TWM403012U - Heat dissipating device having swirl generator - Google Patents
Heat dissipating device having swirl generatorInfo
- Publication number
- TWM403012U TWM403012U TW099221252U TW99221252U TWM403012U TW M403012 U TWM403012 U TW M403012U TW 099221252 U TW099221252 U TW 099221252U TW 99221252 U TW99221252 U TW 99221252U TW M403012 U TWM403012 U TW M403012U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipating
- dissipating device
- swirl generator
- swirl
- generator
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
- F28F1/325—Fins with openings
-
- H10W40/226—
-
- H10W40/43—
-
- H10W40/73—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099221252U TWM403012U (en) | 2010-11-03 | 2010-11-03 | Heat dissipating device having swirl generator |
| DE202011002064U DE202011002064U1 (en) | 2010-11-03 | 2011-01-28 | Cooling device with turbulence generators |
| JP2011001258U JP3167993U (en) | 2010-11-03 | 2011-03-09 | Heat sink device with eddy current generator |
| US13/106,938 US20120103572A1 (en) | 2010-11-03 | 2011-05-13 | Heat dissipating apparatus with vortex generator |
| US29/556,581 USD802543S1 (en) | 2010-11-03 | 2016-03-01 | Cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099221252U TWM403012U (en) | 2010-11-03 | 2010-11-03 | Heat dissipating device having swirl generator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM403012U true TWM403012U (en) | 2011-05-01 |
Family
ID=43829294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099221252U TWM403012U (en) | 2010-11-03 | 2010-11-03 | Heat dissipating device having swirl generator |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20120103572A1 (en) |
| JP (1) | JP3167993U (en) |
| DE (1) | DE202011002064U1 (en) |
| TW (1) | TWM403012U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI736460B (en) * | 2020-10-30 | 2021-08-11 | 華擎科技股份有限公司 | Heat dissipation fin and heat dissipation module |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM403012U (en) * | 2010-11-03 | 2011-05-01 | Enermax Tech Corporation | Heat dissipating device having swirl generator |
| USD699690S1 (en) * | 2013-03-29 | 2014-02-18 | Silverstone Technology Co., Ltd. | Cooling fin |
| US11604035B2 (en) * | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| USD715749S1 (en) * | 2013-11-26 | 2014-10-21 | Heatscape, Inc. | High performance high power tower heat sink |
| USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
| USD722574S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | Power heat sink with hybrid vapor chamber—heat pipe module |
| KR20160139094A (en) * | 2015-05-26 | 2016-12-07 | 엘에스산전 주식회사 | Closed cabinet for electric device having heat pipe |
| USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
| USD827588S1 (en) * | 2016-12-27 | 2018-09-04 | Sony Corporation | Chip connector |
| KR20190121356A (en) * | 2017-03-24 | 2019-10-25 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Heat dissipation device and power generation device |
| USD906268S1 (en) * | 2018-09-11 | 2020-12-29 | Rheem Manufacturing Company | Heat exchanger fin |
| US10739832B2 (en) * | 2018-10-12 | 2020-08-11 | International Business Machines Corporation | Airflow projection for heat transfer device |
| TWI812136B (en) * | 2022-03-31 | 2023-08-11 | 宏碁股份有限公司 | Electronic device, heat dissipation assembly, and thermal fin thereof |
| CN220357540U (en) * | 2023-06-19 | 2024-01-16 | 惠州市讯硕科技有限公司 | Radiator with fins with restarting boundary layer heat radiation effect |
| CN221887007U (en) * | 2024-01-25 | 2024-10-22 | 惠州市讯硕科技有限公司 | Cyclone type heat radiation fin group |
| CN120560461A (en) * | 2024-02-28 | 2025-08-29 | 英特尔公司 | Cooling system including a stack having fins |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1853315A (en) * | 1925-09-25 | 1932-04-12 | Modine Mfg Co | Radiator |
| HU181538B (en) * | 1980-03-11 | 1983-10-28 | Energiagazdalkodasi Intezet | Turbulent heat exchanger |
| US4817709A (en) * | 1987-12-02 | 1989-04-04 | Carrier Corporation | Ramp wing enhanced plate fin |
| JPH07293232A (en) * | 1994-04-21 | 1995-11-07 | Nippon Soken Inc | Metal catalyst carrier for exhaust gas purification |
| US5730214A (en) * | 1997-01-16 | 1998-03-24 | General Motors Corporation | Heat exchanger cooling fin with varying louver angle |
| US20030024687A1 (en) * | 2001-07-31 | 2003-02-06 | Cheng Chung Pin | Radiation fin set for heat sink |
| JP4115390B2 (en) * | 2001-08-10 | 2008-07-09 | よこはまティーエルオー株式会社 | Heat transfer device |
| US6578627B1 (en) * | 2001-12-28 | 2003-06-17 | Industrial Technology Research Institute | Pattern with ribbed vortex generator |
| US20070051502A1 (en) * | 2004-05-19 | 2007-03-08 | Showa Denko K.K. | Heat exchanger fin, heat exchanger, condensers, and evaporators |
| US20060231241A1 (en) * | 2005-04-18 | 2006-10-19 | Papapanu Steven J | Evaporator with aerodynamic first dimples to suppress whistling noise |
| CN100389493C (en) * | 2005-05-29 | 2008-05-21 | 富准精密工业(深圳)有限公司 | heat sink |
| WO2007077968A1 (en) * | 2005-12-28 | 2007-07-12 | National University Corporation Yokohama National University | Heat transfer device |
| WO2007108386A1 (en) * | 2006-03-23 | 2007-09-27 | Matsushita Electric Industrial Co., Ltd. | Fin-tube heat exchanger, fin for heat exchanger, and heat pump device |
| EP2015018B1 (en) * | 2006-04-21 | 2013-10-02 | Panasonic Corporation | Heat transfer fin and fin-tube heat exchanger |
| KR100821180B1 (en) * | 2006-11-28 | 2008-04-14 | 현대모비스 주식회사 | Heat sink fin for heat exchanger |
| US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| TWD125792S1 (en) * | 2007-10-26 | 2008-11-01 | 台達電子工業股份有限公司 | Heat dissipating module |
| CN101641005B (en) * | 2008-07-31 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Radiating device |
| US7961462B2 (en) * | 2009-05-28 | 2011-06-14 | Alcatel Lucent | Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components |
| CN201488626U (en) * | 2009-07-09 | 2010-05-26 | 跃腾科技股份有限公司 | Heat pipe type radiating fin capable of generating vortex |
| US8359745B2 (en) * | 2009-07-29 | 2013-01-29 | Cpumate Inc. | Method for manufacturing a heat sink |
| CN102116586B (en) * | 2009-12-30 | 2013-11-06 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
| TWM403012U (en) * | 2010-11-03 | 2011-05-01 | Enermax Tech Corporation | Heat dissipating device having swirl generator |
| USD662897S1 (en) * | 2011-01-04 | 2012-07-03 | Technicolor S.A. | Heat sink |
| CN102970851B (en) * | 2012-11-16 | 2015-07-22 | 东莞汉旭五金塑胶科技有限公司 | Heat pipe radiator |
| USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
| USD699690S1 (en) * | 2013-03-29 | 2014-02-18 | Silverstone Technology Co., Ltd. | Cooling fin |
| USD722574S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | Power heat sink with hybrid vapor chamber—heat pipe module |
| TWI508653B (en) * | 2014-06-10 | 2015-11-11 | Wistron Corp | Detachable guiding mechanism and related electronic device |
| CN204904199U (en) * | 2015-09-10 | 2015-12-23 | 酷码科技股份有限公司 | Heat sink and its fan and fan module |
-
2010
- 2010-11-03 TW TW099221252U patent/TWM403012U/en not_active IP Right Cessation
-
2011
- 2011-01-28 DE DE202011002064U patent/DE202011002064U1/en not_active Expired - Lifetime
- 2011-03-09 JP JP2011001258U patent/JP3167993U/en not_active Expired - Lifetime
- 2011-05-13 US US13/106,938 patent/US20120103572A1/en not_active Abandoned
-
2016
- 2016-03-01 US US29/556,581 patent/USD802543S1/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI736460B (en) * | 2020-10-30 | 2021-08-11 | 華擎科技股份有限公司 | Heat dissipation fin and heat dissipation module |
| US11781818B2 (en) | 2020-10-30 | 2023-10-10 | Asrock Inc. | Heat dissipation fin and heat dissipation module |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120103572A1 (en) | 2012-05-03 |
| DE202011002064U1 (en) | 2011-03-31 |
| JP3167993U (en) | 2011-05-26 |
| USD802543S1 (en) | 2017-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4K | Expiration of patent term of a granted utility model |