M411601 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種在基座與熱管間形成無接縫結合的 結構。 【先前技術】 電腦内的高功率電子元件，例如中央處理器（Centra丨 Processing Unit’ CPU)，在處理器中密佈許多電晶體，該 等電晶體在運作時所產生的大量熱量若不能被有效的排 散，將導致周圍溫度急劇上升，嚴重影響到該電子元件甚 至整台電腦的正常運作。 參見圖9所示的其中一種現有技術中可用來排散電子 元件所產生之熱量的散熱裝置30,其包括一基座31與複數 熱管32’該基座31之一表面内凹成型有複數相間隔且相互 平行的長槽311，該長槽311貫穿該基座31的兩相對側， 母一熱管32具有一吸熱段321與一散熱段322,各熱管32 之吸熱& 321分別谷置於該基座31之各長槽311中，如基 座31有兩長槽311以上時長槽311中間會有分隔部312 區隔，熱管32之散熱段322處套設有複數散熱鰭片33; 進一步參見圖10所示，現有技術之將上述散熱裝置3〇 之熱管32與基座31相對組裝的方式，係將原本斷面呈圓 形的熱管32之吸熱段321設置於該基座31之長槽311中， 該熱官32之吸熱段321被以整平方式廢抵變形為斷面呈扁 平狀，且該基板31之長槽311處的凹弧面與熱管32之吸 熱段321間利用銲料以銲接方式將二者結合固定，而基座 3 M411601 31的表面與熱管32之間則形成有空隙34 ; 之後’該散熱裝置30在使用時係令該熱管32之吸熱 段321及該基板31的表面貼附在一電子元件4〇上，其中， 該斷面呈扁平狀的熱管32除了可增大該熱管32之吸熱段 321與該電子元件40接觸的面積，使該電子元件4〇所產 生的熱量可經由該熱管32快速的傳導至該散熱鰭片33處 進行排散外，更可令該熱管32之吸熱段321的外壁面與該 基座31之長槽311處的凹面相互貼合，使傳導至基座31 的熱量也可經由該熱管32排散。 然而，該基板31與熱管32形成的結構，對散熱效率 來說會有以下問題，進一步參見圖1〇、11所示，當將該基 板31與熱管32之吸熱段321貼附在電子元件4〇上時，如 果該電子元件40上的部分電晶體41恰好對應到該空隙％ 與为隔部312，該處所產生的熱量便無法有效直接由熱管 32被導熱至散熱段322’而必須靠接觸的基座31將熱擴散 開，尤其是空隙34產生的空間，電晶體41的發熱只能靠 該空間的空氣變熱，再緩慢的擴散至基座31，導致該散熱 裝置30有散熱效果不如預期的問題，此外， 之散熱裝置的基座31與熱管32的結合方式 改良之處。 ’故現有技術 實有待進一步 【新型内容】 有鐘於前述現有技術所存在的問題，本創作提供一種 熱管與基座無接缝結構，希藉此設計解決現有技術之基座 與熱管間的空隙與分隔部的問題，進而提升散熱效果。 為了達到上述的創作目的’本創作所利用的技術手段 M411601 係使一基座之一頂面上内凹成型有至少一長槽，每一長槽 内設置至少一熱管，該基座之頂面與熱管之外壁面形成一 平整且無間隙的表面，讓二者間呈無接缝式的結合，以與 待散熱的熱源破實貼合。 上述基座之之每一長槽内形成有至少一凹弧面，該凹 弧面上各點之曲率中心的位置可位在該長槽的外部。 上述基座之凹弧面上各點之曲率中心的位置亦可位在 該長槽的内部。 上述基座之長槽内可形成有複數相接的凹弧面。 上述基座中之兩相鄰凹弧面的銜接處可低於該基座之 頂面。 上述基座中之兩相鄰凹弧面的銜接處亦可與該基座之 頂面齊平。 藉此設計，除了可在組裝的過程中省去銲接步驟外， 更可在使用時解決現有基座與熱管間的空隙與分隔部的問 題’有效達到提高散熱裝置之散熱效果的目的。 【實施方式】 以下配合圖式及本創作之較佳實施例，進一步闡述本 創作為達成預定創作目的所採取的技術手段。 參見圖1所示之本創作之熱管與基座無接縫結構的第 一較佳實施例，其係於基座10A的一頂面11A上内凹成型 有至少一長槽12A，該長槽12A的兩端分別貫穿該基座1〇A 的兩側面，每一長槽12A内形成有一凹弧面13A，其中， 在該凹弧面13A兩側之與該頂面11A的交接處分別成型有 一凸部14A。 5 M411601 在上述本創作之第一較佳實施例中，該凹弧面1 3a為 小於半圓的弧’即該凹弧面13A上各點之曲率中心的位置 位在該長槽i2A的外部，該凸部14A朝該基座嫩之頂面 1~1A的方向形成凸起，組裝時，先取至少一斷面呈圓形的熱 b 20为別設於該基座1 〇A之長槽1 2a中； 進一步參見圖2所示，接著再以整平方式壓抵該熱管 20,、該基座10A之頂面11A，一方面令該熱管2〇變形而 使其外壁面貼合於該基座嫩之凹弧面13A，另—方面該 基座10A之凸部14A則因整平朝向該熱管2〇與長槽12a 的方向著折變形，從而蓋覆並壓抵於該變形後之熱管的 兩側上，並將該熱管20卡固於該長槽12A中。 參見圖3所示之本創作的第二較佳實施例，其中該凹 弧面13B為大於半圓的弧，即該凹弧面13日上各點之曲率 中心的位置位在該長槽12b的内部，該凸部14B朝該朝該 基座10B之長槽12B内部的方向形成凸起，組裝時，斷面 呈圓形的熱管20係由該基座10B之長槽12日的兩端穿入 該長槽12B中； 進一步參見圖4所示，以整平方式壓抵該熱管2〇及該 基座10B之頂面11B後，該熱管2〇會變形而使其外壁面 貼合於該基座10B之凹弧面13B，該基座ι〇Β之凸部13日 亦會變形而蓋覆並壓抵於該變形後之熱管2〇的兩側，進而 將該熱管20卡固於該長槽12B中。 此外，參見圖5所示之本創作的第三較佳實施例其 t該基座10C之長槽12C内形成有二相接的凹弧面13〇， 該一凹弧面13C的銜接處低於該基座i〇c之頂面iic，又 M411601 該凹弧面13C上各點之曲率中心的位置均位在該長槽12C 的外部，每一凹弧面13C上可設置一熱管2〇 ; 又’參見圖6所示之本創作的第四較佳實施例，其中 該基座10D之長槽12D内形成有二相接的凹弧面彳3D，該 二凹弧面13D的銜接處低於該基座1〇D之頂表面，又，該 凹弧面13D上各點之曲率中心的位置均位在該長槽12D的 内部，每一凹弧面13D上可設置一熱管2〇 ; 上述第二與第四較佳實施例之基座10C、10D與設於 其中的熱官20在經過整平加工後，相鄰的兩熱管2〇會因 變形而相互貼合，且該基板1〇c、1〇D的頂面11C、11D 形成較大範圍的熱管20散熱區域，而該基座1〇c、1〇D之 凸部14C、14D則分別蓋覆並壓抵於相對應之熱管2〇的一 側，以固定該熱管20之位置。 進一步參見圖7所示之本創作的第五較佳實施例，其 中該基座10E之長槽12E内形成有二相接的凹弧面13E， 該二凹弧面13E的銜接處與該基座1〇E之頂面11E齊平， 又’該凹弧面13E上各點之曲率中心的位置均位在該長槽 12E的外部，每一凹弧面13E上可設置一熱管2〇; 進一步參見圖8所示之本創作的第六較佳實施例，其 中該基座10F之長槽12F内形成有二相接的凹旅面13F， 該二凹弧面13F的銜接處與該基座彳〇F之頂面11|Γ齊平， 又’該凹弧面13F上各點之曲率中心的位置均位在該長槽 12F的内部，每一凹弧面13F上可設置一熱管2〇; 藉由上述在基座10A、1〇B、1〇C、1〇〇、1〇E、10F之 頂面11八、1汛、1忆、11〇、1往、1扦與凹弧面13八、138、 7 M411601 13C、13D、13E、13F的交接處成型有凸部14A、14B、14C、 14D、14E、14F的設計，可令該熱管20與基座1〇A' 10B ' 10C、10D' 1〇E、10F在進行整平加工後，使該基座1〇A、 10B、10C、1〇D、10E、10F 之頂面 11A、11B、11C、11D、 11E、11F與熱管之外壁面形成一平整且無間隙的表面讓 一者間呈無接縫式的結合，如此一來，除了可在組裝的過 程中省去銲接步驟外，更可解決現有基座與熱管間的空隙 與分隔部的問題並且，此種結合方式可以使熱管2〇大部分 直接接觸電子元件上所設的電晶體，使電晶體所產生的熱 量大量且直接的由熱管20排散，故可有效達到提高散熱裝 置之散熱效果的目的。 【圖式簡單說明】 圖1為本創作第一較佳實施例經整平加工前之侧視剖 面圖。 圖2為本創作第一較佳實施例經整平加工後之側視剖 面圖。 圖3為本創作第二較佳實施例經整平加工前之側視剖 面岡。 圖 剖面圖 圖 剖面圖 圖 剖面圖 圖 為本創作第一較佳實施例之經整平加工後之側視 > 本創作第二較佳實施例之經整平加工後之側視 > 6為本創作第四較佳實施例之經整平加工後之側視 > 7為本創作第五較佳實施例之經整平加工後之側視 M411601M411601 V. New description: [New technical field] This creation is about a structure that forms a seamless joint between the pedestal and the heat pipe. [Prior Art] High-power electronic components in a computer, such as a central processing unit (Centra丨Processing Unit' CPU), in which a large number of transistors are densely packed, and if a large amount of heat generated by the transistors is not effective, The dispersal will cause the ambient temperature to rise sharply, which will seriously affect the normal operation of the electronic components and even the entire computer. Referring to FIG. 9 , a heat dissipating device 30 , which can be used to dissipate heat generated by an electronic component, includes a base 31 and a plurality of heat pipes 32 ′. One surface of the base 31 is concavely formed with a plurality of phases. The long grooves 311 are spaced apart from each other, and the long grooves 311 extend through opposite sides of the base 31. The heat pipe 32 has a heat absorption portion 321 and a heat dissipation portion 322, and the heat absorption of each heat pipe 32 is placed in the valley. In the long slot 311 of the base 31, if the base 31 has two long slots 311 or more, the partition 312 is partitioned between the long slots 311, and the heat dissipation section 322 of the heat pipe 32 is provided with a plurality of heat dissipation fins 33; Referring to FIG. 10, in the prior art, the heat pipe 32 of the heat sink 3 is assembled opposite to the base 31, and the heat absorption section 321 of the heat pipe 32 having a circular cross section is disposed on the base 31. In the long groove 311, the heat absorption section 321 of the heat official 32 is deformed into a flat shape in a flattening manner, and the concave curved surface at the long groove 311 of the substrate 31 and the heat absorption section 321 of the heat pipe 32 are utilized. The solder is fixed by welding, and the surface and heat of the base 3 M411601 31 Between the 32, a gap 34 is formed; then the heat sink 30 is used to attach the heat absorbing section 321 of the heat pipe 32 and the surface of the substrate 31 to an electronic component 4, wherein the heat sink 30 is flat. The heat pipe 32 can increase the contact area of the heat absorption section 321 of the heat pipe 32 with the electronic component 40, so that the heat generated by the electronic component 4 can be quickly conducted to the heat dissipation fin 33 via the heat pipe 32. In addition, the outer wall surface of the heat absorption section 321 of the heat pipe 32 and the concave surface of the long groove 311 of the base 31 are adhered to each other, so that heat conducted to the base 31 can also be dissipated through the heat pipe 32. However, the structure formed by the substrate 31 and the heat pipe 32 has the following problems with heat dissipation efficiency. Further, as shown in FIGS. 1 and 11, when the substrate 31 and the heat absorption section 321 of the heat pipe 32 are attached to the electronic component 4, When the upper portion of the transistor 41 on the electronic component 40 corresponds to the gap % and the partition portion 312, the heat generated at the portion cannot be effectively directly transferred from the heat pipe 32 to the heat dissipating portion 322' and must be in contact with each other. The susceptor 31 diffuses heat, especially the space created by the gap 34. The heat generated by the transistor 41 can only be heated by the air in the space, and then slowly diffused to the pedestal 31, causing the heat sink 30 to have a heat dissipation effect. The expected problem, in addition, the combination of the base 31 of the heat sink and the heat pipe 32 is improved. 