TWM569990U - Heating device - Google Patents
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- TWM569990U TWM569990U TW107210766U TW107210766U TWM569990U TW M569990 U TWM569990 U TW M569990U TW 107210766 U TW107210766 U TW 107210766U TW 107210766 U TW107210766 U TW 107210766U TW M569990 U TWM569990 U TW M569990U
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 144
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
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Abstract
本案關於一種加熱裝置,包括第一板體、第二板體、加熱器件組、墊片組、溫度感測器件組、樞接組件以及彈性組件。加熱器件組設置於第一板體及第二板體相對的外側面。墊片組相對加熱器件組,設置於第一板體及第二板體相對的內裡面。溫度感測器件組設置墊片組上且外露於墊片組。樞接組件設置於第一板體與第二板體之間,組配第一板體與第二板體相對轉動。彈性組件連接於第一板體與第二板體之間,且於第一板體與第二板體彼此相對轉動時,驅使第一墊片與第二墊片彼此趨向,俾以夾固一物件,並以加熱器件組進行加熱,以及溫度感器件組量測溫度。The present invention relates to a heating device including a first plate body, a second plate body, a heating device group, a gasket group, a temperature sensing device group, a pivoting assembly, and an elastic component. The heating device group is disposed on opposite outer sides of the first plate body and the second plate body. The spacer group is disposed on the inner side of the first plate body and the second plate body opposite to the heating device group. The temperature sensing device set is placed on the shim pack and exposed to the shim group. The pivoting assembly is disposed between the first plate body and the second plate body, and the first plate body and the second plate body are assembled to rotate relative to each other. The elastic component is connected between the first plate body and the second plate body, and when the first plate body and the second plate body rotate relative to each other, the first gasket and the second gasket are driven toward each other to clamp one The object is heated by the heating device set, and the temperature sensing device group measures the temperature.
Description
本案為關於一種加熱裝置,尤指一種可固定加熱物件且量測溫度之加熱裝置。The present invention relates to a heating device, and more particularly to a heating device capable of fixing a heating object and measuring the temperature.
隨著科技的進步,電子裝置的精密度及可靠度需求也不斷提昇。為確保成品的精密度及可靠度,許多例如集成的電子組件、封裝後積體電路元件或記憶體模組等的在出貨前,必須進行燒機(Burn-in)測試,以瞭解電子元件在高溫運作時的穩定度。而於燒機測試時,待測的產品必須放置於預設的高溫中進行電性測試,藉以於出貨前先篩選出早夭失效的產品,進而確保產品出貨的品質。With the advancement of technology, the precision and reliability requirements of electronic devices are also increasing. In order to ensure the precision and reliability of the finished product, many integrated electronic components, packaged integrated circuit components or memory modules must be burned before the shipment to understand the electronic components. Stability at high temperatures. In the burning machine test, the product to be tested must be placed in a preset high temperature for electrical testing, so as to screen out the products that fail early, so as to ensure the quality of the products shipped.
傳統的燒機測試方法係將常溫下已測試完成的電子元件,連同測試用的機板一起送入烘箱中。隨後設定烘箱的溫度,使電子元件、主機和中央處理器在不同的預定溫度下進行燒機測試。然而在實際應用時,由於電子元件與測試用主機板及中央處理器是共同置於烘箱中加熱至測試的高溫,因此主機板及中央處理器的使用壽命,勢必因長期使用而衰減,更可能因反復常溫高溫變化操作而發生異常,甚至損壞。再者,一旦主機板及中央處理器在燒機測試的過程中發生異常,更會造成電子元件燒機測試結果誤差。The traditional burning machine test method is to send the electronic components that have been tested at normal temperature to the oven together with the test board. The oven temperature is then set so that the electronic component, the host, and the central processor perform the burn-in test at different predetermined temperatures. However, in practical applications, since the electronic components and the test motherboard and the central processing unit are placed together in an oven to heat up to the test, the service life of the motherboard and the central processing unit is inevitably attenuated due to long-term use, and more likely Abnormalities or even damage due to repeated normal temperature and high temperature changes. Furthermore, once the motherboard and the central processor are abnormal during the burn-in test, the electronic component burn test result error will be caused.
因此,如何發展一種可固定加熱物件且量測溫度之加熱裝置來解決現有技術所面臨的問題,實為本領域亟待解決的課題。Therefore, how to develop a heating device capable of fixing a heating object and measuring the temperature to solve the problems faced by the prior art is an urgent problem to be solved in the art.
本案的目的在於提供一種加熱裝置。藉由可拆卸式的樞接組件使二板體可穩定地相對轉動,且利用彈性組件提供彈性力,驅使二板體上之加熱器件組及溫度感測器件組緊密地貼近燒機測試的物件,同時達成固定的功效。由於加熱區域集中,於燒機測試時,透過二板體上之墊片組夾固定加熱物件,除了可避免影響其他測試用構件及延長使用壽命外,更利於快速控制溫度並獲致準確的燒機測試結果。此外,由於加熱器件組與溫度感測器件組對應設置,且溫度感測器件組更設置於墊片組上且外露,可與待測物件直接接觸,更利於精確且快速地反應溫度結果,提昇燒機測試的準確度。The purpose of the present invention is to provide a heating device. The two plates are stably rotated relative to each other by the detachable pivoting assembly, and the elastic component is used to provide elastic force to drive the heating device group and the temperature sensing device group on the second plate body to be closely close to the burning test object. At the same time, achieve a fixed effect. Due to the concentrated heating zone, the heating object is fixed through the gasket set on the two plates during the burning test. In addition to avoiding the influence of other test components and prolonging the service life, it is more convenient to quickly control the temperature and obtain an accurate burning machine. Test Results. In addition, since the heating device group is correspondingly arranged with the temperature sensing device group, and the temperature sensing device group is further disposed on the spacer group and exposed, it can directly contact the object to be tested, which is more convenient for accurately and quickly reflecting the temperature result and improving The accuracy of the burn-in test.
本案的另一目的在於提供一種加熱裝置。其結構精巧、組裝簡便且調變靈活。各構成組件間採可拆卸式集合,可視燒機測試需求而更換部份組件,亦可進行部份組件的維修或替換。有效整合加熱器件組與溫度感測器件組、簡化整體結構、降低成本、且提昇加熱裝置之競爭力。Another object of the present invention is to provide a heating device. Its compact structure, easy assembly and flexible modulation. A detachable assembly is adopted between the components, and some components can be replaced according to the requirements of the burning machine test, and some components can be repaired or replaced. Effectively integrate the heating device group and the temperature sensing device group, simplify the overall structure, reduce the cost, and enhance the competitiveness of the heating device.
