TWM473898U - Ultrasonic vibration uniforming equipment for wafer polishing slurry - Google Patents

Description

Wafer polishing liquid ultrasonic vibration equipment

The creation of such a wafer polishing liquid ultrasonic oscillating device is a novel technique for improving the mixing and mixing of the fine particles, improving the mixing quality, and saving the time for mixing the predetermined wafer grinding diluent faster and more.

Nowadays, in the era of microelectronics, many electronic products are becoming more and more compact and easy to carry due to the development of integrated circuits. However, the wafer size required for integrated circuits is made by careful wafer cutting and polishing. The wafer polishing liquid that can grind the wafer must also be very delicate. Otherwise, the rough grinding will waste a lot of wafer material, which will increase the cost of the wafer, and thus the wafer polishing liquid (wafer polishing liquid) It is suitable for the aqueous slurry, cerium oxide, and the industry is known as SLURRY. It is suitable for mixing and quantifying the wafer grinding liquid with the pure water. It does not make the grinding effect too thick or excessive. Grinding is very important, and because the specific gravity of the wafer grinding stock is very heavy, from the wafer grinding stock solution to the predetermined mixing dilution of the wafer polishing liquid, it is sent to the various pipelines of the grinding machine for delivery and distribution, and the standing time is long. Precipitating will be apparent, so that the liquid concentration in the upper layer of the pipeline is more concentrated than that in the lower layer, resulting in uneven grinding effect of the diluted wafer slurry in the same batch. After the quantitative and sufficient mixing operation, it is also necessary to pay special attention to it. After the supply liquid is not quantitatively determined, the mixing is not true or the mixing is too long, and the shortcomings in the same batch of liquid are generated. , so the industry is mixing In the process before and after the wafer grinding and diluting solution, mix it with a special mixing device that operates with a circulation function and a mechanism that prevents precipitation.

The device for mixing the predetermined wafer grinding dilution concentration, as shown in the schematic diagram of the blade stirring slurry wafer polishing device and the surrounding related pipeline equipment in the first figure, the blade is evenly mixed with the wafer grinding liquid mixing device 10 The electric pump 20 drives the blade 30 to extend from the bottom into the center of the agitation tank 40, and respectively connects the external pure water amount take-up cylinder 50 and the wafer polishing raw liquid amount take-up cylinder 60 to the pure water and the wafer grinding stock solution at the top of the stirring tank 40. The tubes 70, 71 are disposed at the bottom of the agitation tank 40, and the outlet pipe 41 is connected to the filter 80 for the subsequent wafer polishing device 90, and the pre-exit flow is returned to the agitation tank 40 for circulation. The returning tube 42 is formed by the precipitation process. When a predetermined proportion of the pure water and the wafer grinding stock enter the stirring tank 40, the electric pump 20 is started to drive the blade 30 to agitate a uniform predetermined wafer grinding diluent concentration. The composition will result in the following missing points:

1. Because the blade is agitated, the edge of the film is sticky, and it is easy to sink.

2. It takes about 4~5 hours for each stirring process to pass through the filter. This time is still too long, and the timing of the precipitation of the slurry grinding liquid particles is increased, which affects the mixing quality of the wafer polishing liquid.

3. The structure of the electric pump driving the blade into the agitation tank is relatively complicated, and the blade directly contacts the rounding and grinding of the raw liquid particles and water molecules. After using for a period of time, not only the edge of the leaf will wear, but also the blade will produce a slight bending deformation, which will affect the stirring. Performance, these components must be repaired frequently.

