TWM566854U - Keyboard structure - Google Patents
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- TWM566854U TWM566854U TW107207472U TW107207472U TWM566854U TW M566854 U TWM566854 U TW M566854U TW 107207472 U TW107207472 U TW 107207472U TW 107207472 U TW107207472 U TW 107207472U TW M566854 U TWM566854 U TW M566854U
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Abstract
一種鍵盤結構包括機殼、載架、薄膜電路層以及按鍵層。機殼具有相對的內表面、相對於內表面的外表面以及貫通內表面與外表面的至少一通孔。載架與薄膜電路層設置於機殼內,且薄膜電路層位於載架上。按鍵層設置於薄膜電路層上。按鍵層包括基層與連接基層的至少一鍵帽。基層抵貼機殼的內表面,且位於機殼的內表面與薄膜電路層之間。鍵帽自通孔凸出於機殼的外表面。A keyboard structure includes a casing, a carrier, a thin film circuit layer, and a button layer. The housing has opposing inner surfaces, an outer surface opposite the inner surface, and at least one through hole extending through the inner and outer surfaces. The carrier and the thin film circuit layer are disposed in the casing, and the thin film circuit layer is located on the carrier. The button layer is disposed on the thin film circuit layer. The button layer includes a base layer and at least one keycap connecting the base layers. The base layer abuts against the inner surface of the casing and is located between the inner surface of the casing and the thin film circuit layer. The key cap protrudes from the through hole to the outer surface of the casing.
Description
本新型創作是有關於一種鍵盤結構,且特別是有關於一種輕薄化的鍵盤結構。The novel creation relates to a keyboard structure, and in particular to a thin and light keyboard structure.
鍵盤作為實體操作介面,可供使用者輸入相應的訊號,以控制主機中相應的軟體執行相應的功能。以應用於筆記型電腦的鍵盤為例,可概分為外部固定式與內部固定式等兩種鍵盤,基於不同的組裝方式與方向,外部固定式鍵盤較易於拆解組裝。然而,無論是外部固定式或內部固定式鍵盤,鍵帽大多透過剪刀腳結構或機械軸連接載架,且鍵帽與機殼之間存在縫隙,故存在著過於厚重以及難以防止外界水氣或異物進入機殼的內部等問題。The keyboard acts as a physical operation interface, and the user can input a corresponding signal to control the corresponding software in the host to perform the corresponding function. For example, the keyboard applied to the notebook computer can be divided into two types: external fixed type and internal fixed type. The external fixed type keyboard is easier to disassemble and assemble based on different assembly methods and directions. However, whether it is an external fixed or internal fixed keyboard, the key caps are mostly connected to the carrier through the scissor foot structure or the mechanical shaft, and there is a gap between the key cap and the casing, so there is too thick and it is difficult to prevent external moisture or Foreign matter enters the inside of the casing and other issues.
本新型創作提供一種鍵盤結構,不僅具有防止外界水氣或異物進入侵的設計,也符合輕薄化的設計趨勢。The novel creation provides a keyboard structure, which not only has a design for preventing external moisture or foreign matter from entering, but also conforms to the trend of thin and light design.
本新型創作的鍵盤結構包括機殼、載架、薄膜電路層以及按鍵層。機殼具有相對的內表面、相對於內表面的外表面以及貫通內表面與外表面的至少一通孔。載架與薄膜電路層設置於機殼內,且薄膜電路層位於載架上。按鍵層設置於薄膜電路層上。按鍵層包括基層與連接基層的至少一鍵帽。基層抵貼機殼的內表面,且位於機殼的內表面與薄膜電路層之間。鍵帽自通孔凸出於機殼的外表面。The keyboard structure of the novel creation includes a casing, a carrier, a thin film circuit layer and a button layer. The housing has opposing inner surfaces, an outer surface opposite the inner surface, and at least one through hole extending through the inner and outer surfaces. The carrier and the thin film circuit layer are disposed in the casing, and the thin film circuit layer is located on the carrier. The button layer is disposed on the thin film circuit layer. The button layer includes a base layer and at least one keycap connecting the base layers. The base layer abuts against the inner surface of the casing and is located between the inner surface of the casing and the thin film circuit layer. The key cap protrudes from the through hole to the outer surface of the casing.
