TWM572888U - Wafer carrying and transportation equipment - Google Patents

Abstract

A wafer carrying device comprises: a machine body, a wafer cassette carrying device, an air blowing device and a control device. The wafer cassette carrying device is fixedly disposed on the machine body, and the wafer cassette carrying device comprises: a frame body, a base and a door opening module. The frame body is fixedly disposed on the machine body, and the frame body includes a communication port. The base is fixedly disposed on one side of the frame, and the base includes a platform for providing a wafer cassette setting. The door opening module is fixedly disposed on the side opposite to the frame body, and the door opening module can be controlled to bring the door panel of the wafer cassette disposed on the platform away from the communication port. The air blowing device is detachably fixedly disposed on the frame body or the machine body, and the air blowing device can be controlled to blow a predetermined gas in a predetermined direction to form an air flow wall on one side of the communication port.

Description

Wafer carrying equipment

The present invention relates to a wafer carrier device, and more particularly to a wafer carrier device for use in a semiconductor device factory.

In the existing semiconductor manufacturing plants, there are a variety of devices for transferring wafer cassettes, which are mostly produced by different manufacturers. Therefore, when the wafer cassette is transferred in equipment produced by two different manufacturers, it may occur. The door panel of the wafer cassette is opened, and the inside of the wafer cassette is directly connected to the outside. Thus, the dirt outside the wafer cassette will easily enter the wafer cassette directly, which may cause the wafer in the wafer cassette. Suffered from pollution.

The main purpose of this creation is to provide a wafer carrying device for improving the problem that dirt outside the wafer cassette easily enters the inside of the wafer cassette when the door panel of the wafer cassette is opened.

In order to achieve the above object, the present invention provides a wafer carrying device comprising: a machine body, at least one wafer cassette carrying device, an air blowing device and a control device. The machine body includes at least one mounting opening. The wafer cassette carrying device is fixedly disposed on the machine body, and the wafer cassette carrying device comprises: a frame body, a base and a door opening module. The frame body is fixedly disposed on the machine body, and the frame body includes a communication port. The pedestal is fixedly disposed on one side of the frame body, at least a portion of the pedestal is exposed at the mounting opening, the pedestal comprises a platform, the platform is used to provide a wafer cassette setting; and when the wafer cassette is disposed on the platform, the wafer cassette A door panel can correspond to the communication port. The door opening module is fixedly disposed on the side opposite to the side of the frame provided with the base, and the door opening module can be controlled to be mounted on the door of the wafer cassette Board with a disconnected connection. The air blowing device is detachably fixedly disposed on the frame body or the machine body, and the air blowing device and the base are located on opposite sides of the frame body; the air blowing device can be controlled to blow a predetermined gas in a predetermined direction to the communication port One side forms an air flow wall. The control device is electrically connected to the wafer cassette carrying device, and the control device can control the door opening module, so that the door opening module brings the door panel of the wafer cassette disposed on the platform away from the communication port; the control device is electrically connected to the air blowing device, and the control device The blowing device can be controlled to form an air flow wall on one side of the communication port.

The beneficial effect of the present invention may be that, by the arrangement of the air blowing device, when the door panel of the wafer cassette is opened, the air blowing device will form an air flow wall on one side of the wafer cassette, thereby greatly reducing the outside of the wafer cassette. The chance of dirty direct access to the inside of the wafer cassette.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

100‧‧‧ wafer carrier equipment

10‧‧‧ machine body

101‧‧‧Installation port

20‧‧‧Facsimile carrier

21‧‧‧ ‧ body

211‧‧‧Connected

22‧‧‧ pedestal

221‧‧‧ platform

23‧‧‧Limit components

24‧‧‧ gas exchange module

25‧‧‧Opening module

251‧‧‧ activity gate

2511‧‧‧Connecting components

252‧‧‧ drive mechanism

26‧‧‧Nozzles

30‧‧‧Blowing device

31‧‧‧ hollow body

31a‧‧‧Sealed end

31b‧‧‧Exhaust end

311‧‧‧Air intake

312‧‧‧ end face

313‧‧‧Auxiliary sealing structure

313s‧‧‧Ring groove

32‧‧‧ Cover

321‧‧‧ ring structure

33‧‧‧Filter plate

331‧‧‧ top surface

332‧‧‧ tooth structure

40‧‧‧Control device

50‧‧‧Auxiliary fixing components

F‧‧‧ wafer cassette

F1‧‧‧ door panel

SP‧‧‧closed space

D1‧‧‧First distance

D2‧‧‧Second distance

G1‧‧‧ colloid

G2‧‧‧ colloid

S‧‧‧fill slot

Figure 1 is a schematic diagram of the wafer carrier device of the present invention.

2 is a side elevational view of the wafer carrier device of the present invention.

3 is a side elevational view of another embodiment of the wafer carrier device of the present invention.

4 is a schematic view of the base of the wafer carrier device of the present invention.

Figure 5 is a schematic illustration of another perspective of the susceptor of the wafer carrier device of the present invention.

6 is an exploded perspective view of the air blowing device of the wafer carrying device of the present invention.

7 is a schematic cross-sectional view of the air blowing device of the wafer carrying device of the present invention.

In the following description, if reference is made to a specific drawing or as shown in the specific drawings, it is only used to emphasize that in the following description, the relevant content of the description is mostly in the specific drawing. However, it is not limited to the specific description in the following description.

Please refer to FIG. 1 and FIG. 2 together, which is a schematic diagram of the wafer carrying equipment of the present invention. The wafer carrier device 100 includes a machine body 10 and two wafer cassette carriers 20. An air blowing device 30 and a control device 40. The control device 40 is electrically connected to the wafer cassette carrying device 20 and the air blowing device 30, and the control device 40 can control the operation of the wafer cassette carrying device 20 and the air blowing device 30. The control device 40 referred to herein may be, for example, a computer device disposed in the machine body 10, or may be a computer device disposed in the wafer cassette carrier 20, or may be a central computer device disposed in the factory building. Wait. The machine body 10 can be installed in a predetermined space of the factory building. The machine body 10 can include an organic casing and a computer device, and the machine body 10 can be provided with a mechanical arm or a wafer for transportation. The relevant transport unit of the cartridge (eg conveyor track, etc.).

The machine body 10 has two mounting ports 101. The two wafer cassette carrying devices 20 are disposed on the machine body 10, and the two wafer cassette carrying devices 20 correspondingly close the two mounting ports 101. Specifically, the wafer cassette carrying device 20 may be detachably disposed on the machine body 10, and the related manufacturer may provide different styles of the wafer cassette carrying device 20 according to the mounting port 101 of the machine body 10. The number of mounting ports 101 that the machine body 10 has is corresponding to the number of the pod carrying devices 20.

As shown in FIG. 2 and FIG. 4 , each of the wafer cassette carrying devices 20 includes a frame 21 and a base 22 . The frame body 21 is fixedly disposed on the machine body 10, and the frame body 21 has a communication port 211. The base 22 is fixedly disposed on one side of the frame body 21 , and the base 22 may be a mounting port 101 corresponding to the machine body 10 . In a specific application, the base 22 can be fixedly disposed on the machine body 10 through the frame body 21, but not limited thereto; in different applications, the base 22 can be directly fixed to the machine body 10, and The frame body 21 is disposed on the base 22, and the frame body 21 is fixed to the machine base body 10 together with the base 22.

As shown in FIG. 2 and FIG. 3, the air blowing device 30 is detachably fixed to the frame body 21 or the machine body 10, and the air blowing device 30 and the base 22 are located on opposite sides of the frame body 21. The air blowing device 30 can be controlled to blow a predetermined gas in a predetermined direction to form an air flow wall on one side of the communication port 211.

