TWM457288U - Wafer film pasting device and pulled film cutting mechanism thereof - Google Patents

Description

Wafer filming device and film cutting mechanism thereof

This creation is about a filming device, especially a wafer filming device and a film cutting mechanism.

At present, the machine for cutting the film on the market will use one or more tools to cut the film on the carrier board and cut it into a plurality of separate adhesive films for subsequent frame bonding.

However, if the film placed on the carrier is not flat, the film adhered to the frame may be uneven when it is subsequently bonded to the frame, which may affect the adhesion of the subsequent wafer, and the wafer may be caused by the wafer. There is a problem with the process or the test.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

One of the aims of the present invention is to provide a wafer filming device and a film cutting mechanism thereof, which use a moving adsorption zone to move away from a fixed adsorption zone to give a mucous membrane a pulling force to smooth the mucosa and facilitate subsequent The wafer is adhered to the mucosa to make the wafer process or inspection more stable.

In order to achieve the above objectives, the present invention provides a wafer filming device for use. In a mucous membrane, the filming apparatus comprises: a cutting transmission device comprising a continuous circulation driving mechanism and at least two film cutting mechanisms, the continuous circulation driving mechanism connecting and driving the film cutting mechanism to circulate along a path Each of the film cutting mechanisms includes an adsorption zone and a moving cutter disposed corresponding to the adsorption zone, the adsorption zone comprising a fixed adsorption zone and a moving adsorption zone corresponding to the reciprocating movement of the fixed adsorption zone; a device, corresponding to a configuration of a film cutting mechanism, the film winding device comprising a fixed shaft for the mucosa sleeve, the mucosa stretching from the fixing shaft toward the adsorption regions; and a frame; When the mucus is adsorbed in the adsorption zone of any of the film cutting mechanisms, the moving adsorption zone moves away from the fixed adsorption zone, and the moving tool of the film cutting mechanism can be cut and separated. The mucosa is such that the separated mucosa is adsorbed in the adsorption zone, and the frame is bonded to the separated mucosa.

In order to achieve the above purpose, the present invention provides a film cutting mechanism for a wafer filming device for a mucous membrane, the film cutting mechanism comprising: an adsorption zone comprising a fixed adsorption zone and a corresponding adsorption zone a moving adsorption zone reciprocating on one side; and a moving cutter corresponding to the adsorption zone configuration; wherein when the mucus is adsorbed in the adsorption zone, the moving adsorption zone will face far Moving away from the direction of the fixed adsorption zone, the moving cutter is capable of cutting and separating the mucosa such that the separated mucosa is adsorbed in the adsorption zone.

This creation also has the following effects:

First, when the mucous membrane is adsorbed to the adsorption zone, the moving adsorption zone will move away from the fixed adsorption zone to give a tensile force to the mucosa, and then the mucosa is flattened to make the adhesion of the subsequent frame and the wafer mucosa more flat and tight. And make the wafer process or inspection more stable.

Second, each of the fixed adsorption zones has a first side and a second side perpendicular to each other, and the first side and the stretching direction of the mucous membrane are vertically arranged, and the moving adsorption zone is disposed corresponding to the second side, so that each of the film is stretched When the cutting mechanism moves along a path, the fixed adsorption zone gives the mucosa a constant pulling force, and the moving adsorption zone moves away from the fixed adsorption zone, and gives the mucosa a transverse pulling force, so that the mucosa is leveled by the vertical two-direction pulling force. Thereby, the flatness of the mucous membrane on the adsorption zone is enhanced.

Thirdly, each of the carrying plates forms side strips on opposite sides of the groove, and each side strip gradually increases in thickness from the inside of the carrying board, thereby enhancing the structural strength of the side strips, so that the moving mechanism pressing frame and the separated mucous membranes are bonded to each other. When the edge strip is not easily deformed by force, the film cutting mechanism has good structural stability.

Fourth, each of the carrier plates is provided with a notch from the side to the inside, so that the moving cutter of the adjacent film cutting mechanism can be passed through the notch to reduce the spacing between the cutting mechanisms of the respective film. This further reduces the size of the wafer filming equipment.

Fifth, the film cutting mechanism further comprises an active laminating assembly, and the movable laminating assembly comprises a laminating member and a laminating activity for connecting and driving the laminating member to move in a fixed adsorption zone. When the mucous membrane is adsorbed to the adsorption zone, the membrane member will press the mucosa to prevent the mucosa from being lifted by the moving tool, so that the subsequent frame and the wafer mucus are more evenly packed.

Sixth, the moving tool reciprocates along a direction, and the moving distance of the moving tool is greater than the width of the mucosa, so that the moving tool directly cuts the mucosa by one knife, and the direction of the cutting of the knife is not limited to the embodiment, and can be adjusted according to actual conditions. The separation of the mucosa is made into a rectangular shape or a square shape instead of being formed by subsequent processing of the moving tool, so that no waste is generated, so as to achieve efficient use of resources and cost saving.

100‧‧‧mucos

10‧‧‧ filming equipment

1‧‧‧ cutting drive

11‧‧‧Continuous cycle driving mechanism

12‧‧‧Draw film cutting mechanism

13‧‧‧Adsorption zone

131‧‧‧Fixed adsorption zone

1311‧‧‧First side

1312‧‧‧Second side

132‧‧‧Mobile adsorption zone

14‧‧‧Mobile knives

141‧‧‧ slider

142‧‧‧Tool set

15‧‧‧Loading board

151‧‧‧ Groove

152‧‧‧Side strips

153‧‧‧ notch

154‧‧‧rails

16‧‧‧ pull board

17‧‧‧ Pulling plate drive

18‧‧‧Active laminating module

181‧‧‧filming parts

182‧‧‧Laminating device

2‧‧‧film coating device

21‧‧‧Fixed shaft

3‧‧‧Frame

4‧‧‧Bottom area

5‧‧‧Transfer organization

51‧‧‧Mobile

52‧‧‧Adsorbed parts

The first picture is a three-dimensional schematic diagram of the original filming device.

The second picture is a top view of the original filming device.

The third figure is a three-dimensional schematic diagram of the cutting drive device of the present invention.

The fourth figure is a top view of the cutting drive of the present creation.

The fifth figure is a schematic diagram of the first use state of the original filming device.

The sixth figure is a schematic diagram of the second state of use of the inventive filming device.

The seventh figure is a schematic diagram of the third use state of the original filming device.

The eighth figure is a schematic diagram of the first use state of the cutting drive device of the present invention.

The ninth drawing is a schematic view of the second use state of the cutting drive device of the present invention.

The tenth figure is a schematic diagram of the third use state of the cutting drive device of the present invention.

The eleventh figure is a fourth state of use of the cutting drive device of the present invention.

The twelfth figure is a schematic diagram of the fourth state of use of the inventive filming device.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

Please refer to the first to twelfth drawings. The present invention provides a wafer filming device and a film cutting mechanism thereof for a film 100. The wafer filming device 10 mainly includes a cutting and dismounting device. The film winding device 2 and a frame 3; the film cutting mechanism 12 includes an adsorption zone 13 and a moving cutter 14.

The cutting transmission device 1 includes a continuous circulation driving mechanism 11 and at least two film cutting mechanism 12, and the continuous circulation driving mechanism 11 is connected to drive the respective film cutting mechanism 12 to circulate along a path, and each of the film cutting mechanisms 12 A moving cutter 14 including an adsorption zone 13 and a corresponding adsorption zone 13 is disposed. The adsorption zone 13 includes a fixed adsorption zone 131 and a moving adsorption zone 132 that reciprocates along the side of the fixed adsorption zone 131.

Further, each fixed adsorption zone 131 has a first side 1311 and a second side 1312 which are perpendicular to each other. The first side 1311 and the stretching direction of the mucous membrane 100 are vertically arranged, and each moving cutter 15 corresponds to each. The first side 1311 is disposed and reciprocated along a direction, and the moving adsorption area 132 is disposed corresponding to the second side 1312; wherein the adsorption area 13 is also formed of a ceramic material, and is provided with a gas circulation on the ceramic material. The plurality of pores allow the adsorption zone 13 to draw gas through the pores to achieve the adsorption function of the adsorption zone 13.

Each of the film cutting mechanism 12 further includes a carrier plate 15, a pull plate 16 and a pull plate driver 17 that connects and drives the pull plate 16 to reciprocate relative to the carrier plate 15. The carrier plate 15 is formed with a fixed adsorption area 131. A moving absorbing area 132 is formed on the board 16; in addition, each of the carrying boards 15 is provided with a recess 151 from the side, and the pull board 16 is received in the recess 151; further, each of the carrying boards 15 is opposite to the recess 151 The sides form two side strips 152, and each side strip 152 gradually increases in thickness from the inside of the carrier sheet 15 toward the outside. Further, each of the carrier plates 15 is provided with a notch 153 from the side edges so that the moving cutters 14 of the adjacent film cutting mechanism 12 can pass through the notches 153. Each of the carrier plates 15 has a slide rail 154. The preferred embodiment of the pull plate driver 17 is a cylinder, but is not limited thereto.

