TWM564161U - Probe assembly - Google Patents

Abstract

The present disclosure discloses a probe assembly that includes two probe structures and a capacitive element. Each of the probe structures includes a first contact segment, a first connection segment, a second connection segment, and a second contact segment. The first connecting section is connected to the first contact section. The second connecting section is connected to the first connecting section. The second contact segment is coupled to the second connecting segment. The capacitive element is electrically connected between the two probe structures. In this way, the creation can improve the power integrity through the arrangement of the capacitive components.

Description

Probe assembly

The present invention relates to a probe assembly, and more particularly to a probe assembly for a wafer probe card.

First, the prior art cantilever probe card is mainly used to manually solder the probes to the printed circuit board one by one, and at the same time, the probe is fixed by an adhesive such as epoxy. For example, in the probe card disclosed in the TW I447397 patent, the probe 33 is fixed to the circuit board 34 by the holding portion 36 containing the epoxy resin.

However, in the above prior art, when the epoxy resin is hardened, the cantilever probe card becomes difficult to repair. In other words, when one of the probes is damaged, the prior art cantilever probe card cannot replace the damaged probe alone, and the entire set of cantilever probe cards must be replaced.

Furthermore, the wire bonding method of the prior art cantilever type probe card requires a dense wire to perform a fan-out process, and the artificial bonding wire requires a relatively wide space, so the transmission path is long. Therefore, the signal transmission quality is poor. Further, the prior art cantilever probe card has a wider probe wire diameter, so that in addition to the lateral alignment on the wiring, longitudinal stacking must be performed. However, when the number of stitches is large or the pitch is small, the difficulty in the arrangement of the probes is increased.

Further, the existing cantilever probe card structure has a long transmission path, uncontrollable impedance, and poor transmission quality. At the same time, the power signal will be too long, and the probe cross-sectional area is too narrow. Its inductance will cause the power supply impedance to rise with frequency, causing the voltage to drop and the test yield to be poor.

The technical problem to be solved by the present invention is to provide a probe assembly for the deficiencies of the prior art, which can effectively improve the characteristics of the cantilever probe which is difficult to repair, and reduce the influence of the inductance in the transmission path of the probe assembly.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a probe assembly including two probe structures and a capacitor element. Each of the probe structures includes a first contact segment, a first connecting segment, a second connecting segment and a second contact segment, the first connecting segment being connected to the first contact segment, the first Two connecting segments are connected to the first connecting segment, and the second connecting segment is connected to the second connecting segment. The capacitive element is electrically connected between the two probe structures.

Another technical solution adopted by the present invention is to provide a probe assembly including a substrate, a first plate body, two probe structures, and a capacitor element. The substrate has a plurality of electrically conductive structures. The first plate body has a plurality of first through holes and a plurality of top abutting portions, each of the top abutting portions being adjacent to the corresponding first through holes. Each of the probe structures includes a first contact segment, a first connecting segment, a second connecting segment and a second contact segment, the first connecting segment being connected to the first contact segment, the first a second connecting segment is connected to the first connecting segment, and the second connecting segment is connected to the second connecting segment, wherein the first contact segment has an abutting portion and a connecting portion The first end portion has a second end portion. The capacitive element is electrically connected between the two probe structures. Wherein the two first contact segments of the two probe structures respectively pass through the two first through holes. The two first contact segments of the two probe structures are electrically connected to the two conductive structures respectively. The two abutting portions of the two probe structures respectively abut against the two abutting portions.

One of the beneficial effects of the present invention is that the probe assembly provided by the present embodiment can utilize the technical solution that "the capacitive element is electrically connected between the two probe structures", thereby reducing the probe. The effect of inductance in the transmission path of the pin structure to improve power integrity (PI).

For a better understanding of the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are provided for the purpose of illustration and description.