基於上述,藉由機殼與按鍵層的整合設計,本新型創作的鍵盤結構的機殼與按鍵層之間的氣密度得以被提高,從而防止外界的水氣或異物進入到機殼的內部。其次,基於機殼與按鍵層的整合設計,本新型創作的鍵盤結構無須額外設置習知的剪刀腳結構,故能符合輕薄化的設計需求,且降低製作成本。Based on the above, by the integrated design of the casing and the button layer, the air density between the casing and the button layer of the keyboard structure of the present invention can be improved, thereby preventing external moisture or foreign matter from entering the inside of the casing. Secondly, based on the integrated design of the casing and the button layer, the keyboard structure created by the novel does not need to be additionally provided with a conventional scissor structure, so that it can meet the design requirements of thin and light, and reduce the manufacturing cost.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
圖1是本新型創作一實施例的鍵盤結構的局部截面示意圖。圖2是圖1的鍵盤結構受力下壓後的局部截面示意圖。特別說明的是,圖式中示意地繪出相應設置的一組鍵帽142與通孔113,但相應設置的鍵帽142與通孔113的組數可視需求增加,不限於圖式所揭內容。請參考圖1與圖2,在本實施例中,鍵盤結構100包括機殼110、載架120、薄膜電路層130以及按鍵層140,其中機殼110可採用塑膠機殼,但不限於此。1 is a partial cross-sectional view showing the structure of a keyboard of an embodiment of the present invention. 2 is a partial cross-sectional view of the keyboard structure of FIG. 1 after being pressed down. Specifically, a set of the key caps 142 and the through holes 113 are schematically illustrated in the drawings, but the number of sets of the corresponding key caps 142 and the through holes 113 may be increased as needed, and is not limited to the contents disclosed in the drawings. . Referring to FIG. 1 and FIG. 2, in the embodiment, the keyboard structure 100 includes a casing 110, a carrier 120, a thin film circuit layer 130, and a button layer 140. The casing 110 may be a plastic casing, but is not limited thereto.
機殼110具有相對的內表面111、相對於內表面111的外表面112以及貫通內表面111與外表面112的至少一通孔113。載架120與薄膜電路層130皆設置於機殼110內,而按鍵層140的至少部分設置於機殼110內。進一步而言,薄膜電路層130與按鍵層140皆由載架120承載,其中薄膜電路層130設置於載架120上,且按鍵層140設置於薄膜電路層130上。按鍵層140的至少部分與薄膜電路層130設置於機殼110的內表面111與載架120之間,其中薄膜電路層130位於按鍵層140與載架120之間,且按鍵層140的至少部分位於機殼110的內表面111與薄膜電路層130之間。The casing 110 has an opposite inner surface 111, an outer surface 112 opposite the inner surface 111, and at least one through hole 113 penetrating the inner surface 111 and the outer surface 112. Both the carrier 120 and the thin film circuit layer 130 are disposed in the casing 110, and at least a portion of the button layer 140 is disposed in the casing 110. Further, the thin film circuit layer 130 and the button layer 140 are all carried by the carrier 120. The thin film circuit layer 130 is disposed on the carrier 120, and the button layer 140 is disposed on the thin film circuit layer 130. At least a portion of the button layer 140 and the thin film circuit layer 130 are disposed between the inner surface 111 of the casing 110 and the carrier 120, wherein the thin film circuit layer 130 is located between the button layer 140 and the carrier 120, and at least a portion of the button layer 140 Located between the inner surface 111 of the casing 110 and the thin film circuit layer 130.
在本實施例中,按鍵層140包括基層141與連接基層141的至少一鍵帽142,其中按鍵層140的材質可採用矽膠,但不限於此。舉例來說,機殼110與按鍵層140可採用雙料射出成型的技術,或者是膠合、熱接合或其他接合方式等方式製作為一體,以提高機殼110與按鍵層140之間的氣密度,從而防止外界的水氣或異物自機殼110的通孔113進入到機殼110的內部。進一步而言,基層141緊密地貼合於機殼110的內表面111,鍵帽142自機殼110的通孔113穿出而凸出於機殼110的外表面111。鍵帽142凸出於機殼110的外表面111,以便於使用者操作,且基層141不會因鍵帽142的上下作動而自機殼110的內表面111脫離。另一方面,鍵帽142朝向薄膜電路層130的一側與薄膜電路層130保有間隙,以提供足夠的按壓行程。In this embodiment, the button layer 140 includes a base layer 141 and at least one keycap 142 of the connection base layer 141. The material of the button layer 140 may be silicone, but is not limited thereto. For example, the casing 110 and the button layer 140 may be formed by a two-shot injection molding process, or by gluing, thermal bonding or other bonding means to improve the gas density between the casing 110 and the button layer 140. Thereby, external moisture or foreign matter is prevented from entering the inside of the casing 110 through the through hole 113 of the casing 110. Further, the base layer 141 is closely attached to the inner surface 111 of the casing 110, and the keycap 142 protrudes from the through hole 113 of the casing 110 to protrude from the outer surface 111 of the casing 110. The keycap 142 protrudes from the outer surface 111 of the casing 110 for user operation, and the base layer 141 is not detached from the inner surface 111 of the casing 110 due to the up and down movement of the keycap 142. On the other hand, the side of the keycap 142 facing the thin film circuit layer 130 is kept spaced from the thin film circuit layer 130 to provide a sufficient pressing stroke.
另一方面,為提供使用者明確的操作手感,並確保鍵帽142能在下壓力移除後自動復位,鍵帽142與薄膜電路層130之間設有至少二彈性體150,其中彈性體150的材質可採用矽膠或其他具有回彈特性的材質,且彈性體150的數量可視需求增減。如圖1所示,鍵帽142朝向薄膜電路層130的一側設有觸發部143,其中觸發部143位於此二彈性體150之間,且朝向薄膜電路層130上的電性接點131延伸,但未與電性接點131接觸。另一方面,彈性體150連接鍵帽142朝向薄膜電路層130的一側,並與薄膜電路層130保有間隙G,藉由間隙G的設計,能夠反饋予使用者兩階段的操作手感。On the other hand, in order to provide a clear operating feel of the user, and to ensure that the key cap 142 can be automatically reset after the lower pressure is removed, at least two elastic bodies 150 are disposed between the key cap 142 and the film circuit layer 130, wherein the elastic body 150 The material can be made of silicone or other materials with resilient properties, and the number of elastomers 150 can be increased or decreased as needed. As shown in FIG. 1 , a side of the key cap 142 facing the thin film circuit layer 130 is provided with a triggering portion 143 , wherein the triggering portion 143 is located between the two elastic bodies 150 and extends toward the electrical contact 131 on the thin film circuit layer 130 . However, it is not in contact with the electrical contact 131. On the other hand, the elastic body 150 connects the keycap 142 toward the side of the thin film circuit layer 130, and maintains a gap G with the thin film circuit layer 130. By the design of the gap G, it is possible to feed back the user's two-stage operation feeling.
進一步而言,在使用者施力下壓鍵帽142的過程中,若彈性體150尚未與薄膜電路層130接觸,則使用者可感受到下壓的落空感,但在彈性體150與薄膜電路層130接觸後,如圖2所示,彈性體150發揮支撐的效果,以讓使用者獲致紮實的反饋手感,且反饋手感隨著彈性體150的變形程度加大而更為顯著。舉例來說,彈性體150可採用柱狀結構,例如圓柱、角柱或錐柱。如圖1所示,觸發部143與薄膜電路層130之間的間隙G1大於彈性體150與薄膜電路層130之間的間隙G,故需使鍵帽142的下壓行程超過間隙G並讓彈性體150產生足夠的壓縮變形量才能使觸發部143接觸電性接點131以產生相應的觸發訊號,並傳送至相應的電子元件(未繪示)以執行後續的動作。Further, in the process of pressing the keycap 142 by the user, if the elastic body 150 has not been in contact with the thin film circuit layer 130, the user can feel the feeling of falling down, but in the elastic body 150 and the thin film circuit. After the layer 130 is in contact, as shown in FIG. 2, the elastic body 150 exerts a supporting effect to allow the user to obtain a solid feedback feeling, and the feedback feeling is more remarkable as the degree of deformation of the elastic body 150 is increased. For example, the elastomer 150 can employ a columnar structure such as a cylinder, a corner post, or a cone. As shown in FIG. 1, the gap G1 between the trigger portion 143 and the thin film circuit layer 130 is larger than the gap G between the elastic body 150 and the thin film circuit layer 130, so that the pressing stroke of the key cap 142 needs to exceed the gap G and allow elasticity. The body 150 generates a sufficient amount of compressive deformation to cause the triggering portion 143 to contact the electrical contact 131 to generate a corresponding trigger signal and transmit it to a corresponding electronic component (not shown) to perform subsequent actions.
舉例來說,彈性體150可一體成型於鍵帽142,不僅製程上更為簡化,也能降低製作成本。另一方面,彈性體150可在使用者施力下壓鍵帽142的過程中反饋予使用者紮實的操作手感,且能在下壓力移除後自動彈性回復以驅使鍵帽142復位,故鍵盤結構100無須額外設置習知的剪刀腳結構,從而能符合輕薄化的設計需求,且製作成本更低。For example, the elastic body 150 can be integrally formed on the keycap 142, which not only simplifies the process but also reduces the manufacturing cost. On the other hand, the elastic body 150 can feedback the user's solid operation feeling during the pressing of the keycap 142 by the user, and can automatically return elastically after the lower pressure is removed to drive the keycap 142 to be reset, so the keyboard structure The 100-scissor structure is not required to be added, so that it can meet the slim design requirements and the production cost is lower.
請繼續參考圖1與圖2,在本實施例中,機殼110的內表面111設有至少一定位柱114,圖式中示意地繪出二個定位柱114,但定位柱114的數量可視需求增減,不限於圖式所揭內容。具體而言,定位柱114穿過基層141、薄膜電路層130以及載架120,藉以防止基層141、薄膜電路層130以及載架120相對滑移。另一方面,載架120背向薄膜電路層130的一側設有對應於定位柱114的固定件115,且連接定位柱114穿出載架120的端部,以將基層141、薄膜電路層130以及載架120的限位在機殼110的內表面111與固定件115之間。舉例來說,固定件115可採用螺絲,或由熱熔膠形成。Referring to FIG. 1 and FIG. 2, in the embodiment, the inner surface 111 of the casing 110 is provided with at least one positioning post 114. Two positioning posts 114 are schematically depicted in the drawing, but the number of the positioning posts 114 is visible. The increase or decrease in demand is not limited to the contents of the drawings. Specifically, the positioning post 114 passes through the base layer 141, the thin film circuit layer 130, and the carrier 120, thereby preventing the base layer 141, the thin film circuit layer 130, and the carrier 120 from slipping relative to each other. On the other hand, a side of the carrier 120 facing away from the thin film circuit layer 130 is provided with a fixing member 115 corresponding to the positioning post 114, and the connecting positioning post 114 is passed through the end of the carrier 120 to connect the base layer 141 and the thin film circuit layer. The limit of the carrier 130 and the carrier 120 is between the inner surface 111 of the casing 110 and the fixture 115. For example, the fixture 115 may be formed of a screw or a hot melt adhesive.
以下將列舉多個實施例以詳細說明本揭露,其中相同的構件將標示相同的符號,並且省略相同技術內容的說明,省略部分請參考前述實施例,以下不再贅述。The present invention will be described in detail in the following detailed description of the embodiments, in which the same components will be denoted by the same symbols, and the description of the same technical content will be omitted.
圖3是本新型創作另一實施例的鍵盤結構的局部截面示意圖。請參考圖3,本實施例的鍵盤結構100A與圖1的鍵盤結構100的差異在於:彈性體的結構型態。進一步而言,在本實施例中,彈性體150a可採用階梯狀結構,且每一階的寬度自薄膜電路層130朝向鍵帽142漸增。因此,在使用者施力下壓鍵帽142並使彈性體150a與薄膜電路層130接觸後,彈性體150a的階梯狀設計可讓使用者獲致多段按壓行程,且反饋手感隨著彈性體150a的變形程度加大而更為顯著。基於彈性體150a的每一階的寬度自薄膜電路層130朝向鍵帽142漸增的設計,使用者需持續加大下壓鍵帽142的力量才能使彈性體150a產生變形。3 is a partial cross-sectional view showing the structure of a keyboard of another embodiment of the present invention. Referring to FIG. 3, the keyboard structure 100A of the present embodiment differs from the keyboard structure 100 of FIG. 1 in the structural form of the elastic body. Further, in the present embodiment, the elastic body 150a may adopt a stepped structure, and the width of each step is gradually increased from the thin film circuit layer 130 toward the key cap 142. Therefore, after the user presses the keycap 142 and brings the elastic body 150a into contact with the film circuit layer 130, the stepped design of the elastic body 150a allows the user to obtain a plurality of pressing strokes, and the feedback feels with the elastic body 150a. The degree of deformation is increased and more significant. Based on the design of the width of each step of the elastic body 150a from the thin film circuit layer 130 toward the keycap 142, the user needs to continuously increase the force of the lower pressing key cap 142 to deform the elastic body 150a.
圖4是本新型創作又一實施例的鍵盤結構的局部截面示意圖。請參考圖4,本實施例的鍵盤結構100B與圖1的鍵盤結構100的差異在於:彈性體的所在位置。進一步而言,在本實施例中,彈性體150b連接薄膜電路層130朝向鍵帽142的一側,並與鍵帽142保有間隙G2,藉由間隙G2的設計,能夠反饋予使用者兩階段的操作手感。進一步而言,在使用者施力下壓鍵帽142的過程中,若鍵帽142尚未與彈性體150b接觸,則使用者可感受到下壓的落空感,但在鍵帽142與彈性體150b接觸後,彈性體150b發揮支撐的效果,以讓使用者獲致紮實的反饋手感,且反饋手感隨著彈性體150b的變形程度加大而更為顯著。另一方面,觸發部143與薄膜電路層130之間的間隙G1大於彈性體150b與鍵帽142之間的間隙G2,故需使鍵帽142的下壓行程超過間隙G2並讓彈性體150b產生足夠的壓縮變形量才能使觸發部143接觸電性接點131以產生相應的觸發訊號,並傳送至相應的電子元件(未繪示)以執行後續的動作。4 is a partial cross-sectional view showing the structure of a keyboard of still another embodiment of the present invention. Referring to FIG. 4, the keyboard structure 100B of the present embodiment differs from the keyboard structure 100 of FIG. 1 in the position of the elastic body. Further, in the embodiment, the elastic body 150b connects the side of the thin film circuit layer 130 toward the keycap 142, and has a gap G2 with the key cap 142. The design of the gap G2 can be fed back to the user in two stages. Operation feel. Further, in the process of pressing the keycap 142 by the user, if the keycap 142 is not in contact with the elastic body 150b, the user can feel the feeling of falling down, but in the keycap 142 and the elastic body 150b. After the contact, the elastic body 150b exerts a supporting effect to allow the user to obtain a solid feedback feeling, and the feedback feeling is more remarkable as the degree of deformation of the elastic body 150b is increased. On the other hand, the gap G1 between the trigger portion 143 and the thin film circuit layer 130 is larger than the gap G2 between the elastic body 150b and the key cap 142, so that the pressing stroke of the key cap 142 needs to exceed the gap G2 and the elastic body 150b is generated. A sufficient amount of compression deformation is required to cause the triggering portion 143 to contact the electrical contact 131 to generate a corresponding trigger signal and transmit it to a corresponding electronic component (not shown) to perform subsequent actions.
圖5是本新型創作再一實施例的鍵盤結構的局部截面示意圖。請參考圖5,本實施例的鍵盤結構100C與圖4的鍵盤結構100B的差異在於:彈性體的結構型態。進一步而言,在本實施例中,彈性體150c可採用階梯狀結構,且每一階的寬度自鍵帽142朝向薄膜電路層130漸增。因此,在使用者施力下壓鍵帽142而使鍵帽142接觸彈性體150c接觸後,彈性體150c的階梯狀設計可讓使用者獲致多段按壓行程,且反饋手感隨著彈性體150c的變形程度加大而更為顯著。另一方面,基於彈性體150c的每一階的寬度自鍵帽142朝向薄膜電路層130漸增的設計,使用者需持續加大下壓鍵帽142的力量才能使彈性體150c產生變形。FIG. 5 is a partial cross-sectional view showing the structure of a keyboard according to still another embodiment of the present invention. Referring to FIG. 5, the keyboard structure 100C of the present embodiment differs from the keyboard structure 100B of FIG. 4 in the structural form of the elastic body. Further, in the present embodiment, the elastic body 150c may adopt a stepped structure, and the width of each step is gradually increased from the key cap 142 toward the thin film circuit layer 130. Therefore, after the user presses the keycap 142 to make the keycap 142 contact the elastic body 150c, the stepped design of the elastic body 150c allows the user to obtain a plurality of pressing strokes, and the feedback feel changes with the deformation of the elastic body 150c. The degree is increased and more significant. On the other hand, based on the design that the width of each step of the elastic body 150c is gradually increased from the keycap 142 toward the thin film circuit layer 130, the user needs to continuously increase the force of the lower pressing key cap 142 to deform the elastic body 150c.
