TWM558470U - Packaging structure of diode - Google Patents

Abstract

The present invention proposes a diode package structure including a package body, a diode chip, a first conductive pin and a second conductive pin. The package has two openings respectively located at the bottom of the first side and the second side of the package. The diode chip is disposed in the package body, and the diode chip includes two electrodes, and the first electrode and the second electrode respectively face the top and the bottom of the package. One end of the first conductive pin contacts the first electrode and extends from the first electrode toward the first side, and the first conductive pin is bent relative to the first side and the bottom of the package to protrude from the package via the first opening. One end of the second conductive pin contacts the second electrode and extends from the second electrode toward the second side, and the second conductive pin is bent relative to the second side and the bottom of the package to protrude from the package via the second opening.

Description

Diode package structure

This case is about a diode package structure.

Nowadays, electronic packaging technology has gradually changed from the traditional dual in-line package (DIP) to Surface Mounted Technology (SMT). The process of electronic components conforming to the surface adhesion technology has been processed quickly. The advantage of simple processing.

1 is a diode package structure conforming to the surface adhesion technology. The diode package structure 4 includes a diode chip soldered to the conductive pins 41 and 42 to enable the diode package structure 4 to be soldered. In the manufacturing of the diode package structure 4, the conductive pins 41 and 42 exposed outside the package body 43 must be bent, and the stress generated by bending the conductive pins 41 and 42 may damage the second. The soldering between the diode wafers in the polar package structure 4 and the conductive leads 41, 42 causes a problem of weak soldering or even disconnection between the diode wafer and the conductive leads 41, 42.

In view of this, the present invention proposes a diode package structure.

In one embodiment, the diode package structure includes a package body, a diode chip, a first conductive pin, and a second conductive pin. The package has a first opening and a second opening, the first opening is located at the bottom of the first side of the package, and the second opening is located at the bottom of the second side of the package. The diode chip is disposed in the package body, and the diode chip includes a first electrode and a second electrode, the first electrode faces the top of the package body, and the second electrode faces the bottom of the package body. One end of the first conductive pin contacts the first electrode, the first conductive pin extends from the first electrode toward the first side, and the first conductive pin is bent relative to the first side and the bottom of the package by the first The opening protrudes from the package. One end of the second conductive pin contacts the second electrode, the second conductive pin extends from the second electrode toward the second side, and the second conductive pin is bent relative to the second side and the bottom of the package via the second The opening protrudes from the package.

In one embodiment, the package further includes a trench, and the bottom of the package includes an upper surface and a lower surface, the upper surface of the bottom portion faces the second electrode of the diode wafer, and the lower surface of the bottom surface is formed. There are grooves mentioned above.

In an embodiment, the aforementioned trench includes a first slot segment and a second slot segment, the first slot segment being perpendicular to the second slot segment.

In one embodiment, the aforementioned trench includes a first slot segment and a second slot segment, the first slot segment being parallel to the second slot segment.

In one embodiment, the portion of the first conductive pin protruding from the outside of the package and the portion of the second conductive pin protruding from the outside of the package are in the same plane.

In one embodiment, the entirety of the portion of the first conductive pin protruding from the outside of the package extends only in one direction, and the entirety of the portion of the second conductive pin protruding from the outside of the package extends only in the other direction. .

In one embodiment, the first conductive pin has two bends, and the two bends of the first conductive pin are located in the package body, and the second conductive pin has two bends, and the second conductive pin The two bends are located inside the package.

In one embodiment, the foregoing diode package further includes a colloid, and the colloid is filled between one of the two bends of the first conductive pin and one side of the diode wafer. And the colloid is filled between the bent portion of the first conductive pin and the first side of the package, and the colloid is filled between the bent portion of the second conductive pin and the second portion of the package Between the sides.

In summary, according to one embodiment of the diode package structure of the present invention, the bends included in the two conductive pins of the diode package are formed in the package, so as to avoid conforming to the surface adhesion. In the diode structure of the technology, the two conductive pins are exposed in the outer surface of the package to break the soldering of the two conductive pins and the two electrodes in the package body, resulting in weak soldering between the two conductive pins and the two electrodes. Is the problem of disconnection.