P, M‧‧ ‧ probe assembly

1, 1a, 1b‧‧‧ probe structure

11‧‧‧First contact segment

111‧‧‧Abutment

112‧‧‧First end

12‧‧‧First connection segment

121‧‧‧Exposed surface

13‧‧‧Second connection

14‧‧‧Second contact

141‧‧‧second end

2‧‧‧Substrate

21‧‧‧Electrical structure

3‧‧‧ first board

31‧‧‧ first through hole

32‧‧‧Abutment

4‧‧‧Second plate

41‧‧‧Second through hole

5‧‧‧Fixed parts

6‧‧‧Capacitive components

61‧‧‧ Carrier Board

611‧‧‧ Carrier

612‧‧‧First Conductive Department

613‧‧‧Second Conductive Department

62‧‧‧ Capacitor parts

H1‧‧‧first aperture

H2‧‧‧second aperture

W‧‧‧Maximum outer diameter

F1‧‧‧first width

F2‧‧‧ second width

N‧‧‧Test object contact

X, Y, Z‧‧ Direction

1 is a perspective view of one of the probe structures of the first embodiment of the present invention.

FIG. 2 is another perspective view of the probe structure of the first embodiment of the present invention.

Figure 3 is a side elevational view of the probe structure of the first embodiment of the present invention.

4 is a top plan view of the probe structure of the first embodiment of the present invention.

Fig. 5 is a side cross-sectional view showing the line V-V of Fig. 1;

Fig. 6 is a side cross-sectional view showing the line VI-VI of Fig. 1;

Figure 7 is a side elevational view of another embodiment of the probe structure of the first embodiment of the present invention.

Figure 8 is a side elevational view of still another embodiment of the probe structure of the first embodiment of the present invention.

FIG. 9 is a schematic perspective view of one of the probe assemblies of the second embodiment of the present invention.

FIG. 10 is a perspective exploded view of the probe assembly of the second embodiment of the present invention.

Figure 11 is another perspective exploded view of the probe assembly of the second embodiment of the present invention.

Figure 12 is a side elevational view of the probe assembly of the third embodiment of the present invention.

Figure 13 is a side elevational view of the probe assembly of the third embodiment of the present invention.

Figure 14 is a further side elevational view of the probe assembly of the third embodiment of the present invention.

Fig. 15 is a view showing the state of use of the probe structure of the third embodiment of the present invention.

The following is a description of an embodiment of the "probe assembly" disclosed in the present application by a specific specific example, which can be disclosed by those skilled in the art. Solve the advantages and effects of this creation. The present invention may be implemented or applied in various other specific embodiments, and various details in the present specification may be made based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be delineated by actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, etc., these elements or signals are not limited by these terms. These terms are used to distinguish one element from another, or a signal and another. Also, as used herein, the term "or" may include all combinations of any one or more of the associated listed items.

[First Embodiment]

First, referring to FIG. 1 to FIG. 4, and referring to FIG. 9 at the same time, FIG. 1 and FIG. 2 are respectively a perspective view of the probe structure of the first embodiment of the present invention, and FIG. 3 is a first embodiment of the present creation. FIG. 4 is a schematic side view of the probe structure of the first embodiment of the present invention, and FIG. 9 is a side view of the probe assembly of the second embodiment of the present invention. As shown in FIG. 9, one embodiment of the present invention provides a probe assembly P including two probe structures (1a, 1b) and a capacitor element 6, and the capacitor element 6 can be electrically connected to two probe structures. Between (1a, 1b). It should be particularly noted that the first embodiment will first introduce the main technical features of the probe structure 1 (probe structures 1a and 1b) in the authoring probe assembly M, and the second embodiment and the third embodiment will be further described. Probe assembly P and probe assembly M.

In view of the above, please refer to FIG. 1 to FIG. 4, since the two probe structures (1a, 1b) in the probe assembly P in FIG. 9 are similar, one of the probe structures 1 (probe structure) will be described below. The structures of 1a and 1b) will be described. In detail, the probe structure 1 can include a first contact segment 11 , a first connecting segment 12 , a second connecting segment 13 and a second contact segment 14 . The first connecting section 12 can be connected to the first contact section 11 and the second connection The segment 13 can be connected to the first connecting segment 12 and the second contact segment 14 can be connected to the second connecting segment 13. Further, in the present embodiment, the probe structure 1 is a cantilever probe structure 1.

As shown in FIG. 1 and FIG. 2 , the first contact segment 11 can have an abutting portion 111 and a first end portion 112 connected to the abutting portion 111 , and the second contact portion 14 can have a first contact portion 11 . Second end portion 141. In the present embodiment, the first contact segment 11 can be the tail of the probe structure 1 for contact with a transitional membrane (eg, the substrate 2 of FIG. 14) (eg, the conductive structure 21 of FIG. 14). Docked. In addition, the second end portion 141 of the probe structure 1 may have a pointed needle shape to scratch the oxide layer on the surface of the solder ball of the object to be tested. However, in other embodiments, the second end portion of the probe structure 1 141 can also be a plane, this creation is not limited to this.

As described above, referring to FIGS. 1 to 3, the extending direction (Z direction) of the first contact portion 11 and the extending direction (negative Z direction) of the second contact portion 14 are different from each other. Further, for example, as shown in FIG. 3, the extending direction of the first contact segments 11 is substantially opposite to and parallel to the extending direction of the second contact segments 14. Further, the first contact segment 11 and the first connecting segment 12 may extend toward a first direction (Z direction), and the second connecting segment 13 may extend toward a second direction (X direction), the first direction and the second direction The directions are different from one another, and in the present inventive embodiment, the first direction can be substantially perpendicular to the second direction. Additionally, the second contact segment 14 can extend toward a third direction (negative Z direction), the third direction can be different from the second direction and, in the case of the present creative embodiment, the third direction can be substantially perpendicular to the second direction . However, this creation is not limited to the examples given above.

5 and FIG. 6, FIG. 5 is a side cross-sectional view taken along line V-V of FIG. 1, and FIG. 6 is a side cross-sectional view taken along line VI-VI of FIG. In the present inventive embodiment, the cross-sectional shape of the first connecting section 12 perpendicular to the extending direction of the first connecting section 12 and the cross-sectional shape of the second connecting section 13 perpendicular to the extending direction of the second connecting section 13 Different from each other. That is, the cross section of the first connecting section 12 is perpendicular to the extending direction of the first connecting section 12, the cross section of the second connecting section 13 is perpendicular to the extending direction of the second connecting section 13, and the cross section of the first connecting section 12 cut The shape of the face and the shape of the cross section of the second connecting section 13 are different from each other. Preferably, in the present inventive embodiment, the area of the cross section of the first connecting section 12 may be larger than the area of the cross section of the second connecting section 13.

Further, as shown in FIG. 5 and FIG. 6 , preferably, the cross-sectional shape of the first connecting section 12 may have a rectangular shape (for example, the first connecting section 12 is a columnar structure), and The cross-sectional shape of the two connecting segments 13 and/or the second contact segments 14 may be in the form of a sheet (a rectangular shape in the form of a sheet, for example, the second connecting portion 13 and/or the second connecting portion 14 are in the form of a sheet). Type, in addition, the columnar structure is different from the shape of the sheet structure. Further, in the present inventive embodiment, the probe structure 1 is preferably a probe manufactured by Microelectromechanical Systems (MEMS) technology. In other words, the rectangular probe structure 1 of the present embodiment is completely different from the circular probe in the manufacturing process.

Further, referring to FIG. 1 , FIG. 2 and FIG. 4 , the first connecting section 12 is connected to the second connecting section 13 , and further, the first connecting section 12 can form a bare surface relative to the second connecting section 13 . 121. That is, since the cross-sectional shape of the first connecting section 12 and the cross-sectional shape of the second connecting section 13 have distinct characteristics in size, the first connecting section 12 and the second connecting section 13 can have A bare surface 121. Thereby, there may be a difference between the first connecting section 12 and the second connecting section 13 and a non-continuous arrangement on the overall structure. Furthermore, the junction between the first connecting section 12 and the second connecting section 13 is a turning point, and the turning point may have a bare surface 121.

In the above, as shown in FIG. 6, in any cross section of the second connecting section 13, the second connecting section 13 may have a first side (not labeled) and a second side (Fig. The first side edge may have a first width F1, and the second side edge may have a second width F2. The size of the first width F1 may be smaller than the size of the second width F2. That is, the sheet structure may have a first width F1 and a second width F2, and the size of the first width F1 is smaller than the size of the second width F2. Preferably, the ratio of the first width F1 to the second width F2 may be between 0.2 and 0.5, for example, the first width F1 It can be 0.1 mm (millimeter, mm), and the second width F2 can be between 2 mm and 5 mm, but the creation is not limited thereto. Further, since the direction in which the second contact segment 14 is forced is the Z direction, the length direction (the extending direction) of the second side is toward the third direction (negative Z direction), and the second connecting portion 13 is smaller. The first side of the dimension is in contact with the first connecting section 12, and therefore, although the dimension of the first width F1 is smaller than the dimension of the second width F2, the force of the second end portion 141 abutting on the object to be tested can be maintained.

1 and 2, although the abutting portion 111 of the first contact portion 11 in the drawings is an inverted hook shape, in other embodiments, the abutting portion The shape of the 111 may also be concave, and the present creation is not limited thereto. Furthermore, in other embodiments, the probe structure 1 may have a plurality of abutting portions 111, and the present invention is not limited thereto.

Next, please refer to FIG. 7 and FIG. 8. FIG. 7 and FIG. 8 are respectively side views of other embodiments of the probe structure of the first embodiment. In detail, in other embodiments, the shape of the probe structure 1 can also be adjusted. For example, in the embodiment of FIGS. 7 and 8 , the second connecting section 13 and the first part of the probe structure 1 can be adjusted. The shape of the two contact segments 14 is adapted to be applied to different side objects. It should be noted that the present invention is not limited to the appearance of the second connecting portion 13 and the second contact portion 14.

[Second embodiment]

First, referring to FIG. 9 and FIG. 10, FIG. 9 and FIG. 10 are respectively a schematic perspective view and a perspective exploded view of the probe assembly of the second embodiment of the present invention. The second embodiment of the present invention provides a probe assembly P comprising two probe structures (1a, 1b) and a capacitor element 6, and the capacitor element 6 is electrically connected to the two probe structures (1a, 1b). between. In addition, the two probe structures (1a, 1b) provided in the second embodiment are similar to the probe structure 1 in the foregoing embodiment, and will not be described again. Therefore, when referring to the contents shown in FIG. 9 and FIG. 10, please refer to FIG. 1 to FIG.

Further, as shown in FIG. 9 and FIG. 10 , the capacitor element 6 may include a carrier 61 and a capacitor disposed on the carrier 61 and electrically connected to the carrier 61 . 62. For example, the capacitor member 62 can be a multilayer ceramic capacitor or a thin film flat panel capacitor, but the creation is not limited thereto. Thereby, the resonance point of the capacitive element 6 can be used to adjust the impedance of the power source at different frequencies to avoid voltage drop of the power signal. For example, when the transmission path from the object to be tested is shorter, the inductance in the path is smaller, so that a capacitor with a smaller capacitance value can be used, and the corresponding resonance point can be suppressed at a higher frequency band position. The higher frequency band supply impedance can ultimately be applied to higher frequency band test scenarios to meet future needs. At the same time, through the setting of the capacitive element 6, the power supply required for the object to be tested can be provided nearby, and the interference of the inductance in the path can be avoided to improve the power integrity (PI).

As shown in FIG. 9 and FIG. 10, in the present embodiment, the carrier 61 may include a carrier 611, a first conductive portion 612 disposed on the carrier 611, and a carrier 611. And the second conductive portion 613 separated from the first conductive portion 612 from each other. Further, the two ends of the capacitor 62 can be electrically connected to the first conductive portion 612 and the second conductive portion 613, respectively. At the same time, the first conductive portion 612 can be electrically connected to one of the probe structures 1a, and the second conductive portion 613 can be electrically connected to the other probe structure 1b. For example, in the present embodiment, the first conductive portion 612 can be electrically connected to the exposed surface 121 of one of the probe structures 1a, and the second conductive portion 613 can be electrically connected to the other probe structure 1b. Exposed surface 121, but this creation is not limited to this.

Referring to the above, please refer to FIG. 9 and FIG. 10, and please refer to FIG. 12 at the same time. In the embodiment of FIG. 9 and FIG. 10, the capacitor member 62 is disposed on the upper surface of the carrier 61, that is, The capacitor member 62 is disposed in a direction toward the Z direction. However, in the embodiment of FIG. 11, the capacitor member 62 may also be disposed in a direction toward the Z direction, which is not limited thereto. It should be noted that the position of the capacitor member 62 can be adjusted by changing the arrangement of the first conductive portion 612 and the second conductive portion 613, and the specific adjustment manner will not be repeated herein.

[Third embodiment]

First, referring to FIG. 12 to FIG. 15 , a third embodiment of the present invention provides a probe assembly M (or a probe card device). As can be seen from a comparison between FIG. 14 and FIG. 9 , the third embodiment and the third embodiment The biggest difference between the two embodiments is that the probe assembly P provided by the second embodiment can be further used in combination with the substrate 2, the first plate 3, the second plate 4, and the fixing member 5 to form the third embodiment. Probe assembly M is provided. It should be particularly noted that, in order to facilitate the understanding of the present embodiment, FIGS. 12 to 15 only show the partial configuration of the probe assembly M in order to clearly present the respective component configurations and connection relationships of the probe assembly M. The respective component configurations of the probe assembly M and their connection relationships will be separately described below. In addition, the probe structure 1 (the probe structures 1a and 1b) provided in the third embodiment is similar to the structure in the foregoing embodiment, and will not be described again. Therefore, when referring to the contents shown in FIGS. 12 to 14, please refer to FIG. 1 to FIG. 2 again. Furthermore, it should be noted that, in order to facilitate the understanding of the present embodiment, FIG. 12 shows only one of the probe structures 1a, and the following description will be described with one of the probe structures 1a.

The third embodiment of the present invention provides a probe assembly M including a substrate 2, a first plate 3, and two probe structures 1 (probe structures 1a and 1b). And a capacitive element 6. The substrate 2 can have a plurality of conductive structures 21. For example, the substrate 2 can be a transfer panel or a Space Transformer (ST) for wafer testing. In addition, in other embodiments, the substrate 2 can also be a printed circuit board, that is, since the probe structure 1a can be fabricated by MEMS technology, and the size is small, it is not necessary to provide a space converter. Rather, the probe structure 1a is placed directly on the printed circuit board, whereby the probe structure 1a can be electrically connected to the conductive structure 21 of the printed circuit board.

As shown in FIG. 12, the first plate body 3 may have a plurality of first through holes 31 and a plurality of top abutting portions 32, and each of the top abutting portions 32 is adjacent to the corresponding first through hole 31, respectively. Each of the first through holes 31 has a first aperture H1. In addition, preferably, in the present embodiment, the probe assembly M may further include a second plate body 4, and the second plate body 4 may have a plurality of second through holes 41. For example, the second plate 4 can be large Parallel to the first plate body 3, the positions of the plurality of second through holes 41 respectively correspond to the positions of the plurality of first through holes 31, and each of the second through holes 41 has a second hole diameter H2.

Referring to the above, please refer to FIG. 12 and FIG. 15, and as shown in FIG. 1 and FIG. 2 together, the two probe structures 1 (the probe structures 1a and 1b) may respectively include a first contact segment 11 a first connecting section 12, a second connecting section 13, and a second contact section 14. The first connecting section 12 can be connected to the first connecting section 11 , the second connecting section 13 can be connected to the first connecting section 12 , and the second connecting section 14 can be connected to the second connecting section 13 . Meanwhile, the first contact portion 11 may have an abutting portion 111 and a first end portion 112 connected to the abutting portion 111, and the second contact portion 14 has a second end portion 141. Further, as shown in FIG. 15, the capacitive element 6 can be electrically connected between the two probe structures (1a, 1b). In other words, the two ends of the capacitor 62 can be electrically connected to the first conductive portion 612 and the second conductive portion 613, respectively. At the same time, the first conductive portion 612 can be electrically connected to one of the probe structures 1a, and the second conductive portion 613 can be electrically connected to the other probe structure 1b. It should be noted that the probe structure 1 (the probe structures 1a and 1b) provided in the third embodiment is similar to the structure in the foregoing embodiment, and details are not described herein again.

Next, referring to FIG. 12, in FIG. 12, the manner in which one of the probe structures 1a and the substrate 2, the first plate body 3, the second plate body 4, and the fixing member 5 are fixed will be described. In detail, the size of a maximum outer diameter W of the first contact segment 11 may be smaller than the size of the first aperture H1 of the first through hole 31, so that two probe structures 1 (the probe structures 1a and 1b) are The first contact segments 11 can pass through the two first through holes 31, respectively. In addition, the size of the maximum outer diameter W of the first contact segment 11 may also be smaller than the size of the second aperture H2 of the second through hole 41, so that the two probe structures 1 (the probe structures 1a and 1b) have two A contact section 11 can pass through the two second through holes 41, respectively. Furthermore, the two first contact segments 11 of the two probe structures 1 (the probe structures 1a and 1b) can be electrically connected to the two conductive structures 21, respectively.

Next, referring to FIG. 13, the user can move the first plate 3 and the second plate 4 to each other such that the first plate 3 and the second plate 4 are displaced from each other. That is, the first plate 3 can be moved in the X direction, and the second plate 4 can be directed to the negative X. direction. Thereby, the two abutting portions 111 of the two probe structures 1 (the probe structures 1a and 1b) can respectively abut against the two abutting portions 32 to achieve the effect of positioning the probe structure.

Next, referring to FIG. 14, the probe assembly M preferably further includes a fixing member 5 (for example, the fixing member 5 can be, for example but not limited to, a screw), and the fixing member 5 can be disposed on the substrate 2, A plate body 3 and a second plate body 4 are disposed such that each of the abutting portions 111 of each of the probe structures (1a, 1b) abuts against each of the corresponding abutting portions 32. In other words, the fixing member 5 can be used to position the relative positions of the probe structure 1 (the probe structures 1a and 1b) with the substrate 2, the first plate body 3, and the second plate body 4. In addition, it should be noted that since each probe structure 1 (the probe structures 1a and 1b) abuts against the corresponding abutting portion 32 through the abutting portion 111, respectively, the probe structure 1 (probe) Structures 1a and 1b) are positioned. Thereby, when one of the probe structures 1 (the probe structures 1a and 1b) is damaged, the faulty probe structure can be replaced by moving the first plate body 3 and the second plate body 4.

Referring to FIG. 15 , it is worth noting that since the cross-sectional shape of the first connecting section 12 can be a rectangular shape, the cross-sectional shape of the second connecting section 13 can be in the form of a sheet (flaky Rectangular shape. Therefore, after the second plate body 4 is disposed, the first contact segment 11 and the first connecting segment 12 (the partial first connecting segment 12 or all the first connecting segments 12) are embedded in the second plate body 4 After the connection with the substrate 2, interference between the second connecting segments 13 of the two probe structures 1 (the probe structures 1a and 1b) can be avoided.

Meanwhile, as shown in FIG. 15, when a plurality of probe structures 1 are provided, a capacitor element 6 may be further disposed between the two probe structures (1a, 1b) to improve power integrity (power integrity). , PI). Further, the other plurality of probe structures 1 may be arranged according to the measurement array design of the probe card. Further, the plurality of probe structures 1 (the probe structures 1a and 1b) may have configurations different from each other (for example, At least two of the plurality of probe structures 1 have different lengths). That is to say, the arrangement angle of each probe structure 1 can be adjusted according to requirements. In addition, the second contact segment 14 of the probe structure 1 can be electrically connected to the object to be tested N.

[Advantageous Effects of Embodiments]

One of the beneficial effects of the present invention is that the probe assembly P provided by the present embodiment can utilize "the capacitive element 6 is electrically connected between the two probe structures 1 (the probe structures 1a and 1b)" The technical solution can reduce the influence of the inductance in the transmission path of the probe structure 1 to improve the power integrity.

In addition, the probe assembly M of the present embodiment can also enable the probe structure 1 (the probe structures 1a and 1b) to be separately exchanged by the technical solution that the first contact segment 11 has an abutting portion 111. To form an alternative probe structure 1, the maintenance cost is reduced. At the same time, compared with the existing cantilever probe structure, the existing cantilever probe impedance discontinuous transmission path can be shortened, and the signal quality (Signal Integrity, SI) of the transmission quality is improved.

Furthermore, since the probe structure 1 provided in the present embodiment is a cantilever probe structure 1, the tip is guided outward, so that a plurality of different first and third plates can be utilized. The body 4 and the fixing member 5 fix the probe structure 1 to the substrate 2. Further, the probe structure 1 of different lengths can be utilized to reduce the processing difficulty of fine pitch. In addition, since the cross-sectional shape of the second connecting portion 13 may be in the form of a sheet (sheet-like rectangular shape) (the first connecting portion 12 is a columnar structure, the second connecting portion 13 is a one-piece structure, and The shape of the columnar structure is different from that of the sheet-like structure, and therefore, not only can the requirements of the micro-pitch be provided, but also the required strength of the supporting force can be provided.

Further, the abutting portions 111 of the probe structure 1 can respectively abut against the top abutting portions 32 of the corresponding first plate body 3, so that the probe structure 1 can be positioned on the substrate 2 so that the probes The first contact segment 11 of the structure 1 is electrically connected to the conductive structure 21 on the substrate 2.

The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the scope of protection of the present creation. Inside.

Claims (16)

A probe assembly comprising: two probe structures, each of the probe structures comprising a first contact segment, a first connecting segment, a second connecting segment and a second contact segment, the first a connecting segment connected to the first contact segment, the second connecting segment being connected to the first connecting segment, the second contact segment being connected to the second connecting segment; and a capacitive element, the capacitive component Electrically connected between the two probe structures. The probe assembly of claim 1, wherein a cross section of the first connecting section is perpendicular to an extending direction of the first connecting section, and a cross section of the second connecting section is perpendicular to the second connection The extending direction of the segments, and the shape of the cross section of the first connecting segment and the shape of the cross section of the second connecting segment are different from each other. The probe assembly of claim 2, wherein an area of the cross section of the first connecting section is larger than an area of the cross section of the second connecting section. The probe assembly of claim 1, wherein the two probe structures are each a cantilever probe structure. The probe assembly of claim 1, wherein the extending direction of the first contact segment and the extending direction of the second contact segment are different from each other. The probe assembly of claim 1, wherein the first connecting section is a columnar structure, the second connecting section is a sheet-like structure, and the columnar structure and the shape of the sheet-like structure different. The probe assembly of claim 1, wherein the first contact segment and the first connecting segment extend toward a first direction, and the second connecting segment extends toward a second direction, the first The direction and the second direction are different from each other. The probe assembly of claim 1, wherein the first contact segment has an abutting portion and a first end portion coupled to the abutting portion, the second contact portion having There is a second end. The probe assembly of claim 8, wherein the abutting portion is capable of abutting against a top abutting portion of a first plate. The probe assembly of claim 1, wherein the capacitive element comprises a carrier and a capacitor disposed on the carrier and electrically connected to the carrier, wherein the carrier comprises a carrier, a first conductive portion disposed on the carrier, and a second conductive portion disposed on the carrier and separated from the first conductive portion, the two ends of the capacitor are electrically connected And the first conductive portion and the second conductive portion. The probe assembly of claim 10, wherein a first exposed portion and the second connecting portion have a bare surface, and the first conductive portion is electrically connected to one of the probe structures The exposed surface, the second conductive portion is electrically connected to the exposed surface of another one of the probe structures. A probe assembly comprising: a substrate having a plurality of conductive structures; a first plate having a plurality of first through holes and a plurality of abutting portions, each of the The top abutting portion is adjacent to the corresponding first through hole; two probe structures, each of the probe structures includes a first contact segment, a first connecting segment, a second connecting segment and a second a contact segment, the first connecting segment is connected to the first connecting segment, the second connecting segment is connected to the first connecting segment, and the second connecting segment is connected to the second connecting segment, wherein The first contact segment has an abutting portion and a first end portion connected to the abutting portion, the second contact portion has a second end portion, and a capacitive element, the capacitive element is electrically Connected between two of the probe structures; wherein two of the first contact segments of the two probe structures pass through the two first through holes respectively; wherein the two probes Two of the first contact segments of the structure are electrically connected And two of the conductive structures; wherein the two abutting portions of the two probe structures respectively abut against the two abutting portions. The probe assembly of claim 12, further comprising: a second plate body having a plurality of second through holes, the second plate body being substantially parallel to the first plate body The positions of the plurality of the second through holes respectively correspond to the positions of the plurality of the first through holes. The probe assembly of claim 13, further comprising: a fixing member disposed on the substrate, the first plate body and the second plate body to make the two The two abutting portions of the probe structure respectively abut against the two abutting portions. The probe assembly of claim 12, wherein the capacitive element comprises a carrier and a capacitor disposed on the carrier and electrically connected to the carrier, wherein the carrier comprises a carrier, a first conductive portion disposed on the carrier, and a second conductive portion disposed on the carrier and separated from the first conductive portion, the two ends of the capacitor are electrically connected And the first conductive portion and the second conductive portion. The probe assembly of claim 15, wherein a first surface of the probe structure has a bare surface between the first connecting portion and the second connecting portion, and the first conductive portion is electrically connected thereto The exposed surface of one of the probe structures, the second conductive portion being electrically connected to the exposed surface of another one of the probe structures.