TWM450938U - Precision flexible printed circuit board - Google Patents
Precision flexible printed circuit board Download PDFInfo
- Publication number
- TWM450938U TWM450938U TW101221969U TW101221969U TWM450938U TW M450938 U TWM450938 U TW M450938U TW 101221969 U TW101221969 U TW 101221969U TW 101221969 U TW101221969 U TW 101221969U TW M450938 U TWM450938 U TW M450938U
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- flexible printed
- printed circuit
- protective film
- board substrate
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 50
- 239000010408 film Substances 0.000 description 49
- 238000005520 cutting process Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
本創作係關於一種精密型軟式印刷電路板，尤指一種可對各導通孔區域提供完整外表面防護，且可於後續裁切過程中，確保保護薄膜層仍維持其完整性的精密型軟式印刷電路板。This is a precision type flexible printed circuit board, especially a precision type flexible printing that provides complete outer surface protection for each via area and ensures that the protective film layer maintains its integrity during subsequent cutting. Circuit board.
通常軟式印刷電路板係於一軟式印刷電路板基材上覆設一線路層，且該線路層上具有複數連接墊，以實現與其他電子元件的電性連接，而軟式印刷電路板可分為僅具有單層線路層之形式或是具有複數線路層之形式，本說明書以軟式印刷電路板具有複數線路層為例，對其位於最外側之線路層的保護方式作一說明，如圖4所示，係一軟式印刷電路板基材10之最外側線路層102的平面示意圖，如圖5所示，該軟式印刷電路板基材10包含有一基材本體101、覆設於基材本體101上下二側的線路層102，以及複數穿設於所述線路層102的導通孔12，其中，位於軟式印刷電路板基材10最外側的線路層102包含有複數連接墊11，以及所述導通孔12側壁上均設有一層導電體121，用以提供各線路層102彼此呈一電性連接關係。Generally, a flexible printed circuit board is provided with a circuit layer on a flexible printed circuit board substrate, and the circuit layer has a plurality of connection pads for electrically connecting with other electronic components, and the flexible printed circuit board can be divided into In the form of a single-layer circuit layer or a plurality of circuit layers, the present specification describes a flexible printed circuit board having a plurality of circuit layers as an example, and the protection mode of the outermost circuit layer is illustrated. The schematic diagram of the outermost circuit layer 102 of a flexible printed circuit board substrate 10 is shown in FIG. 5. The flexible printed circuit board substrate 10 includes a substrate body 101 and is disposed on the substrate body 101. a circuit layer 102 on the two sides, and a plurality of via holes 12 penetrating the circuit layer 102, wherein the circuit layer 102 located at the outermost side of the flexible printed circuit board substrate 10 includes a plurality of connection pads 11 and the via holes Each of the 12 sidewalls is provided with a layer of electrical conductors 121 for providing electrical connection between the circuit layers 102.
為避免軟式印刷電路板基材10上最外側的線路層102之外側表面不慎被刮傷而影響製品良率，通常會於製程中加作兩道防護措施，首先，如圖4及5所示，會在連接墊11與導通孔12以外的區域先貼覆一層保護膠片40，至於 未貼覆保護膠片40中的缺口41區域以及排除連接墊11區域，則會另外印刷上一層保護薄膜層50，上述兩道防護措施皆完成後，其後即會進行製品的裁切程序，而通常軟式印刷電路板基材10上的切割製品框線42，一般係被設定在所述連接墊11及導通孔12的外圍區段且位於保護薄膜層50上。In order to prevent the outer surface of the outermost circuit layer 102 on the flexible printed circuit board substrate 10 from being scratched and affecting the yield of the product, two protective measures are usually added in the process. First, as shown in FIGS. 4 and 5. It is shown that a protective film 40 is attached to the area other than the connection pad 11 and the via hole 12 as well. If the area of the notch 41 in the protective film 40 is not attached and the area of the connection pad 11 is excluded, a protective film layer 50 is additionally printed. After the above two protective measures are completed, the cutting process of the product is performed thereafter. Generally, the cut product frame line 42 on the flexible printed circuit board substrate 10 is generally disposed on the peripheral portion of the connection pad 11 and the via hole 12 and on the protective film layer 50.
然而，上述軟式印刷電路板基材10表面的防護手段，容易發生以下幾點缺失：However, the protective means on the surface of the above flexible printed circuit board substrate 10 is prone to the following defects:
1、由於保護薄膜層50是以油墨印刷而成，當油墨被印刷於導通孔12區域時，容易使尚未凝固之油墨直接自導通12一側流至另一側，而使導通孔12側壁上的導電體121裸露於外，造成假性露銅。1. Since the protective film layer 50 is printed by ink, when the ink is printed on the area of the via hole 12, it is easy to cause the ink which has not been solidified to flow directly from the side of the conduction 12 to the other side, so that the side wall of the via hole 12 is formed. The conductor 121 is exposed to the outside, causing false copper.
2、製品的切割製品框線42因係設定在線路層102上未貼覆有保護膠片40的範圍，由於保護薄膜層30之厚度相當薄，使得軟式印刷電路板基板10在進行裁切過程中，易造成保護薄膜層50上產生龜裂，而無法對軟式印刷電路板基板10提供完整防護。2. The cut product frame line 42 of the product is set in the range of the protective layer 40 on the circuit layer 102. Since the thickness of the protective film layer 30 is relatively thin, the flexible printed circuit board substrate 10 is in the process of cutting. It is easy to cause cracks on the protective film layer 50, and it is impossible to provide complete protection to the flexible printed circuit board substrate 10.
本創作之主要目的在於提供一種精密型軟式印刷電路板，希藉此創作，改善目前用於保護軟式印刷電路板之做法容易造成假性露銅，或是易於裁切過程中不慎使保護薄膜層產生龜裂等問題。The main purpose of this creation is to provide a precision type flexible printed circuit board, which is created to improve the current practice of protecting flexible printed circuit boards, which may cause false copper exposure, or inadvertently make protective films during cutting. The layer has problems such as cracks.
為達前揭目的，本創作精密型軟式印刷電路板係包含：一軟式印刷電路板基材，其具有一基材本體、至少二分設於基材本體上下二側的線路層，以及至少一導通孔， 該軟式印刷電路板基材上位於最外側的線路層具有複數連接墊，所述導通孔縱向穿設於複數線路層，所述導通孔的內緣側壁均設有一層導電體，用以提供各線路層之間的電性連接關係；二保護膠片，係貼覆於該軟式印刷電路板基材上位於最外側的線路層上，所述保護膠片上均形成有至少一缺口，該保護膠片覆蓋於該軟式印刷電路板基材上所設的各導通孔，且令軟式印刷電路板基材上之連接墊顯露在外；以及二保護薄膜層，係覆蓋於所述保護膠片上及所述保護膠片之缺口中，並令軟式印刷電路板基材上之連接墊顯露於外。In order to achieve the above, the present invention relates to a flexible printed circuit board comprising: a flexible printed circuit board substrate having a substrate body, at least two circuit layers disposed on the upper and lower sides of the substrate body, and at least one conductive hole, The circuit layer on the outermost side of the flexible printed circuit board substrate has a plurality of connection pads, the through holes are longitudinally disposed on the plurality of circuit layers, and a sidewall of the inner edge of the via hole is provided with a layer of electrical conductors for providing each The electrical connection between the circuit layers; the second protective film is attached to the outermost circuit layer on the flexible printed circuit board substrate, and at least one notch is formed on the protective film, and the protective film covers Each of the via holes provided on the flexible printed circuit board substrate, and the connection pads on the flexible printed circuit board substrate are exposed; and a second protective film layer covering the protective film and the protective film In the gap, the connection pads on the flexible printed circuit board substrate are exposed.
經由以上所述可得知，本創作令保護膠片的缺口形成於所述連接墊的外圍，並確保軟式印刷電路板基材上各導通孔均能被保護膠片所覆蓋保護，再者，由於保護薄膜層的區域係大於保護膠片之缺口區域，因此，保護薄膜層對缺口區域能提供一外側表面的防護作用，故本創作不僅可防止假性露銅情事，確保導通孔均受保護膠片防護，亦能使本創作經過裁切程序後，仍能維持保護薄膜層的外觀完整性，進而可對軟式印刷電路板基材提供完整的保護功能。As can be seen from the above, the present invention forms a gap of the protective film on the periphery of the connection pad, and ensures that each via hole on the flexible printed circuit board substrate can be covered by the protective film, and further, due to protection The area of the film layer is larger than the notch area of the protective film. Therefore, the protective film layer can provide an outer surface protection effect on the notch area, so the creation can not only prevent false copper exposure, but also ensure that the through holes are protected by the protective film. It also enables the creation of the protective film layer to maintain the integrity of the protective film layer after the cutting process, thereby providing complete protection for the flexible printed circuit board substrate.
為能詳細瞭解本發明的技術特徵及實用功效，並可依照說明書的內容來實施，玆進一步以如圖式所示的較佳實施例，詳細說明如後：本創作所提出的精密型軟式印刷電路板較佳實施例，如 圖1所示，所述精密型軟式印刷電路板係包含一軟式印刷電路板基材10、二保護膠片20及二保護薄膜層30。In order to understand the technical features and practical effects of the present invention in detail, and in accordance with the contents of the specification, the following is a detailed description of the preferred embodiment as illustrated in the following: precision soft printing proposed by the present invention Preferred embodiment of the circuit board, such as As shown in FIG. 1, the precision flexible printed circuit board comprises a flexible printed circuit board substrate 10, a second protective film 20 and a second protective film layer 30.
如圖1所示，該軟式印刷電路板基材10具有一基材本體101、至少一線路層102，以及至少一導通孔12，該軟式印刷電路板基材10上位於最外側的線路層102具有複數連接墊11，係用於電性連接外部的電子元件，所述導通孔12縱向穿設於複數線路層102，所述導通孔12的內緣側壁均設有一層導電體121，用以提供所述線路層102之間的電性連接關係。As shown in FIG. 1, the flexible printed circuit board substrate 10 has a substrate body 101, at least one circuit layer 102, and at least one via hole 12 on the outermost circuit layer 102 of the flexible printed circuit board substrate 10. The plurality of connection pads 11 are electrically connected to the external electronic components. The via holes 12 are longitudinally disposed on the plurality of circuit layers 102. The sidewalls of the inner edges of the via holes 12 are respectively provided with a layer of electrical conductors 121. An electrical connection relationship between the circuit layers 102 is provided.
如圖1及圖3所示，所述保護膠片20係貼覆於軟式印刷電路板基材10之線路層102上，所述保護膠片20上均形成有至少一缺口21，該保護膠片20覆蓋於該軟式印刷電路板基材10上所設的導通孔12，且令軟式印刷電路板基材10上之連接墊11顯露於外。As shown in FIG. 1 and FIG. 3, the protective film 20 is attached to the circuit layer 102 of the flexible printed circuit board substrate 10. The protective film 20 is formed with at least one notch 21, and the protective film 20 is covered. The via holes 12 are provided on the flexible printed circuit board substrate 10, and the connection pads 11 on the flexible printed circuit board substrate 10 are exposed.
如圖2及圖3所示，所述保護薄膜層30係覆蓋於該保護膠片10上及保護膠片20之缺口21中，並令軟式印刷電路板基材10上之連接墊11顯露於外。As shown in FIG. 2 and FIG. 3, the protective film layer 30 covers the protective film 10 and the notch 21 of the protective film 20, and the connection pads 11 on the flexible printed circuit board substrate 10 are exposed.
於本較佳實施例中，如圖1及圖2所示，所述精密型軟式印刷電路板尚包含有至少一預設的切割製品框線22，所述切割製品框線22位於所述連接墊11與導通孔12的外圍區段。In the preferred embodiment, as shown in FIG. 1 and FIG. 2, the precision flexible printed circuit board further includes at least one predetermined cut product frame line 22, and the cut product frame line 22 is located at the connection. The pad 11 and the peripheral section of the via hole 12.
經由以上所述可得知，由於本創作係令該保護膠片20的缺口21範圍僅大至可露出軟式印刷電路板基材10之連接墊11區域，使得軟式印刷電路板基材10上之各導通孔12均能被保護膠片20所覆蓋保護，且由於保護薄膜層30 的區域大於保護膠片20之缺口21區域，故能利用該保護薄膜層30給予軟式印刷電路板基材10上未受到保護膠片20保護之區域一替代性的防護功能。As can be seen from the above, since the present invention is such that the notch 21 of the protective film 20 is only so large as to expose the area of the connection pad 11 of the flexible printed circuit board substrate 10, the respective layers on the flexible printed circuit board substrate 10 are formed. The via holes 12 can be covered by the protective film 20 and protected by the protective film layer 30. The area of the cover film 21 is larger than the area of the notch 21 of the protective film 20, so that the protective film layer 30 can be used to impart an alternative protective function to the area of the flexible printed circuit board substrate 10 that is not protected by the protective film 20.
綜上所述，藉由本創作之保護膠片20及保護薄膜層30貼覆於軟式印刷電路板基材10之範圍的改變，而能對軟式印刷電路板基材10提供外側表面的完整防護，因此，本創作除可防止導通孔12側壁的導電體121裸露(即假性露銅)，使導通孔12能受到保護膠片20之防護，針對製品進行外圍裁切時，亦可避免保護薄膜層30產生龜裂，進而可確保該軟式印刷電路板基材10上所設之保護薄膜層30的完整性。In summary, the flexible printed circuit board substrate 10 can provide complete protection to the outer surface of the flexible printed circuit board substrate 10 by the change of the range of the protective film 20 and the protective film layer 30 of the present invention applied to the flexible printed circuit board substrate 10. In addition to preventing the conductor 121 of the sidewall of the via hole 12 from being exposed (ie, false copper), the via hole 12 can be protected by the protective film 20, and the protective film layer 30 can be avoided when the product is cut for the periphery of the product. Cracks are generated which in turn ensure the integrity of the protective film layer 30 provided on the flexible printed circuit board substrate 10.
以上所述，僅是揭示本創作之較佳實施例，並非對本創作作任何形式上的限制，任何所屬技術領域中具有通常知識者在不脫離本創作所提出的技術特徵的範圍內，利用本創作所揭示技術內容所作出局部更動或修飾的等效實施例，均仍屬於本創作技術特徵的範圍內。The above description is merely a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Anyone having ordinary skill in the art can use the present invention without departing from the technical features proposed by the present invention. Equivalent embodiments of the local changes or modifications made by the technical content disclosed herein are still within the scope of the features of the present invention.
10‧‧‧軟式印刷電路板基材10‧‧‧Soft printed circuit board substrate
101‧‧‧基材本體101‧‧‧Substrate body
102‧‧‧線路層102‧‧‧Line layer
11‧‧‧連接墊11‧‧‧Connecting mat
12‧‧‧導通孔12‧‧‧through holes
121‧‧‧導電體121‧‧‧Electrical conductor
20‧‧‧保護膠片20‧‧‧Protective film
21‧‧‧缺口21‧‧ ‧ gap
22‧‧‧切割製品框線22‧‧‧ cutting product line
30‧‧‧保護薄膜層30‧‧‧Protective film layer
40‧‧‧保護膠片40‧‧‧Protective film
41‧‧‧缺口41‧‧‧ gap
42‧‧‧切割製品框線42‧‧‧ cutting product line
50‧‧‧保護薄膜層50‧‧‧Protective film layer
圖1係本創作中之軟式印刷電路板基材上貼覆有一層保護膠片較佳實施例中的平面示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing a preferred embodiment of a preferred embodiment of a flexible printed circuit board substrate in which a protective film is applied.
圖2係本創作較佳實施例的平面示意圖。Figure 2 is a plan view of a preferred embodiment of the present invention.
圖3係本創作較佳實施例的局部側視剖面圖。Figure 3 is a partial side cross-sectional view of the preferred embodiment of the present invention.
圖4係習用軟式印刷電路板的平面示意圖。Figure 4 is a plan view of a conventional flexible printed circuit board.
圖5係習用軟式印刷電路板的局部側視剖面圖。Figure 5 is a partial side cross-sectional view of a conventional flexible printed circuit board.
10‧‧‧軟式印刷電路板基材10‧‧‧Soft printed circuit board substrate
11‧‧‧連接墊11‧‧‧Connecting mat
12‧‧‧導通孔12‧‧‧through holes
121‧‧‧導電體121‧‧‧Electrical conductor
20‧‧‧保護膠片20‧‧‧Protective film
21‧‧‧缺口21‧‧ ‧ gap
22‧‧‧切割製品框線22‧‧‧ cutting product line
30‧‧‧保護薄膜層30‧‧‧Protective film layer
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101221969U TWM450938U (en) | 2012-11-14 | 2012-11-14 | Precision flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101221969U TWM450938U (en) | 2012-11-14 | 2012-11-14 | Precision flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM450938U true TWM450938U (en) | 2013-04-11 |
Family
ID=48801267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101221969U TWM450938U (en) | 2012-11-14 | 2012-11-14 | Precision flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM450938U (en) |
-
2012
- 2012-11-14 TW TW101221969U patent/TWM450938U/en not_active IP Right Cessation
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