2 and 3 are a top view and a bottom view, respectively, of an embodiment of a diode package according to the present invention, and FIG. 4 is a cross-sectional view of the diode package structure illustrated in FIGS. 2 and 3 taken along line A-A. Referring to FIG. 2 to FIG. 4 , the diode package structure 1 conforms to the surface adhesion technology, and the diode package structure 1 includes the package body 11 , the diode chip 12 , the first conductive pin 13 and the second conductive pin 14 . .

The package body 11 has a top portion 111, a bottom portion 112, two side surfaces 113, 114 (hereinafter referred to as a first side surface 113 and a second side surface 114 for convenience of description), a first opening 115 and a second opening 116. The first opening 115 is located in the package. At the bottom of the first side 113 of the body 11, the second opening 116 is located at the bottom of the second side 114 of the package 11.

The diode chip 12 is disposed in the package body 11. The diode chip 12 includes a first electrode 121 and a second electrode 122. The first electrode 121 faces the top portion 111 of the package body 11, and the second electrode 122 faces the bottom portion 112 of the package body. The first electrode 121 is adjacent to the top portion 111 of the package 11 than the second electrode 122. The first electrode 121 and the second electrode 122 are configured to receive a voltage to cause the diode wafer 12 to operate. In an embodiment, the first electrode 121 may be a positive electrode, and the second electrode 122 may be a negative electrode; in another embodiment, the first electrode 121 may be a negative electrode, and the second electrode 122 may be a positive electrode.

The first conductive pin 13 includes opposite ends, one end of which contacts the first electrode 121, the first conductive pin 13 extends from the first electrode 121 toward the first side 113, and the first conductive pin 13 is opposite to the first The side surface 113 and the bottom portion 112 of the package body 11 are bent and protruded from the package body 11 via the first opening 115. The first conductive pin 13 can be soldered to the circuit board and transfer the voltage received from the outside of the package body 11 to the first electrode. 121. Similarly, the second conductive pin 14 also includes opposite ends, one end of which contacts the second electrode 122, and the second conductive pin 14 extends from the second electrode 122 toward the second side 114, and the second conductive pin 14 is bent relative to the second side 114 and the bottom 112 of the package 11 and protrudes from the package 11 via the second opening 116. The second conductive pin 14 can be soldered to the circuit board and transmit the voltage received from the outside of the package 11. To the second electrode 122.

Therefore, the first conductive pin 13 and the second conductive pin 14 respectively comprise two bends, and the bending of the first conductive pin 13 and the second conductive pin 14 are located in the package body 11, in the manufacturing second In the case of the polar package structure 1, the first conductive pin 13 and the second conductive pin 14 having the bend may be formed first, that is, the first conductive pin 13 and the second conductive pin 14 are fixed to the two electrodes 121. First, the first conductive pin 13 and the second conductive pin 14 are bent to form a first conductive pin 13 and a second conductive pin 14 having two bends, and then have two One end of the first conductive pin 13 and the second conductive pin 14 at the bend is respectively fixed to the first electrode 121 and the second electrode 122, and finally covers the diode wafer 12 and a portion of the first conductive portion with the package 11. The lead 13 and a portion of the second conductive pin 14 complete the fabrication of the diode package structure 1. In the foregoing manufacturing process, after the first conductive pin 13 and the second conductive pin 14 are respectively fixed to the first electrode 121 and the second electrode 122, the portion 13A and the portion of the first conductive pin 13 need not be further The portion 14A of the two conductive pins 14 is bent, so that the stress between the two conductive pins 13, 14 and the two electrodes 121, 122 is not damaged by bending the two conductive pins 13, 14 to cause two conductive The problem of the soldering between the pins 13, 14 and the two electrodes 121, 122 is not strong.

In one embodiment, the diode wafer 12 may be a Schottky diode or a Zener diode, and the material of the diode wafer 12 may include germanium. The first electrode 121, the second electrode 122, the first conductive pin 13 and the second conductive pin 14 may be made of a metal material or alloy such as gold, copper or aluminum. The first conductive pin 13 can be fixed to the first electrode 121 through a die bond material such as solder or silver paste. The second conductive pin 14 is similarly fixed to the second electrode 122 through a die bond material such as solder or silver paste.

