TWM449793U - Arrangement machine for quartz crystal chips - Google Patents

Description

Quartz wafer dispenser

The present invention relates to a layout machine design, and more particularly to a quartz wafer placement machine that can quickly and accurately position a quartz wafer.

Referring to FIG. 1, a conventional quartz wafer processor 1 includes a machine table 11, a placement platform 12 disposed on the machine table 11 and disposed on the quartz wafer 2, and is disposed on the machine table 11 and associated with The placing platform 12 corresponding to the discharge table 13 is disposed, and a clamping device 14 movable between the placement platform 12 and the discharge table 13 is disposed between the placement platform 12 and the discharge table 13 The device 15 and the controller 16 respectively connected to the placement platform 12, the discharge table 13, the clamping device 14, and the detecting device 15; wherein the side of the placing platform 12 is further provided with a waste box for placing defective products The clamping device 14 has a slide rail 141 disposed above the placement platform 12 and the discharge table 13, and is disposed on the slide rail 141 and can be extended on the placement platform 12 The pick-up unit 142 of the quartz wafer 2 is taken up; the detecting device 15 has a detector 151 disposed on the placing platform 12 and detecting the placement state of the quartz crystal chips 2, and the clamping device 14 corresponding and detectable quartz wafer 2 poor detector 152, and a sensor 153 disposed on the moving path a of the clamping device 14; Finally, the discharge table 13 is provided with a discharge tray 131 for the quartz crystal chips 2 to be placed.

Therefore, when the quartz wafer processor 1 is in operation, the quartz wafers are first dumped on the placement platform 12, and the detector 151 first senses the placement of the quartz wafers 2, The quartz wafer 2, in the stacked state, at this time, the controller 16 will interlock the placement platform 12 to cause shaking (note: vibration or left and right movement, etc.), so that the quartz wafer 2 is discrete due to shaking, and then The suction unit 142 is slid to the placement platform 12 to grip the quartz wafer 2, and is slid to the detector 152 to detect the goodness of the quartz wafer 2. If the detector 152 is detected, it is not In the case of the good product, the suction unit 142 is slid to the side of the placement platform 12, and the quartz wafer 2 of the defective product is placed in the waste container 17, and if it is detected as a good product, the suction unit 142 is used. Sliding to the discharge table 13, the quartz wafer 2 is arranged in the discharge tray 131, and is moved, sucked, detected and arranged in such a manner that after the discharge tray 131 is placed and discharged, That is, the arrangement and positioning of the quartz wafers 2 are completed.

However, after the actual use, it is found that the pick-up unit 142 needs to perform a long-distance operation on the slide rail 141 by using the slide rail 141 for the pick-up unit 142 to slide up and perform the positioning operation of the quartz wafer 2. The movement is not only easy to make the suction unit 142 slip slow, but also because the distance is too long, the suction unit 142 is likely to cause large shaking when slipping, and the slow sliding speed is easy to make The quartz wafer 2 is caused by the adhesion of dust during the alignment process, thereby affecting the quality of the quartz wafer 2; further, after the detection, the suction unit 142 is to discharge the quartz wafer 2 to the discharge tray 131. At this time, the discharge tray 131 also needs to be moved at the same time, so that the suction unit 142 is likely to cause instability when the quartz wafer 2 is arranged on the upper surface, thereby affecting the arrangement speed, and once the quartz is used. After the wafer 2 is sucked and detected as a defective product, The suction unit 142 needs to be slid to the other side to place the defective product in the waste box 17, which is not only cumbersome and inconvenient, but also inconveniences of suctioning and arranging work, and needs to be improved.

Therefore, the purpose of the present invention is to provide a quartz wafer splicing machine which utilizes a clamping device to effectively move and grip a quartz wafer for discriminating, and the quartz wafer can be quickly and accurately positioned and positioned, thereby greatly improving the Wait for the quartz crystal to be aligned.

Therefore, the novel quartz wafer rowing machine comprises an organic table, a placing platform, a discharging platform, a clamping device, a detecting device and a controller; wherein the clamping device has a base disposed on the machine a movable member disposed on the base for lateral movement, a clamp disposed on the actuating member for up-and-down rotation and left-right rotation, and a clamp disposed on the clamp for adsorbing a quartz wafer; The detector of the detecting device senses a state in which a plurality of quartz wafers are placed on the placement platform, so that the controller can interlock the positioning platform to cause shaking, so that the quartz wafers have a discrete effect. At this time, the actuating member can be quickly moved to the loading platform, so that the jig is extended downward to allow the nozzle to adsorb the quartz wafer, and then the detecting device can sense the suction direction of the quartz wafer. The quartz wafers can be quickly detected and accurately and quickly positioned and positioned on the discharge tray, which further increases the efficiency of the quartz wafer being clamped and the convenience of the quartz wafer being quickly aligned.

For the technical content, features and effects of this new model, The detailed description of the preferred embodiment will be apparent.

Referring to FIG. 2, in a preferred embodiment of the present invention, the quartz wafer processor 3 of the present embodiment includes a machine table 31, and a placement platform disposed on the machine table 31 for the quartz wafers to be placed. 32. A discharge table 33 disposed on the machine table 31 corresponding to the placement platform 32, and a clamping device 34 disposed between the placement platform 32 and the discharge table 33. a detecting device 35 between the platform 32 and the discharge table 33, and a controller 36 respectively coupled to the placing platform 32, the discharging table 33, the clamping device 34 and the detecting device 35; wherein, on the machine table 31 A waste container 37 corresponding to the clamping device 34 is provided. The detecting device 35 has a detector 351 disposed on the placing platform 32 and detecting the placement state of the quartz wafers 4, The clamping device 34 corresponds to and can detect the detector 352 of the quartz wafer 4, and a sensor 353 disposed on the moving path A of the clamping device 34. Further, the discharging table 33 is provided with a A discharge tray 331 for the quartz wafers 4 to be placed.

