedded in the grooves.

In some embodiments, the electroplating jig further includes a protective plate to cover the groove of the main body.

In some embodiments, the electroplating jig further includes a sealing element, which is disposed between the flange and the conductive body around the flange.

In some embodiments, the sealing element has a ring-shaped bump for abutting the substrate when the quadrangular hollow portion receives the substrate.

In some embodiments, the electroplating jig further includes a cover plate with quadrangular bumps corresponding to the quadrangular hollow.

In some embodiments, the electroplating jig further includes a sealing element, which is disposed between the main body and the cover plate around the quadrilateral bump.

In some implementations, the cover plate has a groove surrounding the quadrilateral bump, and the sealing element is embedded in the groove.

In some embodiments, each electrical conductor includes at least one first positioning component for positioning the corresponding electrical conductor on at least one second positioning component of the main body.

In some implementations, the power input element is electrically connected to the first positioning member of the conductor via a conductive wire.

In some embodiments, the main body further has at least another perforation.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these components and configurations are examples only and are not intended to be limiting. In the present disclosure, it is mentioned in the following description that the first feature is formed on or above the second feature may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include additional features An embodiment formed between the second feature and the first feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in various examples. This repetition is for simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

The embodiments of the present disclosure are discussed in more detail below. However, it should be understood that this disclosure provides many applicable concepts that can be embodied in a wide variety of specific situations. The specific embodiments discussed are merely illustrative and do not limit the scope of this disclosure.

In addition, for ease of description, spaces such as "below", "below", "above", "upper", "lower", "left", "right" and similar terms Relative terms may be used herein to describe the relationship between one element or feature and another element(s) as illustrated in the drawings. In addition to the orientation depicted in the drawings, spatial relative terms are intended to cover different orientations of the device in use or operation. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly accordingly. It should be understood that when an element is referred to as being “connected to” or “coupled to” another element, the element can be directly connected or coupled to the other element, or intervening elements may be present.

The numerical ranges and parameters that illustrate the broad scope of the disclosure are approximate, and the values set forth in specific examples can be reported as accurately as possible. However, some values may contain certain errors necessarily caused by the standard deviation found in the individual test measurements. In addition, as used herein, the term "about" generally means within ±10%, ±5%, ±1%, or ±0.5% of a given value or range. Alternatively, those skilled in the art generally believe that the term "about" means within an acceptable standard error of the average. Except in the operating/working examples, or unless explicitly specified otherwise, numerical ranges, amounts, values, and percentages (such as the amount of materials disclosed in this document, duration, temperature, operating conditions, ratios of amounts and their All of similar ones) should be understood as modified by the term "about" in all cases. Therefore, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the appended patent application are variable approximate values. At a minimum, each numerical parameter should be understood based on the reported number of significant digits and by applying general rounding techniques. Ranges may appear herein from one endpoint to another endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term "substantially coplanar" may refer to two surfaces that are within a few microns (μm) along the same plane (such as within 10 μm, 5 μm, 1 μm, or 0.5 μm along the same plane). When the values or characteristics are said to be "substantially the same", the term may mean that the values are within ±10%, ±5%, ±1%, or ±0.5% of the average of the values.

For a square substrate to be electroplated, the present disclosure provides an electroplating jig 1. Please refer to Figures 1 to 3. FIG. 1 is a perspective view of a main body 11 of the electroplating jig 1 of some embodiments of the disclosure, FIG. 2 is a front view of the main body 11 of the disclosed embodiments, and FIG. 3 is a cross section of the main body 11 of the disclosed embodiments of FIG. 2 Sectional view of line AA'.

As shown in the figure, the electroplating jig 1 includes a main body 11 having a quadrangular hollow portion 110. Specifically, the quadrangular hollow portion 110 includes a space penetrating the main body 11. When this space is formed in the main body 11, the shape displayed on one side of the main body 11 is a quadrangle. After the quadrangular hollow portion 110 penetrates the main body 11, the generated space defines an inner peripheral surface 110A of the main body 11, and the main body 11 extends a flange 110F toward the quadrangular hollow portion 110 on the inner peripheral surface 110A. Corresponding to each side of the quadrangular hollow portion 110, at least one conductor EL is provided on the flange 110F.

In more detail, since the quadrangular hollow portion 110 has four sides corresponding to the main body 11, the inner peripheral surface 110A includes four peripheral surfaces corresponding to the four sides, and the flange 110F includes four inner peripheral surfaces 110A A part of the peripheral surface of the quadrilateral hollow portion 110 that extends. Accordingly, the flange 110F includes four regions corresponding to the four peripheral surfaces of the inner peripheral surface 110A, and each region corresponds to one peripheral surface of the inner peripheral surface 110A. In other words, each area of the flange 110F corresponds to the quadrangular hollow portion 110 corresponding to one side of the body 11.

Then, corresponding to each side of the quadrangular hollow portion 110, at least one conductor EL is disposed on a region of the corresponding flange 110F. In some embodiments, a single conductor EL is provided on each area of the flange 110F, and the length of the single conductor EL is substantially equal to the length of one area of the flange 110F.

Please refer to FIG. 4 together. The arrangement of the conductor EL is used to contact the substrate 9 when the rectangular hollow portion 110 receives one of the substrates 9 to be plated. Therefore, the contact surfaces of all the conductor EL contact substrates 9 face the same direction, that is, face The direction of the substrate 9. In some embodiments, the size of the substrate 9 is substantially the same as the quadrangular hollow portion 110 and can be embedded in the quadrangular hollow portion 110. When the substrate 9 is embedded in the quadrangular hollow portion 110, the areas of the four sides of the substrate 9 may be in contact with the conductors EL on the four areas of the flange 110F, respectively.

However, the foregoing embodiments are not intended to limit the setting of the substrate 9, the number and position of the conductors EL, and the user can adjust the setting of the substrate 9, the number and position of the conductors EL according to needs through the content of this disclosure, to The substrate 9 can contact the provided conductor EL.

In some embodiments, a power input assembly is provided on the main body 11 for connecting the power input terminal for electroplating and transmitting the power input to the substrate 9. Specifically, as shown in FIGS. 1 and 2, the power input assembly includes a plurality of power input elements 112 and a plurality of conductive wires 114. The power input elements 112 are electrically connected to the conductor EL through the plurality of conductive wires 114. According to this, when the quadrangular hollow portion 110 receives the substrate 9 and the substrate 9 is in contact with the conductor EL, the power input element 112 can receive electrical input for electroplating and transmit the electrical input to the substrate 9 through the conductive wire 114 and the conductor EL .

In some embodiments, as shown in FIG. 3, the flange 110F extends toward the quadrangular hollow portion 110 in alignment with a plane of the main body 11. In some embodiments, as shown in FIG. 5, the flange 110F extends from the middle portion section of the inner circumferential surface 110A toward the quadrangular hollow portion 110. However, the foregoing embodiment is not intended to limit the installation position of the flange 110F, and the user can adjust the installation position of the flange 110F according to requirements through the content of the present disclosure.

Through the technique of the foregoing embodiment, when the square substrate 9 is placed in the body 11 of the electroplating jig 1 for electroplating, the square substrate 9 can receive electrical input on average through the conductor EL contacting on four sides. All areas of the substrate 9 are uniformly plated, so that the thickness of the metal film after the plating of the substrate 9 is highly uniform.

In some embodiments, the arrangement of the conductor EL on the flange 110F is adjustable. FIG. 6 is a front view of the main body 11 of some embodiments of the present disclosure. As shown in the figure, since the quadrangular hollow portion 110 has four corners corresponding to the main body 11, the flange 110F includes four corner areas having four corners. Corresponding to each corner of the quadrangular hollow portion 110, at least one conductor EL is disposed on the corner area of the corresponding flange 110F.

In detail, each electrical conductor EL is correspondingly disposed on the corner area of the corresponding flange 110F, and respectively extends in the direction of the two sides connected by the corner area. According to this, each electrical conductor EL can be regarded as corresponding to the two sides of the quadrangular hollow portion 110 at the same time. Such an arrangement of the conductor EL can also provide the electrical input required for electroplating to the counter substrate 9 on average.

In some embodiments, the number of the conductor EL on the flange 110F is adjustable. 7 is a front view of the main body 11 of some embodiments of the present disclosure. As shown in the figure, corresponding to each side of the quadrangular hollow portion 110, two electric conductors EL are provided on a region of the corresponding flange 110F. In these embodiments, each power input element 112 is connected to the two conductors EL through the conductive wire 114.

By disposing two conductors EL on one area of the flange 110F, in addition to providing the electrical input required for plating to the substrate 9 of the other type more evenly, it can also reduce the plating of the substrate 9 when a part of the conductor EL is short-circuited. influences. Specifically, as the number of conductors EL on the flange 110F increases and the volume decreases, the electroplating area where each conductor EL can affect the substrate 9 decreases accordingly. According to this, when there is a short circuit failure of the conductor EL, the area affected by the plating is relatively reduced.

In some embodiments, the shape of the electrical conductor EL can be adjusted. FIG. 8 is a front view of the main body 11 of some embodiments of the present disclosure. As shown in the figure, two electric conductors EL are provided on the flange 110F corresponding to each side of the quadrangular hollow portion 110. In these embodiments, each power input element 112 is connected to the two electrical conductors EL through the conductive wire 114. Furthermore, each conductor EL includes a plurality of pins.

Furthermore, as shown in the figure, the electrical conductor EL includes a comb structure (or comb structure). Through this multi-pin structure, the contact point of each conductor EL contacting the substrate 9 can be increased, so that the electrical input can be applied to the substrate 9 more evenly, so that the metal film formed on the substrate 9 after electroplating The uniformity is further improved. In some embodiments, the total number of leads of the electrical conductor EL is about 40 to 400. In some embodiments, the total number of leads of the electrical conductor EL is about 260.

In some embodiments, a sealing element may be used to prevent the plating solution from contacting the conductor EL. Please refer to Figure 9 and Figure 10. 9 is a front view of the main body 11 of some embodiments of the present disclosure, and FIG. 10 is a cross-sectional view of the main body 11 of some embodiments of the present disclosure along the line BB′ of FIG. 9. Specifically, the electroplating jig 1 further includes a sealing element S1, which is disposed around the flange 110F and interposed between the flange 110F and the conductor EL.

Please refer to FIG. 11 together. In some embodiments, the ring-shaped sealing element S1 has a ring-shaped bump SP for abutting the substrate 9 when the rectangular hollow portion 110 receives a substrate 9. The sealing element S1 is made of waterproof and elastic material. In this way, when the plating solution is electroplated on the right side of the drawing of the substrate 9, the sealing element S1 can prevent the plating solution from contacting the conductor EL, and further avoid causing electrical contact between the conductor EL and the substrate 9.

In some embodiments, the electroplating jig 1 further includes a cover plate 13. See Figures 12 and 13. FIG. 12 is a front view of the cover plate 13 of some embodiments of the present disclosure. FIG. 13 is a cross-sectional view of the cover plate 13 of some embodiments of the present disclosure along the line CC′ of FIG. 12. As shown in the figure, the cover plate 13 has a quadrangular bump 130. Specifically, the quadrilateral bump 130 includes a bump protruding from one surface of the cover plate 13. When the bump is formed on the cover plate 13, the shape corresponding to the one surface of the cover plate 13 is a quadrangle.

In some embodiments, the shape of the quadrilateral bump 130 corresponds to the shape of the quadrilateral hollow 110 formed on the body 11. In more detail, the quadrilateral bump 130 corresponds to the shape shown by the cover plate 13, and is substantially the same as the shape of the quadrangular hollow portion 110 corresponding to the main body 11. Please refer to FIG. 14 together. After the quadrilateral hollow portion 110 receives the substrate 9, the cover 13 can be used to cover the substrate 9 and the main body 11, and the quadrilateral bump 130 is used to fix the substrate 9 in the quadrilateral hollow portion 110. In other words, after receiving the substrate 9, the quadrilateral hollow portion 110 can further receive the quadrilateral bump 130.

In some embodiments, the sealing element may be used to prevent the plating solution from infiltrating from the junction of the main body 11 and the cover plate 13, thereby affecting the conductor EL. See Figures 15 and 16. 15 is a front view of the cover plate 13 of some embodiments of the present disclosure, and FIG. 16 is a cross-sectional view of the cover plate 13 of some embodiments of the present disclosure along the line DD′ of FIG. 15.

Specifically, the electroplating jig 1 further includes a sealing element S2, which is disposed between the main body 11 and the cover plate 13 around the quadrilateral bump 130. As shown in the figure, the sealing element S2 may be first disposed on the cover plate 13 around the quadrilateral bump 130. Next, please refer to FIG. 17 together. When the cover plate 13 is combined with the main body 11, the sealing element S2 can be clamped between the main body 11 and the cover plate 13. The sealing element S2 is made of waterproof and elastic material. In this way, the sealing element S2 can be used to avoid the penetration of the plating solution from the junction of the main body 11 and the cover plate 13.

In some embodiments, the arrangement of the sealing element S2 can be adjusted. See Figures 18 and 19. FIG. 18 is a front view of the cover plate 13 of some embodiments of the present disclosure, and FIG. 19 is a cross-sectional view of the cover plate 13 of the present disclosure along the section line EE′ of FIG. 18. In detail, the cover plate 13 has a groove 13C surrounding the quadrangular bump, and the sealing element S2 is embedded in the groove 13C. Please refer to FIG. 20 together. When the cover plate 13 is combined with the main body 11, the sealing element S2 can be clamped between the main body 11 and the cover plate 13.

In some embodiments, the main body 11 has a structure that can be hung, and the electrical conductor EL can be positioned on the main body 11. Please refer to FIG. 21 and FIG. 22. 21 is a front view of the main body 11 of some embodiments of the present disclosure, and FIG. 22 is a cross-sectional view of the main body 11 of some embodiments of the present disclosure along the line FF′ of FIG. 21. In particular, in order to make the diagram easy to understand, for the part of the conductor EL, FIG. 21 only marks the element symbol of the single conductor EL.

Specifically, the main body 11 further has at least one opening 116. Through the arrangement of at least one opening 116, the main body 11 can be hung by the electroplating device, and further electroplating operations are performed. In addition, each conductor EL includes at least one positioning member L1 for positioning the corresponding conductor EL on at least one positioning member L2 of the main body 11.

In these embodiments, as shown in FIG. 21, each conductor EL has three positioning members L1, and the main body 11 has three positioning members L2. Please refer to FIG. 23 and FIG. 24 together. FIG. 23 is a partially enlarged view of the positioning member L1 of the conductor EL of some embodiments of the present disclosure, and FIG. 24 is a partially enlarged view of the positioning member L2 of the body 11 of the present disclosure of some embodiments. .

Furthermore, each positioning member L1 includes a circular opening, and each positioning member L2 includes a circular protrusion. The circular opening of the positioning member L1 is adapted to fit the corresponding circular protrusion of the positioning member L2. In this way, the conductor EL can be fixed to the main body 11 through the combination of the positioning member L1 and the positioning member L2.

In some embodiments, as shown in FIG. 21, each power input element 112 is connected to the corresponding positioning member L1 of the two electrical conductors EL through the conductive wire 114. In detail, the positioning member L1 and the electrical conductor EL can be integrally formed and include a metal conductor material. Therefore, the positioning member L1 electrically connected to the electrical conductor EL is equivalent to electrically connecting the electrical conductor EL.

In some embodiments, as shown in FIG. 22, each positioning member L1 of the electrical conductor EL extends along a surface of the main body 11 toward the inner peripheral surface 110A, and is disposed against the inner peripheral surface 110A. Next, the positioning member L1 extends to the flange 110F and then bends and extends toward the quadrangular hollow portion 110 to connect the conductor EL. In some embodiments, as shown in FIG. 25, the body 11 has two openings 116.

In some embodiments, the main body 11 is further provided with a groove into which the conductive wire 114 is embedded. Please refer to Figure 26 to Figure 28. 26 is a front view of the main body 11 of some embodiments of the present disclosure, FIG. 27 is a cross-sectional view of the main body 11 of some embodiments of the present disclosure along the line GG′ of FIG. 26, and FIG. 28 is a main body 11 of the present disclosure of some embodiments A cross-sectional view along the line HH' of FIG. 26.

As shown in the figure, the main body 11 is provided with a plurality of grooves 11C, and the conductive wires 114 are embedded in the grooves 11C. Furthermore, the electroplating jig 1 further includes a protective plate 15 for covering the groove 11C of the main body 11. Among them, the protection plate 15 is mainly arranged according to the shape of the main body 11 and is provided with openings where necessary. In particular, in these embodiments, the protective plate 15 includes a transparent material. Therefore, the front view of FIG. 26 still focuses on the display of the main body 11 and corresponding components.

In these embodiments, the protective plate 15 is provided with openings at the corresponding openings 116 to avoid hindering the hanging of the electroplating jig 1. In addition, the protection plate 15 is provided with an opening at the corresponding power input element 112 to avoid hindering the power input element 112 from receiving power input. Furthermore, the protective plate 15 is provided with openings at the corresponding quadrangular hollow portions 110 to avoid obstructing the receiving substrate 9.

In some embodiments, the shape of the conductor EL can be adjusted to enhance the contact between the conductor EL and the substrate 9. Please refer to FIGS. 29 and 30. FIG. 29 is a front view of the conductor EL of some embodiments of the present disclosure, and FIG. 30 is a cross-sectional view of the conductor EL of some embodiments of the present disclosure along the line II′ of FIG. 29. As shown in the figure, the pin portion of each conductor EL can be slightly bent toward the receiving substrate 9, so that the contact between the conductor EL and the substrate 9 can be strengthened.

With the electroplating jig 1 of the foregoing embodiment of the present disclosure, the square substrate 9 can also uniformly complete the electroplating of the metal film. Furthermore, through the arrangement of the conductor EL in some embodiments of the present disclosure, after the square substrate 9 is electroplated, the uniformity of the metal film on the substrate 9 is less than 10%. Furthermore, through the arrangement of the conductor EL in some embodiments of the present disclosure, after the square substrate 9 is electroplated, the uniformity of the metal film on the substrate 9 is less than 6%.

The above embodiments are only used to exemplify the implementation of the present disclosure and to explain the technical features of the present disclosure, but not to limit the scope of protection of the present disclosure. Any changes or equivalence arrangements that can be easily completed by those familiar with this technology are within the scope claimed by this disclosure, and the scope of protection of the rights of this disclosure shall be subject to the scope of patent application.

1: electroplating jig 9: substrate 11: main body 11C: Groove 13: Cover 13C: Notch 110: quadrilateral hollow 110A: inner surface 110F: flange 112: Power input element 114: conductive wire 116: opening 130: quadrilateral bump EL: electrical conductor L1: positioning component L2: positioning component S1: Sealing element S2: Sealing element SP: Ring bump

Reading the following detailed description in conjunction with the drawings will best understand the present disclosure. It should be noted that various features may not be drawn to scale. In fact, the size of various features can be arbitrarily increased or decreased for clarity of discussion.

FIG. 1 is a perspective view of the main body of the electroplating jig of some embodiments disclosed.

2 is a front view of the main body of some disclosed embodiments.

FIG. 3 is a cross-sectional view of the main body of some disclosed embodiments along the cross-sectional line AA′ of FIG. 2.

FIG. 4 is a schematic diagram of a main body receiving substrate of some disclosed embodiments.

FIG. 5 is a cross-sectional view of the main body of some disclosed embodiments along the cross-sectional line AA′ of FIG. 2.

6 is a front view of the main body of some disclosed embodiments.

7 is a front view of the main body of some disclosed embodiments.

8 is a front view of the main body of some disclosed embodiments.

9 is a front view of the main body of some embodiments disclosed.

FIG. 10 is a cross-sectional view of the main body of some disclosed embodiments along the line BB′ of FIG. 9.

11 is a schematic diagram of a main body receiving substrate of some disclosed embodiments.

12 is a front view of the cover plate of the electroplating jig of some embodiments disclosed.

FIG. 13 is a cross-sectional view of the cover plate of some disclosed embodiments along the line CC′ of FIG. 12.

14 is a schematic view of the use of the electroplating jig of some embodiments disclosed.

FIG. 15 is a front view of a cover plate of some embodiments disclosed.

FIG. 16 is a cross-sectional view of the cover plate of some disclosed embodiments along the line DD′ of FIG. 15.

FIG. 17 is a schematic diagram of the use of the electroplating jig of some embodiments disclosed.

FIG. 18 is a front view of a cover plate of some embodiments disclosed.

FIG. 19 is a cross-sectional view of the cover plate of some disclosed embodiments along the line EE′ of FIG. 18.

FIG. 20 is a schematic diagram of the use of the electroplating jig of some embodiments disclosed.

21 is a front view of the main body of some disclosed embodiments.

FIG. 22 is a cross-sectional view of the main body of some disclosed embodiments along the line FF′ of FIG. 21.

FIG. 23 is a partial enlarged view of the positioning member of the conductor according to some disclosed embodiments.

24 is a partial enlarged view of the positioning member of the main body of some embodiments disclosed.

Figure 25 is a front view of the main body of some disclosed embodiments.

Figure 26 is a front view of the main body of some disclosed embodiments.

FIG. 27 is a cross-sectional view of the main body of some disclosed embodiments along the line GG′ of FIG. 26.

FIG. 28 is a cross-sectional view of the main body of some disclosed embodiments along the cross-sectional line HH′ of FIG. 26.

FIG. 29 is a front view of the conductive body of some embodiments disclosed.

FIG. 30 is a cross-sectional view of the conductive body along line II′ of FIG. 29 according to some disclosed embodiments.

11: main body

112: Power input element

114: conductive wire

116: opening

EL: electrical conductor

L1: positioning component

L2: positioning component

Claims (16)

An electroplating jig, including: A main body has a quadrangular hollow portion, wherein the quadrangular hollow portion defines an inner peripheral surface of the main body, the main body extends a flange toward the quadrangular hollow portion at the inner periphery, corresponding to each side of the quadrangular hollow portion at the At least one electrical conductor is arranged on the flange. The electroplating jig according to claim 1, wherein two conductors are provided on the flange corresponding to each side of the quadrangular hollow part. The electroplating jig of claim 1, wherein each conductor includes a plurality of pins. The electroplating jig according to claim 3, wherein each conductor includes a comb structure. The electroplating jig according to claim 1, wherein a power input assembly is provided on the main body, and the power input assembly is electrically connected to the electrical conductors. The electroplating jig according to claim 5, wherein the power input assembly includes: A power input element; and Plural conductive wires; Wherein, the power input element is electrically connected to the conductors through the conductive wires. The electroplating jig according to claim 6, wherein the main body is provided with a plurality of grooves, and the conductive wires are embedded in the grooves. The electroplating jig as described in claim 7 further includes: A protective plate covering the grooves of the main body. The electroplating jig as described in claim 1, further includes: A sealing element is disposed around the flange between the flange and the electrical conductors. The electroplating jig according to claim 9, wherein the sealing element has a ring-shaped bump for abutting the substrate when the quadrangular hollow portion receives the substrate. The electroplating jig as described in claim 1, further includes: A cover plate has a quadrangular protrusion corresponding to the quadrangular hollow. The electroplating jig as described in claim 11 further includes: A sealing element is disposed between the main body and the cover plate around the quadrangular protrusion. The electroplating jig according to claim 12, wherein the cover plate has a groove surrounding the quadrilateral bump, and the sealing element is embedded in the groove. The electroplating jig as claimed in claim 1, wherein each conductor includes at least one first positioning member for positioning the corresponding conductor on at least one second positioning member of the main body. The electroplating jig according to claim 14, wherein a power input assembly is provided on the main body, and the power input assembly includes: A power input element; and Plural conductive wires; Wherein, the power input element is electrically connected to the first positioning components of the conductors through the conductive wires. The electroplating jig according to claim 1, wherein the main body further has at least one opening.

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