In one embodiment, the bottom portion 112 of the package 11 includes an upper surface 112A that faces the second electrode 122 of the diode wafer 12 and a lower surface 112B that is away from the diode wafer 12 from the upper surface 112A. The lower surface 112B is formed with a groove 117. When the diode package structure 1 is soldered to the circuit board, the lower surface 112B of the bottom portion 112 of the package body 11 faces the circuit board, and the bottom surface 112 of the package body 11 can be dispensed, so that the bottom portion 112 of the package body 11 is grooved. The glue in 117 is adhered to the surface of the circuit board, so that the diode package structure 1 is more firmly fixed on the circuit board.

In an embodiment, the trench 117 can include a first slot segment 117A and a second slot segment 117B, the first slot segment 117A being perpendicular to the second slot segment 117B. Dispensing in the first slot section 117A and the second slot section 117B that are perpendicular to each other causes the bottom portion 112 of the package body 11 to be firmly adhered to the surface of the circuit board. In other embodiments, the trench 117 may further comprise a plurality of mutually parallel slot segments such that the bottom portion 112 of the package 11 is firmly bonded to the surface of the circuit board.

In an embodiment, since the two bends of the first conductive pin 13 and the two bends of the second conductive pin 14 are located in the package body 11, there is no need to manufacture the diode package structure 1 again. The first conductive pin 13 protrudes from the portion 13A outside the package 11 and the second conductive pin 14 protrudes from the portion 14A outside the package 11 to be bent. Therefore, the portion 13A of the first conductive pin 13 is not bent, and the entirety of the portion 13A of the first conductive pin 13 protruding from the package 11 extends only in the same direction, and the portion of the second conductive pin 14 14A is also not bent, and the entirety of the portion 14A of the second conductive pin 14 protruding from the package 11 extends only in the same direction, so that the portion 13A and the second conductive portion of the first conductive pin 13 can be avoided. The portion 14A of the pin 14 is bent to break the soldering between the two conductive pins 13, 14 and the two electrodes 121, 122 in the package 11.

In an embodiment, the portion 13A of the first conductive pin 13 protruding from the outside of the package 11 and the portion 14A of the second conductive pin 14 protruding from the outside of the package 11 may be along the bottom portion 112 of the package 11. The surface direction of the surface 112A and the lower surface 112B extends, and the portion 13A of the first conductive pin 13 and the portion 14A of the second conductive pin 14 may extend in opposite directions.

In one embodiment, the portion 13A of the first conductive pin 13 protruding from the first opening 115 and the portion 14A of the second conductive pin 14 protruding from the second opening 116 are on the same horizontal surface, which can cause the two poles The body package structure 1 is soldered to the circuit board more flatly, and it is easier to control the amount of solder required for soldering when soldering the diode package structure 1 to the circuit board. Furthermore, the portion 13A of the first conductive pin 13 protruding from the first opening 115 and the portion 14A of the second conductive pin 14 protruding from the second opening 116 are flat, and the first conductive pin having a flat shape 13 and the second conductive pin 14 have a large soldering area, and the diode package structure 1 can be soldered to the circuit board more firmly.

In one embodiment, the diode wafer 12 further includes a first side 123 toward the first side 113 of the package 11 and a second side 124 toward the second side 114 of the package 11. The diode package structure 1 may further comprise a colloid, and the colloid may be filled in the package body 11. The material of the gel may be an epoxy resin encapsulation material (Epoxy molding compound). The colloid may be filled between the bent portion between the first side 123 of the diode wafer 12 and the two bends of the first conductive pin 13, and the colloid may be filled in the aforementioned bent portion and the package 11 Between the first side faces 113, and the colloid can be filled between the bend between the two bends of the second conductive pin 14 and the second side 114 of the package 11. The first conductive pin 13 and the second conductive pin 14 are fixed in the package 11 so that the first conductive pin 13 and the second conductive pin 14 are more firmly fixed in the package 11 . The diode package structure 1 is not easily moved by force after the first conductive pin 13 and the second conductive pin 14 are soldered to the circuit board.

5 and FIG. 6 are cross-sectional views showing different embodiments of the diode package structure according to the present invention. As shown in other embodiments of the embodiment shown in FIG. 5 and FIG. 6, the two conductive pins 21 of the diode package structure 2 are shown. The bends included in the 22 are also located in the package body 23. The bends included in the two conductive pins 31 and 32 of the diode package structure 3 are also located in the package body 33, so that the formation of the diode body can be avoided. The package structures 2, 3 are broken between the conductive pins 21, 22, 31, 32 and the electrodes in the package 23 by bending portions of the conductive leads 21, 22, 31, 32 exposed outside the packages 23, 33, The problem of welding within 33.

