TWM545048U - Glue-free tape - Google Patents

Abstract

A glue-free tape includes a film, a plurality of convex structures, and at least one side wall. The plurality of convex structures are formed on a surface of the film and configured to contact a surface of an object to generate van der Waals force for attaching the film to the surface of the object through van der Waals force. The at least one side wall is formed on the surface of the film to surround the plurality of convex structures and configured to form an enclosed space between the film and the object.

Description

Glue-free tape

This creation is related to a non-adhesive tape, especially a glue-free tape that is attached to a wafer to increase the yield of semiconductor manufacturing.

In the semiconductor manufacturing method, in order to thin the wafer, the wafer is subjected to a crystal back polishing process. In general, the conventional crystal back grinding process first attaches the tape to the front side of the wafer, and then grinds the back side of the wafer. After the backside polishing of the wafer is completed, the tape on the front side of the wafer is removed for subsequent wafer dicing. In order to avoid the adhesive residue on the front side of the wafer and affect the yield of the integrated circuit formed on the front side of the wafer, the prior art uses a non-adhesive tape attached to the front side of the wafer for the crystal back grinding process. The adhesive-free tape has a plurality of nano-scale raised structures on the surface to create a van der Waals force between the front side of the wafer so that the adhesive-free tape can be attached to the front side of the wafer. However, there is a gap between the plurality of raised structures on the adhesive-free tape, and the gaps may cause foreign matter or liquid to enter between the adhesive-free tape and the wafer after the adhesive tape is attached to the wafer, thereby affecting the front surface of the wafer. The function of the integrated circuit formed reduces the production yield of the semiconductor process.

The purpose of this creation is to provide a glue-free tape that prevents the entry of liquids and foreign matter to solve the problems of the prior art.

The adhesive tape of the present invention comprises a film, a plurality of raised structures and at least one side wall. The plurality of raised structures are formed on a surface of the film for contacting a surface of an object to generate a wattage force, such that the film is attached to the surface of the object by van der Waals. The at least one side wall is formed on the surface of the film and surrounds the plurality of raised structures for forming a confined space between the film and the object.

In an embodiment of the present invention, the at least one side wall is located at an edge of the film.

In an embodiment of the present invention, the height ratio of the at least one side wall and the plurality of raised structures is between 1:0.8 and 1:1.

In an embodiment of the present invention, the total height of the film and the sidewall is between 50 microns and 75 microns.

In an embodiment of the present invention, the width to height ratio of the plurality of raised structures is between 1:2 and 2:1.

In an embodiment of the present invention, the width to height ratio of the at least one side wall is between 1:2 and 2:1.

In an embodiment of the present invention, the width and height of the plurality of raised structures are between 100 nm and 1000 nm, respectively.

In an embodiment of the present invention, the width and height of the at least one side wall are between 100 nm and 1000 nm, respectively.

In an embodiment of the present invention, the spacing between the bottoms of the plurality of raised structures is between 0 nm and 2000 nm.

In an embodiment of the present invention, the spacing between the plurality of raised structures and the bottom of the at least one side wall is between 0 nm and 2000 nm.

In an embodiment of the present invention, the adhesive tape comprises a plurality of side walls formed on a surface of the film and surrounding the plurality of raised structures, wherein a spacing between the bottoms of the plurality of side walls is between 0 Between m and 2000 nm.

In an embodiment of the present invention, the adhesive tape does not contain an adhesive and the adhesive is not applied to the surface of the adhesive tape.

Compared with the prior art, the present adhesive tape is formed by using a side wall on the film to surround the convex structure to form a sealed space between the film and the attached object. Therefore, the present adhesive tape can prevent liquid and foreign matter from entering. There is no adhesive tape between the surface of the object. In addition, when the present adhesive tape is used in a semiconductor process, the adhesive tape can be used to fix the wafer by attaching the film to the wafer surface by the vanishing force between the convex structure of the film and the surface of the wafer. The side wall of the film forms a confined space with the surface of the wafer to prevent liquid and foreign matter from entering. When the adhesive tape is attached to the front side of the wafer for the crystal back grinding process, the function of the integrated circuit formed on the front side of the wafer can be prevented from being affected by the adhesion of liquid or foreign matter, thereby improving the production yield of the semiconductor device. When the adhesive tape is attached to the back side of the wafer for the wafer dicing process, the back surface of the wafer can be prevented from being affected by the adhesion of liquid or foreign matter, so that the integrated circuit is not attached to the back surface when it is packaged by the package material. The liquid or foreign matter affects the bonding state between the package material and the integrated circuit, thereby improving the package quality of the semiconductor device.

Please refer to FIG. 1 to FIG. 3 at the same time. FIG. 1 is a schematic view of the first embodiment of the present adhesive tape. Fig. 2 is a partial schematic view showing the first embodiment of the present adhesive tape. Fig. 3 is a cross-sectional view taken along line A-A of Fig. 1. As shown, the present adhesive tape 100 includes a film 102, a plurality of first raised structures 104, and at least one side wall 106. A plurality of first raised structures 104 are formed on the surface of the film 102 for contacting a surface of an object (such as the surface of the wafer) to generate a wattage force, thereby causing the film 102 to be attached by van der Waals force. On the surface of the object. The side wall 106 is a continuous wall formed on the surface of the film 102 and surrounding a plurality of first raised structures 104. In the present embodiment, the glue-free tape 100 includes two side walls 106, and the side wall 106 is located at the edge of the film 102, but the present invention is not limited thereto. The position and number of side walls 106 can be adjusted as needed. When the adhesive tape 100 is attached to the surface of the object, the side wall 106 directly contacts the surface of the object, and is used to form a sealed space between the film 102 and the object to prevent liquid and foreign matter from passing through a plurality of The gap between the first raised structures 104 enters, thereby achieving the effect of preventing liquid and foreign matter from entering between the glueless tape 100 and the attached surface.

According to the above configuration, when the adhesive tape 100 is used for the semiconductor process, since the adhesive tape 100 is attached to the surface of the wafer by the van der Waals force generated by the first convex structure 104, the adhesive tape 100 is not Adhesives need to be included, and no adhesive is applied to the surface of the adhesive-free tape 100. Therefore, no adhesive remains on the wafer surface when the adhesive-free tape 100 attached to the wafer is removed. On the other hand, the surface of the sidewall 106 for contacting the surface of the wafer is a flat surface and does not include a corner, so that a sealed space can be formed between the film 102 and the surface of the wafer to prevent liquid and foreign matter from entering the adhesive-free tape 100. The gap between the surface of the wafer and the surface of the wafer is such that the surface of the wafer to which the adhesive tape is attached is used to prevent liquid and foreign matter from entering the semiconductor process (for example, a process such as crystal back grinding and/or wafer cutting).

In the first embodiment of the present invention, the widths W1 and H1 of the plurality of first raised structures 104 and the widths W2 and H2 of the side walls 106 are less than 1 micrometer, for example between 100 nanometers and 1000 nanometers. . The interval D1 between the plurality of first protruding structures 104, the interval D2 between the plurality of first protruding structures 104 and the side walls 106, and the interval D3 between the side walls 106 are both less than 2 micrometers, for example, Between 0 nm and 2000 nm. The ratio of the width W1 of the plurality of first raised structures 104 to the height H1 is between 1:2 and 2:1. The ratio of the width W2 of the side wall 106 to the height H2 is also between 1:2 and 2:1. The total height H3 of the film 102 and the side wall 106 may be between 50 micrometers and 75 micrometers, and the ratio of the height H2 of the side wall 106 and the height H1 of the plurality of first convex structures 104 may be 1:0.8. Between 1:1.

Please refer to FIG. 4, which is a cross-sectional view showing another configuration of the first embodiment of the present adhesive tape. As shown, when the interval between the plurality of first raised structures 104 is 0 nm, the bottoms of the plurality of first raised structures 104 are connected. When the interval between the plurality of first protruding structures 104 and the side walls 106 is 0 nm, the bottom of the first protruding structures 104 adjacent to the side walls 106 is connected to the bottom of the side walls 106. In addition, when the interval between the side walls 106 is 0 nm, the side walls 106 may be formed with a V-shaped (or U-shaped) gap so that the bottoms of the side walls are connected.

Please refer to FIG. 5, which is a partial schematic view of a second embodiment of the present adhesive tape. As shown, the glueless tape 200 of the second embodiment of the present invention comprises a film 102, a plurality of second raised structures 204, and at least one side wall 106. The glueless tape 200 of the second embodiment of the present invention is similar to the glueless tape 100 of the first embodiment of the present invention, with the difference that the second raised structure 204 of the glueless tape 200 of the second embodiment of the present invention is different from the adhesive tape 100. The first raised structure 104 is different. The first raised structure 104 of the adhesive tape 100 is a conical convex structure, and the second raised structure 204 of the adhesive tape 200 is a triangular convex structure extending in the same direction. In addition, the width, height, and spacing of the plurality of second protruding structures 204 and the side walls 106 of the adhesive tape 200 are the same as those of the adhesive tape 100, and will not be described here.

Please refer to FIG. 6, which is a partial schematic view of a third embodiment of the present adhesive tape. As shown, the adhesive tape 300 of the third embodiment of the present invention comprises a film 102, a plurality of third raised structures 304, and at least one side wall 106. The glue-free tape 300 of the third embodiment of the present invention is similar to the glue-free tape 200 of the second embodiment of the present invention, with the difference that the plurality of third protrusion structures 304 of the glueless tape 300 of the third embodiment of the present invention are glue-free. The second raised structure 204 of the tape 200 is different. The second raised structure 204 of the adhesive tape 200 has a triangular cross section, and the third raised structure 304 of the adhesive tape 300 has a sinusoidal cross section. In addition, the range and ratio of the width, height, and spacing of the plurality of third protruding structures 304 and the side walls 106 of the adhesive tape 300 are the same as those of the adhesive tape 100, and will not be described here.

Please refer to FIG. 7, which is a partial schematic view of a fourth embodiment of the present adhesive tape. As shown, the adhesive tape 400 of the fourth embodiment of the present invention comprises a film 102, a plurality of fourth raised structures 404, and at least one side wall 106. The plurality of fourth protruding structures 404 of the adhesive tape 400 of the fourth embodiment of the present invention comprise a plurality of convex structures 404a, 404b extending and staggered in the longitudinal direction and the lateral direction, and the convex structures 404a, 404b have a rectangular cross section. The width, height, and spacing of the plurality of fourth raised structures 404 and the side walls 106 of the adhesive tape 400 are the same as those of the adhesive tape 100 (since the plurality of fourth raised structures 404 include a plurality of longitudinal shapes) The raised structure 404a and the plurality of lateral raised structures 404b, such that the spacing D1 of the raised structures simultaneously represents the spacing between two adjacent longitudinal raised structures 404a and represents the spacing between two adjacent lateral raised structures 404b) , will not be explained here.

Please refer to Fig. 8. Fig. 8 is a plan view showing a fifth embodiment of the present adhesive tape. As shown, the plurality of fifth raised structures 504 of the glueless tape 500 of the fifth embodiment of the present invention comprise a plurality of concentric convex structures 504a and a plurality of radially disposed linear raised structures 504b. In the present embodiment, the concentric convex structure 504a can also be regarded as a side wall and used to form a closed space between the film 102 and the object. In addition, the width, height, and spacing of the plurality of fifth raised structures 504 and the side walls 106 of the adhesive tape 500 are the same as those of the adhesive tape 100 (since the plurality of fifth raised structures 504 include a plurality of concentricities) The circular convex structure 504a and the plurality of linear convex structures 504b, so that the interval D1 of the convex structure simultaneously represents the interval between two adjacent concentric convex structures 504a, and represents between the two adjacent linear convex structures 504b. Minimum interval), will not be described here.

On the other hand, the present adhesive-free tapes 100, 200, 300, 400, and 500 may be formed by imprinting on a liquid resin using a mold and using a light or heat-curing liquid resin, but the present invention is not limited thereto. Furthermore, the shapes (or cross sections) and configurations of the first to fifth convex structures 104, 204, 304, 404, and 504 are merely examples, and the shape (or cross section) and configuration of the present convex structure are not limited to the above embodiments. .

Compared with the prior art, the present adhesive tape is formed by using a side wall on the film to surround the convex structure to form a sealed space between the film and the attached object, so that the present adhesive tape can prevent liquid and foreign matter. Enter the gap between the adhesive tape and the surface of the object. In addition, when the present adhesive tape is used in a semiconductor process, the adhesive tape can be used to fix the wafer by attaching the film to the wafer surface by the vanishing force between the convex structure of the film and the surface of the wafer. A confined space is formed between the side wall of the film and the surface of the wafer to prevent liquid and foreign matter from entering. When the adhesive tape is attached to the front side of the wafer for the crystal back grinding process, the integrated circuit on the front side of the wafer can be protected from liquid or foreign matter adhesion, thereby improving the production yield of the semiconductor device; When the adhesive tape is attached to the back side of the wafer for the wafer dicing process, the back surface of the wafer can be prevented from being affected by the adhesion of liquid or foreign matter. Therefore, when the integrated circuit is packaged by the package material, the liquid is not attached to the back surface. Or foreign matter affects the bonding state between the package material and the integrated circuit, thereby improving the package quality of the semiconductor device.

100,200,300,400,500‧‧‧No adhesive tape
102‧‧‧film
104‧‧‧First raised structure
106‧‧‧Side wall
204‧‧‧second raised structure
304‧‧‧3rd raised structure
404‧‧‧4th raised structure
404a‧‧‧Longitudinal raised structure
404b‧‧‧lateral raised structure
504‧‧‧5th raised structure
504a‧‧‧Concentric raised structure
504b‧‧‧Linear raised structure
H1, H2, H3‧‧‧ height
W1, W2‧‧‧ width
D1, D2, D3‧‧ ‧ interval

Fig. 1 is a plan view showing a first embodiment of the present adhesive tape. Fig. 2 is a partial schematic view showing the first embodiment of the present adhesive tape. Fig. 3 is a cross-sectional view taken along line A-A of Fig. 1. Fig. 4 is a cross-sectional view showing another configuration of the first embodiment of the present adhesive tape. Figure 5 is a partial schematic view of a second embodiment of the present adhesive tape. Figure 6 is a partial schematic view of a third embodiment of the present adhesive tape. Figure 7 is a partial schematic view of a fourth embodiment of the present adhesive tape. Fig. 8 is a plan view showing a fifth embodiment of the present adhesive tape.

100‧‧‧No adhesive tape

102‧‧‧film

104‧‧‧First raised structure

106‧‧‧Side wall

Claims (13)

A glue-free tape comprising: a film; a plurality of raised structures formed on a surface of the film for contacting a surface of an object to generate a wattage force, and the film is attached by van der Waals force And on the surface of the object; and at least one side wall formed on the surface of the film and surrounding the plurality of raised structures for forming a confined space between the film and the object. The glue-free tape of claim 1, wherein the at least one side wall is located at an edge of the film. The non-adhesive tape of claim 1, wherein a height ratio of the at least one side wall and the plurality of raised structures is between 1:0.8 and 1:1. The non-adhesive tape of claim 1, wherein the total height of the film and the sidewall is between 50 microns and 75 microns. The non-adhesive tape of claim 1, wherein the plurality of raised structures have a width to height ratio of between 1:2 and 2:1. The glue-free tape of claim 1, wherein the at least one side wall has a width to height ratio of between 1:2 and 2:1. The non-adhesive tape of claim 1, wherein the width and height of the plurality of raised structures are between 100 nm and 1000 nm, respectively. The glue-free tape of claim 1, wherein the width and height of the at least one side wall are between 100 nm and 1000 nm, respectively. The adhesive-free tape of claim 1, wherein the spacing between the bottoms of the plurality of raised structures is between 0 nm and 2000 nm. The glueless tape of claim 1, wherein a spacing between the plurality of raised structures and a bottom of the at least one side wall is between 0 nm and 2000 nm. The non-adhesive tape according to claim 1, comprising a plurality of side walls formed on a surface of the film and surrounding the plurality of convex structures, wherein an interval between the bottoms of the plurality of side walls is 0 nm. And between 2000 nm. The non-adhesive tape according to claim 1, wherein the adhesive tape does not contain an adhesive and the adhesive is not applied to the surface of the adhesive tape. The glue-free tape of claim 1, wherein the side wall is a continuous wall.