TWM590263U - Isothermal plate seal structure - Google Patents
Isothermal plate seal structure Download PDFInfo
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- TWM590263U TWM590263U TW108215559U TW108215559U TWM590263U TW M590263 U TWM590263 U TW M590263U TW 108215559 U TW108215559 U TW 108215559U TW 108215559 U TW108215559 U TW 108215559U TW M590263 U TWM590263 U TW M590263U
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- 238000007789 sealing Methods 0.000 claims abstract 21
- 238000004049 embossing Methods 0.000 claims abstract 12
- 238000002347 injection Methods 0.000 claims abstract 6
- 239000007924 injection Substances 0.000 claims abstract 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract 6
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一種均溫板密封結構,係包含:一本體、一毛細結構;所述本體具有一第一板體及一第二板體,該第一、二板體對應蓋合形成一唇邊並共同界定一氣密腔室,所述唇邊具有一注水流道及一密封壓印部,所述注水流道一端連接該氣密腔室一端連接該密封壓印部,所述密封壓印部呈非一字形;所述毛細結構係選擇設於前述本體之氣密腔室空間內;藉此透過密封壓印部增加密封性提升均溫板之氣密性。A temperature-stabilized plate sealing structure includes: a body and a capillary structure; the body has a first plate body and a second plate body, the first and second plate bodies are correspondingly covered to form a lip and jointly defined An airtight chamber, the lip has a water injection flow channel and a sealing embossing portion, one end of the water injection flow path is connected to the airtight chamber, and one end is connected to the sealing embossing portion, the sealing embossing portion is non-uniform Zigzag; the capillary structure is selected to be set in the airtight chamber space of the aforementioned body; thereby increasing the tightness through the sealing embossing part and improving the airtightness of the temperature equalizing plate.
Description
一種均溫板密封結構,尤指一種可增加密封性提升均溫板之氣密性的均溫板密封結構。A temperature equalizing plate sealing structure, especially a temperature equalizing plate sealing structure which can increase the sealing performance and improve the air tightness of the temperature equalizing plate.
均溫板係為一種具有三維空間進行熱傳導效果的熱傳元件,其主要透過兩片設有毛細結構之板體相互疊合後,形成真空氣密之腔室後填入工作液體,藉此作為一種低沸點的熱傳元件,其中真空氣密腔室主要透過均溫板所預留的一抽氣填水管進行抽真空及填入工作液體等工作,最後在對該管體進行封管而保持氣密。 中國專利公告號CN202014433U一案揭示一種具封口的均溫板,所述具封口的均溫板包括殼體、毛細組織、工作流體及充填除氣管,所述殼體由相互對應的兩殼板密封而成,其內部具有一中空容腔內,充填除氣管穿接於殼體並具有與中空容腔相通的一通道,殼板在對應充填除氣管的位置受壓產生變形進而使通道被封閉,且充填除氣管的外側緣與殼體的側邊緣平齊,因此,可避免管體的裸露而造成與其他機構的干涉,還可在對應凹痕的位置進行二次裁切……,而該案仍然具有一充填除氣管並且夾持在殼體中,如此儘管將其設置之部位進行壓扁密封,仍可能因為充填除氣管設置之處無法確實密封或因外力碰撞而產生洩漏進而喪失氣密性。 故如何改善習知技術所產生之缺失,則為該項技藝之人士首要改善之缺失。 The temperature-equalizing plate is a heat transfer element with a three-dimensional space for heat conduction. It is mainly formed by stacking two plates with a capillary structure to form a vacuum and airtight chamber, and then filled with working liquid. A low boiling point heat transfer element, in which the vacuum airtight chamber is mainly used for vacuuming and filling with working liquid through a suction water filling tube reserved by the temperature equalization plate, and finally the pipe body is sealed and kept airtight. The case of Chinese Patent Announcement No. CN202014433U discloses a sealed temperature equalizing plate, which includes a shell, a capillary structure, a working fluid and a filling degassing tube, and the shell is sealed by two shell plates corresponding to each other It has a hollow cavity inside, the filling and degassing tube is connected to the shell and has a channel communicating with the hollow cavity, the shell plate is deformed under pressure at the position corresponding to the filling and degassing tube, and the channel is closed, And the outer edge of the filling degassing tube is flush with the side edge of the casing, so it can avoid the exposure of the tube body and cause interference with other mechanisms. It can also perform a second cut at the position of the corresponding dent... The case still has a filling degassing tube and is clamped in the housing, so even if the part where it is installed is flattened and sealed, the place where the filling degassing tube is installed may not be reliably sealed or leakage may occur due to external force collision and the airtightness may be lost Sex. Therefore, how to improve the deficiencies caused by the conventional technology is the primary deficiencies of those skilled in the art.
爰此,為解決上述習知技術之缺點,本創作之主要目的,係提供一種可增加均溫板封口氣密性的均溫板密封結構。 為達上述之目的,本創作係提供一種均溫板密封結構,係包含:一本體、一毛細結構;所述本體具有一第一板體及一第二板體,該第一、二板體對應蓋合形成一唇邊並共同界定一氣密腔室,所述唇邊具有一注水流道及一密封壓印部,所述注水流道一端連接該氣密腔室一端連接該密封壓印部,所述密封壓印部呈非一字形;所述毛細結構係選擇設於前述本體之氣密腔室空間內;藉此透過密封壓印部增加密封性提升均溫板之氣密性。 Therefore, in order to solve the shortcomings of the above-mentioned conventional technology, the main purpose of this creation is to provide a temperature-averaged plate sealing structure that can increase the airtightness of the temperature-averaged plate seal. To achieve the above purpose, the present invention provides a temperature-stabilized plate sealing structure, which includes: a body and a capillary structure; the body has a first plate body and a second plate body, the first and second plate bodies A lip is formed corresponding to the cover and defines an airtight chamber. The lip has a water injection flow channel and a sealing embossing part. One end of the water injection flow channel is connected to the airtight chamber and one end is connected to the sealing embossing part. The sealing and embossing part is non-in-line; the capillary structure is selected to be provided in the airtight chamber space of the aforementioned body; thereby increasing the sealing performance through the sealing and embossing part to improve the airtightness of the temperature equalizing plate.
請參閱第1、2圖,係為本創作均溫板密封結構之第一實施例立體分解及組合圖,如圖所示,本創作均溫板密封結構,係包含:一本體1、一毛細結構2;
所述本體1具有一第一板體11及一第二板體12,該第一、二板體11、12對應蓋合形成一唇邊14並共同界定一氣密腔室13,所述唇邊14環繞於該氣密腔室13外緣,所述第一板體11具有一第一側面111及一第二側面112,所述第二板體12具有一第三側面121及一第四側面122,所述第一、二板體11、12係為鋁、銅、商業純鈦、鋁合金、銅合金、陶瓷、不鏽鋼其中任一或混搭之組合。
所述唇邊14具有一注水流道141及一密封壓印部142,所述注水流道141一端連接該氣密腔室13一端連接該密封壓印部142,所述密封壓印部142呈非一字形,所述密封壓印部142係呈歐母形、ㄇ字形、U字形、馬蹄形、X型、C字形、波浪形、米字形其中任一,所述密封壓印部142係低於該於該第一板體11之唇邊14高度。
一槽部15及該注水流道141由該第一板體11之第一側面111向該第二側面112凸設所形成,所述該第二、四側面112、122分設於該本體1之上、下兩側,並定義該第二側面112為一冷凝面,該第四側面122為一吸熱面,所述第二板體12對應蓋合該槽部15形成該氣密腔室13。
所述毛細結構2係選擇設於前述本體1之氣密腔室13空間內,如選擇設置於氣密腔室13內的第一、二板體11、12的第一、三側面111、121其中任一或第一、二板體11、12的第一、三側面111、121表面皆有設置(圖中未示)。
藉此透過密封壓印部142增加密封性提升均溫板之氣密性,防止真空洩漏及工作液體外洩者。
請參閱第3圖,係為本創作均溫板密封結構之第二實施例組合剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述毛細結構2設於氣密腔室13中並與該第一、二板體11、12疊合設置,所述毛細結構2係可為燒結粉末、網格體、纖維體、波浪板其中任一或任一以上,本實施例係以網格體作為說明實施但並不引以為限。
請參閱第4圖,係為本創作均溫板密封結構之第三實施例組合剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述第一板體11之第一側面111設有複數凹坑113,該等凹坑113由所述第一側面111向該槽部15方向凸伸並抵頂於該毛細結構2一側,藉此可增加本體1內部汽液循環時內部冷凝後之工作液體3回水以及增加第一、二板體11、12之間的支撐度,當然亦可於該第一、二板體11、12之間設置支撐柱兩端分別抵頂該第一、三側面(圖中未示)結構亦可增加兩者之間的支撐強度。
請參閱第5圖,係為本創作均溫板密封結構之第四實施例組合立體圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述第一、二板體11、12對應設置該密封壓印部處142之唇邊14具有一第一缺口143及一第二缺口144,所述第一、二缺口143可令該密封壓印部142若需向下壓印凹入唇邊範圍之部分時減少應力集中之發生。
請參閱第6圖,係為本創作均溫板密封結構之第五實施例組合剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述密封壓印部142同時由第一板體11向該第二板體12之唇邊14壓入凹陷,即表示所述本體1之密封壓印部同時低於該第一、二板體之唇邊高度。
請參閱第7圖,係為本創作均溫板密封結構之第六實施例組合剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於,所述本體1更具有一管體4,該管體4插接於該注水流道141(因與管體4重疊故圖中未示)中,並該管體4部分同時受密封壓印部142壓制成扁平狀,令該本體1內之氣密腔室13達到保持真空氣密之效果。
本創作主要提供一種不設置有抽氣填水管的均溫板密封結構,不僅可以改善習知技術管體設置後無法確實密封防止洩漏之缺失,更可進一步防止注水流道方向的洩漏,並密封範圍更延伸向其他方向延伸,進而令該本體之唇部多重方向皆可受壓制而防止洩漏者。
Please refer to Figures 1 and 2 for a three-dimensional exploded and assembled view of the first embodiment of the creation of a temperature-stabilized plate sealing structure. As shown in the figure, the creation of a temperature-stamped plate sealing structure includes: a
1‧‧‧本體
11‧‧‧第一板體
111‧‧‧第一側面
112‧‧‧第二側面
113‧‧‧凹坑
12‧‧‧第二板體
121‧‧‧第三側面
122‧‧‧第四側面
13‧‧‧氣密腔室
14‧‧‧唇邊
141‧‧‧注水流道
142‧‧‧密封壓印部
143‧‧‧第一缺口
144‧‧‧第二缺口
15‧‧‧槽部
2‧‧‧毛細結構
3‧‧‧工作液體
4‧‧‧管體
1‧‧‧
第1圖係為本創作均溫板密封結構之第一實施例立體分解圖; 第2圖係為本創作均溫板密封結構之第一實施例立體組合圖; 第3圖係為本創作均溫板密封結構之第二實施例組合剖視圖; 第4圖係為本創作均溫板密封結構之第三實施例組合剖視圖; 第5圖係為本創作均溫板密封結構之第四實施例組合立體圖; 第6圖係為本創作均溫板密封結構之第五實施例組合剖視圖; 第7圖係為本創作均溫板密封結構之第六實施例組合剖視圖。 Figure 1 is a three-dimensional exploded view of the first embodiment of the creation of a temperature-stabilized plate sealing structure; Figure 2 is a three-dimensional assembled view of the first embodiment of the creation of a temperature-stabilized plate sealing structure; Figure 3 is a combined sectional view of the second embodiment of the creation of the temperature-stabilized plate sealing structure; Figure 4 is a combined cross-sectional view of a third embodiment of the creation of a temperature-stabilized plate sealing structure; Figure 5 is a combined perspective view of a fourth embodiment of the creation of a temperature-stabilized plate sealing structure; Figure 6 is a combined cross-sectional view of a fifth embodiment of the creation of a temperature-stabilized plate sealing structure; FIG. 7 is a combined cross-sectional view of the sixth embodiment of the creation of a temperature-stabilized plate sealing structure.
1‧‧‧本體 1‧‧‧Body
11‧‧‧第一板體 11‧‧‧ First board
12‧‧‧第二板體 12‧‧‧Second plate
13‧‧‧氣密腔室 13‧‧‧Airtight chamber
14‧‧‧唇邊 14‧‧‧ lips
141‧‧‧注水流道 141‧‧‧Water injection channel
142‧‧‧密封壓印部 142‧‧‧Seal Imprinting Department
15‧‧‧槽部 15‧‧‧groove
2‧‧‧毛細結構 2‧‧‧Capillary structure
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108215559U TWM590263U (en) | 2019-11-22 | 2019-11-22 | Isothermal plate seal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108215559U TWM590263U (en) | 2019-11-22 | 2019-11-22 | Isothermal plate seal structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM590263U true TWM590263U (en) | 2020-02-01 |
Family
ID=70415142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108215559U TWM590263U (en) | 2019-11-22 | 2019-11-22 | Isothermal plate seal structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM590263U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI747083B (en) * | 2019-11-22 | 2021-11-21 | 大陸商深圳興奇宏科技有限公司 | Vapor chamber having sealing structure |
-
2019
- 2019-11-22 TW TW108215559U patent/TWM590263U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI747083B (en) * | 2019-11-22 | 2021-11-21 | 大陸商深圳興奇宏科技有限公司 | Vapor chamber having sealing structure |
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