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TWM578741U - Actuating breathable material structure - Google Patents

Actuating breathable material structure Download PDF

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Publication number
TWM578741U
TWM578741U TW108200576U TW108200576U TWM578741U TW M578741 U TWM578741 U TW M578741U TW 108200576 U TW108200576 U TW 108200576U TW 108200576 U TW108200576 U TW 108200576U TW M578741 U TWM578741 U TW M578741U
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Taiwan
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layer
actuating
gas permeable
support substrate
venting
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TW108200576U
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Chinese (zh)
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莫皓然
薛達偉
韓永隆
黃啟峰
李偉銘
陳宣愷
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研能科技股份有限公司
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Priority to TW108200576U priority Critical patent/TWM578741U/en
Publication of TWM578741U publication Critical patent/TWM578741U/en

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Abstract

一種致動透氣材料結構,包含:一支撐本體,由支撐基材所構成,其中支撐基材為一原料;以及複數個致動透氣單元,複合在該支撐基材中與該支撐基材形成一體,藉由複數個該致動透氣單元驅動運作構成該支撐本體特定方向氣體傳送之透氣作用。An actuating gas permeable material structure comprising: a support body composed of a support substrate, wherein the support substrate is a raw material; and a plurality of actuating gas permeable units composited in the support substrate to form an integral body with the support substrate The venting action of the gas transmission in a specific direction of the support body is constituted by a plurality of actuation of the actuating venting unit.

Description

致動透氣材料結構Actuated gas permeable material structure

本創作是關於一種致動透氣材料結構,尤指一種具有特定方向氣體傳送作用之致動透氣材料結構。The present invention relates to an actuating permeable material structure, and more particularly to an actuating permeable material structure having a gas transporting action in a particular direction.

對於一些需要透氣通風作用之產品而言,例如一些穿著衣物或會產生熱源需散熱等產品(如筆記型電腦),如何使這些產品具有透氣通風作用是本創作相當注重的一環,是以,如何發展一種致動透氣材料結構應用到此類產品上,讓致動透氣材料結構具有特定方向氣體傳送作用,為本創作主要研發課題。For some products that need ventilation and ventilation, such as some products that wear clothes or heat sources that need to be cooled (such as notebook computers), how to make these products have ventilation and ventilation is a part of this creation, so how The development of an actuated gas permeable material structure applied to such products, allowing the structure of the actuated gas permeable material to have a specific direction of gas transfer, is the main research and development topic of the creation.

本案之目的在於提供一種致動透氣材料結構,將一微小化之致動透氣單元透過複合於一支撐本體之支撐基材中形成一致動透氣材料結構,供以應用於需要透氣通風作用之產品上。The purpose of the present invention is to provide a structure for actuating a gas permeable material, and a miniaturized actuating gas permeable unit is passed through a support substrate laminated to a support body to form a structure of a uniform dynamic gas permeable material for use in a product requiring ventilation and ventilation. .

本案之另一目的在於利用將複數個致動透氣單元複合在該支撐基材中與支撐基材形成一體,並藉由複數個該致動透氣單元驅動運作構成該支撐本體特定方向氣體傳送之透氣作用。Another object of the present invention is to integrate a plurality of actuating venting units in the supporting substrate with the supporting substrate, and to drive the gas in a specific direction of the supporting body by driving the plurality of actuating venting units. effect.

為達上述目的,本案提供一種致動透氣材料結構,包含:一支撐本體,由一支撐基材所構成,其中該支撐基材為一原料;以及複數個致動透氣單元,複合在該支撐基材中與該支撐基材形成一體,藉由複數個該致動透氣單元驅動運作構成該支撐本體特定方向氣體傳送之透氣作用。To achieve the above object, the present invention provides an actuating gas permeable material structure comprising: a support body composed of a support substrate, wherein the support substrate is a raw material; and a plurality of actuating gas permeable units composited on the support base The material is integrally formed with the supporting substrate, and the driving operation of the plurality of the actuating venting units constitutes a gas permeable effect of gas transmission in a specific direction of the supporting body.

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體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上係當作說明之用,而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.