綜上所述,藉由機殼與按鍵層的緊密貼合,本新型創作的鍵盤結構的機殼與按鍵層之間的氣密度得以被提高,從而防止外界的水氣或異物進入到機殼的內部。其次,基於機殼與按鍵層的整合設計以及設置於機殼與按鍵層之間的彈性體,本新型創作的鍵盤結構無須額外設置習知的剪刀腳結構,故能符合輕薄化的設計需求,且降低製作成本。另一方面,彈性體可在使用者施力下壓鍵帽的過程中反饋予使用者紮實的操作手感,且能在下壓力移除後自動彈性回復以驅使鍵帽復位。In summary, by the close fitting of the casing and the button layer, the air density between the casing and the button layer of the keyboard structure created by the novel is improved, thereby preventing external moisture or foreign matter from entering the casing. internal. Secondly, based on the integrated design of the casing and the button layer and the elastic body disposed between the casing and the button layer, the keyboard structure of the novel creation does not need to be additionally provided with a conventional scissor structure, so that it can meet the design requirements of thin and light. And reduce production costs. On the other hand, the elastic body can feedback the user's solid operation feeling during the pressing of the keycap by the user, and can automatically elastically recover after the downward pressure is removed to drive the keycap to reset.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100、100A~100C‧‧‧鍵盤結構
110‧‧‧機殼
111‧‧‧內表面
112‧‧‧外表面
113‧‧‧通孔
114‧‧‧定位柱
115‧‧‧固定件
120‧‧‧載架
130‧‧‧薄膜電路層
131‧‧‧電性接點
140‧‧‧按鍵層
141‧‧‧基層
142‧‧‧鍵帽
143‧‧‧觸發部
150、150a~150c‧‧‧彈性體
G、G1、G2‧‧‧間隙100, 100A~100C‧‧‧ keyboard structure
110‧‧‧Shell
111‧‧‧ inner surface
112‧‧‧ outer surface
113‧‧‧through hole
114‧‧‧Positioning column
115‧‧‧Fixed parts
120‧‧‧Carriage
130‧‧‧film circuit layer
131‧‧‧Electrical contacts
140‧‧‧ button layer
141‧‧‧ grassroots
142‧‧‧Key Cap
143‧‧‧Trigger
150, 150a~150c‧‧‧ Elastomers
G, G1, G2‧‧‧ gap
圖1是本新型創作一實施例的鍵盤結構的局部截面示意圖。 圖2是圖1的鍵盤結構受力下壓後的局部截面示意圖。 圖3是本新型創作另一實施例的鍵盤結構的局部截面示意圖。 圖4是本新型創作又一實施例的鍵盤結構的局部截面示意圖。 圖5是本新型創作再一實施例的鍵盤結構的局部截面示意圖。1 is a partial cross-sectional view showing the structure of a keyboard of an embodiment of the present invention. 2 is a partial cross-sectional view of the keyboard structure of FIG. 1 after being pressed down. 3 is a partial cross-sectional view showing the structure of a keyboard of another embodiment of the present invention. 4 is a partial cross-sectional view showing the structure of a keyboard of still another embodiment of the present invention. FIG. 5 is a partial cross-sectional view showing the structure of a keyboard according to still another embodiment of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107207472U TWM566854U (en) | 2018-06-05 | 2018-06-05 | Keyboard structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107207472U TWM566854U (en) | 2018-06-05 | 2018-06-05 | Keyboard structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM566854U true TWM566854U (en) | 2018-09-11 |
Family
ID=64399260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107207472U TWM566854U (en) | 2018-06-05 | 2018-06-05 | Keyboard structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM566854U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI669045B (en) * | 2018-11-13 | 2019-08-11 | 和碩聯合科技股份有限公司 | Electronic device |
-
2018
- 2018-06-05 TW TW107207472U patent/TWM566854U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI669045B (en) * | 2018-11-13 | 2019-08-11 | 和碩聯合科技股份有限公司 | Electronic device |
| CN111180239A (en) * | 2018-11-13 | 2020-05-19 | 和硕联合科技股份有限公司 | Electronic device and key structure |
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