In addition, the film cutting mechanism 12 further includes a movable film assembly 18 including a pressing member 181 and a laminating activator 182 that connects and drives the pressing member 181 to move to the fixed adsorption region 131. The preferred embodiment of the laminator 182 is a cylinder, but is not limited thereto.

Each moving tool 14 includes a slider 141 and a cutter set 142 fixed to the slider 141. The slider 141 is slidably coupled to the slide rail 154, so that the cutter set 141 is reciprocally displaced corresponding to one side of the carrier plate 15.

The film winding device 2 is disposed corresponding to each of the stretched film cutting mechanisms 12, and the film winding device 2 includes a fixed shaft 21 for the adhesive film 100 to be stretched, and the adhesive film 100 is stretched from the fixed shaft 21 toward the respective adsorption regions 13.

The frame 3 is internally provided with a hollow portion, and the frame 3 is a rectangular frame. The width of the frame 3 is substantially equal to (substantially equal to or equal to or slightly equal to) the mucosa 100. The width, in turn, allows the shape of the frame 3 to match the shape of the cut mucosa 100 to avoid the generation of waste material of the mucosa 100, and effectively utilizes each of the materials of the mucosa 100 to achieve cost-saving effects.

Wherein, when the mucous membrane 100 is adsorbed on the adsorption zone 13 of the two-drawing film cutting mechanism 12, the moving adsorption zone 132 moves away from the fixed adsorption zone 131, and the moving cutter 14 of the film cutting mechanism 12 can be cut and separated. The mucosa 100 is such that the separated mucosa 100 is adsorbed in the adsorption zone 13, and the frame 3 is bonded to the separated mucosa 100.

The wafer faburing apparatus 10 of the present invention further includes a lower frame region 4 and a transfer mechanism 5, and the adsorption region 13 to which the separation mucous membrane 100 is adsorbed is positioned in the lower frame region 3, and the transfer mechanism 5 is disposed above the lower frame region 4. The transport mechanism 5 moves in the lower frame region 4, and the transport mechanism 5 includes a mover 51 and a suction member 52 that connects the mover 51. The adsorbing member 52 can adsorb the frame 3 and the press frame 3 and the separated mucous membrane 100 are bonded to each other.

The combination of the present wafer laminating apparatus 10 includes a continuous circulation driving mechanism 11 and a respective film cutting mechanism 12 by using the cutting transmission device 1, and the continuous circulation driving mechanism 11 is connected and drives each of the film cutting mechanisms 12 along a The path is circulated, and each of the film cutting mechanism 12 includes an adsorption zone 13 and a moving cutter 14 corresponding to the adsorption zone 13, and the adsorption zone 13 includes a fixed adsorption zone 131 and a moving adsorption zone 132 corresponding to the side of the fixed adsorption zone 131; The film winding device 2 is disposed corresponding to each of the film cutting mechanisms 12, and the film winding device 2 includes a fixing shaft 21 for the mucosa 100 to be stretched, and the mucosa 100 is stretched from the fixing shaft 21 toward the respective adsorption regions 13; wherein the mucosa 100 is When adsorbing on the adsorption zone 13 of any two of the film cutting mechanisms 12, the adsorption zone 132 is moved. Moving away from the fixed adsorption zone 131, the moving cutter 14 of the film cutting mechanism 12 can cut and separate the mucosa 100, so that the separated mucous membrane 100 is adsorbed in the adsorption zone 13, and the frame 3 is bonded to the separated mucous membrane 100. .

The combination of the original film cutting mechanism 12 is configured to utilize a moving adsorption zone 132 in which the adsorption zone 13 includes a fixed adsorption zone 131 and a side corresponding to the fixed adsorption zone 131; the moving cutter 14 is disposed corresponding to the adsorption zone 13; When the 100 is adsorbed in the adsorption zone 13, the moving adsorption zone 132 moves away from the fixed adsorption zone 131, and the moving cutter 14 can cut and separate the mucosa 100, thereby adsorbing the separated mucous membrane 100 in the adsorption zone 13.

The use of the wafer bonding apparatus 10 and the film cutting mechanism 12 thereof, as shown in the fifth to twelfth drawings, each of the film cutting mechanisms 12 is cyclically moved along a path, so that the mucosa 100 is continuously adsorbed in any two cuts. In the adsorption zone 13 of the membrane mechanism 12, each of the moving adsorption zones 132 moves away from the fixed adsorption zone 131, thereby flattening the mucosa 100 on the adsorption zone 13, and then the moving cutter 14 of the film cutting mechanism 12 can cut The mucosa 100 is separated, so that the separated mucous membrane 100 is adsorbed on the adsorption zone 13, and the frame 3 is bonded to the separated mucous membrane 100 through the transfer mechanism 5.

Thereby, when the mucosa 100 is adsorbed to the adsorption zone 13, the moving adsorption zone 132 moves away from the fixed adsorption zone 131 to give the mucosa 100 a pulling force, thereby pulling the mucosa 100 flattened, so that the subsequent frame 3 and the wafer are allowed. The adhesion of the mucosa 100 is more even and tight, and the process or detection of the wafer is more stable.

In addition, each of the fixed adsorption regions 131 has a first side 1311 and a first side perpendicular to each other The two sides 1312, the first side 1311 and the mucosa 100 are vertically arranged, and the moving adsorption area 132 is disposed corresponding to the second side 1312, so that each of the film cutting mechanisms 12 is cyclically moved along a path. The adsorption zone 131 gives the mucosa 100 a constant pulling force, and simultaneously moves the adsorption zone 132 to move away from the fixed adsorption zone 131, and gives the mucosa 100 a lateral pulling force, so that the mucosa 100 is leveled by the vertical two directions, thereby strengthening the adsorption zone 13 The flatness of the upper mucosa 100.

Moreover, each of the carrying plates 15 forms side strips 152 on opposite sides of the recess 151, and the side strips 152 gradually increase in thickness from the inside of the carrying board 15 outward, thereby enhancing the structural strength of the side strips 152, so that the moving mechanism 5 presses the frame 3 When the separated mucosa 100 is adhered to each other, the side strip 152 is not easily deformed by force, and the film cutting mechanism 12 has good structural stability.

Moreover, each of the carrier plates 15 is provided with a notch 153 from the side edges so that the moving cutters 14 of the adjacent film cutting mechanism 12 can pass through the notches 153 to reduce the respective film cutting mechanisms 12 The spacing between them further reduces the size of the wafer filming apparatus 10.

Furthermore, the film cutting mechanism 12 further includes a movable laminating assembly 18 including a laminating member 181 and a laminating activator 182 that connects and drives the laminating member 181 to move in the fixed adsorption zone 131 to make the mucosa When the adsorption zone 13 is adsorbed, the film pressing member 181 presses the mucous membrane 100 to prevent the mucosa 100 from being lifted by the moving tool 14 to make the adhesion of the subsequent frame 3 and the wafer film 100 smoother and tighter.

In addition, the moving tool 14 reciprocates in a direction, and the moving distance of the moving tool 14 is greater than the width of the mucous membrane 100, so that the moving tool 14 is directly cut by the knife. The film 100, the direction in which the knife is cut, is not limited to the embodiment, and can be adjusted according to the actual situation, so that the separated mucous membrane 100 is shaped into a rectangular shape or a square shape in accordance with its own shape, instead of being formed by subsequent processing by moving the cutter 14. Therefore, there is no waste generated to achieve efficient use of resources and cost savings.

In summary, the wafer filming equipment and the film cutting mechanism of the present invention can achieve the intended purpose of use, and solve the lack of conventional knowledge, and have industrial utilization, novelty and progress, and fully comply with the new patent. Apply for the requirements and apply for the patent law. Please check and grant the patent in this case to protect the rights of the creator.

1‧‧‧ cutting drive

11‧‧‧Continuous cycle driving mechanism

12‧‧‧Draw film cutting mechanism

13‧‧‧Adsorption zone

131‧‧‧Fixed adsorption zone

1311‧‧‧First side

1312‧‧‧Second side

132‧‧‧Mobile adsorption zone

14‧‧‧Mobile knives

141‧‧‧ slider

142‧‧‧Tool set

15‧‧‧Loading board

151‧‧‧ Groove

152‧‧‧Side strips

153‧‧‧ notch

16‧‧‧ pull board

17‧‧‧ Pulling plate drive

18‧‧‧Active laminating module

181‧‧‧filming parts

182‧‧‧Laminating device

Claims (18)