請參閱第1圖及第2圖,本案提供一種致動透氣材料結構10,包括一支撐本體1、複數個致動透氣單元2、複數個微處理晶片3、複數個傳感器4以及複數個供電單元5。其中,支撐本體1由支撐基材11所構成,而複數個致動透氣單元2複合在支撐本體1之支撐基材11中與支撐基材11形成一體,藉由複數個致動透氣單元2驅動運作構成支撐本體1特定方向氣體傳送之透氣作用。複數個微處理晶片3嵌設在支撐本體1之支撐基材11之表面,以控制複數個致動透氣單元2之驅動運作。複數個傳感器4嵌設在支撐本體1之支撐基材11之表面,藉以與複數個微處理晶片3電性連結,以及複數個傳感器4之偵測資料連結複數個微處理晶片3予以傳輸,複數個傳感器4偵測支撐本體1之支撐基材11外部之濕度與溫度,並提供偵測資料給複數個微處理晶片3,複數個微處理晶片3藉以控制複數個致動透氣單元2驅動運作而執行支撐本體1特定方向氣體傳送之透氣作用。又上述之每一微處理晶片3包含一資料通訊元件31,用以接收傳感器4之偵測資料,並傳輸發送偵測資料至一外部接收裝置。藉此,外部接收裝置得以顯示傳感器4之偵測資料。於本案實施例中,外部接收裝置為一行動通訊連結裝置,但不以此為限。複數個供電單元5嵌設在支撐本體1之支撐基材11之表面,用以輸出電能由連接線路6供給複數個致動透氣單元2及複數個微處理晶片3之驅動運作。於本案實施例中,供電單元5可為一能源吸收電板,用以將光能轉換成電能輸出,但不以此為限。於本案實施例中,供電單元5亦可為一石墨烯電池,但不以此為限。Referring to Figures 1 and 2, the present invention provides an actuating permeable material structure 10 comprising a support body 1, a plurality of actuating venting units 2, a plurality of micro-processed wafers 3, a plurality of sensors 4, and a plurality of power supply units. 5. The support body 1 is composed of the support substrate 11 , and the plurality of actuation venting units 2 are composited in the support substrate 11 of the support body 1 and integrated with the support substrate 11 , and driven by a plurality of actuating venting units 2 . The operation constitutes a gas permeable effect of the gas transmission in the specific direction of the support body 1. A plurality of micro-processed wafers 3 are embedded on the surface of the support substrate 11 of the support body 1 to control the driving operation of the plurality of actuation venting units 2. A plurality of sensors 4 are embedded on the surface of the support substrate 11 of the support body 1 to electrically connect with the plurality of micro-processed wafers 3, and the detection data of the plurality of sensors 4 are connected to the plurality of micro-process wafers 3 for transmission. The sensors 4 detect the humidity and temperature outside the supporting substrate 11 of the supporting body 1 and provide detection data to the plurality of micro-processing wafers 3, and the plurality of micro-processing wafers 3 control the driving operation of the plurality of actuating venting units 2 The gas permeable action of the gas transmission in the specific direction of the support body 1 is performed. Each of the microprocessor chips 3 includes a data communication component 31 for receiving the detection data of the sensor 4 and transmitting the detection data to an external receiving device. Thereby, the external receiving device can display the detected data of the sensor 4. In the embodiment of the present invention, the external receiving device is a mobile communication connecting device, but is not limited thereto. A plurality of power supply units 5 are embedded on the surface of the support substrate 11 of the support body 1 for outputting electrical energy for driving operation of the plurality of actuated venting units 2 and the plurality of micro-processed wafers 3 by the connection line 6. In the embodiment of the present invention, the power supply unit 5 can be an energy absorbing electric board for converting light energy into electric energy output, but not limited thereto. In the embodiment of the present invention, the power supply unit 5 can also be a graphene battery, but is not limited thereto.

於本案實施例中,支撐基材11可為一原料,此處原料是指天然生成且尚未加工的物質,或者支撐基材11可為一材料,此處材料是指原料經加工處理後所產生的物質,當然材料可為從化學角度分類之有機材料或有機材料,或者從工程角度分類之金屬材料、高分子材料、陶瓷材料或複合材料,或者從應用角度分類之建築材料、電子材料、航空材料、汽車材料、能源材料與生醫材料等,但不以此為限。In the embodiment of the present invention, the support substrate 11 may be a raw material, where the raw material refers to a naturally occurring and unprocessed material, or the support substrate 11 may be a material, where the material refers to the raw material after processing. The material, of course, the material may be an organic material or an organic material classified from a chemical point of view, or a metal material, a polymer material, a ceramic material or a composite material classified from an engineering point of view, or a building material, an electronic material, an aviation classified from an application point of view. Materials, automotive materials, energy materials and biomedical materials are not limited to this.

請參閱第3A圖,上述致動透氣單元2由一入口層21、一流道層22、一共振層23、一腔室層24、一致動層25、一出口層26以及複數個閥27依序堆疊架構所構成,並透過微機電製程所製出,且致動透氣單元2之每個組構層是由微米構造材料製出,致動透氣單元2尺寸為1微米至999微米,或者由更為微小之奈米構造材料製出,即致動透氣單元2尺寸為1奈米至999奈米,但不以此為限。Referring to FIG. 3A, the actuating venting unit 2 is sequentially formed by an inlet layer 21, a first-order layer 22, a resonant layer 23, a chamber layer 24, a uniform layer 25, an outlet layer 26, and a plurality of valves 27. The stacking structure is formed by a micro-electromechanical process, and each of the constituent layers of the actuating venting unit 2 is made of a micro-structural material, and the venting unit 2 is sized from 1 micron to 999 micrometers, or more It is made of a tiny nano-structure material, that is, the size of the actuated gas permeable unit 2 is from 1 nm to 999 nm, but not limited thereto.

上述之入口層21具有一入口21a,形成於入口層21的中心處。上述之流道層22堆疊架構在入口層21上,並具有一通道22a,通道22a對應入口層21之入口21a位置而設置,供與入口21a相連通。上述之共振層23堆疊架構在流道層22上,並具有一中心孔23a、一可動部23b及一固定部23c;其中中心孔23a設置於共振層23之中心處,對應流道層22之通道22a位置而設置,且與通道22a相連通;而可動部23b為設置於在中心孔23a周緣而不與流道層22接觸之部分,以形成一可撓結構;以及固定部23c為設置於與流道層22架構連結接觸之部份。上述之腔室層24堆疊架構在共振層23上,並且中心凹置鏤空形成一共振腔室24a,在圖例中亦即腔室層24堆疊架構在共振層23之固定部23c部分上,而共振腔室24a對應共振層23之中心孔23a位置而設置,且與中心孔23a相連通。上述之致動層25堆疊架構在腔室層24上,如第3B圖所示,致動層25為一中空懸浮結構,並具有一振動區25a、一外緣區25b、一致動體25c、複數個連接區25d以及複數個空隙25e;其中振動區25a透過複數個連接區25d連接外緣區25b,致使複數個連接區25d支撐振動區25a,讓振動區25a得以彈性位移;於本案實施例中,振動區25a具有一方形輪廓,但不以此為限;而複數個空隙25e介於振動區25a與外緣區25b之間,可用以供氣體流通;於其他實施例中,振動區25a、外緣區25b、複數個連接區25d及複數個空隙25e之設置方式、實施態樣及數量均不以此為限,可依據實際情形變化;致動體25c設置於振動區25a的一表面上,以受微處理晶片3經由連接線路6所控制供給之電壓驅動而形變連動振動區25a產生一往復振動位移。於本案實施例中,致動體25c具有一圓形輪廓,但不以此為限。上述之出口層26堆疊架構於致動層25之外緣區25b上並封蓋致動層25,且出口層26與致動層25之間形成一出流腔室26a,並設有一出口26b,出口26b供與出流腔室26a相連通,而出流腔室26a經由致動層25之複數個空隙25e與腔室層24之共振腔室24a相連通。上述之複數個閥27分別設置於出口層26之出口26b以及入口層21之入口21a中,藉以控制入口21a與出口26b之連通狀態。The inlet layer 21 described above has an inlet 21a formed at the center of the inlet layer 21. The above-mentioned flow channel layer 22 is stacked on the inlet layer 21 and has a passage 22a which is provided corresponding to the position of the inlet 21a of the inlet layer 21 for communication with the inlet 21a. The resonant layer 23 is stacked on the flow channel layer 22 and has a central hole 23a, a movable portion 23b and a fixing portion 23c. The central hole 23a is disposed at the center of the resonant layer 23, corresponding to the flow channel layer 22. The passage 22a is disposed at a position and communicates with the passage 22a; and the movable portion 23b is disposed at a periphery of the center hole 23a without contacting the flow passage layer 22 to form a flexible structure; and the fixing portion 23c is disposed at The portion in contact with the structure of the flow channel layer 22. The chamber layer 24 is stacked on the resonant layer 23, and the central recess is hollowed out to form a resonant cavity 24a. In the illustrated embodiment, the chamber layer 24 is stacked on the fixed portion 23c of the resonant layer 23, and the resonance The chamber 24a is provided corresponding to the position of the center hole 23a of the resonance layer 23, and communicates with the center hole 23a. The actuation layer 25 is stacked on the chamber layer 24. As shown in FIG. 3B, the actuation layer 25 is a hollow suspension structure, and has a vibration zone 25a, an outer edge zone 25b, a coincident body 25c, a plurality of connection regions 25d and a plurality of gaps 25e; wherein the vibration region 25a is connected to the outer edge region 25b through a plurality of connection regions 25d, so that the plurality of connection regions 25d support the vibration region 25a, and the vibration region 25a is elastically displaced; The vibration zone 25a has a square profile, but is not limited thereto; and a plurality of voids 25e are interposed between the vibration zone 25a and the outer edge zone 25b for gas circulation; in other embodiments, the vibration zone 25a The arrangement of the outer edge region 25b, the plurality of connection regions 25d, and the plurality of the gaps 25e are not limited thereto, and may be changed according to actual conditions; the actuating body 25c is disposed on a surface of the vibration region 25a. The reciprocating vibrational displacement is generated by the deformation of the interlocking vibration region 25a by the voltage supplied from the microchip 3 via the connection line 6. In the embodiment of the present invention, the actuating body 25c has a circular contour, but is not limited thereto. The outlet layer 26 is stacked on the outer edge region 25b of the actuation layer 25 and covers the actuation layer 25, and an outlet chamber 26a is formed between the outlet layer 26 and the actuation layer 25, and an outlet 26b is provided. The outlet 26b is in communication with the outflow chamber 26a, and the outflow chamber 26a is in communication with the resonant chamber 24a of the chamber layer 24 via a plurality of voids 25e of the actuation layer 25. The plurality of valves 27 described above are respectively disposed in the outlet 26b of the outlet layer 26 and the inlet 21a of the inlet layer 21, thereby controlling the communication state between the inlet 21a and the outlet 26b.

請參閱第5A圖,上述之閥27包含一保持件271、一密封件272以及一位移件273;其中位移件273設置於保持件271及密封件272之間。保持件271、密封件272、位移件273上分別具有複數個通孔271a、272a、273a,而保持件271的複數個通孔271a與位移件273的複數個通孔273a相互對準,且密封件272的複數個通孔272a與保持件271的複數個通孔271a相互錯位;而位移件273為一帶電荷之材料,保持件271為一兩極性之導電材料,位移件273與保持件271之極性可由微處理晶片3(如第2圖所示)控制其極性,以令位移件273與保持件271維持相同極性,而朝密封件272靠近,構成閥27之關閉;再請再參閱第5B圖,位移件273為一帶電荷之材料,保持件271為一兩極性之導電材料,位移件273與保持件271之極性可由微處理晶片3(如第2圖所示)控制其極性,以令位移件273與保持件271維持不同極性,而朝保持件271靠近,構成閥27之開啟;透過調整保持件271的極性,來使位移件273移動,來形成閥27的開啟及關閉狀態。此外,上述之閥27的位移件273也可為一帶磁性之材料,而保持件271為一可受控變換極性之磁性材料,當位移件273與保持件271維持相同極性時,位移件273朝密封件272靠近,使閥27關閉;反之,當保持件271改變極性與位移件273不同極性時,位移件273將朝保持件271靠近,構成該閥27開啟,由以上述可以得知,通過調整保持件271的磁性,使位移件273移動,來調整閥27的開啟及關閉狀態。該保持件271可由微處理晶片3(如第2圖所示)控制其磁極極性。Referring to FIG. 5A, the valve 27 includes a retaining member 271, a sealing member 272 and a displacement member 273. The displacement member 273 is disposed between the retaining member 271 and the sealing member 272. The holding member 271, the sealing member 272, and the displacement member 273 respectively have a plurality of through holes 271a, 272a, 273a, and the plurality of through holes 271a of the holding member 271 and the plurality of through holes 273a of the displacement member 273 are aligned with each other and sealed. The plurality of through holes 272a of the member 272 are offset from the plurality of through holes 271a of the holder 271; the displacement member 273 is a charged material, the holder 271 is a two-polar conductive material, and the displacement member 273 and the holder 271 are The polarity can be controlled by the micro-processed wafer 3 (as shown in Fig. 2) such that the displacement member 273 and the holder 271 maintain the same polarity, and approach the seal 272 to form the valve 27 closed; see again 5B The displacement member 273 is a charged material, the holder 271 is a two-polar conductive material, and the polarity of the displacement member 273 and the holder 271 can be controlled by the microprocessor chip 3 (as shown in FIG. 2). The displacement member 273 and the holder 271 are maintained at different polarities, and are brought closer to the holder 271 to constitute the opening of the valve 27. By shifting the polarity of the holder 271, the displacement member 273 is moved to form the open and closed state of the valve 27. In addition, the displacement member 273 of the valve 27 described above may also be a magnetic material, and the holding member 271 is a magnetic material of controlled polarity. When the displacement member 273 and the holder 271 maintain the same polarity, the displacement member 273 faces toward The sealing member 272 is close to close the valve 27; conversely, when the holding member 271 is changed in polarity and the displacement member 273 is of different polarity, the displacement member 273 will approach the holding member 271 to constitute the opening of the valve 27, which can be known from the above. The magnetism of the holder 271 is adjusted to move the displacement member 273 to adjust the opening and closing states of the valve 27. The holder 271 can be controlled by the microchip 3 (as shown in Fig. 2) to have its magnetic pole polarity.

請參閱第3C圖至第3D圖所示。當致動體25c受微處理晶片3由連接線路6所控制供給電壓驅動時,即產生形變連動振動區25a沿一垂直於振動區25a表面之方向進行往復式振動。如第3C圖所示,當致動體25c受微處理晶片3由連接線路6所控制供給電壓驅動產生形變而朝向遠離入口層21的方向移動,且閥27受微處理晶片3(如第2圖所示)控制開啟時,振動區25a受致動體25c形變產生振動而朝遠離入口層21的方向位移,並帶動共振層23之可動部23b也朝向遠離入口層21的方向位移,致使腔室層24之共振腔室24a體積增大而產生一吸力,讓氣體由入口層21上的入口21a被吸入,並經過入口層21的閥27,匯集到流道層22之通道22a中,且經過共振層23之中心孔23a而匯集到共振腔室24a中暫存。接著,如第3D圖所示,當致動體25c受微處理晶片3所控制供給電壓驅動產生形變而朝向靠近入口層21的方向移動時,振動區25a受致動體25c形變產生振動而朝向靠近入口層21的方向位移,此時致動層25之振動區25a壓縮共振腔室24a體積,讓共振腔室24a內的氣體得以向兩側擠壓而經複數個空隙25e流入出流腔室26a內匯集,再如第3C圖所示,致動體25c受供電單元5之輸出電能由連接線路6所供給電壓驅動產生形變而朝向遠離入口層21的方向移動時,振動區25a受致動體25c形變產生振動而朝遠離入口層21的方向位移,致使出流腔室26a內氣體經過出口層26的閥27,自出口層26之出口26b排出至出口層26之外部,以構成支撐本體1特定方向氣體傳送之透氣作用。如此,重複如第3C圖至第3D圖所示之作動操作,即可持續將氣體由入口21a導向出口26b並加壓排出,俾實現氣體之傳輸。Please refer to Figures 3C to 3D. When the actuator 25c is driven by the supply voltage controlled by the connection line 6 of the microchip 3, the deformation interlocking vibration region 25a is reciprocally vibrated in a direction perpendicular to the surface of the vibration region 25a. As shown in FIG. 3C, when the actuating body 25c is deformed by the supply voltage controlled by the connection line 6 by the micro-processed wafer 3, it moves toward the direction away from the inlet layer 21, and the valve 27 is subjected to the micro-processed wafer 3 (for example, the second When the control is turned on, the vibration region 25a is deformed by the actuator 25c to be vibrated and displaced in a direction away from the inlet layer 21, and the movable portion 23b of the resonance layer 23 is also displaced in a direction away from the inlet layer 21, resulting in a cavity. The resonance chamber 24a of the chamber layer 24 is increased in volume to generate a suction force, and the gas is sucked in from the inlet 21a on the inlet layer 21, and passes through the valve 27 of the inlet layer 21 to be collected into the passage 22a of the flow passage layer 22, and It passes through the center hole 23a of the resonance layer 23 and is collected in the resonance chamber 24a for temporary storage. Next, as shown in FIG. 3D, when the actuator 25c is driven to be deformed by the supply voltage controlled by the microchip 3 and moved toward the inlet layer 21, the vibration region 25a is deformed by the actuator 25c to be vibrated. Displacement in the direction of the inlet layer 21, at which time the vibration zone 25a of the actuation layer 25 compresses the volume of the resonance chamber 24a, allowing the gas in the resonance chamber 24a to be squeezed to both sides and into the outflow chamber through the plurality of voids 25e. As shown in FIG. 3C, when the actuator 25c is driven by the voltage supplied from the connection line 6 to be deformed by the voltage supplied from the connection line 6 and moved toward the direction away from the inlet layer 21, the vibration area 25a is actuated. The body 25c deforms to vibrate and is displaced away from the inlet layer 21, such that the gas in the outflow chamber 26a passes through the valve 27 of the outlet layer 26, and exits from the outlet 26b of the outlet layer 26 to the outside of the outlet layer 26 to form the support body. 1 Ventilation of gas transmission in a specific direction. Thus, the operation as shown in Figs. 3C to 3D is repeated, that is, the gas is continuously guided from the inlet 21a to the outlet 26b and pressurized, and the gas is transported.

於本案實施例中,共振層23之往復式振動頻率可與致動層25之振動區25a之振動頻率相同,即兩者可同時向上或同時向下,可依實際施作情形而任施變化,並不以本案實施例所示之作動方式為限。經由本案實施例之致動透氣單元2之流道中產生壓力梯度,使氣體高速流動,並透過流道進出方向之阻抗差異,將氣體由入口21a傳輸至出口26b,且在出口26b有壓力之狀態下,仍有能力持續推出氣體,並可達到靜音之效果。In the embodiment of the present invention, the reciprocating vibration frequency of the resonant layer 23 may be the same as the vibration frequency of the vibrating portion 25a of the actuating layer 25, that is, both may be upward or downward at the same time, and may be changed according to the actual application situation. It is not limited to the mode of action shown in the embodiment of this case. A pressure gradient is generated in the flow path of the actuating venting unit 2 according to the embodiment of the present invention, so that the gas flows at a high speed, and the gas is transmitted from the inlet 21a to the outlet 26b through the difference in the impedance of the flow path in and out, and the outlet 26b is under pressure. Underneath, there is still the ability to continuously introduce gas and achieve the effect of mute.

請參閱第4A圖及第4C圖,於本案實施例中,本案可採用複數個致動透氣單元2複合在支撐本體1之支撐基材11中與支撐基材11形成一體,複數個致動透氣單元2可依特定排列方式來調整致動透氣材料結構10所輸出之氣體總傳輸量以及氣體傳輸速度。如第4A圖所示,於實施例中,複數個致動透氣單元2可共用一入口層21、一流道層22、一共振層23、一腔室層24、一致動層25、一出口層26,且兩組致動透氣單元2在一入口層21結構下共用一入口21a,並透過微機電製程來實施串聯方式排列設置,如此複數個致動透氣單元2採以串聯方式排列設置,藉以提升致動透氣材料結構10所輸出之氣體總傳輸量。再如第4B圖所示,於實施例中,複數個致動透氣單元2以兩個致動透氣單元2透過微機電製程堆疊設置,並在兩個致動透氣單元2之間設置一共通腔室28予以連通,如此複數個致動透氣單元2構成並聯方式排列設置,藉以提升致動透氣材料結構10所輸出之氣體傳輸速度。再如第4C圖所示,複數個致動透氣單元2利用一組串聯方式排列之致動透氣單元2搭配另一組串聯方式排列之致動透氣單元2,並在兩組串聯方式排列之致動透氣單元2之間設置一共通腔室28予以連通,如此透過微機電製程堆疊設置達成串並聯方式排列設置,藉以同時提升整致動透氣材料結構10所輸出之氣體總傳輸量以及氣體傳輸速度。於本案實施例中,複數個致動透氣單元2配合驅動電路之連接,可同時致動傳輸氣體,因應大流量之氣體傳輸需求。此外,每一複數個致動透氣單元2亦可單獨控制作動或停止,例如:其中一致動透氣單元2作動、另一致動透氣單元2停止,亦可以是交替運作,但均不以此為限,藉以達成需求之氣體總傳輸量,並可達到大幅降低功耗之功效。Referring to FIG. 4A and FIG. 4C , in the embodiment of the present invention, a plurality of actuating and ventilating units 2 can be composited in the supporting substrate 11 of the supporting body 1 to form an integral with the supporting substrate 11 , and a plurality of actuations are breathable. Unit 2 can adjust the total amount of gas delivered by the actuating gas permeable material structure 10 as well as the gas transfer rate in a particular arrangement. As shown in FIG. 4A, in the embodiment, the plurality of actuating venting units 2 can share an inlet layer 21, a first-order layer 22, a resonant layer 23, a chamber layer 24, a uniform moving layer 25, and an exit layer. 26, and the two sets of actuating venting units 2 share an inlet 21a under the structure of the inlet layer 21, and are arranged in series through the microelectromechanical process, such that the plurality of actuating venting units 2 are arranged in series, thereby The total amount of gas delivered by the actuated gas permeable material structure 10 is increased. As shown in FIG. 4B, in the embodiment, a plurality of actuating venting units 2 are disposed through the micro-electromechanical process stack with two actuating venting units 2, and a common cavity is provided between the two actuating venting units 2. The chamber 28 is in communication such that the plurality of actuating venting units 2 are arranged in a parallel arrangement to enhance the rate of gas transmission output by the actuating permeable material structure 10. As shown in FIG. 4C, the plurality of actuating venting units 2 utilizes a set of actuating venting units 2 arranged in series with another set of actuating venting units 2 arranged in series, and arranged in two groups in series. A common chamber 28 is disposed between the movable gas permeable unit 2 to be connected, so that the micro-electromechanical process stacking arrangement is arranged in a series-parallel manner, thereby simultaneously increasing the total gas output and gas transmission speed output by the entire actuation gas permeable material structure 10. . In the embodiment of the present invention, the plurality of actuating venting units 2 cooperate with the connection of the driving circuit to simultaneously actuate the transmission gas in response to the gas transmission demand of a large flow rate. In addition, each of the plurality of actuating venting units 2 can also be individually controlled to operate or stop, for example, wherein the movable venting unit 2 is actuated, the other actuating venting unit 2 is stopped, or it can be alternately operated, but not limited thereto. In order to achieve the total amount of gas required for the demand, and to achieve a significant reduction in power consumption.

值得注意的是,於本案實施例中,複數個致動透氣單元2可採以均質分布複合在支撐本體1之支撐基材11中與支撐基材11形成一體。意即,複數個致動透氣單元2平均分布在支撐基材11中與支撐基材11形成一體。或者,複數個致動透氣單元2亦可採以非均質分布複合在支撐本體1之支撐基材11中與支撐基材11形成一體。意即,複數個致動透氣單元2複合在支撐基材11中的特定區域與支撐基材11形成一體。複數個致動透氣單元2於支撐基材11中分布的方式可依照設計需求而變更,不以此為限。It should be noted that, in the embodiment of the present invention, the plurality of actuating venting units 2 may be integrated with the supporting substrate 11 in the supporting substrate 11 of the supporting body 1 by a homogeneous distribution. That is, a plurality of actuating venting units 2 are evenly distributed in the support substrate 11 to be integrated with the support substrate 11. Alternatively, the plurality of actuating venting units 2 may be integrated with the supporting substrate 11 in the supporting substrate 11 of the supporting body 1 by a heterogeneous distribution. That is, a specific area in which the plurality of actuating gas permeable units 2 are composited in the support substrate 11 is integrated with the support substrate 11. The manner in which the plurality of actuating venting units 2 are distributed in the supporting substrate 11 can be changed according to design requirements, and is not limited thereto.

值得注意的是,於本案實施例中,如前所述,支撐本體1之支撐基材11可為多種原料或材料,而欲將複數個致動透氣單元2複合在支撐本體1之支撐基材11中以構成一致動透氣材料結構時,因應不同原料或材料有多種複合方式,例如當支撐基材11為金屬材料、陶瓷材料等時,可採以將複數個致動透氣單元2混合組成於支撐基材11中之方式;例如當支撐基材11為纖維、紡織等材料時,可採以將複數個致動透氣單元2編織組成於支撐基材11中之方式;例如當支撐基材11為高分子材料,可採以將複數個致動透氣單元2植入組成於支撐基材11中之方式。複數個致動透氣單元2複合在支撐本體1之支撐基材11中的方式可依照設計需求而變更,不以此為限。It should be noted that, in the embodiment of the present invention, as described above, the support substrate 11 of the support body 1 may be a plurality of materials or materials, and a plurality of actuation ventilation units 2 are to be composited on the support substrate of the support body 1. In the case of forming a structure of a uniform dynamic gas permeable material in 11 , a plurality of composite materials may be used in response to different materials or materials. For example, when the support substrate 11 is a metal material or a ceramic material, a plurality of actuating gas permeable units 2 may be mixed and composed. The manner of supporting the substrate 11; for example, when the supporting substrate 11 is a material such as fiber, textile, or the like, a plurality of actuating venting units 2 may be woven into the supporting substrate 11; for example, when the supporting substrate 11 is supported. For the polymer material, a plurality of actuating gas permeable units 2 can be implanted into the support substrate 11. The manner in which the plurality of actuating venting units 2 are combined in the supporting substrate 11 of the supporting body 1 can be changed according to design requirements, and is not limited thereto.

由上述說明可知,本案之致動透氣材料結構10在具體實施應用上,當實施作為穿著衣物之紡織材料時,將複數個致動透氣單元2複合在支撐本體1之支撐基材11(如:紡織材料)中之方式,係將複數個致動透氣單元2編織組成於支撐基材11(如:紡織材料)中,且複數個微處理晶片3、複數個傳感器4以及複數個供電單元5也編織組成於支撐基材11(如:紡織材料)中,即可構成一致動透氣材料結構10。複數個傳感器4可視外部溫度來調節穿著者體表溫度,體表溫度過熱時,可由複數個微處理晶片3控制複數個致動透氣單元2驅動運作,藉由複數個致動透氣單元2驅動運作構成支撐本體1特定方向氣體傳送之透氣作用,以調節穿著者體表溫度,如此實施於穿著衣物之紡織材料時,即可達成一種智能衣的體現。或者,實施作為會產生熱源需散熱等產品之外殼部分(如:筆記型電腦之外殼)時,將複數個致動透氣單元2複合在支撐本體1之支撐基材11(如:筆記型電腦之外殼)中之方式,係採以將複數個致動透氣單元2混合組成於支撐基材11(如:筆記型電腦之外殼)中,且複數個微處理晶片3、複數個傳感器4以及複數個供電單元5也混合組成於支撐基材11(如:筆記型電腦之外殼)中,即可構成一致動透氣材料結構10。複數個傳感器4可視筆記型電腦之內部(外殼內)溫度來調節透氣,筆記型電腦之內部溫度過熱時,可由複數個微處理晶片3控制複數個致動透氣單元2驅動運作,藉由複數個致動透氣單元2驅動運作構成支撐本體1特定方向氣體傳送之透氣作用,以調節筆記型電腦之散熱作用,以體現智能散熱。It can be seen from the above description that the actuating gas permeable material structure 10 of the present invention, in the specific application, when the textile material as the wearing garment is implemented, the plurality of actuating gas permeable units 2 are composited on the supporting substrate 11 of the supporting body 1 (eg: In the textile material, a plurality of actuating gas permeable units 2 are woven into a support substrate 11 (eg, a textile material), and a plurality of micro-processed wafers 3, a plurality of sensors 4, and a plurality of power supply units 5 are also The woven composition is formed in the support substrate 11 (e.g., textile material) to form the uniform dynamic gas permeable material structure 10. The plurality of sensors 4 can adjust the wearer's body surface temperature according to the external temperature. When the body surface temperature is overheated, the plurality of micro-processed wafers 3 can control the driving operation of the plurality of actuating venting units 2, and the plurality of actuating venting units 2 are driven to operate. The ventilation effect of the gas conveying in the specific direction of the supporting body 1 is adjusted to adjust the temperature of the body surface of the wearer. When the textile material of the wearing body is thus implemented, an embodiment of the smart clothing can be achieved. Alternatively, when the outer casing portion (for example, the outer casing of the notebook computer) that generates heat is required to generate heat, the plurality of actuating venting units 2 are composited on the supporting substrate 11 of the supporting body 1 (eg, a notebook computer). The outer casing is formed by mixing a plurality of actuating venting units 2 into a supporting substrate 11 (such as a casing of a notebook computer), and a plurality of micro-processing wafers 3, a plurality of sensors 4, and a plurality of The power supply unit 5 is also mixed and formed in the support substrate 11 (for example, the outer casing of the notebook computer) to constitute the uniform movable gas permeable material structure 10. A plurality of sensors 4 can adjust the air permeability inside the inside of the notebook computer (in the outer casing), and when the internal temperature of the notebook computer is overheated, a plurality of micro-processed wafers 3 can control a plurality of actuation ventilating units 2 to be driven, by a plurality of Actuating the venting unit 2 to drive the air to form a venting effect of the gas transmission in a specific direction of the supporting body 1 to adjust the heat dissipation function of the notebook computer to reflect the intelligent heat dissipation.

綜上所述,本案所提供之致動透氣材料結構,將一微小化致動透氣單元透過複合於一支撐本體之支撐基材中形成一致動透氣材料結構,供以應用於需要透氣通風作用之產品上,極具產業利用性。In summary, the actuating gas permeable material structure provided by the present invention transmits a miniaturized actuating gas permeable unit through a support substrate laminated to a support body to form a structure of a uniform dynamic gas permeable material for application of ventilation and ventilation. The product is highly industrially usable.

本案得由熟知此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

10‧‧‧致動透氣材料結構10‧‧‧Actuating the structure of breathable materials

1‧‧‧支撐本體 1‧‧‧Support ontology

11‧‧‧支撐基材 11‧‧‧Support substrate

2‧‧‧致動透氣單元 2‧‧‧Actuating the ventilation unit

21‧‧‧入口層 21‧‧‧Entry floor

21a‧‧‧入口 21a‧‧‧ entrance

22‧‧‧流道層 22‧‧‧Flow layer

22a‧‧‧通道 22a‧‧‧ channel

23‧‧‧共振層 23‧‧‧Resonance layer

23a‧‧‧中心孔 23a‧‧‧Center hole

23b‧‧‧可動部 23b‧‧‧movable department

23c‧‧‧固定部 23c‧‧‧Fixed Department

24‧‧‧腔室層 24‧‧‧ chamber layer

24a‧‧‧共振腔室 24a‧‧‧Resonance chamber

25‧‧‧致動層 25‧‧‧Activity layer

25a‧‧‧振動區 25a‧‧‧Vibration zone

25b‧‧‧外緣區 25b‧‧‧Outland Area

25c‧‧‧致動體 25c‧‧‧actuator

25d‧‧‧連接區 25d‧‧‧Connected area

25e‧‧‧空隙 25e‧‧‧ gap

26‧‧‧出口層 26‧‧‧Exit layer

26a‧‧‧出流腔室 26a‧‧‧ outflow chamber

26b‧‧‧出口 26b‧‧‧Export

27‧‧‧閥 27‧‧‧Valves

271‧‧‧保持件 271‧‧‧ Holder

272‧‧‧密封件 272‧‧‧Seal

273‧‧‧位移件 273‧‧‧ displacement parts

271a、272a、273a‧‧‧通孔 271a, 272a, 273a‧‧‧through holes

28‧‧‧共通腔室 28‧‧‧Common chamber

3‧‧‧微處理晶片 3‧‧‧Microprocessor wafer

31‧‧‧資料通訊元件 31‧‧‧Data communication components

4‧‧‧傳感器 4‧‧‧ sensor

5‧‧‧供電單元 5‧‧‧Power supply unit

6‧‧‧連接線路 6‧‧‧Connected lines

第1圖為本案致動透氣材料結構之示意圖。 第2圖為第1圖中致動透氣材料結構之剖面示意圖。 第3A圖為本案一致動透氣單元之剖面結構示意圖。 第3B圖為本案一致動透氣單元之致動層示意圖。 第3C圖至第3D圖為第3A圖中致動透氣單元之作動示意圖。 第4A圖為本案複數個致動透氣單元之串聯架構剖面示意圖。 第4B圖為本案複數個致動透氣單元之並聯架構剖面示意圖。 第4C圖為本案複數個致動透氣單元之串並聯架構剖面示意圖。 第5A圖至第5B圖為本案致動透氣單元之閥作動示意圖。Figure 1 is a schematic view of the structure of the actuated gas permeable material of the present invention. Figure 2 is a schematic cross-sectional view showing the structure of the actuating gas permeable material in Figure 1. Figure 3A is a schematic cross-sectional view of the consistently ventilating unit of the present invention. Figure 3B is a schematic view of the actuation layer of the consistently movable gas permeable unit of the present invention. 3C to 3D are schematic views of the actuation of the actuating venting unit in Fig. 3A. Fig. 4A is a schematic cross-sectional view showing a series structure of a plurality of actuating venting units in the present case. Figure 4B is a schematic cross-sectional view of a parallel structure of a plurality of actuated venting units of the present invention. Figure 4C is a schematic cross-sectional view of a series-parallel structure of a plurality of actuated venting units in the present case. 5A to 5B are schematic views showing the operation of the valve for actuating the venting unit in the present case.

Claims (10)

一種致動透氣材料結構,包含: 一支撐本體,由一支撐基材所構成,其中該支撐基材為一原料;以及 複數個致動透氣單元,複合在該支撐基材中與該支撐基材形成一體,藉由複數個該致動透氣單元驅動運作構成該支撐本體特定方向氣體傳送之透氣作用。An actuating gas permeable material structure comprising: a support body composed of a support substrate, wherein the support substrate is a raw material; and a plurality of actuating gas permeable units composited in the support substrate and the support substrate Formed integrally, the driving operation of the plurality of actuating venting units constitutes a gas permeable effect of gas transmission in a specific direction of the supporting body. 如申請專利範圍第1項所述之致動透氣材料結構,其中該支撐基材之該原料係指天然生成且尚未加工的物質。The actuated gas permeable material structure of claim 1, wherein the raw material of the support substrate refers to a naturally occurring and unprocessed material. 如申請專利範圍第2項所述之致動透氣材料結構,其中該支撐基材為一材料,該材料係指該原料經加工處理後所產生的物質。The structure of the actuating gas permeable material according to claim 2, wherein the supporting substrate is a material, and the material refers to a substance produced by processing the raw material. 如申請專利範圍第3項所述之致動透氣材料結構,其中該支撐基材為一有機材料及一無機材料之其中之一。The actuating gas permeable material structure of claim 3, wherein the support substrate is one of an organic material and an inorganic material. 如申請專利範圍第3項所述之致動透氣材料結構,其中該支撐基材為一金屬材料、一高分子材料、一陶瓷材料及一複合材料之其中之一。The actuating gas permeable material structure according to claim 3, wherein the supporting substrate is one of a metal material, a polymer material, a ceramic material and a composite material. 如申請專利範圍第3項所述之致動透氣材料結構,其中該支撐基材為一建築材料、一電子材料、一航空材料、一汽車材料、一能源材料及一生醫材料之其中之一。The actuating gas permeable material structure according to claim 3, wherein the supporting substrate is one of a building material, an electronic material, an aviation material, an automobile material, an energy material, and a biomedical material. 如申請專利範圍第1項所述之致動透氣材料結構,其中該致動透氣單元為透過微機電製程所製出。The actuating venting material structure of claim 1, wherein the actuating venting unit is made by a microelectromechanical process. 如申請專利範圍第1項所述之致動透氣材料結構,其中該致動透氣單元由微米構造材料製出。The actuated gas permeable material structure of claim 1, wherein the actuating gas permeable unit is made of a micron construction material. 如申請專利範圍第1項所述之致動透氣材料結構,其中該致動透氣單元由奈米構造材料製出。The actuated gas permeable material structure of claim 1, wherein the actuating gas permeable unit is made of a nanostructure material. 如申請專利範圍第1項所述之致動透氣材料結構,其中每一該致動透氣單元至少包含: 一入口層; 一流道層,堆疊架構於該入口層上; 一共振層,堆疊架構於該流道層上; 一腔室層,堆疊架構於該共振層上; 一致動層,堆疊架構於該腔室層上; 一出口層,堆疊架構於該致動層上;以及 複數個閥; 其中,該入口層、該流道層、該共振層、該腔室層、該致動層以及該出口層分別堆疊,而複數個該閥分別設置於該入口層以及該出口層。The actuating gas permeable material structure of claim 1, wherein each of the actuating venting units comprises: at least: an inlet layer; a first-order channel layer stacked on the inlet layer; a resonance layer stacked on the substrate a flow channel layer; a chamber layer stacked on the resonant layer; a uniform moving layer stacked on the chamber layer; an outlet layer stacked on the actuating layer; and a plurality of valves; Wherein, the inlet layer, the channel layer, the resonance layer, the chamber layer, the actuation layer and the outlet layer are respectively stacked, and a plurality of the valves are respectively disposed on the inlet layer and the outlet layer.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724362B (en) * 2019-01-11 2021-04-11 研能科技股份有限公司 Actuating breathable material structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724362B (en) * 2019-01-11 2021-04-11 研能科技股份有限公司 Actuating breathable material structure

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