In practical applications, the air blowing device 30 may be one side fixed to the frame body 21 by a plurality of auxiliary fixing members 50, or one side of the machine body 10. Auxiliary fixation group For example, the member 50 may include a plurality of screws and a plurality of fixing sheets (for example, an L-shaped metal sheet), and each of the fixing sheets may be coupled to the plurality of screws and fixed to the air blowing device 30. The other part of each of the fixed pieces may be fixed to the frame 21 or the machine body 10 by being engaged with a plurality of screws. Regarding the shape and size of each of the fixed sheets, it may be changed according to requirements, and is not limited thereto.

Specifically, in practical applications, the machine body 10, the wafer cassette carrying device 20, and the air blowing device 30 may be manufactured by different manufacturers, respectively, and the machine body 10 and the wafer cassette carrying device 20 may be It is installed in the factory in succession; when the relevant personnel are performing the installation operation of the air blowing device 30, the actual installation state between the machine body 10 and the wafer cassette carrier device 20 may be determined to determine which form of assistance is used. The fixing unit 50 fixes the air blowing device 30 to the frame body 21 or the machine body 10 .

Referring to FIG. 4 and FIG. 5 , in the actual application, the base 22 of each of the wafer cassette carrying devices 20 may have a platform 221 , and the platform 221 may be a set limit component 23 , and the base 22 is A gas exchange module 24 may be disposed, and one side of the base 22 may be provided with a door opening module 25.

The platform 221 is configured to provide a wafer cassette F, and when the wafer cassette F is disposed on the platform 221, a door panel F1 of the wafer cassette F is correspondingly facing the communication port 211. The limiting component 23 is disposed on the platform 221, and the limiting component 23 can be controlled to selectively interconnect with the wafer cassette F disposed on the platform 221 to limit the activity of the wafer cassette F.

The gas exchange module 24 is connected to a plurality of nozzles 26 disposed on the platform 221 and an external gas exchange device. When the wafer cassette F is disposed on the platform 221, and the limiting component 23 is connected to the wafer cassette F, the control device 40 may be controlled by the gas exchange module 24 to pass the wafer to the wafer through at least a portion of the nozzles 26 The inside of the cartridge F is inflated, and the gas in the wafer cassette F is taken out through the other portion of the nozzles 26, whereby the inside of the wafer cassette F is subjected to a gas exchange operation.

As shown in FIG. 2, when the control device 40 controls the operation of the gas exchange module 24, the control device 40 may simultaneously control the operation of the air blowing device 30 to cause the air blowing device 30 to operate. The air is blown in the direction of the door opening module 25, so that a gas flow cycle is formed inside the wafer cassette F, and the outer portion of the wafer cassette F has an air flow wall formed by the air blowing device 30, so that the crystal can be greatly reduced. The probability of dirt outside the round box F entering the wafer cassette F.

As shown in FIG. 2, FIG. 4 and FIG. 5, the door opening module 25 is disposed on one side of the frame body 21. The door opening module 25 includes a movable door 251 and a driving mechanism 252. The driving mechanism 252 is disposed on the frame body 21 or the base 22, and the movable door 251 is connected to the driving mechanism 252. When the driving mechanism 252 is controlled to be actuated, the movable door 251 can be moved up and down to selectively shield the frame body 21. The communication port 211. In a specific application, the movable door 251 may be disposed directly below the air blowing device 30. When the air blowing device 30 is controlled to be actuated, the air blowing device 30 may be blown in the direction of the movable door 251 to An air flow wall is formed between the air blowing device 30 and the movable door 251.

The movable door 251 may be provided with a connecting component 2511, and the connecting component 2511 can be controlled to be interconnected with the door panel F1 of the wafer cassette F disposed on the platform 221. When the connecting component 2511 and the door panel F1 of the wafer cassette F are connected to each other, the movable door 251 and the door panel F1 can be driven together by the driving mechanism 252 to move away from the communication port 211, whereby the internal space of the wafer cassette F It will be able to communicate with the outside through the communication port 211.

In practical applications, the control device 40 may control the operation of the air blowing device 30 and the gas exchange module 24 before the control driving mechanism 252 is actuated, so that the internal space of the wafer cassette F is gradually connected to the outside. The air blowing device 30 will continuously form an air flow wall on one side of the communication port 211 to greatly reduce the probability of dirt outside the wafer cassette F entering the wafer cassette F.

Please refer to FIG. 6 and FIG. 7 together for a schematic diagram of the air blowing device 30 of the wafer carrying device of the present invention. The air blowing device 30 includes a hollow body 31, a cover plate 32 and two filter plates 33. The two ports opposite to each other of the hollow body 31 are defined as a sealed end 31a and an air outlet end 31b, respectively. The cover plate 32 is fixedly disposed at the sealing end 31a of the hollow body 31, and the cover plate 32 seals the sealed end 31a of the hollow body 31. One side wall of the hollow body 31 is formed with two air inlet holes 311, and each air inlet hole 311 penetrates the hollow body The side wall of the 31 is disposed, and the air inlet 311 may be connected to the external air supply device through an associated connection assembly. The inlet holes may be formed in the cover plate 32 in different applications.

Each of the filter plates 33 includes a plurality of air holes (not shown). The two filter plates 33 are disposed in a sealed manner in the hollow body 31, and the two filter plates 33 are disposed adjacent to the air outlet end 31b. The hollow body 31, the cover plate 32 and the two filter plates 33 are formed together with a closed space SP (shown in FIG. 7) in the hollow body 31, and the external air supply device can fill the air in the closed space through the air inlet hole 311. SP. When the gas pressure in the closed space SP reaches a predetermined pressure, the gas in the closed space SP can pass through the plurality of pores of the two filter plates 33, and is uniformly discharged from the gas outlet end 31b.

As shown in FIG. 7, in a specific application, the distance between each air inlet hole 311 and the end surface 312 of the hollow body 31 at the air outlet end 31b in a longitudinal direction is defined as a first distance D1; filtering adjacent to the cover plate 32 The closest distance between the top surface 331 of the plate 33 and the end surface 312 of the air outlet end 31b in the longitudinal direction is defined as a second distance D2; the first distance D1 is greater than the second distance D2.

In a particular application, the periphery of each filter plate 33 may be formed with a plurality of toothed structures 332. When each of the filter plates 33 is disposed in the hollow body 31, a plurality of filling grooves S can be formed correspondingly between the plurality of toothed structures 332 and the inner wall of the hollow body 31. Each of the filling grooves S can be used to fill the colloid G1 to improve the connection strength between the filter plate 33 and the hollow body 31 through the colloid G1.

In an actual implementation, the hollow body 31 may have an auxiliary sealing structure 313 extending inwardly from the inner wall of the sealing end 31a. The auxiliary sealing structure 313 may be concave from one side of the sealing end 31a to the outlet end 31b. An annular groove 313s is formed; oppositely, a wide side surface of the cover plate 32 may have an annular structure 321 protruding therefrom. In the process of fixing the cover 32 to the sealing end 31a of the hollow body 31, the colloid G2 may be filled in the annular groove 313s, and then the annular structure 321 of the cover 32 may be correspondingly disposed in the annular concave. In the groove 313s, the connection strength between the cover plate 32 and the hollow body 31 can be greatly improved by the provision of the colloidal G2. another In addition, in order to ensure the degree of sealing between the hollow bodies 31 of the cover plate 32, in addition to the use of the above-mentioned colloid to interconnect the cover plate 32 and the hollow body 31, the cover plate 32 may be locked to the hollow body 31 by using a plurality of screws. Sealed end 31a.

The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

Claims (10)

A wafer carrying device comprising: a machine body comprising at least one mounting port; at least one wafer cassette carrying device fixedly disposed on the machine body, the wafer cassette carrying device comprising: a frame The body is fixedly disposed on the machine body, the frame body includes a communication port; a base is fixedly disposed on one side of the frame body, and at least a portion of the base body is exposed The mounting port includes a platform, the platform is configured to provide a wafer cassette setting; when the wafer cassette is disposed on the platform, a door panel of the wafer cassette can face the surface a communication opening; a door opening module fixedly disposed on the side opposite to the frame, wherein the door opening module can be controlled to be disposed on the platform The door panel is away from the communication port; an air blowing device is detachably fixedly disposed on the frame body or the machine body, and the air blowing device and the base are located in the frame The opposite sides of the body; the air blowing device can be controlled to blow out the predetermined direction a gas is formed on one side of the communication port to form an air flow wall; a control device electrically connected to the wafer cassette carrying device, wherein the control device can control the door opening module to enable the door opening mode The group is configured to carry a door panel of the wafer cassette disposed on the platform away from the communication port; the control device is electrically connected to the air blowing device, and the control device can control the operation of the air blowing device to The airflow wall is formed on one side of the communication port. The wafer carrying device of claim 1, wherein the air blowing device is connected to an external air supply device, the air blowing device comprises: a hollow body, wherein the opposite ports are respectively defined as a sealed end and An outlet; a cover plate fixedly disposed at the sealing end of the hollow body, wherein the cover plate seals the sealed end of the hollow body; and at least one air inlet hole formed in the hollow body a side wall or the cover plate, the air inlet hole is disposed through the side wall or the cover plate, the air inlet hole is connected to the external air supply device; at least two filter plates, each of the The filter plate includes a plurality of air holes, and the two filter plates are disposed in a sealed manner in the hollow body, and the two filter plates are disposed adjacent to the air outlet end; wherein the hollow body and the The cover plate and the two filter plates jointly form a closed space in the hollow body, and the external air supply device can fill the closed space through the air inlet hole; when the closed When the gas pressure in the space reaches a predetermined pressure, the gas in the closed space can pass through the plurality of the pores of the two filter plates, and is uniformly discharged from the gas outlet end. The wafer carrier device of claim 2, wherein the wafer carrier device further comprises an auxiliary fixing component for fixing the air blowing device to the frame body or the machine Platform body. The wafer carrying device of claim 2, wherein the air inlet hole is formed in at least one side wall of the hollow body, and the air inlet hole is in a longitudinal direction and an end surface of the hollow body at the air outlet end The closest distance is defined as a first distance; a closest distance between a top surface of the filter plate adjacent to the cover plate and an end surface of the air outlet end in the longitudinal direction is defined as a second distance; wherein A distance is greater than the second distance. The wafer carrying device of claim 2, wherein a periphery of each of the filter plates has a plurality of tooth-like structures; and when each of the filter plates is disposed in the hollow body, a plurality of the tooth structures are Forming between inner walls of the hollow body There are a plurality of filling grooves, each of which fills the colloid, and the colloid filled in each of the filling grooves enables the filter plate and the hollow body to be fixed to each other. The wafer carrying device according to claim 2, wherein the hollow body extends inwardly from the inner wall of the sealing end to form an auxiliary sealing structure, and the auxiliary sealing structure is provided by one side of the sealing end An annular groove is formed in the direction of the air end; a wide side surface of the cover plate protrudes from an annular structure, and the cover plate is fixedly disposed at the sealed end of the hollow body, the ring shape The structure corresponds to being located in the annular groove. The wafer carrying device of claim 1, wherein the door opening module comprises a driving mechanism and a movable door, the driving mechanism is disposed on the machine body, and the movable door is coupled to the driving mechanism Connected, the control device can control the driving mechanism to act such that the movable door shields the communication port or does not shield the communication port. The wafer carrying device of claim 7, wherein the movable door is provided with a connecting component that can be controlled to be interconnected with a door panel of the wafer cassette disposed on the platform; When the connecting component is connected to the door panel of the wafer cassette, the movable door and the cover panel can be driven together by the driving mechanism to move away from the communication opening. The wafer carrying device of claim 1, wherein the platform is provided with a limiting component, and the limiting component is controllably and selectively interconnected with the wafer cassette disposed on the platform. To limit the activity of the wafer cassette. The wafer carrying device of claim 1, wherein the wafer cassette carrying device further comprises a gas exchange module, the platform is provided with a plurality of nozzles, and the plurality of the nozzles and the gas exchange module Connecting the gas exchange module to charge the interior of the wafer cassette through at least a portion of the nozzles And the gas exchange module can extract the gas in the wafer cassette through another portion of the nozzle.