為達到前述目的,本案提供一種加熱裝置。其結構包括第一板體、第二板體、加熱器件組、墊片組、溫度感測器件組、一樞接組件以及至少一彈性組件。第一板體具有一第一面與一第二面,第一面與第二面彼此相對。第二板體具有一第三面與一第四面,第三面與第四面彼此相對,且第一板體的第二面面向第二板體的第三面。加熱器件組包括一第一加熱器件及一第二加熱器件,分別設置於第一板體的第一面及第二板體的第四面。墊片組包括一第一墊片與一第二墊片,其中第一墊片相對第一加熱器件且設置於第一板體的第二面,第二墊片相對於第二加熱器件且設置於第二板體的第三面,且第一墊片面向第二墊片。溫度感測器件組包括一第一溫度感測器件以及一第二溫度感測器件,其中第一溫度感測器件相對第一加熱器件設置於第一墊片之上且外露於第一墊片,第二溫度感測器件相對於第二加熱器件且設置於第二墊片之上且外露於第二墊片。樞接組件設置於第一板體的第二面與第二板體的第三面之間,且組配第一板體與第二板體彼此相對轉動。至少一彈性組件連接於第一板體的第二面與第二板體的第三面之間,且於第一板體與第二板體彼此相對轉動時,驅使第一墊片與第二墊片彼此趨向,俾以夾固一物件於第一墊片與第二墊片之間,且於第一墊片與第二墊片夾固物件時,溫度感測器件組之第一溫度感測器件與第二溫度感測器件分別與物件接觸。To achieve the foregoing objects, the present invention provides a heating device. The structure comprises a first plate body, a second plate body, a heating device group, a gasket group, a temperature sensing device group, a pivoting assembly and at least one elastic component. The first plate has a first surface and a second surface, and the first surface and the second surface are opposite to each other. The second plate body has a third surface and a fourth surface, the third surface and the fourth surface are opposite to each other, and the second surface of the first plate body faces the third surface of the second plate body. The heating device group includes a first heating device and a second heating device, which are respectively disposed on the first surface of the first plate body and the fourth surface of the second plate body. The gasket set includes a first gasket and a second gasket, wherein the first gasket is opposite to the first heating device and disposed on the second surface of the first plate body, and the second gasket is disposed opposite to the second heating device On the third side of the second plate body, and the first gasket faces the second gasket. The temperature sensing device group includes a first temperature sensing device and a second temperature sensing device, wherein the first temperature sensing device is disposed on the first spacer and exposed to the first spacer relative to the first heating device, The second temperature sensing device is disposed above the second spacer and exposed to the second spacer relative to the second heating device. The pivoting assembly is disposed between the second surface of the first plate body and the third surface of the second plate body, and the first plate body and the second plate body are assembled to rotate relative to each other. The at least one elastic component is connected between the second surface of the first plate body and the third surface of the second plate body, and drives the first gasket and the second body when the first plate body and the second plate body rotate relative to each other The gaskets are inclined toward each other to clamp an object between the first gasket and the second gasket, and when the first gasket and the second gasket clamp the object, the first temperature sense of the temperature sensing device group The measuring device and the second temperature sensing device are respectively in contact with the object.
於一實施例中,樞接組件包括至少一第一樞接部、至少一第二樞接部以及至少一轉軸,第一樞接部與第二樞接部分別樞接於轉軸上,第一樞接部連接第一板體,第二樞接部連接第二板體,俾以組配第一板體與第二板體彼此相對轉動。In one embodiment, the pivoting assembly includes at least one first pivoting portion, at least one second pivoting portion, and at least one rotating shaft. The first pivoting portion and the second pivoting portion are respectively pivotally connected to the rotating shaft, and the first The pivoting portion is connected to the first plate body, and the second pivoting portion is connected to the second plate body, and the first plate body and the second plate body are arranged to rotate relative to each other.
於一實施例中,第一樞接部具有一第一樞接孔,第二樞接部具有一第二樞接孔,轉軸穿過第一樞接孔與第二樞接孔,使第一樞接部與第二樞接部分別可拆卸地樞接於轉軸上。In one embodiment, the first pivoting portion has a first pivoting hole, and the second pivoting portion has a second pivoting hole, and the rotating shaft passes through the first pivoting hole and the second pivoting hole to make the first The pivoting portion and the second pivoting portion are respectively detachably pivotally connected to the rotating shaft.
於一實施例中,加熱裝置更包括一鎖固組件,具有至少一第一鎖固件以及至少一第二鎖固件,其中第一板體具有至少一第一穿孔,第一樞接部具有至少一第一固定孔,第一鎖固件穿過第一板體的第一穿孔與第一樞接部的第一固定孔嚙合,俾使第一樞接部可拆卸地鎖固於第一板體的第二面上,其中第二板體具有至少一第二穿孔,第二樞接部具有至少一第二固定孔,第二鎖固件穿過第二板體的第二穿孔與第二樞接部的第二固定孔嚙合,俾使第二樞接部可拆卸地鎖固於第二板體的第三面上。In one embodiment, the heating device further includes a locking assembly having at least one first locking member and at least one second locking member, wherein the first plate body has at least one first through hole, and the first pivoting portion has at least one a first fixing hole, the first locking member is engaged with the first fixing hole of the first pivoting portion through the first through hole of the first plate body, so that the first pivoting portion is detachably locked to the first plate body a second surface, wherein the second plate body has at least one second through hole, the second pivoting portion has at least one second fixing hole, and the second locking member passes through the second through hole of the second plate body and the second pivoting portion The second fixing hole is engaged, so that the second pivoting portion is detachably locked to the third surface of the second plate body.
於一實施例中,第一樞接部係與第一板體一體成型,第二樞接部係與第二板體一體成型。In one embodiment, the first pivoting portion is integrally formed with the first plate body, and the second pivoting portion is integrally formed with the second plate body.
於一實施例中,第一板體包括至少一第一限位部,第二板體包括至少一第二限位部,彈性組件包括至少一彈簧,其中彈簧之兩端分別連接第一限位部以與第二限位部。In one embodiment, the first plate body includes at least one first limiting portion, the second plate body includes at least one second limiting portion, and the elastic component includes at least one spring, wherein the two ends of the spring are respectively connected to the first limiting position The Ministry and the second limit.
如於一實施例中,第一限位部與第二限位元部分別為一凹槽,彈簧為一壓縮彈簧。In an embodiment, the first limiting portion and the second limiting portion are respectively a groove, and the spring is a compression spring.
於一實施例中,第一板體包括一第一按壓部,第二板體包括一第二按壓部,其中第一按壓部相對於第二按壓部,於第一按壓部與第二按壓部受按壓而彼此趨向,且第一板體與第二板體彼此相對轉動時,驅使第一墊片與第二墊片彼此分離。In one embodiment, the first plate body includes a first pressing portion, and the second plate body includes a second pressing portion, wherein the first pressing portion is opposite to the second pressing portion, and the first pressing portion and the second pressing portion are When pressed against each other and the first plate and the second plate rotate relative to each other, the first gasket and the second gasket are driven apart from each other.
於一實施例中,加熱裝置更包括一控制器以及一連接線路組,其中加熱器件組的第一加熱器件與第二加熱器件以及溫度感測器件組的第一溫度感測器件與第二溫度感測器件分別透過連接線路組電連接至控制器。In one embodiment, the heating device further includes a controller and a connection line group, wherein the first heating device and the second heating device of the heating device group and the first temperature sensing device and the second temperature of the temperature sensing device group The sensing devices are electrically connected to the controller through the connection line group, respectively.
於一實施例中,控制器包括至少一連接座,連接線路組包括一連接頭,連接頭可拆卸地插置於連接座,俾使加熱器件組與溫度感測器件組電連接至控制器。In one embodiment, the controller includes at least one connector, the connection line set includes a connector, and the connector is detachably inserted into the connector to electrically connect the heating device group and the temperature sensing device group to the controller.
於一實施例中,控制器包括一顯示單元,於控制器電連接加熱器件組時,分別顯示第一加熱器件與第二加熱器件之一設定加熱溫度。In one embodiment, the controller includes a display unit that displays one of the first heating device and the second heating device to set the heating temperature when the controller electrically connects the heating device group.
於一實施例中,控制器包括一顯示單元,於控制器電連接溫度感測器件組時,分別顯示第一溫度感測器件與第二溫度感測器件之一量測溫度。In one embodiment, the controller includes a display unit that displays the measured temperature of one of the first temperature sensing device and the second temperature sensing device when the controller is electrically connected to the temperature sensing device group.
於一實施例中,第一板體與第二板體係選自一由一金屬板、一導熱陶瓷片及其組合所構成的群組之一。In one embodiment, the first plate and the second plate system are selected from the group consisting of a metal plate, a thermally conductive ceramic plate, and combinations thereof.
於一實施例中,金屬板係選自一由一鋁、銅、鋁合金、銅合金及其組合所構成的群組之一。In one embodiment, the metal sheet is selected from the group consisting of aluminum, copper, aluminum alloys, copper alloys, and combinations thereof.
於一實施例中,第一墊片與第二墊片係導自一由一導熱膠體、一導熱墊片、一導熱膏體及其組合所構成的群組之一。In one embodiment, the first spacer and the second spacer are guided by one of a group consisting of a thermal paste, a thermal pad, a thermal paste, and combinations thereof.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖式在本質上為當作說明之用,而非用於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various embodiments, and is not intended to limit the scope of the invention.
首先,請參考第1圖至第8圖。第1圖係揭示本案第一較佳實施例之加熱裝置之立體結構圖。第2圖係揭示本案第一較佳實施例之加熱裝置於另一視角之立體結構圖。第3圖係揭示本案第一較佳實施例之加熱裝置之組裝完成結構圖。第4圖係揭示本案第一較佳實施例之加熱裝置之局部結構分解圖。第5圖係揭示本案第一較佳實施例之加熱裝置於另一視角之局部結構分解圖。第6圖係揭示第4圖之加熱裝置之局部組裝結構圖。第7圖係第6圖之側視圖。第8圖係揭示本案第一較佳實施之加熱裝置於使用狀態之局部結構側視圖。如圖所示,於本實施例中,加熱裝置1包括一第一板體10、一第二板體20、一加熱器件組30、一墊片組40、一溫度感測器件組50、一樞接組件60以及至少一彈性組件70。其中第一板體10具有一第一面11與一第二面12,第一面11與第二面12彼此相對。第二板體20具有一第三面21與一第四面22,第三面21與第四面22彼此相對,且第一板體10的第二面12面向第二板體20的第三面21。於本實施例中,第一板體10與第二板體20可例如是一金屬板、一導熱陶瓷片或其他由熱良導體或高熱導係數之材料所構成的板體結構。於一實施例中,金屬板更可例如是由鋁、銅、鋁合金、銅合金或其他導熱金屬或合金所構成,本案並不以此為限。First, please refer to Figures 1 to 8. Fig. 1 is a perspective view showing the heating device of the first preferred embodiment of the present invention. Figure 2 is a perspective view showing the heating device of the first preferred embodiment of the present invention in another perspective. Fig. 3 is a view showing the assembled structure of the heating device of the first preferred embodiment of the present invention. Fig. 4 is a partially exploded perspective view showing the heating apparatus of the first preferred embodiment of the present invention. Figure 5 is a partial exploded view showing the heating device of the first preferred embodiment of the present invention in another viewing angle. Fig. 6 is a partially assembled structural view showing the heating device of Fig. 4. Figure 7 is a side view of Figure 6. Figure 8 is a side elevational view showing the partial structure of the heating device of the first preferred embodiment of the present invention in use. As shown in the figure, in the embodiment, the heating device 1 includes a first plate body 10, a second plate body 20, a heating device group 30, a gasket group 40, a temperature sensing device group 50, and a temperature sensing device group 50. The pivot assembly 60 and the at least one elastic assembly 70. The first plate body 10 has a first surface 11 and a second surface 12, and the first surface 11 and the second surface 12 are opposite to each other. The second plate body 20 has a third surface 21 and a fourth surface 22 opposite to each other, and the second surface 12 of the first plate body 10 faces the third surface of the second plate body 20 Face 21. In this embodiment, the first plate body 10 and the second plate body 20 may be, for example, a metal plate, a heat conductive ceramic sheet or other plate body structure composed of a heat conductor or a material having high thermal conductivity. In one embodiment, the metal plate may be made of, for example, aluminum, copper, aluminum alloy, copper alloy or other heat conductive metal or alloy, and the present invention is not limited thereto.
