[go: up one dir, main page]

TWM488037U - Shielding housing and shielding device with heat dissipation function - Google Patents

Shielding housing and shielding device with heat dissipation function Download PDF

Info

Publication number
TWM488037U
TWM488037U TW103210028U TW103210028U TWM488037U TW M488037 U TWM488037 U TW M488037U TW 103210028 U TW103210028 U TW 103210028U TW 103210028 U TW103210028 U TW 103210028U TW M488037 U TWM488037 U TW M488037U
Authority
TW
Taiwan
Prior art keywords
shielding
frame
engaging portions
cover
heat dissipation
Prior art date
Application number
TW103210028U
Other languages
Chinese (zh)
Inventor
Wan-Ting Hsieh
Hsiang-Chao Liu
Original Assignee
Wistron Neweb Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Neweb Corp filed Critical Wistron Neweb Corp
Priority to TW103210028U priority Critical patent/TWM488037U/en
Publication of TWM488037U publication Critical patent/TWM488037U/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Claims (14)

一種具散熱功能之屏蔽裝置,適用於屏蔽一電路板上的至少一電子元件,該屏蔽裝置包含:一屏蔽單元,包括一覆蓋該電子元件的屏蔽蓋,該屏蔽蓋為板金件且具有一蓋板及多個散熱凸出結構,該等散熱凸出結構與該蓋板為一體的結構;及一導熱元件,介於該電子元件與該屏蔽蓋之間並且與該電子元件及該屏蔽蓋的蓋板接觸。A shielding device with a heat dissipation function, configured to shield at least one electronic component on a circuit board, the shielding device comprising: a shielding unit, comprising a shielding cover covering the electronic component, the shielding cover is a sheet metal piece and has a cover a heat dissipation protruding structure and an integrated structure of the cover plate; and a heat conducting component interposed between the electronic component and the shielding cover and the electronic component and the shielding cover The cover is in contact. 如請求項1所述具散熱功能之屏蔽裝置,其中,該屏蔽單元還包括一屏蔽框,該屏蔽框具有一框體,及多個分別形成於該框體之相對兩側的第一卡合部,該屏蔽蓋還具有二分別由該蓋板之相對兩側緣延伸的延伸片,及數量對應該等第一卡合部並分別形成於該等延伸片且提供與該等第一卡合部卡合的第二卡合部,該屏蔽蓋與該屏蔽框藉該等第一卡合部分別與該等第二卡合部卡合而相結合。The shielding device of the heat dissipation function of claim 1, wherein the shielding unit further comprises a shielding frame, the shielding frame has a frame body, and a plurality of first clamping bodies respectively formed on opposite sides of the frame body The shielding cover further has two extending pieces respectively extending from opposite side edges of the cover plate, and the first corresponding engaging portions are correspondingly formed on the extending pieces and respectively provided with the first engaging pieces The second engaging portion that is engaged with the portion, the shielding cover and the shielding frame are respectively engaged with the second engaging portions by the first engaging portions. 如請求項1所述具散熱功能之屏蔽裝置,其中,該屏蔽單元之屏蔽蓋的每一散熱凸出結構為該板金件局部擠壓隆起而概呈倒U型並具有二側片,且該等側片相貼合。The shielding device with a heat dissipation function according to claim 1, wherein each of the heat dissipating protruding structures of the shielding cover of the shielding unit has an inverted U shape and has two side pieces, and the two side pieces are Wait for the side panels to fit together. 如請求項1所述具散熱功能之屏蔽裝置,其中,該屏蔽單元之屏蔽蓋的每一散熱凸出結構為該板金件局部沖切彎折。The shielding device with a heat dissipation function according to claim 1, wherein each of the heat dissipation protruding structures of the shielding cover of the shielding unit is partially punched and bent. 如請求項2所述具散熱功能之屏蔽裝置,其中,該屏蔽框之該等第一卡合部分別形成於該框體之側面,該屏蔽 蓋之延伸片朝該屏蔽框延伸,且各第一卡合部與各第二卡合部的其中一者為凸柱,其中另一者為穿孔。The shielding device with a heat dissipation function according to claim 2, wherein the first engaging portions of the shielding frame are respectively formed on a side of the frame, the shielding The extension piece of the cover extends toward the shielding frame, and one of each of the first engaging portion and each of the second engaging portions is a protrusion, and the other is a through hole. 如請求項2所述具散熱功能之屏蔽裝置,其中,該屏蔽框之該等第一卡合部分別形成於該框體之頂緣,該屏蔽蓋之延伸片平貼於該框體之頂緣,且各第一卡合部與各第二卡合部的其中一者為卡勾,其中另一者為穿孔。The shielding device of claim 2, wherein the first engaging portions of the shielding frame are respectively formed on the top edge of the frame, and the extending piece of the shielding cover is flatly attached to the top edge of the frame. And one of each of the first engaging portions and each of the second engaging portions is a hook, and the other one is a through hole. 如請求項2所述具散熱功能之屏蔽裝置,其中,該屏蔽框之該等第一卡合部分別形成於該框體之側面,該屏蔽蓋之延伸片朝該屏蔽框延伸,且各第一卡合部與各第二卡合部其中的其中一者為卡勾,其中另一者為穿孔。The shielding device of the heat dissipation function of claim 2, wherein the first engaging portions of the shielding frame are respectively formed on a side of the frame, and the extending piece of the shielding cover extends toward the shielding frame, and each of the first One of the engaging portions and each of the second engaging portions is a hook, and the other one is a through hole. 一種具散熱功能之屏蔽殼體,適用於屏蔽一電路板上的至少一電子元件,該屏蔽殼體包含:一屏蔽蓋,覆蓋該電子元件並能傳遞該電子元件的熱能,該屏蔽蓋為板金件且包括一蓋板及多個散熱凸出結構,該等散熱凸出結構與該蓋板為一體的結構。A shielding case with a heat dissipation function, configured to shield at least one electronic component on a circuit board, the shielding case comprising: a shielding cover covering the electronic component and capable of transmitting thermal energy of the electronic component, the shielding cover is a sheet metal And comprising a cover plate and a plurality of heat dissipation protruding structures, wherein the heat dissipation protruding structures are integrated with the cover plate. 如請求項8所述具散熱功能之屏蔽殼體,還包含一屏蔽框,該屏蔽框包括一框體,及多個分別形成於該框體之相對兩側的第一卡合部,該屏蔽蓋還包括二分別由該蓋板之相對兩側緣延伸的延伸片,及數量對應該等第一卡合部並分別形成於該等延伸片且提供與該等第一卡合部卡合的第二卡合部,該屏蔽蓋與該屏蔽框藉該等第一卡合部分別與該等第二卡合部卡合而相結合。The shielding case of the heat dissipation function of claim 8, further comprising a shielding frame, the shielding frame comprising a frame body, and a plurality of first engaging portions respectively formed on opposite sides of the frame body, the shielding The cover further includes two extending pieces respectively extending from opposite side edges of the cover plate, and corresponding to the first engaging portions and respectively formed on the extending pieces and provided for engaging with the first engaging portions In the second engaging portion, the shielding cover and the shielding frame are respectively engaged with the second engaging portions by the first engaging portions. 如請求項8所述具散熱功能之屏蔽殼體,其中,該屏蔽蓋的每一散熱凸出結構為該板金件局部擠壓隆起而概呈 倒U型並具有二側片,且該等側片相貼合。The shielding case with a heat dissipation function according to claim 8, wherein each of the heat dissipating protruding structures of the shielding cover is a partial pressing protrusion of the plate metal piece It is inverted U-shaped and has two side panels, and the side panels are attached. 如請求項8所述具散熱功能之屏蔽殼體,其中,該屏蔽蓋的每一散熱凸出結構為該板金件局部沖切彎折。The shielding case with a heat dissipation function according to claim 8, wherein each of the heat dissipating protruding structures of the shielding cover is partially punched and bent. 如請求項9所述具散熱功能之屏蔽殼體,其中,該屏蔽框之該等第一卡合部分別形成於該框體之側面,該屏蔽蓋之延伸片朝該屏蔽框延伸,且各第一卡合部與各第二卡合部的其中一者為凸柱,其中另一者為穿孔。The shielding case of the heat dissipation function of claim 9, wherein the first engaging portions of the shielding frame are respectively formed on sides of the frame, and the extending piece of the shielding cover extends toward the shielding frame, and each One of the first engaging portion and each of the second engaging portions is a stud, and the other is a perforation. 如請求項9所述具散熱功能之屏蔽殼體,其中,該屏蔽框之該等第一卡合部分別形成於該框體之頂緣,該屏蔽蓋之延伸片平貼於該框體之頂緣,且各第一卡合部與各第二卡合部的其中一者為卡勾,其中另一者為穿孔。The shielding housing of the heat dissipation function of claim 9, wherein the first engaging portions of the shielding frame are respectively formed on a top edge of the frame, and the extending piece of the shielding cover is flat on the top of the frame a rim, and one of each of the first engaging portions and each of the second engaging portions is a hook, and the other one is a through hole. 如請求項9所述具散熱功能之屏蔽殼體,其中,該屏蔽框之該等第一卡合部分別形成於該框體之側面,該屏蔽蓋之延伸片朝該屏蔽框延伸,且各第一卡合部與各第二卡合部其中的其中一者為卡勾,其中另一者為穿孔。The shielding case of the heat dissipation function of claim 9, wherein the first engaging portions of the shielding frame are respectively formed on sides of the frame, and the extending piece of the shielding cover extends toward the shielding frame, and each One of the first engaging portion and each of the second engaging portions is a hook, and the other is a through hole.
TW103210028U 2014-06-06 2014-06-06 Shielding housing and shielding device with heat dissipation function TWM488037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103210028U TWM488037U (en) 2014-06-06 2014-06-06 Shielding housing and shielding device with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103210028U TWM488037U (en) 2014-06-06 2014-06-06 Shielding housing and shielding device with heat dissipation function

Publications (1)

Publication Number Publication Date
TWM488037U true TWM488037U (en) 2014-10-11

Family

ID=52108957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103210028U TWM488037U (en) 2014-06-06 2014-06-06 Shielding housing and shielding device with heat dissipation function

Country Status (1)

Country Link
TW (1) TWM488037U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109526137A (en) * 2019-01-11 2019-03-26 上海剑桥科技股份有限公司 Screening arrangement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109526137A (en) * 2019-01-11 2019-03-26 上海剑桥科技股份有限公司 Screening arrangement

Similar Documents

Publication Publication Date Title
JP2016188975A5 (en)
JP2006229046A5 (en)
JP2012093288A5 (en)
JP2012044179A (en) Electromagnetic wave blocking cover and printed circuit board module using it
MX340396B (en) ELECTRONIC CONTROL DEVICE.
JP2015206815A5 (en)
JP2013503440A5 (en)
JP2014110426A5 (en)
TWI621389B (en) Heat dissipation structure and portabel electronic device using same
JP2016139056A5 (en)
JP2014132388A5 (en)
TWI487476B (en) Heat sink
JP2013058663A5 (en)
MY175136A (en) Substrate reinforcing structure
TWM488037U (en) Shielding housing and shielding device with heat dissipation function
JP2016510513A5 (en)
JP2013214770A (en) Metal fitting and method for fixing heating component
JP2015142108A5 (en)
TWI564534B (en) heat sink
JP2014022314A5 (en)
JP2015153823A5 (en)
JP2017103366A5 (en)
JP2013225581A (en) Heat radiation structure of circuit board
TW201531215A (en) Heat dissipation mechanism for handheld electronic apparatus
JP2015133454A5 (en)

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees