TWM487608U - Heat dissipation structure of handhold device - Google Patents
Heat dissipation structure of handhold device Download PDFInfo
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- TWM487608U TWM487608U TW103210590U TW103210590U TWM487608U TW M487608 U TWM487608 U TW M487608U TW 103210590 U TW103210590 U TW 103210590U TW 103210590 U TW103210590 U TW 103210590U TW M487608 U TWM487608 U TW M487608U
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- 230000017525 heat dissipation Effects 0.000 title claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001690 polydopamine Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作係一種手持裝置散熱結構，尤指一種應用於手持裝置內提升散熱效能的散熱結構。
The present invention relates to a heat dissipation structure of a handheld device, and more particularly to a heat dissipation structure for improving heat dissipation performance in a handheld device.
現行手持式行動裝置隨著使用者其傾愛輕薄與運算及效能越來越高之要求下，其內部中央處理單元則邁向雙核心或四核心甚至更高之效能，並因中央處理器之處理效能處理速度越快其所產生之熱量也勢必越來越高，故如何解熱與薄化也成為一項非常重要的問題。
習知技術如中華民國專利申請號102209866新型一案揭示一種具有散熱結構的手持通訊裝置，此手持通訊裝置包括一殼體、一發熱元件及一散熱器，殼體內部設有一容腔；發熱元件容置在容腔內；散熱器對應發熱元件配置，散熱器包含一熱管及一導熱板，熱管一端熱貼接於發熱元件，另一端朝遠離發熱元件的方向配置；導熱板熱貼接於熱管。藉此，熱管將發熱元件產生之熱量均勻導至導熱板上，避免熱量累積於發熱元件的周圍，以達到提升散熱效率之功效。
習知技術雖然使用熱管將熱量傳導至導熱板上，但是熱量傳遞的過程使以熱管為中心然後擴散散熱至導熱板上，導熱板靠近熱管的區域的熱量較高，遠離熱管的區域的熱量較低，亦即熱管傳遞到導熱板的熱量分佈不均，散熱效果不彰，此外這樣的設計致使裝置無法薄化，故如何在現有的空間中在不增加厚度及空間之條件下，以有效解決散熱問題，為本創作的起點。
Current handheld mobile devices, with the user's love for thinness and higher computing and performance requirements, the internal central processing unit is moving toward dual-core or quad-core and even higher performance, and due to the central processor The faster the processing efficiency is processed, the more heat it generates will become higher and higher, so how to deheat and thinen is also a very important issue.
The prior art, such as the Republic of China Patent Application No. 102209866, discloses a handheld communication device having a heat dissipation structure. The handheld communication device includes a housing, a heating element and a heat sink, and a cavity is disposed inside the housing; the heating element The heat sink is disposed in the cavity; the heat sink is disposed corresponding to the heat generating component, the heat sink includes a heat pipe and a heat conducting plate, one end of the heat pipe is heat-bonded to the heat generating component, and the other end is disposed away from the heat generating component; the heat conductive plate is heat-bonded to the heat pipe . Thereby, the heat pipe uniformly conducts the heat generated by the heating element to the heat conducting plate, so as to prevent heat from accumulating around the heating element, so as to improve the heat dissipation efficiency.
Although the conventional technology uses a heat pipe to conduct heat to the heat conducting plate, the heat transfer process centers on the heat pipe and then diffuses heat to the heat conducting plate. The heat of the heat conducting plate near the heat pipe is higher, and the heat away from the heat pipe is higher. Low, that is, the heat distribution of the heat pipe to the heat conducting plate is uneven, and the heat dissipation effect is not good. Moreover, such a design makes the device not thin, so how to effectively solve the problem in the existing space without increasing the thickness and space. The issue of heat dissipation is the starting point for this creation.