於本實施例中,加熱器件組30包括一第一加熱器件31及一第二加熱器件32。第一加熱器件31可透過例如是一導熱黏膠而貼合設置於第一板體10的第一面11。第二加熱器件32亦可透過例如是一導熱黏膠而貼合設置於第二板體20的第四面22。換言之,第一加熱器件31與第二加熱器件32分別設置於第一板體10與第二板體20相對的外側面。於一實施例中,第一板體10上的第一加熱器件31與第二板體20上的第二加熱器件32更呈對稱設置,但本案並不以此為限。In the present embodiment, the heating device group 30 includes a first heating device 31 and a second heating device 32. The first heating device 31 can be attached to the first surface 11 of the first plate body 10 through, for example, a thermal conductive adhesive. The second heating device 32 can also be disposed on the fourth surface 22 of the second plate body 20 through, for example, a thermal conductive adhesive. In other words, the first heating device 31 and the second heating device 32 are respectively disposed on opposite outer sides of the first plate body 10 and the second plate body 20. In an embodiment, the first heating device 31 on the first board 10 and the second heating device 32 on the second board 20 are more symmetrically disposed, but the present invention is not limited thereto.
另外,於本實施例中,墊片組40包括一第一墊片41與一第二墊片42。其中第一墊片41相對第一加熱器件31且設置於第一板體10的第二面12,第二墊片42相對於第二加熱器件32且設置於第二板體20的第三面21,且第一墊片41面向第二墊片42。換言之,墊片組40的第一墊片41與第二墊片42分別相對加熱器件組30的第一加熱器件31與第二加熱器件32,且分別設置於第一板體10與第二板體20相對的內裡面。於一實施例中,第一板體10上的第一墊片41與第二板體20上的第二墊片42更呈對稱設置,但本案並不以此為限。於本實施例中,墊片組40的第一墊片41與第二墊片42可例如是由一導熱膠體、一導熱墊片、一導熱膏體或其他導熱材料構成之軟質墊片結構,透過例如是一導熱黏膠而分別貼合至第一板體10的第二面12與第二板體20的第三面21,然本案並不以此為限。In addition, in the embodiment, the spacer group 40 includes a first spacer 41 and a second spacer 42. The first spacer 41 is disposed on the second surface 12 of the first board 10 opposite to the first heating device 31, and the second spacer 42 is disposed on the third surface of the second board 20 with respect to the second heating device 32. 21, and the first spacer 41 faces the second spacer 42. In other words, the first spacer 41 and the second spacer 42 of the spacer group 40 are respectively opposite to the first heating device 31 and the second heating device 32 of the heating device group 30, and are respectively disposed on the first board 10 and the second board. The inner side of the body 20 is opposite. In one embodiment, the first spacer 41 on the first board 10 and the second spacer 42 on the second board 20 are more symmetrically disposed, but the present invention is not limited thereto. In this embodiment, the first gasket 41 and the second gasket 42 of the gasket group 40 can be, for example, a soft gasket structure composed of a thermal conductive paste, a thermal conductive gasket, a thermal conductive paste or other heat conductive material. The second surface 12 of the first plate body 10 and the third surface 21 of the second plate body 20 are respectively attached to the third surface 21 of the first plate body 10, for example, by a heat-conductive adhesive.
另一方面,於本實施例中,溫度感測器件組50包括一第一溫度感測器件51以及一第二溫度感測器件52,其中第一溫度感測器件51相對第一加熱器件31設置於第一墊片41之上,且外露於第一墊片41,第二溫度感測器件52相對於第二加熱器件32且設置於第二墊片42之上,且外露於第二墊片42。於本實施例中,第一溫度感測器件51可於第一墊片41透過例如是一導熱黏膠而貼合至第一板體10的第二面12時,一併嵌設第一墊片41之上,且外露於第一墊片41。同樣地,第二溫度感測器件52可於第二墊片42透過例如是一導熱黏膠而貼合至第二板體20的第三面21時,一併嵌設於第二墊片42之上,且外露於第二墊片42。當然,本案並不受限於此。於其他實施例中,第一溫度感測器件51與第二溫度感測器件52更分別部份嵌設於第一墊片41與第二墊片42,且部份外露。應強調的是,於第一墊片41與第二墊片42分別趨向物件9時,溫度感測器件組50的第一溫度感測器件51以及一第二溫度感測器件52更直接與物件9接觸,以更精確的反應物件9的實際溫度。當然,本案並不受限於溫度感測器件的數量及型式,於此便不再贅述。On the other hand, in the present embodiment, the temperature sensing device group 50 includes a first temperature sensing device 51 and a second temperature sensing device 52, wherein the first temperature sensing device 51 is disposed relative to the first heating device 31. Above the first spacer 41 and exposed to the first spacer 41, the second temperature sensing device 52 is disposed on the second spacer 42 opposite to the second heating device 32 and exposed to the second spacer 42. In this embodiment, the first temperature sensing device 51 can be embedded with the first pad when the first pad 41 is attached to the second surface 12 of the first board 10 through, for example, a thermal conductive adhesive. Above the sheet 41, and exposed to the first spacer 41. Similarly, the second temperature sensing device 52 can be embedded in the second spacer 42 when the second spacer 42 is attached to the third surface 21 of the second board 20 through, for example, a thermal conductive adhesive. Above and exposed to the second spacer 42. Of course, this case is not limited to this. In other embodiments, the first temperature sensing device 51 and the second temperature sensing device 52 are partially embedded in the first spacer 41 and the second spacer 42 respectively, and are partially exposed. It should be emphasized that when the first spacer 41 and the second spacer 42 respectively point toward the object 9, the first temperature sensing device 51 and the second temperature sensing device 52 of the temperature sensing device group 50 are more directly related to the object. 9 contact to more accurately reflect the actual temperature of the object 9. Of course, the present case is not limited to the number and type of temperature sensing devices, and will not be described herein.
