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TWM548274U - Inspection equipment of printed circuit board - Google Patents

Inspection equipment of printed circuit board Download PDF

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Publication number
TWM548274U
TWM548274U TW105215280U TW105215280U TWM548274U TW M548274 U TWM548274 U TW M548274U TW 105215280 U TW105215280 U TW 105215280U TW 105215280 U TW105215280 U TW 105215280U TW M548274 U TWM548274 U TW M548274U
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Taiwan
Prior art keywords
printed circuit
circuit board
light source
reference mark
tested
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TW105215280U
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Chinese (zh)
Inventor
ding-shan Zheng
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Wintank Automation Inc
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Priority to TW105215280U priority Critical patent/TWM548274U/en
Publication of TWM548274U publication Critical patent/TWM548274U/en

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Description

印刷電路板之檢測設備Printed circuit board testing equipment

本創作係關於一種板件之檢測設備,特別是關於一種可快速且準確偵測出表面狀態的印刷電路板之檢測設備。 The present invention relates to a detection device for a panel, and more particularly to a detection device for a printed circuit board that can quickly and accurately detect a surface state.

現代的生活中充滿著各式各樣的電子裝置。位於這些電子裝置內部的印刷電路板(Printed circuit board;PCB),雖然鮮被提及,卻默默扮演著極為重要的角色。印刷電路板除了用來固定各種電子零件,更可依據預先設定的方式來提供電子零件之間的電流連接。因此,無論是單面板(Single-Sided Boards)、雙面板(Double-Sided Boards)、或是多層板(Multi-Layer Boards),為了讓這些電子零件準確地裝設在各自預設的位置上,印刷電路板的檢測成了相當重要的工作。 Modern life is full of various electronic devices. Printed circuit boards (PCBs) located inside these electronic devices, although rarely mentioned, play an extremely important role. In addition to fixing various electronic components, printed circuit boards can provide current connections between electronic components in a predetermined manner. Therefore, whether it is Single-Sided Boards, Double-Sided Boards, or Multi-Layer Boards, in order to accurately mount these electronic components in their respective preset positions, The detection of printed circuit boards has become a very important task.

對於印刷電路板的製造廠商而言,進行各項確保品質控制的檢測項目,以防止將具有瑕疵的印刷電路板出貨給下游廠商,是必須進行的產品監控動作。在各種檢測項目中,印刷電路板的表面平整檢測是印刷電路板品質控制中的一項重要檢測項目。如果引刷電路板的表面不平整,可能會導致後續元件加工出現問題,甚至最終的電子裝置產品也將會出現諸如雜訊,接觸不 良等等的問題。然而,隨著市場需求而暴增的印刷電路板產量,使得需檢測的印刷電路板數量相當龐大,傳統上以人力操作光學儀器來檢測的效率已不堪負荷。現有的平整瑕疵檢測方式多改為自動光學檢查(Automated Optical Inspection;AOI)。習知技藝中,目前最廣為使用的方式,是運用雷射光束的直進特性來進行印刷電路板的檢測。 For manufacturers of printed circuit boards, it is a must-have product monitoring operation to carry out various inspection items to ensure quality control to prevent shipment of defective printed circuit boards to downstream manufacturers. Among various inspection items, surface flatness detection of printed circuit boards is an important test item in the quality control of printed circuit boards. If the surface of the brushed circuit board is not flat, it may cause problems in subsequent component processing, and even the final electronic device products will appear such as noise, contact is not Good and so on. However, the proliferation of printed circuit boards with market demand has made the number of printed circuit boards to be detected quite large, and the efficiency of conventionally manipulating optical instruments has been overwhelmed. The existing flat flaw detection methods are mostly changed to Automated Optical Inspection (AOI). Among the conventional techniques, the most widely used method is to use the straight-through characteristics of the laser beam to detect the printed circuit board.

第一圖係一習知技藝的印刷電路板檢測設備之示意圖。參見第一圖,習知技藝中的檢測設備100在承載台120兩側設置有雷射裝置160。上述雷射裝置160在承載台120的兩側分別具有一雷射光產生器、與一雷射光接收器。雷射光產生器可產生雷射光束162,且雷射光束162將直線傳輸至位於相對側之雷射光接收器。上述雷射光束162的方向係與承載台120的行進方向相互垂直。當承載台120上放置待測印刷電路板140,且沿著承載台行進方向122移動時,待測印刷電路板140將會通過上述雷射光束162。因為待測印刷電路板140具有一定的厚度,所以,當待測印刷電路板140沿著行進方向122通過雷射光束162時,待測印刷電路板140將會遮斷部分的雷射光束162。正常狀況下,由於待測印刷電路板140的厚度一致,所以,待測印刷電路板140通過雷射光束162時,所遮斷的雷射光束162高度也應該完全一致。換言之,假如待測印刷電路板140的表面並非一個平面,而是具有隆起的曲面,則雷射光接收器所得到的訊息將會顯示出,待測印刷電路板140遮斷的雷射光束162在某個時刻有出現不同高度的遮斷訊號。如此一來,就可判斷出待測印刷電路板140的表面是否具有曲面隆起。由於這些印刷電路板上的曲面將可能造成後 續電子零件裝設工序出現錯誤,因此,提前藉由檢測,將具有曲面的瑕疵印刷電路板挑出,是一項很重要的檢測項目。 The first figure is a schematic diagram of a conventional printed circuit board inspection apparatus. Referring to the first figure, the detection apparatus 100 of the prior art is provided with laser devices 160 on both sides of the stage 120. The laser device 160 has a laser light generator and a laser light receiver on each side of the carrying platform 120. The laser light generator can produce a laser beam 162, and the laser beam 162 transmits a straight line to the laser light receiver on the opposite side. The direction of the laser beam 162 described above is perpendicular to the direction of travel of the stage 120. When the printed circuit board 140 to be tested is placed on the stage 120 and moved along the direction of travel 122 of the stage, the printed circuit board 140 to be tested will pass through the laser beam 162 described above. Because the printed circuit board 140 to be tested has a certain thickness, when the printed circuit board 140 to be tested passes the laser beam 162 along the traveling direction 122, the printed circuit board 140 to be tested will block part of the laser beam 162. Under normal conditions, since the thickness of the printed circuit board 140 to be tested is uniform, when the printed circuit board 140 to be tested passes the laser beam 162, the height of the blocked laser beam 162 should also be completely uniform. In other words, if the surface of the printed circuit board 140 to be tested is not a flat surface but has a raised curved surface, the information obtained by the laser receiver will show that the laser beam 162 blocked by the printed circuit board 140 to be tested is At some point, there are occlusion signals at different heights. In this way, it can be determined whether the surface of the printed circuit board 140 to be tested has a curved surface. Because the curved surfaces on these printed circuit boards will likely cause There is an error in the process of installing electronic parts. Therefore, it is an important test item to pick out the printed circuit board with curved surface by inspection.

在上述的檢測過程中,假如待測印刷電路板140的上方(偵測表面)具有凸起的曲面,雷射裝置160將偵測到雷射光束162的遮斷訊號出現不同,進而得知待測印刷電路板140的上方/偵測表面並非完全的水平面。然而,如果待測印刷電路板140的上方/偵測表面具中間區域有凹陷的曲面或是出現波浪狀表面,雷射裝置160所偵測到的雷射光束162遮斷訊號將不會有所差異,換言之,印刷電路板檢測設備100可能會把具有凹陷曲面的待測印刷電路板140誤判為沒有任何曲面的待測印刷電路板。 In the above detection process, if the upper surface (detection surface) of the printed circuit board 140 to be tested has a convex curved surface, the laser device 160 detects that the interception signal of the laser beam 162 is different, and further knows that The upper/detection surface of the printed circuit board 140 is not a complete horizontal plane. However, if the upper/detection surface of the printed circuit board 140 to be tested has a concave curved surface or a wavy surface, the laser beam 162 detected by the laser device 160 will not intercept the signal. The difference, in other words, the printed circuit board detecting apparatus 100 may mistake the printed circuit board 140 to be tested having a concave curved surface as the printed circuit board to be tested without any curved surface.

在印刷電路板的檢測上,選擇AOI作為檢測方式,是為了更快速、更準確、且更穩定地完成檢測工序。倘若檢測結果存在著可能有誤判的風險,不僅增加複檢的人力成本與時間成本,如果因此產出瑕疵品給下游廠商,更可能會因此造成鉅額賠償與商譽損失。因此,雖然上述印刷電路板檢測設備100已經是目前業界所廣為使用之技術,上述印刷電路板檢測設備100的誤判可能因素對於印刷電路板的檢測工序仍存在著許多不確定性與風險。 In the detection of printed circuit boards, AOI is selected as the detection method in order to complete the inspection process more quickly, more accurately, and more stably. If there is a risk of misjudgment in the test results, it will not only increase the labor cost and time cost of the re-inspection. If the counterfeit goods are produced to downstream manufacturers, it will be more likely to cause huge compensation and loss of goodwill. Therefore, although the above-described printed circuit board detecting apparatus 100 has been widely used in the industry, the possibility of misjudgment of the above-described printed circuit board detecting apparatus 100 still has many uncertainties and risks for the printed circuit board detecting process.

鑒於上述之背景中,為了符合產業上的需求,本新型提供一種印刷電路板之檢測設備,上述印刷電路板之檢測設備不僅可以快速檢測板體表面之曲度,更可同時有效避免誤判發生率。 In view of the above background, in order to meet the industrial requirements, the present invention provides a detecting device for a printed circuit board, and the detecting device of the printed circuit board can not only quickly detect the curvature of the surface of the board, but also effectively avoid the occurrence of false positives. .

本新型之一目的係提供一種印刷電路板之檢測設備,藉由全面性的影像信號擷取,可有效地大幅降低誤判發生率,進而達到避免重複檢查之效果。 One of the objects of the present invention is to provide a detection device for a printed circuit board, which can effectively reduce the incidence of false positives by comprehensive image signal capture, thereby achieving the effect of avoiding repeated inspections.

本新型之另一目的係提供一種印刷電路板之檢測設備,藉由全面性擷取待測表面影像之設計,使得根據本創作之印刷電路板之檢測設備可以達到快速完成檢測工序之效果。 Another object of the present invention is to provide a testing device for a printed circuit board. By comprehensively capturing the design of the surface image to be tested, the detecting device of the printed circuit board according to the present invention can achieve the effect of quickly completing the detecting process.

本新型之又一目的係提供一種印刷電路板之檢測設備,藉由可同時檢測複數組印刷電路板之設計,使得根據本創作之印刷電路板之檢測設備可進一步縮短檢測的時間。 Another object of the present invention is to provide a detecting device for a printed circuit board, which can further reduce the detection time by the detecting device of the printed circuit board according to the present invention by simultaneously detecting the design of the multi-array printed circuit board.

本新型之又一目的係提供一種印刷電路板之檢測設備,藉由簡單的光學原理與光學器材的選擇,使得根據本創作之印刷電路板之檢測設備可以達到比習知技藝的印刷電路板之檢測設備更省成本且更簡易操作之效果。 Another object of the present invention is to provide a detecting device for a printed circuit board, which can realize a printed circuit board according to the prior art by a simple optical principle and selection of an optical device. The detection device is more cost effective and easier to operate.

根據前述目的,本說明書提供一印刷電路板之檢測設備,前述印刷電路板之檢測設備包含承載台、參考標記、光源、影像擷取裝置、以及處理器。上述承載台可用以承載待測印刷電路板。上述印刷電路板之檢測設備可以一次檢測一待測印刷電路板,也可一次檢測複數個待測印刷電路板。上述參考標記設置於上述承載台的上方。上述參考標記可以是複數個幾何圖形的重複單元。上述光源設置於上述承載台的斜上方。上述的光源可以是一點光源,或是可產生點光源效果之發光裝置。上述的光源以非正投影的方式照射上述參考標記,並在承載台與待測印刷電路板上產生參考標記投影。上述影像擷取裝置設置於上述承載台之上方,用以擷取投影於承載台與待測印刷電路板上之參考標記投 影。上述處理器連接於上述影像擷取裝置,可用以計算影像擷取裝置所擷取的影像信號,以獲知待測印刷電路板的表面資訊。 In accordance with the foregoing objects, the present specification provides a test apparatus for a printed circuit board including a carrier, a reference mark, a light source, an image capture device, and a processor. The above-mentioned carrier can be used to carry the printed circuit board to be tested. The detecting device of the above printed circuit board can detect a printed circuit board to be tested at a time, and can also detect a plurality of printed circuit boards to be tested at a time. The above reference mark is disposed above the above-mentioned carrier. The above reference mark may be a repeating unit of a plurality of geometric figures. The light source is disposed obliquely above the carrier. The light source described above may be a light source or a light-emitting device that produces a point source effect. The light source described above illuminates the reference mark in a non-orthoscopic manner and produces a reference mark projection on the stage and the printed circuit board to be tested. The image capturing device is disposed above the carrying platform for capturing a reference mark projected on the carrying platform and the printed circuit board to be tested Shadow. The processor is connected to the image capturing device, and can be used to calculate an image signal captured by the image capturing device to obtain surface information of the printed circuit board to be tested.

100‧‧‧印刷電路板檢測設備 100‧‧‧Printed circuit board testing equipment

120‧‧‧承載台 120‧‧‧Loading station

122‧‧‧承載台行進方向 122‧‧‧The direction of travel of the carrying platform

140‧‧‧待測印刷電路板 140‧‧‧Printed circuit board to be tested

160‧‧‧雷射裝置 160‧‧‧ Laser device

162‧‧‧雷射光束 162‧‧‧Laser beam

200‧‧‧印刷電路板之檢測設備 200‧‧‧Printed circuit board testing equipment

220‧‧‧待測印刷電路板 220‧‧‧Printed circuit board to be tested

240‧‧‧參考標記 240‧‧‧ reference mark

240’‧‧‧參考標記投影 240'‧‧‧ reference mark projection

260‧‧‧光源 260‧‧‧Light source

280‧‧‧影像擷取裝置 280‧‧‧Image capture device

300‧‧‧印刷電路板之檢測設備 300‧‧‧Printed circuit board testing equipment

320‧‧‧第一待測印刷電路板 320‧‧‧First printed circuit board to be tested

325‧‧‧第二待測印刷電路板 325‧‧‧Second printed circuit board to be tested

340‧‧‧參考標記 340‧‧‧ reference mark

340’‧‧‧第一參考標記投影 340'‧‧‧First reference mark projection

340’‧‧‧第二參考標記投影 340'‧‧‧second reference mark projection

360‧‧‧第一光源 360‧‧‧First light source

365‧‧‧第二光源 365‧‧‧second light source

380‧‧‧第一影像擷取裝置 380‧‧‧First image capture device

385‧‧‧第二影像擷取裝置 385‧‧‧Second image capture device

第一圖係習知技藝之印刷電路板之檢測設備之示意圖;第二圖係本新型之一具體實施例的印刷電路板之檢測設備之示意圖;以及第三圖係本新型之一具體實施例的印刷電路板之檢測設備之示意圖。 1 is a schematic diagram of a detection device of a printed circuit board of a prior art; a second diagram is a schematic diagram of a detection device of a printed circuit board according to an embodiment of the present invention; and a third diagram is a specific embodiment of the present invention A schematic diagram of a test device for a printed circuit board.

本新型在此所探討的方向為一種印刷電路板之檢測設備。為了能徹底地瞭解本新型,將在下列的描述中提出詳盡的步驟及其組成。顯然地,本新型的施行並未限定於此領域技藝者所熟習的特殊細節。另一方面,眾所周知的組成或步驟並未描述於細節中,以避免造成本新型不必要之限制。本新型的較佳實施例會詳細描述如下,然而除了這些詳細描述之外,本新型還可以廣泛地施行在其他的實施例中,且本新型的範圍不受限定,其以之後的專利範圍為準。 The invention is directed to a detection device for a printed circuit board. In order to thoroughly understand the present invention, detailed steps and compositions thereof will be presented in the following description. Obviously, the implementation of the present invention is not limited to the specific details familiar to those skilled in the art. On the other hand, well-known components or steps are not described in detail to avoid unnecessary limitations of the present invention. The preferred embodiments of the present invention will be described in detail below, but the present invention may be widely practiced in other embodiments, and the scope of the present invention is not limited, and the scope of the following patents shall prevail. .

根據本說明書之一實施例,係揭露一種印刷電路板之檢測設備。第二圖係一根據本實施例印刷電路板之檢測設備200之示意圖。上述印刷電路板之檢測設備200包含承載台、參考標記240、光源260、影像擷取裝置280、以及處理器。上述印刷電 路板之檢測設備200可用來進行印刷電路板的曲面檢測。上述承載台,未顯示於圖中,可以用來承載待測印刷電路板220。 According to an embodiment of the present specification, a detecting apparatus for a printed circuit board is disclosed. The second drawing is a schematic view of a detecting apparatus 200 for a printed circuit board according to this embodiment. The above-described printed circuit board detecting apparatus 200 includes a carrying table, reference numerals 240, a light source 260, an image capturing device 280, and a processor. Printed above The board inspection apparatus 200 can be used to perform surface inspection of a printed circuit board. The above-mentioned carrying platform, not shown in the figure, can be used to carry the printed circuit board 220 to be tested.

上述參考標記240設置於上述承載台的上方。根據本實施例,上述參考標記240可以是複數個幾何圖形的重複單元。在根據本實施例之一較佳範例中,上述參考標記240可以是複數條直線。在根據本實施例之另一較佳範例中,上述參考標記240可以是由兩組彼此相交的線所形成的網狀輪廓。在根據本實施例之又一較佳範例中,上述參考標記240可以是複數個參考點。 The above reference mark 240 is disposed above the above-mentioned stage. According to this embodiment, the above reference numeral 240 may be a repeating unit of a plurality of geometric figures. In a preferred example according to this embodiment, the reference numeral 240 may be a plurality of straight lines. In another preferred embodiment according to the present embodiment, the reference mark 240 may be a mesh profile formed by two sets of lines intersecting each other. In still another preferred example according to this embodiment, the reference numeral 240 may be a plurality of reference points.

上述光源260設置於上述承載台的斜上方。根據本創作之設計,上述光源260可以是一點光源,或是可產生點光源效果之發光裝置,例如以面光源或線光源搭配光柵、聚光元件、導光元件、或其他習知該項技藝者所熟知可產生點光源效果的技術組合。根據本實施例之設計,上述光源260以非正投影的方式照射上述參考標記240,並在承載台與待測印刷電路板220上產生參考標記投影240’。在根據本實施例之一較佳範例中,上述光源260可以是以約10~85度的入射角照射參考標記240,以產生參考標記投影240’。 The light source 260 is disposed above the support platform. According to the design of the present invention, the light source 260 may be a light source or a light-emitting device capable of generating a point light source effect, such as a surface light source or a line light source with a grating, a concentrating element, a light guiding element, or other conventional techniques. A combination of techniques known to produce point source effects is well known. In accordance with the design of the present embodiment, the light source 260 illuminates the reference mark 240 in a non-projective manner and produces a reference mark projection 240' on the stage and the printed circuit board 220 to be tested. In a preferred embodiment in accordance with the present embodiment, the light source 260 can illuminate the reference mark 240 at an angle of incidence of about 10 to 85 degrees to produce a reference mark projection 240'.

上述影像擷取裝置280設置於上述承載台之上方。上述影像擷取裝置280可擷取投影於承載台與待測印刷電路板220上之參考標記投影240’的影像信號。上述處理器,未顯示於圖中,連接於上述影像擷取裝置280。處理器可用以計算影像擷取裝置280所擷取的影像信號,以獲知待測印刷電路板220的表面資訊。 The image capturing device 280 is disposed above the carrying platform. The image capturing device 280 can capture the image signal projected by the reference mark projection 240' on the carrying platform and the printed circuit board 220 to be tested. The processor is not shown in the figure and is connected to the image capturing device 280. The processor can be used to calculate the image signal captured by the image capturing device 280 to obtain surface information of the printed circuit board 220 to be tested.

根據本實施例,進行檢測時,可先在上述承載台上 放置標準樣板(Golden sample)來進行影像擷取。光源260照射參考標記240,並在上述承載台與標準樣板上產生標準樣板之參考標記投影240’。此時,影像擷取裝置280可從上方擷取標準樣板之參考標記投影240’的影像信號V0,並將影像信號V0傳送至處理器進行記錄。接下來,在上述承載台上放置待測印刷電路板220。光源260照射參考標記240並在上述承載台與待測印刷電路板220形成待測印刷電路板之參考標記投影240’後,影像擷取裝置280可從上方擷取待測印刷電路板220之參考標記投影240’的影像信號V1,並將影像信號V1傳送至上述的處理器。上述的處理器藉由計算分別已先濾除背景資料之後的影像信號V0與V1,將可判斷出待測印刷電路板220是否有出現異於標準樣板的異常曲面。更好的是,根據本實施例,上述的處理器藉由濾除背景資料之後的影像信號V0與V1的計算結果,也可判斷出待測印刷電路板220出現異常曲面的位置。 According to this embodiment, when performing the detection, a standard sample (Golden sample) may be placed on the above-mentioned carrying platform to perform image capturing. Light source 260 illuminates reference mark 240 and produces a reference mark projection 240' of the standard template on the carrier and standard template. At this time, the image capturing device 280 can capture the image signal V 0 of the reference mark projection 240 ′ of the standard template from above, and transmit the image signal V 0 to the processor for recording. Next, the printed circuit board 220 to be tested is placed on the above-mentioned stage. After the light source 260 illuminates the reference mark 240 and forms the reference mark projection 240 ′ of the printed circuit board to be tested on the carrying platform and the printed circuit board 220 to be tested, the image capturing device 280 can extract the reference of the printed circuit board 220 to be tested from above. The image signal V 1 of the projection 240' is marked and the image signal V 1 is transmitted to the processor described above. The processor can determine whether the printed circuit board 220 to be tested has an abnormal surface different from the standard template by calculating the image signals V 0 and V 1 after the background data has been filtered first. More preferably, according to the embodiment, the processor can determine the position of the abnormal curved surface of the printed circuit board 220 to be tested by filtering out the calculation results of the image signals V 0 and V 1 after the background data.

在根據本實施例之一較佳範例中,上述參考標記240可以包含一組第一參考標記、與一組第二參考標記。根據本範例,上述第一參考標記與第二參考標記可以是彼此具有一不為零度或180度夾角的兩組幾何圖形,例如兩組彼此不平行的線條。在根據本範例之一較佳實施方式中,上述的參考標記240可以是由兩組直線所形成的網狀輪廓。根據本範例,上述的影像擷取裝置280擷取上述兩組參考標記所產生的參考標記陰影的影像信號,並傳送至處理器進行計算分析後,除了可判斷待測印刷電路板220是否有異常曲面之外,更可建立待測印刷電路板220表面的3D模型。如此一來,將可進一步有助於降低自動光學檢測(AOI)所可 能產生的誤判與進行其他分析。 In a preferred example according to this embodiment, the reference mark 240 may include a set of first reference marks and a set of second reference marks. According to the present example, the first reference mark and the second reference mark may be two sets of geometric figures having an angle of not zero or 180 degrees with each other, for example, two sets of lines that are not parallel to each other. In a preferred embodiment according to the present example, the reference mark 240 may be a mesh profile formed by two sets of straight lines. According to the example, the image capturing device 280 captures the image signal of the reference mark shadow generated by the two sets of reference marks, and transmits the image signal to the processor for calculation and analysis, in addition to determining whether the printed circuit board 220 to be tested is abnormal. In addition to the curved surface, a 3D model of the surface of the printed circuit board 220 to be tested can be created. As a result, it will further help reduce the automatic optical inspection (AOI). Misjudgments that can be generated and other analyses.

根據本說明書之另一實施例,係揭露一種印刷電路板之檢測設備。根據本說明書,上述印刷電路板檢測設備可同時進行多組引刷電路板的檢測。在本實施例中,僅以同時進行兩印刷電路板之檢測做為代表性說明。第三圖係一根據本實施例印刷電路板之檢測設備300之示意圖。上述印刷電路板之檢測設備300包含承載台、參考標記340、第一光源360、第一影像擷取裝置380、第二影像擷取裝置385、以及處理器。上述印刷電路板之檢測設備300可用來進行多組印刷電路板的表面檢測。上述承載台,未顯示於圖中,可同時承載第一待測印刷電路板320、與第二待測印刷電路板325。 According to another embodiment of the present specification, a detecting apparatus for a printed circuit board is disclosed. According to the present specification, the above printed circuit board detecting apparatus can simultaneously perform detection of a plurality of sets of brushed circuit boards. In the present embodiment, the detection of only two printed circuit boards is performed as a representative description. The third figure is a schematic view of a detecting apparatus 300 for a printed circuit board according to this embodiment. The above-described printed circuit board detecting apparatus 300 includes a carrying platform, a reference mark 340, a first light source 360, a first image capturing device 380, a second image capturing device 385, and a processor. The above-described printed circuit board detecting apparatus 300 can be used for surface detection of a plurality of sets of printed circuit boards. The above-mentioned carrying platform, not shown in the figure, can simultaneously carry the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested.

上述參考標記340設置於上述承載台的上方。根據本實施例,上述參考標記340可以是複數個幾何圖形的重複單元。在根據本實施例之一較佳範例中,上述參考標記340可以是複數條直線。在根據本實施例之另一較佳範例中,上述參考標記340可以是由兩組彼此相交的線所形成的網狀輪廓。在根據本實施例之又一較佳範例中,上述參考標記340可以是複數個點。 The above reference mark 340 is disposed above the above-mentioned stage. According to this embodiment, the above reference mark 340 may be a repeating unit of a plurality of geometric figures. In a preferred example according to this embodiment, the reference numeral 340 may be a plurality of straight lines. In another preferred example according to the present embodiment, the reference mark 340 may be a mesh profile formed by two sets of lines intersecting each other. In still another preferred example according to the embodiment, the reference mark 340 may be a plurality of points.

上述第一光源360設置於上述承載台的斜上方。根據本創作之設計,上述第一光源360可以是一點光源,或是可產生點光源效果之發光裝置。根據本實施例之設計,上述第一光源360以非正投影的方式照射上述參考標記340,並在承載台與第一待測印刷電路板320與第二待測印刷電路板325上產生參考標記投影340’與340”。在根據本實施例之一較佳範例中,上述第一光源360可以是以約10~85度的入射角照射參考標記340,以產生參 考標記投影340’與340”。 The first light source 360 is disposed obliquely above the carrier. According to the design of the present invention, the first light source 360 may be a light source or a light-emitting device that can generate a point light source effect. According to the design of the embodiment, the first light source 360 illuminates the reference mark 340 in a non-projective manner, and generates reference marks on the carrying platform and the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested. Projections 340' and 340". In a preferred example according to this embodiment, the first light source 360 may illuminate the reference mark 340 with an incident angle of about 10 to 85 degrees to generate a reference. The test marks 340' and 340" are marked.

上述第一影像擷取裝置380與第二影像擷取裝置385分別設置於上述第一待測印刷電路板320與第二待測印刷電路板325之上方。上述第一影像擷取裝置380與第二影像擷取裝置385分別可擷取投影於承載台與第一待測印刷電路板320以及第二待測印刷電路板325上之參考標記投影340’與340”的影像信號。上述處理器,未顯示於圖中,連接於上述第一影像擷取裝置380與第二影像擷取裝置385。處理器可用以計算第一影像擷取裝置380與第二影像擷取裝置385所擷取的影像信號,以獲得第一待測印刷電路板320以及第二待測印刷電路板325的表面狀態資訊。 The first image capturing device 380 and the second image capturing device 385 are respectively disposed above the first to-be-tested printed circuit board 320 and the second to-be-tested printed circuit board 325. The first image capturing device 380 and the second image capturing device 385 respectively capture the reference mark projection 340' projected on the carrying platform and the first to-be-tested printed circuit board 320 and the second printed circuit board 325 to be tested. 340" image signal. The processor, not shown in the figure, is connected to the first image capturing device 380 and the second image capturing device 385. The processor can be used to calculate the first image capturing device 380 and the second The image signal captured by the image capturing device 385 is used to obtain surface state information of the first to-be-tested printed circuit board 320 and the second to-be-tested printed circuit board 325.

根據本實施例,進行檢測時,可先在上述承載台上輸送兩標準樣板,讓第一影像擷取裝置380與第二影像擷取裝置385分別擷取標準樣板的參考標記投影之影像信號V0與V0’,並將影像信號V0與V0’傳送至上述的處理器。然後,再以上述承載台輸送第一待測印刷電路板320以及第二待測印刷電路板325。上述第一光源360照射參考標記340並分別在第一待測印刷電路板320以及第二待測印刷電路板325產生參考標記陰影340’與340”。第一影像擷取裝置380與第二影像擷取裝置385分別擷取第一待測印刷電路板320以及第二待測印刷電路板325的參考標記投影340’與340”之影像信號V1與V1’,並將影像信號V1與V1’傳送至處理器。處理器可藉由分別計算由濾除背景資料之後的影像信號V0與V1、以及濾除背景資料之後的影像信號V0’與V1’而分別得到第一待測印刷電路板320以及第二待測印刷電路板325 的表面資訊,進而判斷出第一待測印刷電路板320與第二待測印刷電路板325是否有出現異於標準樣板的異常曲面。 According to the embodiment, when the detection is performed, the two standard templates are first transported on the loading platform, and the first image capturing device 380 and the second image capturing device 385 respectively capture the image signal V of the reference mark projected by the standard template. 0 and V 0 ', and the image signals V 0 and V 0 ' are transmitted to the above processor. Then, the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested are transported by the above-mentioned carrier. The first light source 360 illuminates the reference mark 340 and generates reference mark shadows 340' and 340" on the first printed circuit board 320 to be tested and the second printed circuit board 325, respectively. The first image capturing device 380 and the second image The capturing device 385 captures the image signals V 1 and V 1 ' of the reference mark projections 340 ′ and 340 ′ of the first to-be-tested printed circuit board 320 and the second to-be-tested printed circuit board 325 , respectively, and the image signal V 1 and V 1 ' is transferred to the processor. The processor can respectively obtain the first circuit board 320 to be tested by calculating the image signals V 0 and V 1 after filtering the background data and the image signals V 0 ′ and V 1 ′ after filtering the background data, respectively. The surface information of the second printed circuit board 325 to be tested further determines whether the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested have an abnormal surface different from the standard template.

在根據本實施例之一較佳範例中,上述印刷電路板之檢測設備300可以更包含一第二光源365。上述第二光源365設置於上述承載台的斜上方,如第三圖所示。上述第二光源365可以是一點光源,或是可產生點光源效果之發光裝置。根據本範例,上述第一光源360與第二光源365可以是分別設置於第一待測印刷電路板320與第二待測印刷電路板325的斜上方。第一光源360與第二光源365皆以非正投影的方式照射上述參考標記340,並在承載台、第一待測印刷電路板320與第二待測印刷電路板325上產生參考標記投影340’與340”。依據本範例之設計,上述第一光源360與第二光源365可設定為輪流開啟。例如,在欲使用第一影像擷取裝置380擷取第一待測印刷電路板320之影像信號V1時,只有第一光源360照射上述參考標記340並在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影。在欲使用第二影像擷取裝置385擷取第二待測印刷電路板325之影像信號V1’時,只有第二光源365照射上述參考標記340並在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影。如此一來,可讓第一影像擷取裝置380與第二影像擷取裝置385得到更清晰的影像信號。在根據本範例之一實施方式中,依序以第一光源360與第二光源365照射參考標記340並在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影,第一影像擷取裝置380與第二影像擷取裝置385將可擷取到影像信號V1與V1’、以 及V2與V2’。其中,以第一光源360照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影,第一影像擷取裝置380與第二影像擷取裝置385分別擷取到的影像信號為V1與V1’;以第一光源360照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影,第一影像擷取裝置380與第二影像擷取裝置385分別擷取到的影像信號為V2與V2’。處理器分別比對濾除背景資料之後的影像信號V0與V1、V0與V2,將可得到更細緻的第一待測印刷電路板320表面資訊。相同地,處理器分別比對濾除背景資料之後的影像信號V0與V1’、V0與V2’,將可得到更細緻的第二待測印刷電路板325之表面資訊。 In a preferred example of the present embodiment, the detecting device 300 of the printed circuit board may further include a second light source 365. The second light source 365 is disposed obliquely above the loading platform as shown in the third figure. The second light source 365 may be a light source or a light emitting device that can generate a point light source effect. According to the present example, the first light source 360 and the second light source 365 may be disposed obliquely above the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested, respectively. The first light source 360 and the second light source 365 both illuminate the reference mark 340 in a non-projective manner, and generate a reference mark projection 340 on the carrying platform, the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested. According to the design of the present example, the first light source 360 and the second light source 365 can be set to be turned on. For example, the first image capturing device 380 is used to capture the first printed circuit board 320 to be tested. video signal V 1, only the first light source irradiating the reference numerals 360 and 340 generate the carrier on the stage reference mark and the projection of the first printed circuit board 320 under test and a second printed circuit board 325 under test. For use in a second image When the capturing device 385 captures the image signal V 1 ' of the second printed circuit board 325 to be tested, only the second light source 365 illuminates the reference mark 340 and is on the carrying platform and the first printed circuit board 320 to be tested and the second to be tested. A reference mark projection is generated on the printed circuit board 325. Thus, the first image capturing device 380 and the second image capturing device 385 can obtain clearer image signals. In an embodiment according to the present example, in order The first light source 360 and the second light source 365 illuminate the reference mark 340 and generate a reference mark projection on the carrying platform and the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested, and the first image capturing device 380 and the first The second image capturing device 385 can capture the image signals V 1 and V 1 ', and V 2 and V 2 '. wherein the first light source 360 illuminates the reference mark 340, and the carrier and the first printed circuit to be tested A reference mark projection is generated on the board 320 and the second printed circuit board 325 to be tested, and the image signals respectively captured by the first image capturing device 380 and the second image capturing device 385 are V 1 and V 1 '; The light source 360 illuminates the reference mark 340, and the reference mark projection is generated on the carrying platform and the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested. The first image capturing device 380 and the second image capturing device 385 respectively The captured image signals are V 2 and V 2 '. The processor compares the image signals V 0 and V 1 , V 0 and V 2 after filtering the background data, respectively, to obtain a more detailed first test to be tested. Circuit board 320 surface information. Similarly, the processors are compared separately In addition to the video signal V and 0 V after background information 1 ', V 0 and V 2', the second test result in more detailed information about the surface of the printed circuit board 325 of.

在根據本實施例之另一較佳範例中,上述印刷電路板之檢測設備300可以更包含一第二光源。上述第二光源設置於上述承載台的斜上方。上述第二光源可以是一點光源,或是可產生點光源效果之發光裝置。根據本範例,上述第一光源360與第二光源可以是分別設置於第一待測印刷電路板320與第二待測印刷電路板325的斜上方。第一光源360與第二光源皆以非正投影的方式照射上述參考標記340,並在承載台、第一待測印刷電路板320與第二待測印刷電路板325上產生參考標記投影340’與340”。依據本範例之設計,上述第一光源360與第二光源可設定為輪流開啟。例如,在欲使用第一影像擷取裝置380擷取第一待測印刷電路板320之影像信號V1時,只以第二光源照射上述參考標記340並在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影;在欲使用第二影像擷取裝置 385擷取第二待測印刷電路板325之影像信號V1’時,只以第一光源360照射上述參考標記340並在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影。在進行標準樣板的檢測時,是以第二光源照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影後,讓第一影像擷取裝置380擷取到放置在第一待測印刷電路板320的位置的標準樣板的影像信號為V0;以第一光源360照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影後,以第二影像擷取裝置380擷取到放置在第二待測印刷電路板325的位置的標準樣板的影像信號為V0’。在進行待測印刷電路板檢測時,以第二光源照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影,第一影像擷取裝置380擷取到第一待測印刷電路板320的影像信號為V1;以第一光源360照射參考標記340,在承載台與第一待測印刷電路板320以及第二待測印刷電路板325上產生參考標記投影,第二影像擷取裝置385擷取到的影像信號為V1’。處理器比對濾除背景資料之後的影像信號V0與V1,將可得到第一待測印刷電路板320的表面資訊。處理器比對濾除背景資料之後的影像信號V0’與V1’,將可得到第二待測印刷電路板325的表面資訊。 In another preferred embodiment of the present embodiment, the detecting device 300 of the printed circuit board may further include a second light source. The second light source is disposed obliquely above the loading platform. The second light source may be a point source or a light-emitting device that produces a point source effect. According to the present example, the first light source 360 and the second light source may be disposed obliquely above the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested, respectively. The first light source 360 and the second light source both illuminate the reference mark 340 in a non-projective manner, and generate a reference mark projection 340 on the carrying platform, the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested 325. According to the design of the present example, the first light source 360 and the second light source may be set to be turned on in turn. For example, the first image capturing device 380 is used to capture the image signal of the first printed circuit board 320 to be tested. V 1, the second light source illuminates only the tag 340 described above with reference to the carrier and to generate a reference mark projected on the test station and the first printed circuit board 320 and the second printed circuit board 325 under test; to be used in the second image capturing When the device 385 captures the image signal V 1 ' of the second printed circuit board 325 to be tested, only the first light source 360 illuminates the reference mark 340 and is printed on the carrying platform and the first printed circuit board 320 to be tested and the second to be tested. A reference mark projection is generated on the circuit board 325. When the standard template is detected, the reference mark 340 is illuminated by the second light source, and is generated on the stage and the first printed circuit board 320 to be tested and the second printed circuit board 325 to be tested. After the test marker projection, so that a first image capturing device 380 to capture the template is placed in a standard position of the first printed circuit board under test 320 is a video signal V 0; a first light source 360 is irradiated to the reference numerals 340, the carrier After the reference mark projection is generated on the first and second printed circuit boards 320 to be tested, the second image capturing device 380 is captured by the second image capturing device 380 to be placed at the position of the second printed circuit board 325 to be tested. The image signal of the standard template is V 0 '. When the printed circuit board to be tested is tested, the reference mark 340 is illuminated by the second light source, and the carrier and the first printed circuit board 320 to be tested and the second printed circuit board 325 are to be tested. A reference mark projection is generated, the image signal captured by the first image capturing device 380 to the first printed circuit board 320 to be tested is V 1 ; the reference light 340 is illuminated by the first light source 360, and the first to be tested is printed on the carrier and the first to be tested. A reference mark projection is generated on the circuit board 320 and the second printed circuit board 325 to be tested, and the image signal captured by the second image capturing device 385 is V 1 '. The processor compares the image signal V 0 after filtering the background data. and V 1, A first printed circuit board under test to obtain information about the surface 320. The surface information processor than the video signal V 0 after filtering out background information 'and V 1', to obtain the second printed circuit board 325 under test.

綜合上述,本說明書揭露了一種印刷電路板之檢測設備。上述印刷電路板之檢測設備包含承載台、參考標記、光源、影像擷取裝置、以及處理器。上述承載台可用以承載待測印刷電路板。根據本說明書之設計,上述印刷電路板之檢測設備可以一 次檢測一待測印刷電路板,也可一次檢測複數個待測印刷電路板。上述參考標記設置於上述承載台的上方。上述參考標記可以是複數個幾何圖形的重複單元。上述光源設置於上述承載台的斜上方。上述的光源可以是一點光源,或是可產生點光源效果之發光裝置。上述的光源以非正投影的方式照射上述參考標記,並在承載台與待測印刷電路板上產生參考標記投影。上述影像擷取裝置設置於上述承載台之上方,用以擷取投影於承載台與待測印刷電路板上之參考標記投影。上述處理器連接於上述影像擷取裝置,可用以計算影像擷取裝置所擷取的影像信號,以獲知待測印刷電路板的表面資訊。根據本說明書的設計,上述印刷電路板之檢測設備除了可以有效達到快速檢測板體表面之曲度的效果之外,更可藉由投射光影來模擬出待測板體之表面的類2D,甚至類3D模型,進而有效避免對於板體表面之曲度產生誤判。換言之,本說明書提供了一種可兼具提昇偵測速率與有效避免誤判發生率,同時又可降低檢測設備成本、與方便使用者操作的印刷電路板之檢測設備。 In summary, the present specification discloses a detecting device for a printed circuit board. The above-mentioned printed circuit board detecting apparatus includes a carrying platform, a reference mark, a light source, an image capturing device, and a processor. The above-mentioned carrier can be used to carry the printed circuit board to be tested. According to the design of the present specification, the above detection device of the printed circuit board can be After detecting a printed circuit board to be tested, it is also possible to detect a plurality of printed circuit boards to be tested at a time. The above reference mark is disposed above the above-mentioned carrier. The above reference mark may be a repeating unit of a plurality of geometric figures. The light source is disposed obliquely above the carrier. The light source described above may be a light source or a light-emitting device that produces a point source effect. The light source described above illuminates the reference mark in a non-orthoscopic manner and produces a reference mark projection on the stage and the printed circuit board to be tested. The image capturing device is disposed above the carrying platform for capturing a reference mark projection projected on the carrying platform and the printed circuit board to be tested. The processor is connected to the image capturing device, and can be used to calculate an image signal captured by the image capturing device to obtain surface information of the printed circuit board to be tested. According to the design of the present specification, in addition to the effect of quickly detecting the curvature of the surface of the board body, the detecting device of the above printed circuit board can simulate the surface 2D of the surface of the board to be tested by projecting light and shadow, and even Class 3D model, which effectively avoids misjudgment of the curvature of the surface of the board. In other words, the present specification provides a detection device that can simultaneously improve the detection rate and effectively avoid the occurrence of false positives, while reducing the cost of the detection device and facilitating the operation of the user.

顯然地,依照上面實施例中的描述,本新型可能有許多的修正與差異。因此需要在其附加的權利要求項之範圍內加以理解,除了上述詳細的描述外,本新型還可以廣泛地在其他的實施例中施行。上述僅為本新型之較佳實施例而已,並非用以限定本新型之申請專利範圍;凡其它未脫離本新型所揭示之精神下所完成的等效改變或修飾,均應包含在下述申請專利範圍內。 Obviously, the present invention may have many modifications and differences as described in the above embodiments. It is therefore to be understood that within the scope of the appended claims, the invention may be The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; any equivalent changes or modifications made without departing from the spirit of the present invention should be included in the following patent application. Within the scope.

200‧‧‧印刷電路板之檢測設備 200‧‧‧Printed circuit board testing equipment

220‧‧‧待測印刷電路板 220‧‧‧Printed circuit board to be tested

240‧‧‧參考標記 240‧‧‧ reference mark

240’‧‧‧參考標記投影 240'‧‧‧ reference mark projection

260‧‧‧光源 260‧‧‧Light source

280‧‧‧影像擷取裝置 280‧‧‧Image capture device

Claims (10)

一種印刷電路板之檢測設備,其包含:一承載台,用以承載待測印刷電路板;複數個參考標記,上述參考標記設置於上述承載台的上方;一光源,上述光源設置於上述承載台的斜上方,上述光源以非正投影的方式照射上述參考標記,並在上述承載台與待測印刷電路板產生參考標記投影;一影像擷取裝置,上述影像擷取裝置設置於上述承載台之上方;以及一處理器,上述處理器連接上述影像擷取裝置。 A detecting device for a printed circuit board, comprising: a carrying platform for carrying a printed circuit board to be tested; a plurality of reference marks, wherein the reference mark is disposed above the carrying platform; and a light source, wherein the light source is disposed on the carrying platform Incliningly above, the light source illuminates the reference mark in a non-projective manner, and generates a reference mark projection on the carrying platform and the printed circuit board to be tested; an image capturing device, wherein the image capturing device is disposed on the carrying platform Above; and a processor, the processor is coupled to the image capturing device. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述參考標記是複數個幾何圖形的重複單元。 A detecting device for a printed circuit board according to the first aspect of the invention, wherein the reference mark is a repeating unit of a plurality of geometric figures. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述參考標記是複數複數條直線。 A detecting device for a printed circuit board according to the first aspect of the invention, wherein the reference numeral is a plurality of straight lines. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述參考標記包含一組第一參考標記、與一組第二參考標記,上述第一參考標記與第二參考標記可以是彼此具有一不為零度或180度夾角的兩組幾何圖形。 A detecting device for a printed circuit board according to claim 1, wherein the reference mark comprises a set of first reference marks and a set of second reference marks, and the first reference mark and the second reference mark may have each other A set of two geometric figures that are not zero or 180 degrees. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述參考標記是由兩組直線所形成的網狀輪廓。 A detecting device for a printed circuit board according to the first aspect of the invention, wherein the reference mark is a mesh profile formed by two sets of straight lines. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述光源是點光源,或是可產生點光源效果之發光裝置。 The apparatus for detecting a printed circuit board according to the first aspect of the invention, wherein the light source is a point light source or a light-emitting device capable of generating a point light source effect. 根據申請專利範圍第1項之印刷電路板之檢測設備,其中,上述光源以約10~85度的入射角照射上述的參考標記,以產生上述的參考標記投影。 The apparatus for detecting a printed circuit board according to the first aspect of the invention, wherein the light source illuminates the reference mark at an incident angle of about 10 to 85 degrees to generate the reference mark projection. 一種印刷電路板之檢測設備,其包含:一承載台,用以承載第一待測印刷電路板與第二待測印刷電路板;複數個參考標記,上述參考標記設置於上述承載台的上方;一第一光源與一第二光源,上述第一光源與第二光源各自設置於上述承載台的斜上方,上述第一光源與第二光源分別以非正投影的方式照射上述參考標記,並在上述承載台、第一待測印刷電路板與第二待測印刷電路板產生第一參考標記投影與第二參考標記投影;一第一影像擷取裝置與一第二影像擷取裝置,上述第一影像擷取裝置與第二影像擷取裝置分別設置於上述承載台之上方;以及一處理器,上述處理器分別連接上述第一影像擷取裝置與第二影像擷取裝置。 A detecting device for a printed circuit board, comprising: a carrying platform for carrying a first printed circuit board to be tested and a second printed circuit board to be tested; a plurality of reference marks, wherein the reference mark is disposed above the carrying platform; a first light source and a second light source, wherein the first light source and the second light source are respectively disposed obliquely above the carrying platform, and the first light source and the second light source respectively illuminate the reference mark in a non-projective manner, and The first display image projection and the second reference mark projection are generated by the first test substrate and the second test printed circuit board; the first image capture device and the second image capture device, the first An image capturing device and a second image capturing device are respectively disposed above the carrying platform; and a processor, wherein the processor is respectively connected to the first image capturing device and the second image capturing device. 根據申請專利範圍第8項之印刷電路板之檢測設備,其中上述 參考標記是複數個幾何圖形的重複單元。 A detecting device for a printed circuit board according to item 8 of the patent application, wherein the above A reference mark is a repeating unit of a plurality of geometric figures. 根據申請專利範圍第8項之印刷電路板之檢測設備,其中上述第一光源與第二光源是點光源,或是可產生點光源效果之發光裝置。 The apparatus for detecting a printed circuit board according to the eighth aspect of the invention, wherein the first light source and the second light source are point light sources or light emitting devices capable of generating a point light source effect.
TW105215280U 2016-10-07 2016-10-07 Inspection equipment of printed circuit board TWM548274U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659207B (en) * 2018-07-24 2019-05-11 皓琪科技股份有限公司 Projection-type auxiliary system assisting printed circuit board to quickly locate target and capable of zooming in at fixed points
CN110763703A (en) * 2018-07-27 2020-02-07 皓琪科技股份有限公司 Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation
CN113012097A (en) * 2021-01-19 2021-06-22 富泰华工业(深圳)有限公司 Image rechecking method, computer device, and storage medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659207B (en) * 2018-07-24 2019-05-11 皓琪科技股份有限公司 Projection-type auxiliary system assisting printed circuit board to quickly locate target and capable of zooming in at fixed points
CN110763703A (en) * 2018-07-27 2020-02-07 皓琪科技股份有限公司 Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation
CN113012097A (en) * 2021-01-19 2021-06-22 富泰华工业(深圳)有限公司 Image rechecking method, computer device, and storage medium
CN113012097B (en) * 2021-01-19 2023-12-29 富泰华工业(深圳)有限公司 Image rechecking method, computer device and storage medium

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