In summary, according to one embodiment of the diode package structure of the present invention, the bends included in the two conductive pins of the diode package are formed in the package, so as to avoid conforming to the surface adhesion. In the diode structure of the technology, the two conductive pins are exposed in the outer surface of the package to break the soldering of the two conductive pins and the two electrodes in the package body, resulting in weak soldering between the two conductive pins and the two electrodes. Is the problem of disconnection.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of the creation is subject to the definition of the scope of the patent application attached.

1‧‧‧ Diode package structure
11‧‧‧Package
111‧‧‧ top
112‧‧‧ bottom
112A‧‧‧Upper surface
112B‧‧‧ lower surface
113‧‧‧ first side
114‧‧‧ second side
115‧‧‧ first opening
116‧‧‧second opening
117‧‧‧ trench
117A‧‧‧first slot
117B‧‧‧Second trough section
12‧‧‧ Diode Wafer
121‧‧‧First electrode
122‧‧‧second electrode
123‧‧‧First side
124‧‧‧Second side
13‧‧‧First conductive pin
13A‧‧‧The first conductive pin protrudes from the first opening
14‧‧‧Second conductive pin
14A‧‧‧The second conductive pin protrudes from the second opening
2‧‧‧ Diode package structure
21‧‧‧Electrical pins
22‧‧‧Electrical pins
23‧‧‧Package
3‧‧‧ Diode package structure
31‧‧‧Electrical pins
32‧‧‧Electrical pins
33‧‧‧Package
4‧‧‧ Diode package structure
41‧‧‧Electrical pins
42‧‧‧Electrical pins
43‧‧‧Package

[Fig. 1] It is a conventional diode package structure conforming to the surface adhesion technique. [Fig. 2] is a plan view of an embodiment of a diode package according to the present invention. [Fig. 3] is a bottom view of an embodiment of a diode package structure according to the present invention. 4 is a cross-sectional view of the diode package structure illustrated in FIGS. 2 and 3 taken along line A-A. Fig. 5 is a cross-sectional view showing another embodiment of a diode package structure according to the present invention. Fig. 6 is a cross-sectional view showing still another embodiment of the diode package structure according to the present invention.

Claims (8)

A diode package structure comprising: a package having a first opening and a second opening, the first opening being located at a bottom of a first side of the package, the second opening being located in the package a bottom surface of the second side; a diode chip disposed in the package, the diode chip includes a first electrode and a second electrode, the first electrode facing the top of the package, the second electrode a first conductive pin, one end of which contacts the first electrode, the first conductive pin extends from the first electrode toward the first side, and the first conductive pin is opposite The first side and the bottom of the package are bent to protrude from the package through the first opening; and a second conductive pin has one end contacting the second electrode, and the second conductive pin is from the first The second electrode extends toward the second side, and the second conductive pin is bent relative to the second side and the bottom of the package to protrude from the package via the second opening. The package of claim 1 further comprising a trench, wherein the bottom of the package includes an upper surface and a lower surface, the upper surface facing the second electrode, the lower surface being formed The groove. The diode package structure of claim 2, wherein the trench comprises a first slot segment and a second slot segment, the first slot segment being perpendicular to the second slot segment. The diode package structure of claim 2, wherein the trench comprises a first slot segment and a second slot segment, the first slot segment being parallel to the second slot segment. The diode package structure of claim 2, wherein the portion of the first conductive pin protruding from the outside of the package and the portion of the second conductive pin protruding from outside the package are in the same plane. The diode package structure of claim 2, wherein the entirety of the first conductive pin protruding from the outside of the package extends only in one direction, and the second conductive pin protrudes from the outside of the package Part of the whole extends only in the other direction. The diode package structure of any one of claims 1 to 6, wherein the first conductive pin has two bends, and the two bends of the first conductive pin are located in the package body, The second conductive pin has two bends, and the two bends of the second conductive pin are located in the package. The diode package structure of claim 7, further comprising a colloid filling a bend between the two bends of the first conductive pin and one side of the diode wafer Between the sides, and the colloid is filled between the bent portion of the first conductive pin and the first side of the package, and the colloid is filled at the two bends of the second conductive pin Between the bent portion and the second side of the package.