於本實施例中,樞接組件60係可拆卸地設置於第一板體10的第二面12與第二板體20的第三面21之間,且組配第一板體10與第二板體20彼此相對轉動。樞接組件60可例如包括至少一第一樞接部61、至少一第二樞接部62以及至少一轉軸63,其中第一樞接部61與第二樞接部62分別樞接於轉軸63上,第一樞接部61連接第一板體10,第二樞接部62連接第二板體20,俾以組配第一板體10與第二板體20彼此相對轉動。於本實施例中,第一樞接部61具有一第一樞接孔61a,第二樞接部62具有一第二樞接孔62a,轉軸63穿過第一樞接孔61a與第二樞接孔62a,使第一樞接部61與第二樞接部62分別可拆卸地樞接於轉軸63上。此外,於本實施例中,為使樞接組件60可拆卸地設置於第一板體10的第二面12與第二板體20的第三面21之間,加熱裝置1更包括一鎖固組件80,具有至少一第一鎖固件81以及至少一第二鎖固件82。另外,第一板體10具有至少一第一穿孔13,第一樞接部61具有至少一第一固定孔61b,第一鎖固件81穿過第一板體10的第一穿孔13與第一樞接部61的第一固定孔61b嚙合,俾使第一樞接部61可拆卸地鎖固於第一板體10的第二面12上。同樣地,第二板體20具有至少一第二穿孔23,第二樞接部62具有至少一第二固定孔62b,第二鎖固件82穿過第二板體20的第二穿孔23與第二樞接部62的第二固定孔62b嚙合,俾使第二樞接部62可拆卸地鎖固於第二板體20的第三面21上。於一實施例中,鎖固組件80的第一鎖固件81與第二鎖固件82更可例如是一螺絲,第一固定孔61b與第二固定孔62b則為一相對的螺孔,但本案並不以此為限。值得注意的是,由於樞接組件60之第一樞接部61、第二樞接部62以及轉軸63採可拆卸式組裝結合,且第一板體10、樞接組件60與第二板體20亦採可拆卸式組裝結合,除了使加熱裝置1的組裝方式更加簡便外,各構成組件間可拆卸式的集合更具調變性,可視燒機測試需求而更換部份組件,亦可進行部份組件的維修或替換。有效整合加熱器件組與溫度感測器件組、簡化整體結構、降低成本、且提昇加熱裝置1之競爭力。In this embodiment, the pivoting assembly 60 is detachably disposed between the second surface 12 of the first board 10 and the third surface 21 of the second board 20, and the first board 10 and the first board are assembled. The two plates 20 are rotated relative to each other. The pivoting assembly 60 can include, for example, at least a first pivoting portion 61, at least one second pivoting portion 62, and at least one rotating shaft 63. The first pivoting portion 61 and the second pivoting portion 62 are respectively pivotally connected to the rotating shaft 63. The first pivoting portion 61 is connected to the first plate body 10, and the second pivoting portion 62 is connected to the second plate body 20, and the first plate body 10 and the second plate body 20 are arranged to rotate relative to each other. In the embodiment, the first pivoting portion 61 has a first pivoting hole 61a, and the second pivoting portion 62 has a second pivoting hole 62a. The rotating shaft 63 passes through the first pivoting hole 61a and the second pivoting hole. The first hole connecting portion 61 and the second pivoting portion 62 are detachably pivotally connected to the rotating shaft 63. In addition, in the embodiment, in order to detachably connect the pivoting assembly 60 between the second surface 12 of the first plate body 10 and the third surface 21 of the second plate body 20, the heating device 1 further includes a lock. The solid component 80 has at least one first fastener 81 and at least one second fastener 82. In addition, the first plate body 10 has at least one first through hole 13 . The first pivoting portion 61 has at least one first fixing hole 61 b. The first locking piece 81 passes through the first through hole 13 of the first plate body 10 and the first hole. The first fixing hole 61b of the pivoting portion 61 is engaged, so that the first pivoting portion 61 is detachably locked to the second surface 12 of the first plate body 10. Similarly, the second plate body 20 has at least one second through hole 23, the second pivoting portion 62 has at least one second fixing hole 62b, and the second locking member 82 passes through the second through hole 23 of the second plate body 20. The second fixing hole 62b of the two pivoting portions 62 is engaged, so that the second pivoting portion 62 is detachably locked to the third surface 21 of the second plate body 20. In one embodiment, the first locking member 81 and the second locking member 82 of the locking assembly 80 can be, for example, a screw, and the first fixing hole 61b and the second fixing hole 62b are opposite screw holes, but the present case Not limited to this. It is noted that the first pivoting portion 61, the second pivoting portion 62, and the rotating shaft 63 of the pivoting assembly 60 are detachably assembled, and the first board 10, the pivoting assembly 60, and the second board are assembled. 20 also adopts detachable assembly and combination. In addition to making the assembly method of the heating device 1 more convenient, the detachable collection between the components is more variability, and some components can be replaced according to the requirements of the burning machine test. Repair or replacement of components. The heat device group and the temperature sensing device group are effectively integrated, the overall structure is simplified, the cost is reduced, and the competitiveness of the heating device 1 is improved.