A wafer filming device for a film, the filming device comprising: a cutting transmission device comprising a continuous circulation driving mechanism and at least two film cutting mechanism, the continuous cycle driving mechanism connecting and driving the film cutting The cutting mechanism is cyclically moved along a path, and each of the pulling film cutting mechanisms comprises an adsorption zone and a moving cutter disposed corresponding to the adsorption zone, the adsorption zone comprising a fixed adsorption zone and a reciprocating movement corresponding to one side of the fixed adsorption zone Moving the adsorption zone; a film winding device corresponding to the configuration of the film cutting mechanism, the film winding device comprising a fixed shaft for the mucosa sleeve, the mucous membrane pulling from the fixing axis toward the adsorption zone And a frame; wherein, when the mucus is adsorbed in the adsorption zone of any of the film cutting mechanisms, the moving adsorption zone moves away from the fixed adsorption zone, and the film cutting mechanism The moving cutter is capable of cutting and separating the mucosa such that the separated mucosa is adsorbed in the adsorption zone, and the frame is bonded to the separated mucosa. The wafer filming apparatus of claim 1, wherein each of the fixed adsorption zones has a first side and a second side perpendicular to each other, and the first side and the mucosa are vertically aligned. It is assumed that each of the moving cutters is disposed corresponding to each of the first side edges and reciprocates along a direction, and the moving adsorption zone is disposed corresponding to the second side. The wafer filming device of claim 2, wherein each of the film cutting mechanisms is further The utility model comprises a carrier plate, a pulling plate and a pull plate driver connecting and driving the pulling plate to reciprocate relative to the carrying plate. The supporting plate is formed with the fixed adsorption zone, and the moving adsorption zone is formed on the pulling plate. The wafer filming device of claim 3, wherein each of the carrier plates is provided with a recess from a side edge, and the pull plate is received in the groove. The wafer filming apparatus of claim 4, wherein each of the carrier plates forms a two-sided strip with respect to two sides of the groove, and each of the side strips gradually increases in thickness from the inside of the carrier sheet. The wafer filming apparatus of claim 3, wherein each of the carrier plates is provided with a notch from the side inward so that a moving tool of the adjacent film cutting mechanism can pass through the notch. The wafer filming apparatus of claim 1, wherein the film cutting mechanism further comprises a movable film assembly, the movable film assembly comprises a filming member and is connected to drive the film member to move to the fixed adsorption. A laminating activator in the area. The wafer filming apparatus of claim 3, wherein each of the carrier plates has a slide rail, each of the movable cutters includes a slider and a cutter set fixed to the slider, the slider being slidably coupled to the slide rail So that the tool set is reciprocally displaced corresponding to one side of the carrier plate. The wafer filming device of claim 1, further comprising a lower frame region and a moving mechanism, wherein the adsorption region where the mucosa is separated is located in the lower frame region, and the moving mechanism is disposed in the lower frame region Above. The wafer filming apparatus of claim 8, wherein the moving mechanism moves in the lower frame region, the moving mechanism includes a mover and an adsorbing member connected to the movable device, and the adsorbing member can adsorb the frame and suppress The frame and the separated The mucosa adheres to each other. A film cutting device for a wafer filming device for a mucous membrane, the film cutting mechanism comprising: an adsorption zone comprising a fixed adsorption zone and a moving adsorption zone corresponding to a reciprocating movement of the fixed adsorption zone; And a moving cutter corresponding to the adsorption zone configuration; wherein, when the mucous membrane is adsorbed in the adsorption zone, the moving adsorption zone moves away from the fixed adsorption zone, and the moving cutter can cut and separate the mucous membrane, thereby The separated mucosa is adsorbed in the adsorption zone. The film cutting device of the wafer filming device of claim 11, wherein each of the fixed adsorption regions has a first side and a second side perpendicular to each other, the first side and the mucosa The stretching direction is vertically disposed, and each of the moving cutters is disposed corresponding to each of the first side edges and reciprocates along a direction, and the moving adsorption zone is disposed corresponding to the second side. The film cutting device of the wafer filming device of claim 12, wherein the film cutting mechanism further comprises a carrier plate, a pull plate and a pull connecting and pulling the pull plate relative to the carrier plate The plate driver is formed with the fixed adsorption zone, and the movable adsorption zone is formed on the plate. The film cutting device of the wafer filming device of claim 13, wherein the carrier plate is provided with a recess from the side edge, and the pull plate is received in the groove. The film cutting device of the wafer filming device of claim 14, wherein the carrier plate forms two side strips on opposite sides of the groove, and each of the side strips gradually increases in thickness from the inside of the carrier sheet. The film cutting device of the wafer filming device according to claim 13, wherein the bearing The carrier plate is provided with a notch from the side to the inside. The film cutting device of the wafer filming device of claim 11, wherein the film cutting mechanism further comprises a movable film assembly comprising a film member and connecting and driving the film A pressure film mover that moves in the fixed adsorption zone. The film cutting device of the wafer filming device of claim 13, wherein each of the carrier plates has a slide rail, each of the moving cutters comprising a slider and a cutter group fixed to the slider, the slider Sliding to the slide rail, so that the cutter set is reciprocally displaced corresponding to one side of the load plate.