有鑑於上述問題，本創作主要目的係提供一種將手持裝置內的發熱元件的熱均勻傳導到大面積的支撐體的散熱結構，以有效解決手持裝置內的散熱問題。
為達到上述目的，本創作提供一種手持裝置散熱結構，係容置在一手持裝置的殼體內，該殼體內具有至少一發熱元件，該散熱結構係包括：一支撐體，具有相反的第一側表面及一第二側表面，及一槽孔貫穿該支撐體的第一側表面及第二側表面；一熱管，係對應該發熱元件設置，且嵌設在該槽孔內，該熱管具有一第一端貼接該發熱元件或位於該發熱元件周圍及一第二端遠離該第一端，一中間段連接該第一端及該第二端；一熱傳導片，係設置在該支撐體的第一側表面，且覆蓋貼接該熱管的第一端及第二端及中間段，該熱傳導片延伸覆蓋到該第一側表面未嵌設熱管的區域。
本創作另外提供一種手持裝置散熱結構，係容置在一手持裝置的殼體內，該殼體內具有至少一發熱元件，該散熱結構係包括：一支撐體，具有相反的第一側表面及一第二側表面，及一槽孔貫穿該支撐體的第一側表面及第二側表面；一熱管係對應該發熱元件設置且嵌設在該槽孔內，該熱管具有一第一端及一第二端遠離該第一端，一中間段連接該第一端及該第二端；一熱傳導片，係設置在該支撐體的第二側表面，且覆蓋貼接該熱管的第一端及第二端及中間段，該熱傳導片延伸覆蓋到該第二側表面未嵌設熱管的區域，該發熱元件貼接該熱傳導片且隔著該熱傳導片對應該熱管的第一端。
在一實施該熱管具有相反的一第一面及一第二面，該第一面係跟該支撐體的第一側表面同一方向，該第二面係跟該支撐體的第二側表面同一方向。
在一實施該熱傳導片的組成材質的熱傳導率高於支撐體的組成材質，該支撐體係為不銹鋼或鋁合金材質構成，該熱傳導片係為銅、鋁等金屬或石墨材質構成。
In view of the above problems, the main object of the present invention is to provide a heat dissipation structure for uniformly conducting heat of a heat generating component in a handheld device to a large-area support body, so as to effectively solve the heat dissipation problem in the handheld device.
In order to achieve the above object, the present invention provides a heat dissipating structure of a handheld device, which is housed in a casing of a handheld device having at least one heating element therein, the heat dissipating structure comprising: a supporting body having an opposite first side a surface and a second side surface, and a slot penetrates the first side surface and the second side surface of the support body; a heat pipe is disposed corresponding to the heat generating component and is embedded in the slot, the heat pipe has a The first end is attached to the heating element or is located around the heating element and a second end is away from the first end, an intermediate section is connected to the first end and the second end; a heat conducting sheet is disposed on the supporting body The first side surface covers the first end and the second end and the intermediate portion of the heat pipe, and the heat conducting sheet extends to cover the area where the first side surface is not embedded with the heat pipe.
The present invention further provides a heat dissipating structure of a handheld device, which is housed in a casing of a handheld device having at least one heat generating component therein, the heat dissipating structure comprising: a supporting body having opposite first side surfaces and a first a second side surface, and a slot through the first side surface and the second side surface of the support body; a heat pipe is disposed corresponding to the heat generating component and embedded in the slot, the heat pipe has a first end and a first The second end is away from the first end, and the middle end is connected to the first end and the second end; a heat conducting sheet is disposed on the second side surface of the supporting body, and covers the first end of the heat pipe and the first end In the two ends and the middle section, the heat conducting sheet extends to cover the area of the second side surface where the heat pipe is not embedded, and the heat generating component is attached to the heat conducting sheet and corresponds to the first end of the heat pipe via the heat conducting sheet.
In an embodiment, the heat pipe has an opposite first surface and a second surface, the first surface is in the same direction as the first side surface of the support body, and the second surface is the same as the second side surface of the support body direction.
The thermal conductivity of the constituent material of the thermally conductive sheet is higher than the composition of the support. The support system is made of stainless steel or aluminum alloy. The thermal conductive sheet is made of a metal such as copper or aluminum or a graphite material.
10‧‧‧手持裝置散熱結構
11‧‧‧支撐體
111‧‧‧第一側表面
112‧‧‧第二側表面
113‧‧‧槽孔
12‧‧‧熱管
121‧‧‧第一端
122‧‧‧第二端
123‧‧‧中間段
124‧‧‧第一平面
125‧‧‧第二平面
126‧‧‧腔室
13‧‧‧熱傳導片
14‧‧‧電路板
141‧‧‧發熱元件
20‧‧‧手持裝置
21‧‧‧殼體
211‧‧‧前蓋
212‧‧‧背蓋
213‧‧‧空間
2111‧‧‧視窗
24‧‧‧顯示觸控螢幕
10‧‧‧Handheld device heat dissipation structure
11‧‧‧Support
111‧‧‧First side surface
112‧‧‧Second side surface
113‧‧‧Slots
12‧‧‧ Heat pipe
121‧‧‧ first end
122‧‧‧ second end
123‧‧‧ Middle section
124‧‧‧ first plane
125‧‧‧ second plane
126‧‧ ‧ chamber
13‧‧‧Hot conductive sheet
14‧‧‧ boards
141‧‧‧heating components
20‧‧‧Handheld devices
21‧‧‧ housing
211‧‧‧ front cover
212‧‧‧Back cover
213‧‧‧ Space
2111‧‧‧Window
24‧‧‧ display touch screen
下列圖式之目的在於使本創作能更容易被理解，於本文中會詳加描述該些圖式，並使其構成具體實施例的一部份。透過本文中之具體實施例並參考相對應的圖式，俾以詳細解說本創作之具體實施例，並用以闡述創作之作用原理。
第1A圖係為本創作立體分解示意圖；
第1B圖係為本創作之立體組合示意圖；
第1C圖係為本創作第1B圖之A-A’之剖視示意圖；
第1D圖係為本創作熱管與發熱元件另一態樣之組合示意圖；
第2A圖係為本創作容置在手持裝置的殼體內之示意圖；
第2B圖係為第2A圖之剖視示意圖；
第3A圖係為本創作另一實施之立體分解示意圖；
第3B圖係為本創作另一實施之立體組合示意圖；
第3C圖係為本創作第3B圖之B-B’之剖視示意圖。
The following figures are intended to make the present invention easier to understand, and the drawings are described in detail herein and form part of the specific embodiments. Through the specific embodiments herein and with reference to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the function principle of the creation is explained.
Figure 1A is a schematic exploded view of the creation;
Figure 1B is a three-dimensional combination diagram of the creation;
Figure 1C is a schematic cross-sectional view of A-A' of Figure 1B of the present creation;
The first 1D is a schematic diagram of a combination of another aspect of the creation heat pipe and the heating element;
2A is a schematic view of the creation of the creation in the housing of the handheld device;
Figure 2B is a schematic cross-sectional view of Figure 2A;
Figure 3A is a perspective exploded view of another implementation of the present creation;
Figure 3B is a schematic diagram of a three-dimensional combination of another implementation of the present creation;
Figure 3C is a schematic cross-sectional view of B-B' of Figure 3B of the creation.
以下將參照相關圖式，說明本創作較佳實施，其中相同的元件將以相同的元件符號加以說明。
第1A圖係為本創作立體分解圖；第1B圖係為本創作之立體組合圖；第1C圖係為本創作第1B圖之A-A’之剖視示意圖。如第1A至1C圖所示，手持裝置散熱結構10包括一支撐體11、一熱管12及一熱傳導片13。該支撐體11又稱為中框係設置在手持裝置（例如手機或導航器）的殼體內，並作為手持裝置內的其他構件例如一電路板14或一電池（無圖示）等連接的支撐結構，支撐體11具有相反的第一側表面111及一第二側表面112，及一槽孔113貫穿該支撐體11的第一側表面111及第二側表面112，該槽孔113係提供該熱管12嵌置。所以在第一側表面111及第二側表面112沒有開設槽孔113的區域界定為未嵌設熱管的區域。再者該第一側表面111對應該熱傳導片13，該第二側表面112對應該電路板14。
熱管12嵌設在該槽孔113內且對應手持裝置內的發熱元件141設置，熱管12具有一第一端121及遠離該第一端121的一第二端122，一中間段123則連接該第一端121及第二端122。熱管12較佳為薄型平板式熱管具有相反的一第一平面124及一第二平面125，該第一平面124係跟該支撐體11的第一側表面111同一方向，該第二平面125係跟該支撐體11的第二側表面112同一方向。熱管12內具有一封閉的腔室126從第一端121延伸到中間段123直到第二端122，該腔室126內設有工作流體及毛細結構，藉由在腔室126內的工作流體受熱產生循環的液汽二相變化，及汽體與液體於熱管12的第一端121及第二端122間汽往液返的對流而達到傳熱的目的。在本較佳實施該熱管12的第一端121貼接電路板14上的一發熱元件141，但是並不限於此，如第1D圖所示熱管12的第一端121位於該該發熱元件141周圍。
該熱傳導片13，係設置在該支撐體11的第一側表面111上，除了覆蓋貼接該熱管12的第一端121及第二端122及中間段123外，且覆蓋到該第一側表面111未嵌設熱管12的區域。
尤其要說明的是，支撐體11係由強度跟硬度較高的材質製成，而該熱傳導片13的組成材質的熱傳導率高於支撐體11的組成材質的熱傳導率，所以可以藉由熱傳導片13將熱管12的熱均勻分散到支撐體11的第一側表面111未嵌設熱管12的區域。在一實施該支撐體11較佳為不銹鋼或鋁合金材質（例如AL5052）構成，該熱傳導片13較佳為銅、鋁等金屬或石墨散熱膜（或稱石墨均溫片(Graphite Heat Spreader)）構成。
特別是石墨散熱膜是一種奈米複合材料作為均溫散熱的構件，適應任何表面均勻導熱，具有EMI電磁遮罩效果，其具有獨特的晶粒取向，沿兩個方向均勻導熱，片層狀結構可很好地適應任何表面。石墨散熱膜平面內（水平導熱）具有150-1500 W/m-K範圍內的超高導熱性能，而垂直導熱係數僅為5～20W/mK，幾乎起到了隔熱的作用。也因為石墨散熱膜擁有水平方向讓其他金屬難以企及的熱傳導係數，且在垂直方向上的熱傳導係數偏低的特徵。由於石墨散熱膜具有較高的水平導熱係數，因此，它能夠將熱量進行快速的水平方向的傳導，使水平方向整個表面熱量分佈均勻，消除局部熱點。所以準確來說，石墨散熱膜其實是起到了導熱，並且把熱量均勻散佈的作用，間接來說也就是起到散熱作用。
以下將詳細說明手持裝置散熱結構10應用在一手持裝置內之具體實施，本創作所指的手持裝置包含手機（包括智慧型手機）、平板電腦、PDA，顯示器及智慧型手錶，在本說明的圖式將以智慧型手機作為例示。
第2A圖係為本創作容置在手持裝置的殼體內之示意圖；第2B圖係為第2A圖之剖視示意圖。如第2A及2B圖並一併參考第1A至1C圖所示，該手持裝置20包括一殼體21係由一前蓋211及一背蓋212組成，在該前蓋211與背蓋212之間界定一空間213，前蓋211開設有一視窗2111裝設有一顯示觸控螢幕24。前述的手持裝置散熱結構10係放置在該空間213內位於前蓋211與背蓋212之間，除此之外空間213內更容置有該電路板14及電池（無圖示）等零件。在手持裝置20內的電路板14上的發熱元件141貼接該熱管12的第一端121，以透過熱管12將熱傳導到第二端122。且由於該熱傳導片13除了覆蓋貼接該熱管12的第一端121及第二端122及中間段123外，並覆蓋到該第一側表面111未嵌設熱管12的區域，進而將熱管12的熱均勻分散到支撐體11的第一側表面111未嵌設熱管12的區域。因此第一側表面111的各點位置或各區域的溫度值係為均勻分佈的狀態，並藉由這樣的設置改善發熱元件141的熱都集中在支撐體11的第一側表面111的一局部位置（對應發熱元件141的位置）的問題。
請繼續參考第3A圖係為本創作另一實施之立體分解示意圖；第3B圖係為本創作另一實施之立體組合示意圖；第3C圖係為本創作第3B圖之B-B’之剖視示意圖。如第3A至3B圖所示，前述的熱傳導片13係可以設置在該支撐體11的第二側表面112，並覆蓋貼接該熱管12的第一端121及第二端122及中間段123，及延伸覆蓋到該第二側表面112未嵌設熱管12的區域，該發熱元件141貼接該熱傳導片13且隔著該熱傳導片13對應該熱管12的第一端121。發熱元件141的熱透過熱傳導片13傳遞到該熱管12，藉由熱管12將熱由第一端121傳遞到第二端122，遠離發熱元件141的區域，同時該發熱元件141的熱及熱管12的熱經由熱傳導片13傳遞到第二側表面112未嵌設熱管12的區域。因此第二側表面112的各點位置或各區域的溫度值係為均勻分佈的狀態，並藉由這樣的設置改善發熱元件141的熱均集中在支撐體11的第二側表面112的一局部位置（對應發熱元件14的位置）的問題。
綜上所述，本創作能被應用在各種手持式裝置，如手機、平板電腦、PDA、及數位顯示器等電子裝置，將手持裝置20內的發熱元件141的熱均勻傳導到大面積表面的支撐體11的散熱結構，以有效解決手持裝置20內的散熱問題。
雖然本創作以實施方式揭露如上，然其並非用以限定本創作，任何熟悉此技藝者，在不脫離本創作的精神和範圍內，當可作各種的更動與潤飾，因此本創作之保護範圍當視後附的申請專利範圍所定者為準。
The preferred embodiment of the present invention will be described with reference to the related drawings, in which the same elements will be described with the same element symbols.
Figure 1A is a three-dimensional exploded view of the creation; Figure 1B is a three-dimensional combination of the creation; Figure 1C is a schematic cross-sectional view of A-A' of the first drawing of Figure 1B. As shown in FIGS. 1A to 1C, the handheld device heat dissipation structure 10 includes a support body 11, a heat pipe 12, and a heat conduction sheet 13. The support body 11 is also referred to as a middle frame system disposed in a housing of a handheld device (such as a mobile phone or a navigator), and is supported as a connection between other components in the handheld device such as a circuit board 14 or a battery (not shown). The support body 11 has opposite first side surfaces 111 and a second side surface 112, and a slot 113 extends through the first side surface 111 and the second side surface 112 of the support body 11. The slot 113 provides The heat pipe 12 is embedded. Therefore, the area where the first side surface 111 and the second side surface 112 are not provided with the slot 113 is defined as a region where the heat pipe is not embedded. Again, the first side surface 111 corresponds to the thermally conductive sheet 13, which corresponds to the circuit board 14.
The heat pipe 12 is disposed in the slot 113 and is disposed corresponding to the heat generating component 141 in the handheld device. The heat pipe 12 has a first end 121 and a second end 122 away from the first end 121. The first end 121 and the second end 122. The heat pipe 12 preferably has a thin flat heat pipe having an opposite first plane 124 and a second plane 125. The first plane 124 is in the same direction as the first side surface 111 of the support body 11, and the second plane 125 is The same direction as the second side surface 112 of the support body 11. The heat pipe 12 has a closed chamber 126 extending from the first end 121 to the intermediate portion 123 to the second end 122. The chamber 126 is provided with a working fluid and a capillary structure, and the working fluid in the chamber 126 is heated. The two-phase change of the liquid-vapor is generated, and the convection of the vapor and the liquid between the first end 121 and the second end 122 of the heat pipe 12 to the liquid return reaches the purpose of heat transfer. In the preferred embodiment, the first end 121 of the heat pipe 12 is attached to a heat generating component 141 on the circuit board 14, but is not limited thereto. The first end 121 of the heat pipe 12 is located at the heat generating component 141 as shown in FIG. around.
The heat conducting sheet 13 is disposed on the first side surface 111 of the support body 11 except for covering the first end 121 and the second end 122 and the intermediate portion 123 of the heat pipe 12, and covering the first side The surface 111 is not embedded with the area of the heat pipe 12.
In particular, the support 11 is made of a material having a high strength and hardness, and the thermal conductivity of the constituent material of the thermally conductive sheet 13 is higher than the thermal conductivity of the constituent material of the support 11, so that it can be thermally conductive. 13 The heat of the heat pipe 12 is uniformly dispersed to a region where the first side surface 111 of the support 11 is not embedded with the heat pipe 12. In a preferred embodiment, the support body 11 is preferably made of stainless steel or aluminum alloy (for example, AL5052). The heat conductive sheet 13 is preferably a metal such as copper or aluminum or a graphite heat sink (or a graphite heat spreader). Composition.
In particular, the graphite heat-dissipating film is a kind of nano-composite material as a component for uniform temperature heat dissipation, which is suitable for uniform heat conduction on any surface, has an EMI electromagnetic shielding effect, has a unique grain orientation, and uniformly conducts heat in two directions, a lamellar structure. It fits well on any surface. The graphite heat-dissipating film has an ultra-high thermal conductivity in the range of 150-1500 W/mK, and the vertical thermal conductivity is only 5-20 W/mK, which almost plays a role of heat insulation. Also, the graphite heat-dissipating film has a heat transfer coefficient that is difficult to achieve in other directions in the horizontal direction, and has a low heat transfer coefficient in the vertical direction. Because the graphite heat-dissipating film has a high horizontal thermal conductivity, it can conduct heat in a fast horizontal direction, so that the heat distribution of the entire surface in the horizontal direction is uniform, eliminating local hot spots. So accurately speaking, the graphite heat-dissipating film actually plays the role of heat conduction and evenly distributes heat, which indirectly means heat dissipation.
The following is a detailed description of the implementation of the handheld device heat dissipation structure 10 in a handheld device. The handheld device referred to in this creation includes a mobile phone (including a smart phone), a tablet computer, a PDA, a display, and a smart watch. The diagram will be exemplified by a smart phone.
2A is a schematic view of the creation of the device in the housing of the handheld device; FIG. 2B is a schematic cross-sectional view of the second embodiment. As shown in FIGS. 2A and 2B and referring to FIGS. 1A to 1C, the handheld device 20 includes a housing 21 composed of a front cover 211 and a back cover 212. The front cover 211 and the back cover 212 are A space 213 is defined between the front cover 211 and a window 2111 for mounting a touch screen 24. The above-mentioned hand-held device heat dissipation structure 10 is placed between the front cover 211 and the back cover 212 in the space 213, and the circuit board 213 and the battery (not shown) and the like are accommodated in the space 213. A heat generating component 141 on the circuit board 14 within the handheld device 20 is attached to the first end 121 of the heat pipe 12 to conduct heat through the heat pipe 12 to the second end 122. And the heat conducting sheet 13 covers the first end 121 and the second end 122 and the intermediate portion 123 of the heat pipe 12, and covers the area where the heat pipe 12 is not embedded in the first side surface 111, and then the heat pipe 12 is further disposed. The heat is uniformly dispersed to a region where the first side surface 111 of the support 11 is not embedded with the heat pipe 12. Therefore, the position of each point of the first side surface 111 or the temperature value of each area is a state of uniform distribution, and by such an arrangement, the heat of the heat generating element 141 is concentrated on a part of the first side surface 111 of the support body 11. The problem of the position (corresponding to the position of the heat generating element 141).
Please refer to FIG. 3A for a three-dimensional exploded view of another embodiment of the present invention; FIG. 3B is a three-dimensional combination diagram of another implementation of the present creation; FIG. 3C is a section of B-B' of FIG. See the schematic. As shown in FIG. 3A to FIG. 3B , the heat conduction sheet 13 may be disposed on the second side surface 112 of the support body 11 and cover the first end 121 and the second end 122 and the intermediate portion 123 of the heat pipe 12 . And extending to cover the region of the second side surface 112 where the heat pipe 12 is not embedded, the heat generating component 141 is attached to the heat conducting sheet 13 and corresponds to the first end 121 of the heat pipe 12 via the heat conducting sheet 13 . The heat of the heat generating component 141 is transmitted to the heat pipe 12, and the heat is transferred from the first end 121 to the second end 122 by the heat pipe 12, away from the region of the heat generating component 141, and the heat and heat pipe 12 of the heat generating component 141. The heat is transferred to the region where the heat pipe 12 is not embedded via the heat conduction sheet 13 to the second side surface 112. Therefore, the position of each point of the second side surface 112 or the temperature value of each area is a uniformly distributed state, and the heat of the heat generating element 141 is concentrated on a part of the second side surface 112 of the support body 11 by such an arrangement. The problem of the position (corresponding to the position of the heating element 14).
In summary, the present invention can be applied to various handheld devices, such as mobile phones, tablet computers, PDAs, and digital displays, to uniformly conduct the heat of the heating element 141 in the handheld device 20 to the support of a large surface. The heat dissipation structure of the body 11 is effective to solve the heat dissipation problem in the handheld device 20.
Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.
10‧‧‧手持裝置散熱結構 10‧‧‧Handheld device heat dissipation structure
11‧‧‧支撐體 11‧‧‧Support
111‧‧‧第一側表面 111‧‧‧First side surface
112‧‧‧第二側表面 112‧‧‧Second side surface
113‧‧‧槽孔 113‧‧‧Slots
12‧‧‧熱管 12‧‧‧ Heat pipe
121‧‧‧第一端 121‧‧‧ first end
122‧‧‧第二端 122‧‧‧ second end
123‧‧‧中間段 123‧‧‧ Middle section
13‧‧‧熱傳導片 13‧‧‧Hot conductive sheet
14‧‧‧電路板 14‧‧‧ boards
141‧‧‧發熱元件 141‧‧‧heating components
Claims (8)
一支撐體，具有相反的第一側表面及一第二側表面，及一槽孔貫穿該支撐體的第一側表面及第二側表面；
一熱管，係對應該發熱元件設置，且嵌設在該槽孔內，該熱管具有一第一端貼接該發熱元件或位於該發熱元件周圍及一第二端遠離該第一端，一中間段連接該第一端及該第二端；
一熱傳導片，係設置在該支撐體的第一側表面，並覆蓋貼接該熱管的第一端及第二端及中間段，及延伸覆蓋到該第一側表面未嵌設熱管的區域。A heat dissipating structure of a handheld device is housed in a housing of a handheld device having at least one heat generating component therein, the heat dissipating structure comprising:
a support body having opposite first side surfaces and a second side surface, and a slot extending through the first side surface and the second side surface of the support body;
a heat pipe disposed corresponding to the heating element and embedded in the slot, the heat pipe having a first end attached to the heating element or located around the heating element and a second end away from the first end, a middle a segment connecting the first end and the second end;
A heat conducting sheet is disposed on the first side surface of the support body and covers the first end and the second end and the intermediate portion of the heat pipe, and extends to cover a region where the heat pipe is not embedded in the first side surface.
一支撐體，具有相反的第一側表面及一第二側表面，及一槽孔貫穿該支撐體的第一側表面及第二側表面；
一熱管係對應該發熱元件設置且嵌設在該槽孔內，該熱管具有一第一端及一第二端遠離該第一端，一中間段連接該第一端及該第二端；
一熱傳導片，係設置在該支撐體的第二側表面，並覆蓋貼接該熱管的第一端及第二端及中間段，及延伸覆蓋到該第二側表面未嵌設熱管的區域，該發熱元件貼接該熱傳導片且隔著該熱傳導片對應該熱管的第一端。A heat dissipating structure of a handheld device is housed in a housing of a handheld device having at least one heat generating component therein, the heat dissipating structure comprising:
a support body having opposite first side surfaces and a second side surface, and a slot extending through the first side surface and the second side surface of the support body;
a heat pipe is disposed corresponding to the heat generating component and embedded in the slot, the heat pipe has a first end and a second end away from the first end, and an intermediate section is connected to the first end and the second end;
a thermally conductive sheet disposed on the second side surface of the support body, covering the first end and the second end and the intermediate portion of the heat pipe, and extending to cover the area of the second side surface where the heat pipe is not embedded The heat generating component is attached to the heat conducting sheet and corresponds to the first end of the heat pipe via the heat conducting sheet.
The heat dissipation structure of the handheld device according to claim 7, wherein the support system is made of stainless steel or aluminum alloy; the heat conductive sheet is made of metal such as copper or aluminum or graphite.
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| Application Number | Priority Date | Filing Date | Title |
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| TW103210590U TWM487608U (en) | 2014-06-17 | 2014-06-17 | Heat dissipation structure of handhold device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW103210590U TWM487608U (en) | 2014-06-17 | 2014-06-17 | Heat dissipation structure of handhold device |
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| TWM487608U true TWM487608U (en) | 2014-10-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617234B (en) * | 2015-05-27 | 2018-03-01 | 宏碁股份有限公司 | Electronic apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617234B (en) * | 2015-05-27 | 2018-03-01 | 宏碁股份有限公司 | Electronic apparatus |
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