於本實施例中,彈性組件70更提供一彈性力,驅使樞接組件60連接的第一板體10與第二板體20朝一特定方向轉動,俾使第一板體10與第二板體20上之加熱器件組30、墊片組40與溫度感測器件組50趨向物件9以進行例如燒機測試,同時達成固定物件9的功效。其中物件9可例如是集成的電子組件、封裝後積體電路元件或記憶體模組等,本案並不以此為限。於本實施例中,至少一彈性組件70連接於第一板體10的第二面12與第二板體20的第三面21之間,且於第一板體10與第二板體20彼此相對轉動時,驅使第一墊片41與第二墊片42彼此趨向,俾以夾固物件9於第一墊片41與第二墊片42之間,且溫度感測器件組50的第一溫度感測器件51以及第二溫度感測器件52更直接貼合物件9的兩側而與其接觸,以精確的反應物件9的實際溫度。於本實施例中,彈性組件70可例如是一壓縮彈簧71,第一板體10包括至少一例如是凹槽的第一限位部14,第二板體20包括至少一例如是凹槽的第二限位部24,其中壓縮彈簧71之兩端分別容置於第一限位部14與第二限位部24,達成第一板體10、彈性組件70與第二板體20之連接,並提供一彈性力,驅使第一板體10與第二板體20上之加熱器件組30、墊片組40與溫度感測器件組50於例如燒機測試時可趨向夾固物件9。應強調的是,樞接組件60組配彈性組件70可為之轉動角度、數量、配置位置等均可視實際應用需求而調變。此外,彈性組件70連接第一板體10與第二板體20之型式亦可視實際應用需求而調變。例如於其他實施例中,彈性組件70更例如是一扭力彈簧,第一限位部14與第二限位部24則不限定為一固定凸塊或凹槽。換言之,本案可固定加熱物件且量測溫度之加熱裝置1可為之變化並不受限於前述例示。In this embodiment, the elastic component 70 further provides an elastic force to drive the first plate body 10 and the second plate body 20 connected to the pivoting assembly 60 to rotate in a specific direction, so that the first plate body 10 and the second plate body are rotated. The heating device group 30, the spacer group 40 and the temperature sensing device group 50 on the 20 are directed to the article 9 for performing, for example, a burn-in test, while achieving the effect of fixing the article 9. The object 9 can be, for example, an integrated electronic component, a packaged integrated circuit component or a memory module, etc., and the present invention is not limited thereto. In the present embodiment, at least one elastic component 70 is connected between the second surface 12 of the first plate body 10 and the third surface 21 of the second plate body 20, and is between the first plate body 10 and the second plate body 20. When rotating relative to each other, the first spacer 41 and the second spacer 42 are driven toward each other to clamp the object 9 between the first spacer 41 and the second spacer 42 and the temperature sensing device group 50 A temperature sensing device 51 and a second temperature sensing device 52 are further directly attached to both sides of the member 9 to be in contact with each other to accurately reflect the actual temperature of the object 9. In this embodiment, the elastic component 70 can be, for example, a compression spring 71. The first plate body 10 includes at least one first limiting portion 14 such as a groove, and the second plate body 20 includes at least one groove, for example. The second limiting portion 24, wherein the two ends of the compression spring 71 are respectively received in the first limiting portion 14 and the second limiting portion 24, so as to achieve the connection between the first plate body 10, the elastic component 70 and the second plate body 20. And providing an elastic force to drive the heating device group 30, the spacer group 40 and the temperature sensing device group 50 on the first plate body 10 and the second plate body 20 to the clamping member 9 during, for example, a burn-in test. It should be emphasized that the pivoting assembly 60 can be configured such that the angle of rotation, the number, the position of the arrangement, and the like can be adjusted according to actual application requirements. In addition, the type of the elastic component 70 connecting the first plate body 10 and the second plate body 20 can also be modulated according to actual application requirements. For example, in other embodiments, the elastic component 70 is more than a torsion spring, and the first limiting portion 14 and the second limiting portion 24 are not limited to a fixing protrusion or a groove. In other words, the heating device 1 in the present case in which the heating object can be fixed and the temperature is measured can be varied and is not limited to the foregoing illustration.
於本實施例中,加熱裝置1更包括一控制器35以及一連接線路組55,其中加熱器件組30的第一加熱器件31與第二加熱器件32以及溫度感測器件組50的第一溫度感測器件51與第二溫度感測器件52分別透過連接線路組55電連接至控制器35。控制器35連接至一電源,以提供加熱裝置1所需。於本實施例中,控制器35更包括至少一連接座38,連接線路組55包括一連接頭56,連接頭56可拆卸地插置於連接座38,俾使加熱器件組30與溫度感測器件組50電連接至控制器35。於其他實施例中,控制器35更包含複數個連接座38,例如兩個以上的連接座38,使用者可依實際應用需求選用,或組配設定不同的控制參數應用,本案並不受限於此。另外,需說明的是加熱器件組30的第一加熱器件31與第二加熱器件32透過連接線路組55電連接至控制器35之型式並不限定於本案所示之實施例,溫度感測器件組50的第一溫度感測器件51與第二溫度感測器件52透過連接線路組55電連接至控制器35之型式亦同。例如於一實施例中,連接線路組55更可貫穿或嵌設於第一板體10或第二板體20,以達最短路徑連接加熱器件組30與溫度感測器件組50至控制器35,同時也保有美觀且整齊的線路連接。惟其非限制本案之必要技術特徵,於此便不再贅述。此外,控制器35更包括一顯示單元36,例如與控制按鍵表整合一體,於控制器35電連接加熱器件組30時,分別顯示第一加熱器件31與第二加熱器件32之一設定加熱溫度。同時,於控制器35電連接溫度感測器件組50時,分別顯示第一溫度感測器件51與第二溫度感測器件52之一量測溫度。於進行例如燒機測試或其他溫度控制程序時,控制器35透過連接線路組55電性連接至加熱組件30與溫度感測元件組50,且可根據溫度感測元件組50所測得的量測溫度,控制加熱組件30對待測的物件9進行加熱並控制溫度至設定加熱溫度。於其他實施例中,控制器35亦可包含一回饋電路及一處理模組(未圖示),其中溫度感測元件組50通過回饋電路與處理模組電性連接,處理模組根據從回饋電路傳回的信號,控制加熱組件30對待測的物件9進行加熱並控制溫度至設定加熱溫度。惟其並非限制本案之必要技術特徵,於此便不再贅述。In the present embodiment, the heating device 1 further includes a controller 35 and a connection line group 55, wherein the first heating device 31 and the second heating device 32 of the heating device group 30 and the first temperature of the temperature sensing device group 50 The sensing device 51 and the second temperature sensing device 52 are electrically connected to the controller 35 through the connection line group 55, respectively. The controller 35 is connected to a power source to provide the heating device 1 as needed. In this embodiment, the controller 35 further includes at least one connecting block 38. The connecting circuit group 55 includes a connecting head 56. The connecting head 56 is detachably inserted into the connecting base 38 to enable the heating device group 30 and the temperature sensing device. Group 50 is electrically coupled to controller 35. In other embodiments, the controller 35 further includes a plurality of connecting bases 38, for example, two or more connecting seats 38, which can be selected by the user according to actual application requirements, or configured to set different control parameter applications, and the present invention is not limited. herein. In addition, it should be noted that the first heating device 31 and the second heating device 32 of the heating device group 30 are electrically connected to the controller 35 through the connection circuit group 55. The type of the temperature sensing device is not limited to the embodiment shown in the present disclosure. The first temperature sensing device 51 of the group 50 and the second temperature sensing device 52 are electrically connected to the controller 35 via the connection line group 55. For example, in an embodiment, the connection line group 55 can be penetrated or embedded in the first board body 10 or the second board body 20 to connect the heating device group 30 and the temperature sensing device group 50 to the controller 35 in the shortest path. At the same time, it also maintains a beautiful and neat line connection. However, it does not limit the necessary technical features of this case, so it will not be repeated here. In addition, the controller 35 further includes a display unit 36, for example integrated with the control button table. When the controller 35 is electrically connected to the heating device group 30, one of the first heating device 31 and the second heating device 32 is respectively set to set the heating temperature. . At the same time, when the controller 35 is electrically connected to the temperature sensing device group 50, the temperature measured by one of the first temperature sensing device 51 and the second temperature sensing device 52 is respectively displayed. The controller 35 is electrically connected to the heating assembly 30 and the temperature sensing element group 50 through the connection line group 55, and can measure the amount measured by the temperature sensing element group 50, for example, during a burn-in test or other temperature control program. The temperature is measured, and the heating element 30 is controlled to heat the object 9 to be measured and control the temperature to a set heating temperature. In other embodiments, the controller 35 can also include a feedback circuit and a processing module (not shown). The temperature sensing component group 50 is electrically connected to the processing module through a feedback circuit, and the processing module is based on feedback. The signal returned by the circuit controls the heating component 30 to heat the object 9 to be measured and control the temperature to a set heating temperature. However, it is not a limitation of the necessary technical features of the case, and will not be repeated here.
另一方面,為便於使用者操作,於本實施例中,第一板體10更包括一第一按壓部15,第二板體20包括一第二按壓部25,其中第一按壓部15相對於第二按壓部25,於第一按壓部15與第二按壓部25受按壓而彼此趨向,且第一板體10與第二板體20彼此相對轉動時,驅使第一墊片41與第二墊片42彼此分離,進而達成夾固物件9的目的。當然,第一按壓部15與第二按壓部25之型式及設置位置等並非限制本案之必要技術特徵,於此便不再贅述。On the other hand, in order to facilitate the operation of the user, in the embodiment, the first plate body 10 further includes a first pressing portion 15, and the second plate body 20 includes a second pressing portion 25, wherein the first pressing portion 15 is opposite. In the second pressing portion 25, when the first pressing portion 15 and the second pressing portion 25 are pressed toward each other, and the first plate body 10 and the second plate body 20 are rotated relative to each other, the first spacer 41 and the first spacer 41 are driven. The two spacers 42 are separated from each other, thereby achieving the purpose of clamping the object 9. Of course, the types and positions of the first pressing portion 15 and the second pressing portion 25 and the like do not limit the technical features necessary for the present invention, and thus will not be described again.
第9圖係揭示本案第二較佳實施例之加熱裝置之局部結構分解圖。第10圖係揭示本案第二較佳實施例之加熱裝置於另一視角之局部結構分解圖。於本實施例中,加熱裝置1與第1圖至第9圖所示的加熱裝置1相似,且相同的元件標號代表相同的元件、結構與功能,於此不再贅述。不同於前述實施例中樞接組件60與第一板體10及第二板體20的固定方式,於本實施例中,第一樞接部61與第一板體10係可透過例如機械沖壓或銑切等製程而一體成型,同樣地,第二樞接部62係與第二板體20亦可透過例如機械沖壓或銑切等製程而一體成型。於其他實施例,第一樞接部61與第一板體10係可透過例如黏合方式而建構為一體結構,同樣地,第二樞接部62與第二板體20亦可透過例如黏合方式而建構為一體結構。於本實施例中,結合成一體的第一樞接部61與第一板體10,相對結合成一體的第二樞接部62與第二板體20,可通過轉軸63穿過第一樞接部61的第一樞接孔61a與第二樞接部62的第二樞接孔62a,而直接達成第一板體10、樞接組件60與第二板體20的組裝。於本實施例中,第一樞接部61、第二樞接部62與轉軸63仍採可拆卸式組裝構成,除了使加熱裝置1的組裝方式更加簡便外,可拆卸式的集合同樣使加熱裝置1更具調變性,可視燒機測試需求而更換部份組件,亦可進行部份組件的維修或替換。有效整合加熱器件組與溫度感測器件組、簡化整體結構、降低成本、且提昇加熱裝置1之競爭力。Fig. 9 is a partially exploded perspective view showing the heating device of the second preferred embodiment of the present invention. Figure 10 is a partial exploded view showing the heating device of the second preferred embodiment of the present invention at another viewing angle. In the present embodiment, the heating device 1 is similar to the heating device 1 shown in FIGS. 1 to 9, and the same component numbers denote the same elements, structures, and functions, and will not be described again. Different from the first embodiment, the first pivoting portion 61 and the first plate 10 are permeable to, for example, mechanical stamping or The second pivoting portion 62 and the second plate body 20 can also be integrally formed by a process such as mechanical punching or milling, in the same manner as the milling process. In other embodiments, the first pivoting portion 61 and the first plate body 10 can be integrally formed by, for example, bonding, and the second pivoting portion 62 and the second plate body 20 can also be adhered, for example, by way of bonding. And constructed as an integrated structure. In this embodiment, the first pivoting portion 61 and the first plate body 10 are integrally combined to form an integral second pivoting portion 62 and the second plate body 20, and can pass through the first pivot through the rotating shaft 63. The first pivoting hole 61a of the connecting portion 61 and the second pivoting hole 62a of the second pivoting portion 62 directly achieve assembly of the first plate body 10, the pivoting assembly 60 and the second plate body 20. In this embodiment, the first pivoting portion 61, the second pivoting portion 62 and the rotating shaft 63 are still detachably assembled, and in addition to making the assembling manner of the heating device 1 easier, the detachable assembly also heats up. The device 1 is more variability, and some components can be replaced according to the requirements of the burning machine test, and some components can be repaired or replaced. The heat device group and the temperature sensing device group are effectively integrated, the overall structure is simplified, the cost is reduced, and the competitiveness of the heating device 1 is improved.
綜上所述,本案提供一種加熱裝置。藉由可拆卸式的樞接組件使二板體可穩定地相對轉動,且利用彈性組件提供彈性力,驅使二板體上之加熱器件組及溫度感測器件組緊密地貼近燒機測試的物件,同時達成固定的功效。由於加熱區域集中,於燒機測試時,透過二板體上之墊片組夾固定加熱物件,除了可避免影響其他測試用構件及延長使用壽命外,更利於快速控制溫度並獲致準確的燒機測試結果。此外,由於加熱器件組與溫度感測器件組對應設置,且溫度感測器件組更設置於墊片組上且外露,可與待測物件直接接觸,,更利於精確且快速地反應溫度結果,提昇燒機測試的準確度。再者,其結構精巧、組裝簡便且調變靈活。各構成組件間採可拆卸式集合,可視燒機測試需求而更換部份組件,亦可進行部份組件的維修或替換。有效整合加熱器件組與溫度感測器件組、簡化整體結構、降低成本、且提昇加熱裝置之競爭力。In summary, the present invention provides a heating device. The two plates are stably rotated relative to each other by the detachable pivoting assembly, and the elastic component is used to provide elastic force to drive the heating device group and the temperature sensing device group on the second plate body to be closely close to the burning test object. At the same time, achieve a fixed effect. Due to the concentrated heating zone, the heating object is fixed through the gasket set on the two plates during the burning test. In addition to avoiding the influence of other test components and prolonging the service life, it is more convenient to quickly control the temperature and obtain an accurate burning machine. Test Results. In addition, since the heating device group is correspondingly disposed with the temperature sensing device group, and the temperature sensing device group is disposed on the spacer group and exposed, it can directly contact the object to be tested, which is more convenient for accurately and quickly reflecting the temperature result. Improve the accuracy of the burn-in test. Moreover, the structure is compact, the assembly is simple, and the modulation is flexible. A detachable assembly is adopted between the components, and some components can be replaced according to the requirements of the burning machine test, and some components can be repaired or replaced. Effectively integrate the heating device group and the temperature sensing device group, simplify the overall structure, reduce the cost, and enhance the competitiveness of the heating device.
本案得由熟習此技術的人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with this technology, but it is not intended to be protected by the scope of the patent application.
1‧‧‧加熱裝置
10‧‧‧第一板體
11‧‧‧第一面
12‧‧‧第二面
13‧‧‧第一穿孔
14‧‧‧第一限位部
15‧‧‧第一按壓部
20‧‧‧第二板體
21‧‧‧第三面
22‧‧‧第四面
23‧‧‧第二穿孔
24‧‧‧第二限位部
25‧‧‧第二按壓部
30‧‧‧加熱器件組
31‧‧‧第一加熱器件
32‧‧‧第二加熱器件
35‧‧‧控制器
36‧‧‧顯示單元
38‧‧‧連接座
40‧‧‧墊片組
41‧‧‧第一墊片
42‧‧‧第二墊片
50‧‧‧溫度感測器件組
51‧‧‧第一溫度感測器件
52‧‧‧第二溫度感測器件
55‧‧‧連接線路組
56‧‧‧連接頭
60‧‧‧樞接組件
61‧‧‧第一樞接部
61a‧‧‧第一樞接孔
61b‧‧‧第一固定孔
62‧‧‧第二樞接部
62a‧‧‧第二樞接孔
62b‧‧‧第二固定孔
63‧‧‧轉軸
70‧‧‧彈性組件
71‧‧‧壓縮彈簧
80‧‧‧鎖固組件
81‧‧‧第一鎖固件
82‧‧‧第二鎖固件
9‧‧‧物件1‧‧‧heating device
10‧‧‧ first board
11‧‧‧ first side
12‧‧‧ second side
13‧‧‧First perforation
14‧‧‧First Limitation
15‧‧‧First press
20‧‧‧Second plate
21‧‧‧ third side
22‧‧‧ fourth side
23‧‧‧Second perforation
24‧‧‧Second Limitation
25‧‧‧Second press
30‧‧‧Heating device group
31‧‧‧First heating device
32‧‧‧Second heating device
35‧‧‧ Controller
36‧‧‧Display unit
38‧‧‧Connecting seat
40‧‧‧gasket set
41‧‧‧First gasket
42‧‧‧Second gasket
50‧‧‧Temperature sensing device group
51‧‧‧First temperature sensing device
52‧‧‧Second temperature sensing device
55‧‧‧Connected line group
56‧‧‧Connecting head
60‧‧‧ pivot assembly
61‧‧‧First pivotal
61a‧‧‧First pivot hole
61b‧‧‧First fixing hole
62‧‧‧Second pivotal
62a‧‧‧Second pivot hole
62b‧‧‧Second fixing hole
63‧‧‧ shaft
70‧‧‧Flexible components
71‧‧‧Compression spring
80‧‧‧Locking components
81‧‧‧First lock firmware
82‧‧‧Second lock firmware
9‧‧‧ objects
第1圖係揭示本案第一較佳實施例之加熱裝置之立體結構圖。Fig. 1 is a perspective view showing the heating device of the first preferred embodiment of the present invention.
第2圖係揭示本案第一較佳實施例之加熱裝置於另一視角之立體結構圖。Figure 2 is a perspective view showing the heating device of the first preferred embodiment of the present invention in another perspective.
第3圖係揭示本案第一較佳實施例之加熱裝置之組裝完成結構圖。Fig. 3 is a view showing the assembled structure of the heating device of the first preferred embodiment of the present invention.
第4圖係揭示本案第一較佳實施例之加熱裝置之局部結構分解圖。Fig. 4 is a partially exploded perspective view showing the heating apparatus of the first preferred embodiment of the present invention.
第5圖係揭示本案第一較佳實施例之加熱裝置於另一視角之局部結構分解圖。Figure 5 is a partial exploded view showing the heating device of the first preferred embodiment of the present invention in another viewing angle.
第6圖係揭示第4圖之加熱裝置之局部組裝結構圖。Fig. 6 is a partially assembled structural view showing the heating device of Fig. 4.
第7圖係第6圖之側視圖。Figure 7 is a side view of Figure 6.
第8圖係揭示本案第一較佳實施之加熱裝置於使用狀態之局部結構側視圖。Figure 8 is a side elevational view showing the partial structure of the heating device of the first preferred embodiment of the present invention in use.
第9圖係揭示本案第二較佳實施例之加熱裝置之局部結構分解圖。Fig. 9 is a partially exploded perspective view showing the heating device of the second preferred embodiment of the present invention.
第10圖係揭示本案第二較佳實施例之加熱裝置於另一視角之局部結構分解圖。Figure 10 is a partial exploded view showing the heating device of the second preferred embodiment of the present invention at another viewing angle.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107210766U TWM569990U (en) | 2018-08-07 | 2018-08-07 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107210766U TWM569990U (en) | 2018-08-07 | 2018-08-07 | Heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM569990U true TWM569990U (en) | 2018-11-11 |
Family
ID=65035828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107210766U TWM569990U (en) | 2018-08-07 | 2018-08-07 | Heating device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM569990U (en) |
-
2018
- 2018-08-07 TW TW107210766U patent/TWM569990U/en not_active IP Right Cessation
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |