M435148 五、新型說明： 【新型所屬之技術領域】 本創作關於一種散鱗置，尤指-種具有以麟製程成型之底 座的散熱裝置。 【先前技術】 散熱裝置與電子產品的發展息息相關。由於電子產品在運作 卞電路中的電流會因阻抗的影響而產生不必要的熱能，如果這些 熱能不能有效地排除而累積在電子產品内部的電子元件上，電子: =便有可朗為不斷升高的溫度*導致損壞。.因此，散熱裝置的優 劣影響電子產品的運作甚矩。 一般而言，許多散絲置中皆設置有鮮，用來將電子元件所 產=的熱I料至散熱器，再由賴器將熱_^電子產品外部。 目則’習知散絲置巾用來承載熱管之底座皆須 道 :且::::::_繼嫩㈣、⑽跑產= 【新型内容】 其係以_製程成來承載熱管 本創作提供一種散熱裝置， 之底座，以解決上述之問題。 根據一實施例，本創作之散熱裴 置包含~底座、 一熱管以及一 叫 5148 ^定件。底座包含一容置槽以及二擋止部，其中二擋止部分別位於 谷置槽之相對二側，且一開口介於二擋止部之間。熱管之—第一端 設置於容置槽中，使得第-端之底面外露於開Π中，其中開口之寬 f小於第-端之最大寬度。蚊件設置於底座上，使得熱管之第一 端固定於固定件與二擋止部之間。 於上述之實施例中，可將外露於容置槽之開口中之熱管貼附於 電子元件上，以對電子元件進行散熱。 •。:上所述，由於本創作之散熱裝置之底座係以壓鎮冑程成型， 製各間單，可有效提高生產鱗且降低生產成本。此外，在熱管設 座之谷置槽後’本創作再銑削底座之底面，以使熱管外露， 外賴熱官朗於電子元件上。藉此，可有效降低散熱裝置 整體南度，使得本創作之散熱裝置有._化的設計。 =於本_之優點與精神可以藉由以下賴作詳述及所附圖式 件到進一步的瞭解。 【實施方式】 裝置圖，8圖，1圖為根據本創作一實施例之散熱 座10、的"補，弟2圖為底座10的立體圖’第3圖為底 ==^及_ 14的組合圖’第4圖為底錢、熱管 …以及固疋件16的組合圖，帛5圖為第4圖中的底座 、.，Hx及固定件16沿泣線㈣ 的部分底座！〇被銑轉的剖關，第7圖為 ^弟5圖中 法製造而成之散歸置丨的背面 第:/不之製造方 Π)的正面立體圖啊第聰第2 ^圖為弟7圖中的底座 θ 46圖為搭配第1_製程示意圖。 首先’執行步驟S10，以一壓鏟匍叙士并丨二一-10句令一 _ Μ鍵軸型-底座U)，其中底座 100、-第一半部收、一第二半部1〇4、 106以及四鉚接部⑽，如第2圖所示。容置槽漏形成於第—一料 102與弟—+部104之間。二肋部1〇6位於底座1〇之相對二側且 連接第一半部K)2與第二半部1〇4。需說明的是，肋部1〇6斑柳接 部108的數量與位置可根據實際應用而決定，不以第2圖所示之實 施例為限。 接著，執行步驟S12，將一熱管12之一第一端12〇設置於容置 槽100中，且將—散熱器14設置於熱管12之一第二端122上，如 第3圖所示。熱管12之第一端12〇係自底座1〇側邊之穿孔11〇(示 於第2圖中）穿入而設置於容置槽100中。於此實施例中，熱管12 為一扁平熱管。然而.，於另一實施例中，熱管12亦可為圓形熱管或 其它形式熱管，視實際應用而定。此外，散熱器14可由多個散熱鰭 片組合而成，但不以此為限。 接著’執行步驟S14，將一固定件16設置於底座1〇上’以將 熱管12之第—端120固定於容置槽1〇〇中，如第4圖所示。於實際 應用中， 固定件16可為金屬彈片， 可將固定件16鉚接於底座1G之鉚接部 ，但不以此為限。於此實施例中， 10之鉚接部108。此外，若於壓鑄製程M435148 V. New description: [New technical field] This creation is about a kind of scaly scale, especially a kind of heat sink with a base formed by the lining process. [Prior Art] The heat sink is closely related to the development of electronic products. Since the current in the circuit of the electronic product generates unnecessary heat due to the influence of the impedance, if the heat energy cannot be effectively eliminated and accumulates on the electronic components inside the electronic product, the electron: = can be continuously increased High temperatures* cause damage. Therefore, the advantages and disadvantages of the heat sink affect the operation of the electronic product. In general, many of the filaments are placed in the middle to provide the heat I produced by the electronic components to the heat sink, and then the heat is external to the electronic product. The purpose of the 'skilled loose silk towel used to carry the base of the heat pipe is required: and::::::_Jinnen (four), (10) run production = [new content] It is the process of carrying the heat pipe A heat sink is provided to the base to solve the above problems. According to an embodiment, the heat dissipation device of the present invention comprises a base, a heat pipe, and a 5148^piece. The base includes a receiving groove and a second stopping portion, wherein the two stopping portions are respectively located on opposite sides of the valley groove, and an opening is between the two stopping portions. The first end of the heat pipe is disposed in the accommodating groove such that the bottom surface of the first end is exposed in the opening, wherein the width f of the opening is smaller than the maximum width of the first end. The mosquito member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the second stopping portion. In the above embodiments, the heat pipe exposed in the opening of the accommodating groove may be attached to the electronic component to dissipate heat from the electronic component. •. : As mentioned above, since the base of the heat sink of the present invention is formed by pressing and forming, the single scale can effectively increase the scale and reduce the production cost. In addition, after the groove in the valley of the heat pipe set, the original side of the base is milled to expose the heat pipe, and the heat is applied to the electronic component. Thereby, the overall southness of the heat sink can be effectively reduced, so that the heat sink of the present invention has a design of _. The advantages and spirit of this book can be further understood by the following detailed description and drawings. [Embodiment] FIG. 8 is a diagram of a heat sink 10 according to an embodiment of the present invention. FIG. 3 is a perspective view of the base 10. FIG. 3 is a bottom==^ and _14. The combination diagram 'Fig. 4 is the combination diagram of the bottom money, the heat pipe... and the solid element 16 , and the figure 5 is the base of the figure 4, . . . , Hx and the part of the base of the fixing piece 16 along the weeping line (4)! 〇 is cut and cut, the seventh picture is the front view of the back of the 制造 5 : : : : : : : : : : : : : : : 第 第 第 第 第 第 第 第 第 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The figure θ 46 in the figure is a schematic diagram of the first 1 process. First, 'execution step S10, with a pressure shovel 匍 丨 丨 丨 丨 丨 -10 -10 -10 -10 丨 丨 _ _ _ _ 底座 , , , , , , , , , , , , , , , , , , , 底座 底座 底座 底座4, 106 and four riveting parts (10), as shown in Figure 2. The accommodating slot is formed between the first material 102 and the div-+ portion 104. The two ribs 1〇6 are located on opposite sides of the base 1〇 and connect the first half K)2 and the second half 1〇4. It should be noted that the number and position of the rib portions 1〇6 of the stalks 108 can be determined according to the practical application, and are not limited to the embodiment shown in Fig. 2. Next, in step S12, one of the first ends 12 of one of the heat pipes 12 is disposed in the accommodating groove 100, and the heat sink 14 is disposed on one of the second ends 122 of the heat pipe 12, as shown in FIG. The first end 12 of the heat pipe 12 is inserted into the accommodating groove 100 from the through hole 11 〇 (shown in Fig. 2) of the side of the base 1 . In this embodiment, the heat pipe 12 is a flat heat pipe. However, in another embodiment, the heat pipe 12 can also be a circular heat pipe or other form of heat pipe, depending on the application. In addition, the heat sink 14 may be composed of a plurality of heat dissipating fins, but is not limited thereto. Then, step S14 is performed to fix a fixing member 16 on the base 1 to fix the first end 120 of the heat pipe 12 in the receiving groove 1 as shown in Fig. 4. In a practical application, the fixing member 16 can be a metal elastic piece, and the fixing member 16 can be riveted to the riveting portion of the base 1G, but not limited thereto. In this embodiment, the riveting portion 108 of 10. In addition, if the die casting process
，最後’執行步驟S16，銑削底座10之底面m，以於容置槽100 之一側形成-開口 116，使得熱管12之第一端12〇之底面124外露 於開口 116中’如第6圖所示。換言之，步驟S16係將第5圖所示 之厚度τι的材料銑削掉，以使熱管12之第—端12()之底面124外 露。此時，二擋止部118分別位於容置槽100之相對二側，且開口 116介於二擋止部118之間。於此實施例中，開口 116之寬度wi 小於熱f 12之第一端12〇之最大寬度W2，使得二擋止部118可將 熱管12之第一端120支撐於容置槽1〇〇中，以防止熱管12之第一 編120自開口 116脫落。換言之，熱管12之第一端12〇係固定於固 疋件16與二擋止部118之間。此外，由於熱管12之第一端120的 二侧為弧面，二擋止部118與熱管12之第一端120接觸之表面亦為 弧面，以使熱管12之第一端120可與二擋止部118緊密貼合而穩固 地設置於容置槽100中。需說明的是，若熱管12之第一端12〇的二 側為斜面，則二擋止部118與熱管12之第一端120接觸之表面亦為 斜面。 M435148 經由上述之步驟㈣至步驟S16，即可完成如第7圖所示之散 熱裝置1的製造。於實應用中，可將外露的熱管12之第一端 之底面m貝占附於電子元件（未顯示）上，再將固定件㈣固於電 子產品中的電路板（未顯示）上，以對電子元件進行散孰。如第7 圖所示，散熱裝置！製造完成後，熱管12之第一端12〇之底面124 可與銑削後之底座10之底面m共平面，以增加熱管12之散執面 積以及_於電子元件上的敎性。再者，連料—铸收與第 二半部1〇4的二肋部1〇6可加強底座10之剛性，以避免散熱敦置 於組裝時因過度受壓而損壞。 ' 請參閱第9圖至第15圖，第9圖為底座3〇的立體圖，第ι〇 圖為底座30、熱管32以及散熱器34的組合圖，第^圖為 熱官32、散熱器34以及固定件36的组合圖，第12圖為第 的底座30、熱管32以及固定件36沿γ_γ線的剖面圖，化二 第12圖中的部分底座30被銑削掉的剖面圖，第圖為以’ 示之製造方法製造而成之另-散熱裝置3㈣面立體圖，第Μ = 第14圖中的底座3〇的正面立體圖，其中第9圖至第 = 1圖的另-製程示意圖。 貫先’執行步驟sio，以-壓鑄製程成型一底座3〇 3〇包含-容置槽遍、一第一半部搬、一第二半部取、、—底座 306以及四鉚接部3〇8，如第9圖所示。容置槽3〇〇形成於肋部 3〇2與第二半部304之間。二肋部3〇6位於底座30之相對二^半^ 7 需說明的是’肋部306與鉚接 而決定，不以第9圖所示之實 連接弟一半部302與第二半部304。 部308的數量與位置可根據實際應用 施例為限。 接著，執行步驟S12，將一熱管 掷川η 士 ·…-〜冲—峒：設置於容i “ /且將一散熱器34設置於熱管32之—第二端322上，如 :圖所示。熱管32之第一端32〇係自底細上方向下置入容還 中。於此實施例中，熱管32為—扁平熱管。然而，於另一填 列中’熱管32亦可為圓形熱管或其它形式熱管，視實際應用而定, 接著，執行步驟S14，將一狀件36設置於底座3g上，以將 =32之第一端320固定於容置槽_中，如第U圖所示。於實 固定件36可為金屬彈片，但不以此為限。於此實施例中， 可將固;t件36鉚接於底座3G之鉚接部通。此外，若於麟製程 ^沒$在底座3〇上形成鉚接部3〇8，則可利用螺絲鎖固、悍接或其 疋方式將固疋件36设置於底座3〇上。在固定件％設置於底座 〇上後，肋部3〇6係與固定件36位於底座1〇之相對二側。如第U 圖所不’底座30之底® 312與容置槽300之底©314具有-厚度 农後執行步驟S16，銑削底座之底面M2，以於容置槽3〇〇 =側形成-開口 316，使得熱管32之第一端32〇之底面似外露 於開口 316中’如第13圖所示。換言之，步驟S16係將第12圖所 M435148 示之厚度72的材料銑削掉，以使熱管32之第一端32〇之底面324 外露。此時，二擋止部318分別位於容置槽300之相對二側，且開 口 316介於二擋止部318之間。於此實施例中，開口 3-16之寬度 W3小於熱管32之第一端320之最大寬度W4 Μ吏 可將熱管32之第—端32〇.支撐於容置槽3〇〇中，以防止田熱管％之 第-端320自開口 316脫落。換言之，熱管32之第一端挪係固定 於固定件36與二播止部318之間。此外，由於熱管％之第一端挪 的二側為弧面，二擔止部318與熱管32之第一端32〇接觸之表面亦 為弧面’以使熱管32之第-端32〇可與二擋止部318緊密貼合而穩 固地設置於容置槽3GG中。需說明的是，若熱f 32之第一端32〇 的二側為斜面，則二擒止部318與熱管32之第一端32〇接觸之表面 亦為斜面。 經由上述之步驟S10至步驟S16，即可完成如第14圖所示之散 ^熱裝置3的製造。於實際應用中，可將外露的熱管η之第_端孤 之底面324貼附於電子元件（未顯示）上，再將固定件％鎖固減 子產品中的電路板（未顯示）上，以對電子元件進行散熱。如第^ 圖所示，散熱裝置3製造完成後，熱管32之第一端32〇之底面似 可與銑削後之底座30之底面312共平面，以增加熱管32之散執面 積以及貼附於電子元件上的穩定性。再者，連接第一半部3〇2盘第 .二半部304的二肋部3〇6可加強敍3〇之剛性，以避免散熱楚置3 ,於組裝時因過度受壓而損壞。 、 M435148 、相較於先前技術，由於本創作之散熱裝置之底座係以壓禱製程 成型’製程簡單’可有效提高生產效率且降低生產成本。此外，在 熱管設置於底紅容置概，本麟再_結之底面，以使熱管 外露’進而將外露的熱管_於電子树上。藉此，可有效降低散 熱裳置之整體高度，使得本創作之散熱裝置有利於薄型化的設計。 以上所述僅為本創狀難實_，騎摘作申·圍所做 之均等變化與修飾，皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第1圖為根據本創作-實施例之散熱裝置之製造方法的流程 圖0 第2圖為底座的立體圖。 第3圖為底座、熱管以及散熱器的組合圖。 第圖為底座、熱管、散熱器以及固定件的組合圖。 第5圖為第4圖中的底座、熱管以及固定件沿面圖。 第6圖為第5圖中的部分底座被銑削掉的剖面圖。 第7圖為以第丨圖所不之製造方法製造而成之散熱裝置的背面 围〇 第8圖為第7圖中的底座的正面立體圖。 第9圖為底座的立體圖。 第10圖為底座、熱管以及散熱器的組合圖。 第11圖為底座、熱管、散熱器以及固定件的組合圖。 M435148 第12圖為第11圖中的底座、熱管以及固定件沿Y-Y線的剖面 圖。 第13圖為第12圖中的部分底座被銑削掉的剖面圖。 第14圖為以第1圖所示之製造方法製造而成之另一散熱裝置的 背面立體圖。 第15圖為第14圖中的底座的正面立體圖。Finally, the step S16 is performed to mill the bottom surface m of the base 10 so as to form an opening 116 on one side of the receiving groove 100, so that the bottom surface 124 of the first end 12 of the heat pipe 12 is exposed in the opening 116 as shown in FIG. Shown. In other words, step S16 mills the material of the thickness τι shown in Fig. 5 so that the bottom surface 124 of the first end 12 () of the heat pipe 12 is exposed. At this time, the two stoppers 118 are respectively located on opposite sides of the accommodating groove 100, and the opening 116 is interposed between the two stoppers 118. In this embodiment, the width wi of the opening 116 is smaller than the maximum width W2 of the first end 12〇 of the heat f 12 , so that the second stopping portion 118 can support the first end 120 of the heat pipe 12 in the receiving groove 1 . To prevent the first braid 120 of the heat pipe 12 from falling out of the opening 116. In other words, the first end 12 of the heat pipe 12 is fixed between the retaining member 16 and the second stop portion 118. In addition, since the two sides of the first end 120 of the heat pipe 12 are curved surfaces, the surface of the second stop portion 118 contacting the first end 120 of the heat pipe 12 is also curved, so that the first end 120 of the heat pipe 12 can be combined with two The stopper portion 118 is closely fitted and firmly disposed in the accommodating groove 100. It should be noted that if the two sides of the first end 12 of the heat pipe 12 are inclined, the surface of the second stop 118 contacting the first end 120 of the heat pipe 12 is also a slope. M435148 Through the above steps (4) to S16, the manufacture of the heat sink 1 as shown in Fig. 7 can be completed. In a practical application, the bottom surface of the first end of the exposed heat pipe 12 can be attached to an electronic component (not shown), and the fixing member (4) can be fixed on a circuit board (not shown) in the electronic product to Diffusion of electronic components. As shown in Figure 7, the heat sink! After fabrication, the bottom surface 124 of the first end 12 of the heat pipe 12 can be coplanar with the bottom surface m of the milled base 10 to increase the dissipative area of the heat pipe 12 and the susceptibility to the electronic components. Further, the lining-casting and the two ribs 1〇6 of the second half 1〇4 can reinforce the rigidity of the base 10 to prevent the heat dissipation from being damaged due to excessive pressure during assembly. 'Please refer to Fig. 9 to Fig. 15, Fig. 9 is a perspective view of the base 3〇, and Fig. 1 is a combination view of the base 30, the heat pipe 32 and the heat sink 34, and the second figure is the heat officer 32 and the radiator 34. And a combination view of the fixing member 36, and FIG. 12 is a cross-sectional view of the base 30, the heat pipe 32, and the fixing member 36 along the γ-γ line, and the partial base 30 in the second drawing of Fig. 12 is milled off, and the figure is A three-dimensional view of the heat sink 3 (four), which is manufactured by the manufacturing method shown in the figure, and a front perspective view of the base 3 of the figure 14 in FIG. 14 , wherein the other drawings are shown in FIG. 9 to FIG. 1 . Firstly, the step sio is performed to form a base 3〇3〇 including a accommodating groove, a first half, a second half, a base 306 and a fourth rivet 3〇8. As shown in Figure 9. The accommodating groove 3 is formed between the rib 3〇2 and the second half 304. The two ribs 3〇6 are located on the opposite side of the base 30. It is to be noted that the ribs 306 are riveted and are not connected to the second half 302 and the second half 304 as shown in Fig. 9. The number and location of the portions 308 can be limited to the actual application. Then, step S12 is executed to set a heat pipe to the second end 322 of the heat pipe 32, as shown in the figure. The first end 32 of the heat pipe 32 is placed downward from the top of the bottom. In this embodiment, the heat pipe 32 is a flat heat pipe. However, in another fill, the heat pipe 32 may also be round. The heat pipe or other heat pipe is used according to the actual application. Then, step S14 is performed to set the first member 36 on the base 3g to fix the first end 320 of the bracket 32 in the receiving slot _, as shown in FIG. As shown in the figure, the solid fixing member 36 can be a metal elastic piece, but not limited thereto. In this embodiment, the solid part t can be riveted to the riveting portion of the base 3G. $ When the rivet portion 3〇8 is formed on the base 3〇, the fixing member 36 can be placed on the base 3〇 by means of screw locking, splicing or twisting. After the fixing member is disposed on the base ,, the rib The portion 3〇6 and the fixing member 36 are located on opposite sides of the base 1〇. As shown in FIG. U, the bottom 312 of the base 30 and the bottom of the accommodating groove 300 are 314 thick. After the step S16, the bottom surface M2 of the base is milled so that the receiving groove 3〇〇=side forms the opening 316, so that the bottom surface of the first end 32 of the heat pipe 32 is exposed in the opening 316 as shown in FIG. In other words, step S16 mills the material of the thickness 72 shown by M435148 in Fig. 12 to expose the bottom surface 324 of the first end 32 of the heat pipe 32. At this time, the second stop portions 318 are respectively placed. The opposite sides of the slot 300, and the opening 316 is between the two stops 318. In this embodiment, the width W3 of the opening 3-16 is smaller than the maximum width W4 of the first end 320 of the heat pipe 32. The first end 32 of the 32 is supported in the receiving groove 3〇〇 to prevent the first end 320 of the field heat pipe from falling off from the opening 316. In other words, the first end of the heat pipe 32 is fixed to the fixing member 36 and two. In addition, since the two sides of the first end of the heat pipe % are curved, the surface of the second supporting portion 318 contacting the first end 32 of the heat pipe 32 is also curved to make the heat pipe 32 The first end 32 〇 can be closely attached to the second stop portion 318 and firmly disposed in the accommodating groove 3GG. It should be noted that if the heat f The two sides of the first end 32 of the 32 are beveled, and the surface of the second end 318 which is in contact with the first end 32 of the heat pipe 32 is also a slope. Through the above steps S10 to S16, the 14th can be completed. The manufacturing of the heat dissipating device 3 shown in the figure. In practical applications, the bottom surface 324 of the exposed end of the exposed heat pipe η can be attached to an electronic component (not shown), and then the fixing member is locked and reduced. On the circuit board (not shown) in the sub-product, the electronic component is dissipated. As shown in Fig. 2, after the heat dissipating device 3 is manufactured, the bottom surface of the first end 32 of the heat pipe 32 is similar to the base after milling. The bottom surface 312 of the 30 is coplanar to increase the slack area of the heat pipe 32 and the stability attached to the electronic components. Furthermore, the two ribs 3〇6 connecting the first half of the third half of the second half 304 can enhance the rigidity of the third half 304 to avoid heat dissipation, which is damaged by excessive pressure during assembly. M435148, compared with the prior art, because the base of the heat sink of the present invention is formed by the praying process, the process is simple, which can effectively improve the production efficiency and reduce the production cost. In addition, the heat pipe is placed on the bottom of the red space, and the bottom of the lining is reinforced, so that the heat pipe is exposed and the exposed heat pipe is placed on the electronic tree. Thereby, the overall height of the heat dissipation skirt can be effectively reduced, so that the heat sink of the present invention is advantageous for the thin design. The above description is only for the creation of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method of manufacturing a heat sink according to the present invention embodiment. Fig. 0 is a perspective view of the base. Figure 3 is a combination of the base, heat pipe and heat sink. The figure is a combination of the base, heat pipe, heat sink and fixture. Fig. 5 is a plan view of the base, the heat pipe, and the fixing member in Fig. 4. Figure 6 is a cross-sectional view of a portion of the base in Figure 5 being milled away. Fig. 7 is a rear view of the heat sink manufactured by the manufacturing method of the second drawing. Fig. 8 is a front perspective view of the base in Fig. 7. Figure 9 is a perspective view of the base. Figure 10 is a combination of the base, heat pipe and heat sink. Figure 11 is a combination of the base, heat pipe, heat sink and fixture. M435148 Figure 12 is a cross-sectional view of the base, heat pipe and fixture along the Y-Y line in Figure 11. Figure 13 is a cross-sectional view showing a portion of the base in Fig. 12 being milled off. Fig. 14 is a rear perspective view showing another heat sink manufactured by the manufacturing method shown in Fig. 1. Figure 15 is a front perspective view of the base in Figure 14.
【主要元件符號說明】 1 ' 2 5 散熱裝置 10、 30 底座 12、 32 熱管 14、 34 散熱器 16、 36 固定件 100 、300 容置槽 102 、302 第一半部 104 、304 第二半部 106 、306 肋部 108 、308 鉚接部 110 穿孔 112 、114、 124、 底面 312 、314 、324 116 ' 316 開口 118 、318 擋止部 120 ' 320 第一端 122 、322 第二端 Τ1、 Τ2 厚度 W1 、W2、 W3、 寬度 W4 Χ-Χ 、Υ-Υ 剖面線 S10-S16 步驟 11[Main component symbol description] 1 ' 2 5 Heat sink 10, 30 Base 12, 32 Heat pipe 14, 34 Heat sink 16, 36 Fixing member 100, 300 accommodating groove 102, 302 First half 104, 304 Second half 106, 306 ribs 108, 308 riveting portion 110 perforations 112, 114, 124, bottom surface 312, 314, 324 116 '316 opening 118, 318 stop 120' 320 first end 122, 322 second end Τ 1, Τ 2 thickness W1, W2, W3, width W4 Χ-Χ, Υ-Υ Section line S10-S16 Step 11