4. Due to poor uniformity of blade agitation, it is not possible to completely mix the wafer slurry quickly and grow to withstand the circulation time of the flow back to the agitation tank, and the equipment supplier will add the filter to the larger wafer slurry particles. Filtration prevents the large wafer polishing liquid particles from being scratched when the wafer is polished, and in the case of not having a long time to withstand the circulation time of the flow back to the agitation tank, it is inevitable The large amount of slurry slurry particles that are filtered and intercepted is increased, not only the particles of the filter slurry that are not filtered are used effectively, but also the waste of waste is generated, and the filter plugging workload is large, and the filter element is completely blocked early. In the case of flow, the filter is often replaced with a new filter to maintain the normal supply of the wafer slurry to the flow rate of the wafer, resulting in an increase in operating costs.

In view of the above-mentioned various kinds of blade mixing equipment that mixes out the predetermined wafer grinding dilution concentration, the creator is actively researching the improvement method. After some painstaking thinking and testing process, the author finally has this creation.

The creation of such a wafer polishing liquid ultrasonic oscillating device, which is intended to improve the lack of equipment for mixing the wafer polishing liquid in the blade, the main body of which is a closed cylindrical piece projecting from the upper end of the liquid pipe to the upper end of the liquid pipe, and The closed tubular member is composed of at least one trough layer vertically surrounding, and the trough body at the center of the closed cylindrical member is a mixing tank, so that the liquid inlet pipe is introduced into the mixing trough space from the lower end, and the liquid discharging pipe is mixed and mixed from the upper end. The space inside the sluice, especially at the outer wall around the groove of the mixing tank, is superimposed with at least one ultrasonic oscillating head, thereby constituting the wafer grinding liquid and the water flowing into the mixing tank through the liquid inlet tube, and then being ultrasonically oscillated The head is shaken to the vibration and uniformity in the mixing tank, and then the predetermined wafer grinding dilution liquid shaken in the tank is sent to the wafer grinding operation through the liquid discharge pipe.

Based on the lower frequency of the ultrasonic wave, the period and amplitude of the ultrasonic wave generated by various types of ultrasonic oscillating heads are changed by the vibration machine, which is like the single cycle diagram of the second figure. The difference between the surrounding wave pattern and the frequency modulation periodogram of the fourth picture, together with the ultrasonic oscillating head array which can simultaneously use more than two different types of cycles, produces a more complicated and chaotic wave frequency variation. The fast transmission of the frequency scatters a variety of mixed fluid molecules to achieve a fast mixing effect, and regardless of the type of ultrasonic vibration of the cycle type, The liquid instantly causes different actions of "boosting" and "decompression". It will continuously produce various near-true void distribution patterns in the liquid, and the gas dissolved in the liquid becomes a bubble, which is called a cavity phenomenon. When the bubbles are squeezed and destroyed by the atmosphere, a strong shock wave is generated to directly break the surrounding particles, so that the particles are more differentially pulverized and more easily mixed, thereby achieving the following effects.

Because of the creation of such a device, the ultrasonic wave is transmitted from the outer wall of the mixing tank to the inside of the mixing tank, and there is no rotating member such as a blade in the mixing tank, so that the blade edge is not adhered and the edge is sticky. The sinking of the stagnation and the lack of mixing and unfavorable mixing is one of the purposes of this creation.

After the same mixing liquid amount test, the device generates ultrasonic vibration of the wafer polishing liquid process to send out the filter for about 2.5 hours, without calculating the filter time, only calculating the ultrasonic vibration time. 40 minutes, far less than the use of blade mixing and filtration, it takes 4 to 5 hours to be much shorter, speeding up the wafer grinding of the raw liquid particles and mixing the output speed, and recycling the remixing efficiency, reducing the retention of the wafer slurry in the pipeline, deposition generation The large wafer polishing liquid particle timing can improve the quality and appropriate utilization rate of the wafer polishing liquid, which is another purpose of the creation.

Moreover, because of the creation of such a device, there is no complicated structure of the structure in which the electric pump drives the blade into the agitation tank. Therefore, after a period of use, there is no leaf edge wear, and the blade is also slightly bent and deformed, which affects the stirring performance problem. Maintenance is more convenient, this is another purpose of this creation.

Furthermore, the creation of such a device can more precisely pulverize the particles in the miscible mixture, so that the diluted wafer slurry is diluted in concentration, the acidity is completely uniform, and the growth is resistant to the flow back to the agitation tank. The cycle time, even if the equipment supplier will add the filter, in the case that the mixing particles are smaller, and the circulation time of the flow back to the agitation tank is tolerated when it is long, the filter is inevitably blocked. The large amount of wafer slurry particles is reduced, which greatly reduces the waste of waste that is no longer useful. The number of particles of the wafer slurry that is filtered is also reduced, reducing the filter plugging workload and lengthening the filter filter life. In order to maintain the flow rate of the normal grinding wafer, and the number of new filters is changed, the operating cost is greatly reduced, which is a further objective of the creation.

As for the detailed structure, application principle, function and effect of this creation, a complete understanding can be obtained by referring to the following description according to the drawings.

10‧‧‧Way the blade stir the wafer grinding liquid mixing equipment

20‧‧‧Electric pump

30‧‧‧ leaves

40‧‧‧Stirring tank

41‧‧‧Draining tube

42‧‧‧Return pipe

50‧‧‧ pure water volume

60‧‧‧ Wafer grinding stock solution

70,71‧‧‧Injection tube

80‧‧‧Filter

90‧‧‧ Wafer grinding equipment

100‧‧‧Closed cylinder

200‧‧‧Inlet tube

300‧‧‧Draining tube

400‧‧‧ mixing tank

401‧‧‧sealing tank

402‧‧‧Shell body

403‧‧‧Teflon layer

404‧‧‧包密外槽

405‧‧‧foam

500,501,502‧‧‧Supersonic shock head

The first picture is a schematic diagram of the equipment for mixing the wafer slurry and the surrounding pipeline equipment.

The second picture shows a single cycle diagram of a single-cycle type ultrasonic oscillating head.

The third picture shows the surrounding wave pattern of the surrounding wave type ultrasonic oscillating head.

The fourth figure is the frequency modulation cycle diagram of the frequency-modulated periodic wave type ultrasonic oscillating head.

The fifth picture is an overall perspective view of the ultrasonic polishing device for the wafer polishing liquid.

The sixth figure is a structural sectional view of the ultrasonic vibration device for creating a wafer polishing liquid.

The seventh figure is an enlarged cross-sectional view of the inner layer structure of the ultrasonic polishing device for the wafer polishing liquid.

The eighth figure is a schematic diagram of the operation of the ultrasonic polishing device for the wafer polishing liquid.

The ninth picture shows the mixing groove type 1 of the ultrasonic polishing device for the wafer polishing liquid.

The tenth figure is the mixing trough type II of the ultrasonic polishing device for creating the wafer polishing liquid.

The eleventh figure is the mixing trough type III of the ultrasonic polishing device for creating a wafer polishing liquid.

The twelfth figure is the mixing trough type IV of the ultrasonic polishing device for creating a wafer polishing liquid.

The thirteenth picture shows the mixing trough type 5 of the ultrasonic polishing device for the wafer polishing liquid.

The fourteenth figure is the mixing trough type 6 of the ultrasonic polishing device for creating a wafer polishing liquid.

The fifteenth figure is a cross-sectional view showing another embodiment of the ultrasonic polishing device for creating a wafer polishing liquid.

The lack of the blade to stir the wafer slurry equipment is as described above, and will not be described here. The fifth figure is the overall perspective view of the ultrasonic polishing device for the wafer polishing liquid, and please refer to the structure diagram of the sixth figure at the same time. As can be seen from the figures, the main body of the wafer polishing liquid ultrasonic oscillating device is a closed cylindrical member 100 whose lower end protrudes from the upper end of the liquid pipe 200 and protrudes out of the liquid discharge pipe 300, and the closed cylindrical member 100 is composed of At least one tank layer is surrounded by a layer, and the vertical tank body in the center of the closed cylinder 100 is a mixing tank 400, so that the liquid inlet pipe 200 passes from the lower end into the space inside the mixing tank 400, and the liquid outlet pipe 300 is opened from the upper end. The inner space of the mixing tank 400, particularly the outer wall surrounding the tank body of the mixing tank 400, is superimposed with at least one ultrasonic oscillating head 500, 501, 502, and the filter tube 80 as shown in the first figure can be attached to the liquid outlet tube 300. In addition to the central vertical mixing tank 400, the closed cylinder 100 is further provided with a shell groove 401 in the periphery of the mixing tank 400 together with all the ultrasonic oscillating heads 500, 501, 502, and the top surface of the shell groove 401 is The top surface of the mixing tank 400 is stacked and fixed, and the bottom surface of the sealing groove 401 is mixed with The top surface of the tank 400 is fixedly stacked, and the mixing tank 400 is fully enclosed with all the ultrasonic oscillating heads 500, 501, 502, so that the inside of the shell 401 is dustproof, antifouling and anti-collision. However, in terms of operational utility, the sealing groove 401 is not absolute. necessary.

The wall of the tank of the mixing tank 400, as shown in the enlarged cross-sectional view of the inner layer of the seventh figure, is the shell body 402 of the acid-resistant metal tire material (for example, SUS 304 stainless steel), and the inner surface can be recoated. The composite layer wall of the previous Teflon layer 403 is formed to make the surface of the inner wall of the mixing tank 400 easy to remove the slimming effect, and when the internal space of the mixing tank 400 is ultrasonically shaken to grind the liquid and the water, It is possible to simultaneously pulsate and remove the particles of the wafer slurry which are stuck to the wall, thereby reducing the waste of the adhesion of the wafer slurry.

During the operation, as shown in the operation diagram of the eighth figure, the grinding liquid is added with water from the front pure water metering cylinder 50 and the wafer grinding raw liquid measuring cylinder 60 to send pure water, and the wafer grinding raw liquid flows into the mixing tank through the liquid inlet pipe 200. After 400, the ultrasonic oscillating head 500, 501, 502 is shocked and shaken into the mixing tank 400, and the predetermined wafer grinding dilution which is shaken in the mixing tank 400 is sent to the subsequent through the filter tube 80 through the filter 80. The wafer grinding device 90, by operating the ultrasonic fast wave frequency shaking performance, can be more dispersed and mixed with the traditional stirred wafer polishing equipment, improve the mixing quality, and can be faster and more economical. Mix the predetermined wafer grinding dilution time.

In addition to the above-described drawing and the mixing groove type 1 of the ninth drawing, the mixing tank 400 can only leave the above-mentioned liquid inlet pipe 200 and the liquid discharge pipe 300, and has a rectangular (visible as a straight edge) cross section. In addition to the closed trough shape, the complex can be as shown in the tenth, eleventh, twelfth, thirteenth and fourteenth, respectively, in the cross-sectional shape of the vibration wave that can be used for ultrasonic vibration, and will not be super Under the request of resonance wave noise caused by sound wave fluctuation, it can also be multi-arc-shaped, round-like (circular including: round or elliptical) and other shapes, as long as the ultrasonic vibration effect in the groove can be achieved, any test The mixing tank 400 may have a trough shape, and it should not be described as a limitation of the mixing tank 400 shape.

The present invention can be implemented as shown in the cross-sectional view of another embodiment of the fifteenth figure. The closed cylindrical member 10 is vertically arranged, except for the central mixing tank 400, and the mixing tank 400 together with all the ultrasonic waves. The outer surface of the oscillating head 500, 501, 502 is surrounded by the sealing groove 401, and the outer periphery of the sealing groove 401 is surrounded by a tight outer groove 404, and the outer groove 404 faces the groove between the inner surface of the sealing groove 401. The foam is filled with 405 to absorb the ultrasonic sound noise emitted from the mixing tank 400 to achieve a silent operation effect.

In summary, this creation does achieve the stated effect, and it has not been used publicly. In accordance with the provisions of the Patent Law, it is a matter of granting a patent.

It should be noted that the above is a better embodiment of this creation. If the changes made according to the concept of this creation, or the functional functions produced by them, still do not exceed the spirit of the manual and the illustration, All should be included in the scope of this creation, combined with Chen Ming.

100‧‧‧Closed cylinder

200‧‧‧Inlet tube

300‧‧‧Draining tube

400‧‧‧ mixing tank

401‧‧‧sealing tank

500,501,502‧‧‧Supersonic shock head

Claims (11)

The invention relates to a structure for ultrasonic vibration of a wafer polishing liquid, which is different from a structure in which a blade is uniformly stirred by a wafer polishing liquid device to drive a blade to be stirred, and a main body is a closed tubular piece whose lower end protrudes from an upper end of the liquid pipe and protrudes from the liquid discharge pipe, and The closed tubular member is composed of at least one trough layer vertically surrounding, and the trough body at the center of the closed cylindrical member is a mixing tank, so that the liquid inlet pipe is introduced into the mixing trough space from the lower end, and the liquid discharging pipe is mixed and mixed from the upper end. The space inside the sump is characterized in that: the outer wall surrounding the groove of the mixing groove is overlapped with at least one ultrasonic oscillating head. The wafer polishing liquid ultrasonic oscillating device according to claim 1, wherein the filter is attached to the liquid discharge pipe. The ultrasonic polishing device for wafer polishing liquid according to claim 1, wherein the mixing groove has a cross-sectional shape that is capable of ultrasonic waves oscillating the vibration wave of the hair, and is not subject to resonance by ultrasonic waves. There are many straight-sided noises. The ultrasonic polishing device for wafer polishing liquid according to claim 1, wherein the mixing groove has a cross-sectional shape that is capable of ultrasonic waves oscillating the vibration wave of the hair, and is not subject to resonance by ultrasonic waves. The arc is more than the arc. The ultrasonic polishing device for wafer polishing liquid according to claim 1, wherein the mixing groove has a cross-sectional shape that is capable of ultrasonic waves oscillating the vibration wave of the hair, and is not subject to resonance by ultrasonic waves. Round like noise. The wafer slurry ultrasonic vibration oscillating device according to claim 1, wherein the closed cylinder is arranged in addition to the central erection mixing tank, and is further disposed in the mixing tank together with all the ultrasonic oscillating heads. The shell groove is sealed, and the top surface of the shell shell is overlapped with the top surface of the mixing tank shell, and the bottom surface of the shell shell is fixedly overlapped with the top surface of the mixing tank shell, and the mixing tank together with all the ultrasonic shock heads are all packaged. Enter By. The wafer slurry ultrasonic vibration oscillating device according to claim 1, wherein the ultrasonic oscillating head is a type that transmits a single cycle. The wafer slurry ultrasonic vibration oscillating device according to claim 1, wherein the ultrasonic oscillating head is a peripheral wave pattern. The wafer polishing liquid ultrasonic oscillating device according to claim 1, wherein the ultrasonic oscillating head is a frequency modulation type. The ultrasonic polishing device for wafer polishing liquid according to claim 1, wherein the tank wall of the mixing tank is a shell body of an acid-resistant metal tire material, and the inner surface is coated with a composite of a Teflon layer. Layer walled. The wafer slurry ultrasonic shock oscillating device according to claim 6, wherein the closed cylinder is vertically arranged, except for the central mixing tank, and the mixing tank is combined with all the ultrasonic oscillating heads. Outside the enclosure slot surrounded by the enclosure, the entire package is placed on the periphery of the enclosure slot to form a tight outer slot, and the gap between the slots in the inner groove of the enclosure groove facing the enclosure groove is laid and filled with foam.