'Therefore, the prior art needs to be further. [New content] With the problems of the prior art mentioned above, the present invention provides a seamless structure of the heat pipe and the base, thereby designing and solving the gap between the base and the heat pipe of the prior art. The problem with the partition improves the heat dissipation. In order to achieve the above-mentioned creative purpose, the technical means M411601 utilized in the present invention is such that at least one long groove is concavely formed on one of the top surfaces of one of the bases, and at least one heat pipe is disposed in each long groove, and the top surface of the base is provided. Forming a flat and gap-free surface with the outer wall of the heat pipe, so that the two are seamlessly combined to break the heat source to be dissipated. At least one concave arc surface is formed in each of the long grooves of the base, and a position of a center of curvature of each point on the concave surface may be located outside the long groove. The position of the center of curvature of each point on the concave arc surface of the pedestal may also be located inside the long groove. A plurality of concave curved surfaces may be formed in the long groove of the base. The junction of two adjacent concave curved surfaces in the pedestal may be lower than the top surface of the pedestal. The junction of two adjacent concave curved surfaces in the pedestal may also be flush with the top surface of the pedestal. In this way, in addition to eliminating the welding step in the assembly process, the problem of the gap between the existing base and the heat pipe and the partition can be solved in use, effectively achieving the purpose of improving the heat dissipation effect of the heat sink. [Embodiment] The following is a description of the preferred embodiment of the present invention and the preferred embodiment of the present invention, further illustrating the technical means by which the creation is intended to achieve the intended purpose of creation. Referring to the first preferred embodiment of the heat pipe and the pedestal structure of the present invention shown in FIG. 1, the top surface 11A of the base 10A is concavely formed with at least one long groove 12A. The two ends of the 12A are respectively penetrated through the two sides of the base 1A, and each of the long slots 12A is formed with a concave curved surface 13A, wherein the intersection of the concave curved surface 13A and the top surface 11A is respectively formed. There is a convex portion 14A. 5 M411601 In the first preferred embodiment of the present invention, the concave curved surface 13a is an arc smaller than a semicircle, that is, the position of the center of curvature of each point on the concave curved surface 13A is located outside the long groove i2A. The convex portion 14A is formed in a direction toward the top surface 1~1A of the pedestal. When assembling, at least one heat b 20 having a circular cross section is taken as the long groove 1 which is disposed on the pedestal 1 〇A. 2a; further see FIG. 2, and then pressurizing the heat pipe 20 in a leveling manner, the top surface 11A of the base 10A, on the one hand, deforming the heat pipe 2〇 so that the outer wall surface thereof is attached to the base The convex curved surface 13A is another, and the convex portion 14A of the base 10A is deformed by flattening toward the heat pipe 2〇 and the long groove 12a, thereby covering and pressing against the deformed heat pipe. On both sides, the heat pipe 20 is clamped in the long groove 12A. Referring to the second preferred embodiment of the present invention shown in FIG. 3, wherein the concave curved surface 13B is an arc larger than a semicircle, that is, the position of the center of curvature of each point on the concave curved surface 13 is located in the long groove 12b. Internally, the convex portion 14B is convex toward the inside of the long groove 12B of the base 10B. When assembled, the heat pipe 20 having a circular cross section is worn by the two ends of the long groove 12 of the base 10B. Referring to the long groove 12B; further, referring to FIG. 4, after the heat pipe 2〇 and the top surface 11B of the base 10B are pressed in a flattening manner, the heat pipe 2〇 is deformed so that the outer wall surface thereof is attached thereto. The concave curved surface 13B of the base 10B, the convex portion 13 of the base 〇Β is also deformed to cover and press against the two sides of the deformed heat pipe 2〇, thereby fixing the heat pipe 20 to the Long slot 12B. In addition, referring to the third preferred embodiment of the present invention shown in FIG. 5, the long groove 12C of the base 10C is formed with a concave arc surface 13〇 which is connected to each other, and the junction of the concave curved surface 13C is low. The top surface iic of the base i〇c, and M411601, the position of the center of curvature of each point on the concave curved surface 13C is located outside the long groove 12C, and a heat pipe 2 can be disposed on each concave curved surface 13C. Referring to the fourth preferred embodiment of the present invention shown in FIG. 6, wherein the long groove 12D of the base 10D is formed with two concave concave curved faces 3D, and the joints of the two concave curved faces 13D are formed. The position of the center of curvature of each point on the concave curved surface 13D is located inside the long groove 12D, and a heat pipe 2 can be disposed on each concave curved surface 13D. The susceptors 10C, 10D of the second and fourth preferred embodiments and the heat register 20 disposed therein are subjected to leveling processing, and the adjacent two heat pipes 2 相互 are attached to each other by deformation, and the substrate The top surfaces 11C and 11D of 1〇c and 1〇D form a large heat dissipation area of the heat pipe 20, and the convex portions 14C and 14D of the bases 1〇c and 1〇D are respectively covered and pressed against the corresponding ones. One side of the heat pipe 2 is fixed to fix the position of the heat pipe 20. Referring to the fifth preferred embodiment of the present invention shown in FIG. 7, the long groove 12E of the base 10E is formed with two concave concave curved faces 13E, and the joints of the concave curved faces 13E and the base are formed. The top surface 11E of the seat 1E is flush, and the position of the center of curvature of each point on the concave curved surface 13E is located outside the long groove 12E, and a heat pipe 2〇 can be disposed on each concave curved surface 13E; Referring to a sixth preferred embodiment of the present invention shown in FIG. 8, a long recessed groove 12F of the base 10F is formed with two adjacent recessed faces 13F, and the joints of the two concave curved faces 13F and the base are formed. The top surface of the seat F is 11|Γ flush, and the position of the center of curvature of each point on the concave curved surface 13F is located inside the long groove 12F, and a heat pipe 2 can be disposed on each concave curved surface 13F.藉; by the above-mentioned pedestal 10A, 1〇B, 1〇C, 1〇〇, 1〇E, 10F top surface 11 eight, 1 汛, 1 memory, 11 〇, 1 to, 1 扦 and concave arc The intersection of the surface 13 VIII, 138, 7 M411601 13C, 13D, 13E, 13F is formed with the convex portions 14A, 14B, 14C, 14D, 14E, 14F, so that the heat pipe 20 and the pedestal 1A' 10B ' 10C, 10D' 1〇E, 10F are leveling After processing, the top surfaces 11A, 11B, 11C, 11D, 11E, and 11F of the susceptors 1A, 10B, 10C, 1〇D, 10E, and 10F form a flat and gap-free surface with the outer wall surface of the heat pipe. There is a seamless joint between the two, so that in addition to the elimination of the welding step in the assembly process, the problem of the gap and the partition between the existing base and the heat pipe can be solved and the combination manner The heat pipe 2 can be directly contacted with the transistor provided on the electronic component, so that the heat generated by the transistor is largely discharged directly from the heat pipe 20, so that the heat dissipation effect of the heat dissipation device can be effectively achieved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational cross-sectional view showing the first preferred embodiment of the prior art before being leveled. Figure 2 is a side elevational cross-sectional view of the first preferred embodiment of the present invention after leveling. Fig. 3 is a side elevational view of the second preferred embodiment of the present invention before being leveled. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a first preferred embodiment of the present invention. FIG. 6 is a side view of the second preferred embodiment of the present invention. The side view after the leveling processing of the fourth preferred embodiment of the present invention is the side view M411601 after the leveling processing of the fifth preferred embodiment of the present invention.
剖面圖D 圖8為本創作第六較佳實施例之經整平加工後之側視 剖面圖。 圖9為現有技術之散熱裝置的俯視圖。 圖1 0為現有技術於實施狀態之侧視剖面圖。 圖11為現有技術之散熱裝置於實施狀態的俯視放大 【主要元件符號說明】Section D FIG. 8 is a side cross-sectional view showing the leveling process of the sixth preferred embodiment of the present invention. Figure 9 is a top plan view of a prior art heat sink. Figure 10 is a side cross-sectional view of the prior art in an implemented state. Figure 11 is a plan view of the heat sink of the prior art in an enlarged state. [Main component symbol description]
10A、10B、10C、10D、10E、10F 基座 11A、11B、11C、11D、11E、11F 頂面 12A、12B、12C、12D、12E、12F 長槽 13A、13B、13C、13D、13E、13F 凹弧面 14A、14B、14C、14D、14E、14F 凸部 20熱管 30散熱裝置 31基座 311長槽10A, 10B, 10C, 10D, 10E, 10F Bases 11A, 11B, 11C, 11D, 11E, 11F Top faces 12A, 12B, 12C, 12D, 12E, 12F Long slots 13A, 13B, 13C, 13D, 13E, 13F Concave curved surface 14A, 14B, 14C, 14D, 14E, 14F convex portion 20 heat pipe 30 heat sink 31 base 311 long groove
312分隔部 321吸熱段 33散熱鰭片 40電子元件 32熱管 322散熱段 34空隙 41電晶體 9312 partition 321 heat absorption section 33 heat sink fin 40 electronic component 32 heat pipe 322 heat sink section 34 gap 41 transistor 9