M430384 五、新型說明： 【新型所屬之技術領域】 一種轉印機’特別是指一種紫外光熱轉印機。 【先前技術】 隨著科技的進步，大量.的3C產品，如智慧型手 機、筆記型電腦等各項產品，已成為現代人於日常 生活上不可或缺的產品。 於筆記型電腦及各式3C產品，為追求視覺美 感，於其外殼上多半會作一些裝飾處理。以傳統處 理方式而言，若外殼材質為塑膠時，多半以噴塗上 色的方式進行處理。然而，此種製程方式均會於製 程中產生或多或少的有毒廢氣，造成汙染。此外， 噴塗後需額外作二次加工之程序，步驟繁鎖。 此外’亦有使用金屬表面裝飾處理的技術，對 外殼作表面處理，如使用化學著色、電解著色、裝 飾電鍵或金屬表面敍刻等技術，如於金屬殼體上產 生髮絲紋路。然而 ’此種處理方式成本較高，且具 有難以回故使用的缺點。M430384 V. New description: [New technical field] A transfer machine 'specially refers to an ultraviolet light heat transfer machine. [Prior Art] With the advancement of technology, a large number of 3C products, such as smart phones and notebook computers, have become indispensable products for modern people in their daily lives. In the notebook computer and various 3C products, in order to pursue visual beauty, most of the decoration on the outer casing will be made. In the traditional way, if the outer casing is made of plastic, it is mostly treated by spraying. However, this type of process will produce more or less toxic waste gas in the process, causing pollution. In addition, additional processing is required after spraying, and the steps are complicated. In addition, there is also the use of metal surface decoration technology to surface treatment of the outer casing, such as the use of chemical coloring, electrolytic coloring, decorative keys or metal surface engraving techniques, such as the production of hairline on the metal casing. However, this type of treatment is costly and has the disadvantage of being difficult to use.
出一種印刷結構， 再以印刷方式印刷 3 M430384 於子膜上，於子膜上形成立體圖案結構，其處理步 驟如第1圖所示，其大致上係經前處理（Sii〇)、三 滾輪61來進行上光#1(S111)、烘烤17〇它/1〇分鐘 (S 11 2)、平板印刷6 2進行印刷# 1 ( S 11 3 )、烘烤1 7 0 °C / 5 分鐘（S114)印刷#2(S115)、烘烤17〇t：/5分鐘 (S116)、印刷 #3(S117)、烘烤 17〇。〇/5 分鐘（S118)、 印刷#4(S119)、烘烤170°C/5分鐘（S120)、上光 #2(S121)、烘烤170°C/10分鐘（S122)之步驟逐層進 行平板印刷，而可於母板上形成立體圖案，最後再 藉網印63以印刷（S 123)、烘烤60。〇/3〜5分鐘（S 124) 後’使用壓印機64來壓印（S 125)立體圖文至一子膜 上，藉以形成一立體圖案。然而，此種製程方式雖 可獲彳于較精細之圖文圖樣’然而製作過程複雜，成 本較高。 因此，如何提出一種印刷結構，可快速完成立 體圖案之製作，來滿足需快速生產製造之電子產 業’為目前業界極力尋求解決的問題。 【新型内容】 本創作之主要目的，旨在提供一種紫外光熱轉 印機，其可以熱轉印方式結合光固化膠形成立體壓 紋，以快速作業。 為達上述目的，本創作之紫外光熱轉印機，其 係包含—熱轉印模組、—印刷模Μ、-烘烤模組及 4 一轉印模組。該熱轉印模組供熱轉印一薄膜結構至 —基材之表面。該印刷模組係供印刷一光固化膠層 至該基材對應該薄膜結構之一側。該烘烤模組係供 供烤該光固化朦層，使該光固化層至一適當硬度以 便後加工。該轉印模組供對應該薄膜結構於該光固 化膠層進行一立體壓紋作業，而於該基材上形成一 立體圖案層。 其中，該紫外光熱轉印機更包括一基材轉送模 組，係供搬運該基材至該熱轉印模組、該印刷模組、 該烘烤模組及該轉印模組。 其中，該熱轉印模組更包括一熱轉印輪、一送 捲結構及一加熱源，該送捲結構係輸送該薄膜結構 至該熱轉印輪處，該熱轉印輪係位於該送捲結構之 間，該加熱源係位於該熱轉印輪之一侧。 其中，該加熱源係加熱至50°C至180°C。 其中，該印刷模組包括一印刷結構及基材吸附 印刷平台，該印刷結構係設置於該基材吸附印刷平 台之一側。. 其中’該烘烤結構更包含一烤箱及一基材熱烤 輸送結構，該烤箱係位於該基材熱烤輸送結構< 一 側。 其中，該烤箱係加熱該基材至6〇。(：至180°C， 加熱時間為3〜10分鐘。 紫外光照 其中，該轉印模組更包括一轉印輪、一 射單元及一基材吸附定位滾壓平台，該轉印輪係供進 行該立體壓紋作業，該紫外光照射單元位於該轉印輪 之一側’係固化該光固化膠層，該基材吸附定位滾壓 平台係供承載該基材，並吸附、定位及滾壓該基材。 【實施方式】 為使貝審查委員能清楚了解本創作之内容，謹 以下列說明搭配圖式，敬請參閱。 請參閱第2圖、第3圖、第4圖、第5圖及第6 圖所示’其係為本創作紫外光熱轉印機較佳實施例 之方塊圖、熱轉印模組示意圖、印刷模組示意圖、 烘烤模組示意圖及轉印模組示意圖。圖中，該紫外 光熱轉印機1用於形成一立體壓紋至一基材2上， 包括一熱轉印模組11、一印刷模組12、一烘烤模組 1 3、一轉印模組1 4及一基材轉送模組1 。 該熱轉印模組11包括一熱轉印輪u丨、一送捲 結構11 2及一加熱源丨丨3。該送捲結構丨丨2可為一滚 筒型式’可供送捲及收捲一薄膜結構3。該熱轉印 輪111設置於該送捲結構112之間，可藉由壓力將 薄膜結構3轉印至一基材2上。該加熱源113則設 置於該熱轉印輪111之上方。其中，該加熱源113 之溫度可達50〜180。(：，以幫助薄膜結構3轉印至該 基材2上。 該印刷模組12則包括一印刷結構i 2 1及一基材 吸附印刷平台1 22，該印刷結構1 2 1係設置於該基 材吸附平台122之一側。其中，該印刷結構121係 供印刷一光固化膠層4至對應該薄膜結構3之該基 材2之一側面上。該基枋吸附印刷平台12 2則供吸 附該基材2，以供該印刷結構12 1作業。 該烤箱模組1 3則包括一烤箱1 3 1及一基材熱烤 輸送結構132。該烤箱131係位於該基材熱烤輸送 結構1 3 2之一側.。該烤箱1 3 1可供蜞烤塗佈於基材 2上之光固化膠層4 ’以將.光固化膠層4烘烤揮發内 部之溶劑成份。該烤箱1 3 1可供設定烘烤時間及供 烤溫度。在本實施例中’該烤箱丨3 1可設定烘烤條 件為60〜180。(：/3〜10分鐘。該基材熱烤輪送結構ι32 則用於輸送該基材2通過該烤箱131。 該轉印模組14則包括一轉印輪14 1、一紫外光 照射單元1 42及一基材吸附定位滾壓平台1 43。該 轉印輪141可供壓印該光固化膠層4以形成立體壓 紋。該紫外光照射單元142設於該轉印輪ι41之一 側’當完成立體壓紋作業之光固化膠層4通過時， 可光固化該光固化膠層4.，以定型該立體壓紋。該 基材吸附定位滾壓平台143則供承載該基材2 .，並 供及附叱位及滾壓該基材2，以帶動該基材2通 過該轉印輪141及該紫外光照射單元ι42。 該基材轉送模組1 5可設置於該熱轉印模組丨^、 該印刷模纟且12、該烘烤模組13及該轉印模組14之 M430384 間或外側，其可供搬運該基材2至該熱轉印模組 11、該印刷模組1 2、該烘烤模組1 3至該轉印模組 1 4，以進行相對應之作業。 當該紫外光熱轉印機1開始運作時，首先藉由 該基材轉送模組15將基材2搬運至該熱轉印模組 11之下方。.此時，該送捲結構112捲送該薄膜結構 3，藉由該熱轉印輪111及該加熱源Π3之輔助，將 該薄膜結構3上之接著層31、印刷色層32、保護層 33、離型層34及一聚對苯二甲酸乙二酯（pet)層35 轉印至該基材2上。接著’再由該送捲結構η]進 行收捲’以分離該離型層34及該PET層35。接著， 再由該基材轉送模組丨5將基材2搬運至該印刷模組 1 2内’藉由基材吸附印刷平台122吸附該基材2後， 該印刷結構121係於該基材2完成熱轉印之該薄膜 結構3之一側塗佈印刷該光固化膠層4。之後，再 由該基材轉送模组15將該基材2搬運至烤箱模組 13。藉由該基材熱烤輸送結構132，緩緩搬運該基 材2至該烤箱131内移動以進行加熱，以揮發該基 材2内部之溶劑.成份。接著，再藉由該基材轉送= 組15將該基材2搬運至該轉印模組14 $。該轉印 杈，’且1 4之該轉印輪丨4丨緩緩滾動，及由該基材吸附 定位滚壓平台143帶·#^ .兮I,. ▼動該基材2’而於該光固化勝 層4上壓印出一立體圖案層’再由該紫外光照射單 兀142射該光固化膠層4，以固化該光固化膠層* 8 而成型固化該立體圖案層。當該基材 立體圖案層後，再由該基材轉送模組 2 〇 此外，為保護該基材2之立體圖案層，更可再 施加-層㈣膜至該基材2之整面上，^確保該基 材2表面及該立體圖案層不被刮傷。A printing structure is printed, and 3 M430384 is printed on the sub-film by printing, and a three-dimensional pattern structure is formed on the sub-film. The processing steps are as shown in FIG. 1 , which are generally pre-processed (Sii 〇) and three rollers. 61 to perform glazing #1 (S111), baking 17 〇 it / 1 〇 minutes (S 11 2), lithography 6 2 to print # 1 (S 11 3 ), baking 1 70 ° C / 5 minutes (S114) Printing #2 (S115), baking 17〇t: 5 minutes (S116), printing #3 (S117), baking 17〇. 〇/5 minutes (S118), printing #4 (S119), baking 170 ° C / 5 minutes (S120), glazing #2 (S121), baking 170 ° C / 10 minutes (S122) steps layer by layer The lithography is performed, and a three-dimensional pattern can be formed on the mother board, and finally the screen printing 63 is used to print (S 123) and bake 60. 〇 / 3 to 5 minutes (S 124) After the embossing machine 64 is used to imprint (S 125) the stereoscopic image onto a sub-film to form a three-dimensional pattern. However, although this type of process can be obtained from a finer graphic pattern, the production process is complicated and the cost is high. Therefore, how to propose a printing structure that can quickly complete the production of the vertical pattern to meet the needs of the electronics industry that needs rapid manufacturing is a problem that the industry is currently seeking to solve. [New Content] The main purpose of this creation is to provide an ultraviolet photothermal transfer machine that can be combined with a light-curing adhesive to form a three-dimensional embossing for thermal operation. In order to achieve the above object, the ultraviolet light heat transfer machine of the present invention comprises a heat transfer module, a printing die, a baking module and a 4-transfer module. The thermal transfer module heat transfers a film structure to the surface of the substrate. The printing module is for printing a photocurable adhesive layer to one side of the substrate corresponding to the film structure. The baking module is provided for baking the photocurable layer to a suitable hardness for post processing. The transfer module is configured to perform a three-dimensional embossing operation on the photo-curing adhesive layer corresponding to the film structure, and form a three-dimensional pattern layer on the substrate. The UV thermal transfer machine further includes a substrate transfer module for transporting the substrate to the thermal transfer module, the printing module, the baking module and the transfer module. Wherein, the thermal transfer module further comprises a thermal transfer wheel, a feeding structure and a heating source, the feeding structure conveying the film structure to the thermal transfer wheel, wherein the thermal transfer wheel is located at the Between the feed structures, the heating source is located on one side of the thermal transfer wheel. Wherein, the heating source is heated to 50 ° C to 180 ° C. Wherein, the printing module comprises a printing structure and a substrate adsorption printing platform, and the printing structure is disposed on one side of the substrate adsorption printing platform. Wherein the baking structure further comprises an oven and a substrate hot-baked conveying structure, the oven being located on the side of the substrate hot-baked conveying structure < Wherein the oven heats the substrate to 6 Torr. (: to 180 ° C, heating time is 3 to 10 minutes. In the ultraviolet light, the transfer module further comprises a transfer wheel, a shooting unit and a substrate adsorption positioning rolling platform, the transfer wheel is for Performing the three-dimensional embossing operation, the ultraviolet light irradiation unit is located on one side of the transfer wheel to cure the photo-curable adhesive layer, and the substrate adsorbing and positioning the rolling platform is for carrying the substrate, and adsorbing, positioning and rolling The substrate is pressed. [Embodiment] In order to clearly understand the contents of this creation, please refer to the following description. Please refer to Figure 2, Figure 3, Figure 4, and Figure 5. FIG. 6 and FIG. 6 are a block diagram of a preferred embodiment of the UV light transfer machine, a schematic diagram of a thermal transfer module, a schematic diagram of a printing module, a schematic diagram of a baking module, and a schematic diagram of a transfer module. In the figure, the ultraviolet heat transfer machine 1 is used to form a three-dimensional embossing onto a substrate 2, including a thermal transfer module 11, a printing module 12, a baking module 13, and a transfer. The module 14 and a substrate transfer module 1. The thermal transfer module 11 includes a thermal transfer wheel u a feeding structure 11 2 and a heating source 丨丨 3. The feeding structure 丨丨 2 can be a roller type for feeding and winding a film structure 3. The thermal transfer wheel 111 is disposed at the sending Between the roll structures 112, the film structure 3 can be transferred to a substrate 2 by pressure. The heat source 113 is disposed above the heat transfer wheel 111. The temperature of the heat source 113 can be up to 50. 〜180. (: to help transfer the film structure 3 onto the substrate 2. The printing module 12 includes a printing structure i 2 1 and a substrate adsorption printing platform 1 22, the printing structure 1 2 1 The printing structure 121 is disposed on a side of the substrate 2 corresponding to the film structure 3. The substrate is adsorbed on the printing platform 12 2, for adsorbing the substrate 2 for the printing structure 12 1. The oven module 13 includes an oven 133 and a substrate hot-baked conveying structure 132. The oven 131 is located on the substrate. One side of the baking conveying structure 1 3 2 . The oven 1 3 1 can be used for baking the light-curing adhesive layer 4' on the substrate 2 The glue layer 4 is baked to evaporate the solvent component inside. The oven 13 1 can be used to set the baking time and the baking temperature. In the present embodiment, the oven can be set to a baking condition of 60 to 180. The substrate hot-baked wheel transfer structure ι32 is used to transport the substrate 2 through the oven 131. The transfer module 14 includes a transfer wheel 14 1 and an ultraviolet light irradiation unit 1 42 and a substrate adsorbing and positioning the rolling platform 1 43. The transfer wheel 141 is capable of imprinting the photo-curable adhesive layer 4 to form a three-dimensional embossing. The ultraviolet light irradiation unit 142 is disposed on one side of the transfer wheel ι41 'When the photo-curable adhesive layer 4 of the three-dimensional embossing operation is passed, the photo-curable adhesive layer 4 can be photo-cured to shape the three-dimensional embossing. The substrate adsorbing and positioning the rolling platform 143 is for carrying the substrate 2, and attaching and pressing the substrate 2 to drive the substrate 2 through the transfer wheel 141 and the ultraviolet light irradiation unit. Ι42. The substrate transfer module 15 can be disposed between the thermal transfer module, the printing die 12, the baking module 13 and the M430384 of the transfer module 14 The substrate 2 is transferred to the thermal transfer module 11, the printing module 1, and the baking module 13 to the transfer module 14 for corresponding operations. When the UV thermal transfer machine 1 starts operating, the substrate 2 is first transported under the thermal transfer module 11 by the substrate transfer module 15. At this time, the film feeding structure 112 winds up the film structure 3, and the backing layer 31, the printing color layer 32, and the protective layer on the film structure 3 are supported by the heat transfer wheel 111 and the heat source Π3. 33. A release layer 34 and a polyethylene terephthalate (pet) layer 35 are transferred onto the substrate 2. Then, the winding structure η is further wound to separate the release layer 34 and the PET layer 35. Then, the substrate transfer module 丨5 transports the substrate 2 into the printing module 1 2. After the substrate 2 is adsorbed by the substrate adsorption printing platform 122, the printing structure 121 is attached to the substrate. 2 One side of the film structure 3 on which thermal transfer is completed is coated and printed on the photocurable adhesive layer 4. Thereafter, the substrate 2 is transferred to the oven module 13 by the substrate transfer module 15. The base material 2 is slowly conveyed by the substrate to be thermally conveyed to the inside of the oven 131 for heating to volatilize the solvent component inside the substrate 2. Next, the substrate 2 is transferred to the transfer module 14$ by the substrate transfer = group 15. The transfer 杈, 'and the transfer rim 4 of the 4 丨 slowly roll, and the substrate is adsorbed and positioned by the substrate 143. ^I,. ▼ move the substrate 2' The photo-curing layer 4 is embossed with a three-dimensional pattern layer, and the photo-curing layer 4 is irradiated by the ultraviolet ray 142 to cure the photo-curable layer*8 to form and cure the three-dimensional pattern layer. After the substrate is patterned into a three-dimensional pattern, the substrate transfer module 2 is further transferred. Further, in order to protect the three-dimensional pattern layer of the substrate 2, a layer (four) film may be further applied to the entire surface of the substrate 2, ^ Ensure that the surface of the substrate 2 and the three-dimensional pattern layer are not scratched.
综上所述，本創作紫外.光熱轉印機，其功效在 於可利用熱轉印方 <，快速於基材上轉印出圖案 層’避免需如習知技術以進行多次供烤、印刷方式， 如：逐層進行平板印刷方式之作業，而可快速生產 製造。 唯，以上所述者，僅為本創作之較佳實施例而 已’並非用以限定本創作實施之範圍，在不脫離本 創作之精神與範圍下所作 ，# TU勺專變化與修飾’皆應 涵蓋於本創作之專利範圍内。In summary, the utility of the UV-light heat transfer machine of the present invention is that the thermal transfer side can be used to quickly transfer the pattern layer on the substrate to avoid the need to use conventional techniques for multiple baking. Printing methods, such as: lithography work layer by layer, and can be quickly manufactured. However, the above descriptions are merely for the preferred embodiment of the present invention and are not intended to limit the scope of the present invention, and the present invention should be made without departing from the spirit and scope of the present invention. Covered by the scope of this creation patent.
2完成成型該 15運出該基材 综上所述， 專利之創作性， 專利法之規定， 本創作之紫外光熱轉印機，係具有 及對產業的利用價值；申請人爰依 向鈞局提起新型專利之申請。 92 completed the molding of the 15 shipped out of the substrate in summary, the patent's creative, patent law provisions, the creation of the UV light heat transfer machine, has the value of the industry and the use of the industry; File an application for a new patent. 9
第1圖， 第2圖， 為習知技術印刷結構之步驟流程圖。 為本創作f外光熱㈣機較佳實施例方塊 第3圖， 印模組示意圖 為本創作紫外光熱轉印 機較佳實施例熱轉 第4圖， 模組示意圖。 第5圖， 模組示意圖。 為本創作紫外光熱轉印機較佳實施例印刷 為本創作紫外光熱轉印機較佳實施例烘烤 第6圖’為本創作紫外光熱轉印機較佳實施例轉印 模組示意圖。 【主要元件符號說明】 S110-S125 步騾流程 1 紫*外光熱轉印機 11 #轉印模組 111 熱轉印輪 112 送捲結構 113 加熱源 12 印刷模組 121 印刷結構 122 基材吸附印刷平台 13 焕烤模組 M430384 13 1 烤箱 132 基材 14 轉印 141 轉印 142 紫外 143 基材 15 基材 2 基材 3 :薄膜 3 1 接著 32 印刷 33 保護 34 離型 35 PET 4 光固 61 三滚 62 平板 63 網印 64 壓印Figure 1, Figure 2 is a flow chart of the steps of a prior art printed structure. The present invention is a preferred embodiment of the present invention. Fig. 3 is a schematic view of the printing module. The preferred embodiment of the present invention is a heat transfer diagram of the preferred embodiment of the ultraviolet light heat transfer machine. Figure 5, a schematic of the module. The preferred embodiment of the present invention is a printing of a preferred embodiment of the ultraviolet light heat transfer machine. FIG. 6 is a schematic view of a transfer module of the preferred embodiment of the ultraviolet light heat transfer machine. [Main component symbol description] S110-S125 Step flow process 1 Purple* external light heat transfer machine 11 #Transfer module 111 Thermal transfer wheel 112 Rolling structure 113 Heating source 12 Printing module 121 Printing structure 122 Substrate adsorption printing Platform 13 Resin Module M430384 13 1 Oven 132 Substrate 14 Transfer 141 Transfer 142 UV 143 Substrate 15 Substrate 2 Substrate 3: Film 3 1 Next 32 Printing 33 Protection 34 Release 35 PET 4 Light Solid 61 III Roll 62 flat 63 screen printing 64 imprint
熱烤輸送結構 模組 輪 光照射單元 吸附定位滾壓平台 轉送模組 結構 層 色層 層 層 層 化膠層 輪 印刷 機 11Hot-baked conveying structure Module Wheel Light irradiation unit Adsorption positioning rolling platform Transfer module Structure Layer Color layer Layer Layer glue layer Wheel printing machine 11