In particular, the clamping device 34 has a base 341 disposed on the base 31, and an actuating member 342 disposed on the base 341 for lateral movement. A clamp 343 for actuating up and down and rotating left and right, a nozzle 344 disposed on a jig 343 and capable of adsorbing the quartz wafer 4.

Referring to FIG. 2 to FIG. 4, when the quartz crystal chips 4 are first dumped on the placement platform 32, the detector 351 can be used to sense the placement of the quartz wafer 4, and the control must pass through the control. The placement platform 32 is oscillated to cause the quartz wafers 4 to be poured onto the placement platform 32. The dispersing effect is generated by the swaying. At this time, the actuating member 342 can be synchronously actuated, and the actuating member 342 can be moved in a rapid lateral direction, and the jig 343 can be quickly extended to the place where the quartz crystal wafer 4 is placed, and then actuated. The clamp 343 is extended downward to allow the nozzle 344 to adsorb the quartz wafer 4, and then the clamp 343 is returned to the original state, and the actuator 342 is quickly driven to move the clamp 343 to the first position. At the detector 352, while the actuator 342 is moving, the sensor 353, which can sense the moving path A of the clamping device 34, senses the direction of the adsorbed quartz wafer 4, so as to timely interlock the fixture. The 343 is rotated, and the detector 352 further detects whether the quartz wafer 4 is a good product. If it is a defective product, it is placed in the waste container 37 for concentration, and then the movable member 342 is quickly moved to the placement platform 32. The nozzle 344 is re-absorbed to the other quartz wafer 4 for detection. If it is detected as a good product, the actuator 342 is quickly moved to the discharge table 33, and the quartz wafer 4 is accurately The arrangement is placed in the discharge tray 331 without limiting the influence of the movement of the discharge table 33, so that the quartz wafers 4 are gripped, detected, and arranged until the discharge tray 331 is full. Arrangement and positioning of the quartz wafer 4.

Therefore, the efficiency of the rapid lateral movement can be generated by using the actuating member 342, that is, the actuating member 342 can be effectively and quickly extended to any position of the placing platform 32, thereby expanding the clamping device 34 on the placement platform. The range of the quartz crystal wafers 4 is clamped on the 32, and the distance that the quartz crystal wafer 4 is transported after being sucked is also shortened, so that no dust is attached to the quartz crystal wafer 4, and the sensor is matched. 353 can sense the quartz crystal Whether the direction of the sheet 4 is sucked by the nozzle 344 is correct, so that the clamp 343 can be rotated to the correct direction in time to facilitate the subsequent detection and scheduling of the quartz wafer 4, and then each quartz wafer 4 is processed. If it is a defective product after the detection, it can be directly placed in the waste box 37 corresponding to the discharge device 34, and then the suction operation of the next quartz wafer 4 can be quickly performed, so that the operation is not only fast but also convenient. The efficiency and alignment of the quartz wafer 4 are greatly increased, and the positioning operation of the quartz wafers 4 is greatly improved.

In summary, the present invention has a design that can be moved laterally by the clamping device, and a member such as a clamp that can be actuated up and down and left and right to rotate, so that the discharge device can be quickly moved and extended to the placement. The suction operation of the quartz wafer is performed at any position of the platform, and at the same time, the detection device can sense the suction direction of the quartz wafers, so that the quartz wafers can be quickly detected and accurately and quickly aligned and positioned. It is indeed possible to achieve the purpose of the present invention by substantially increasing the positioning operation of the quartz wafers.

However, the above description is only for the purpose of illustrating the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the new specification. All should remain within the scope of this new patent.

3‧‧‧Quartz wafer placement machine

31‧‧‧ machine

32‧‧‧Placement platform

33‧‧‧Drawer

34‧‧‧Clamping device

35‧‧‧Detection device

36‧‧‧ Controller

331‧‧‧Disc tray

341‧‧‧Base

342‧‧‧actuation

343‧‧‧ fixture

344‧‧ ‧ nozzle

351‧‧‧Detector

352‧‧‧Detector

353‧‧‧ sensor

4‧‧‧Quartz wafer

A‧‧‧Moving path

1 is a schematic plan view of a conventional quartz wafer arranging machine; FIG. 2 is a schematic view of a preferred embodiment of the present invention; FIG. 3 is a schematic view of the operation of the preferred embodiment; Figure 4 is a schematic illustration of another operation of the preferred embodiment.

3‧‧‧Quartz wafer placement machine

31‧‧‧ machine

32‧‧‧Placement platform

33‧‧‧Drawer

34‧‧‧Clamping device

35‧‧‧Detection device

36‧‧‧ Controller

37‧‧‧Waste box

331‧‧‧Disc tray

341‧‧‧Base

342‧‧‧actuation

343‧‧‧ fixture

344‧‧ ‧ nozzle

351‧‧‧Detector

352‧‧‧Detector

353‧‧‧ sensor

4‧‧‧Quartz wafer

A‧‧‧Moving path

Claims (1)

A quartz wafer arranging machine comprising a machine table, a placement platform disposed on the machine table and capable of placing a plurality of quartz wafers, and a discharge table on a side of the placement platform a clamping device for moving between the platform and the discharge table, a detecting device disposed between the placing platform and the discharging table, and a controller capable of controlling the clamping device and the detecting device; wherein the detecting device has a detector disposed on the placement platform and detecting the placement state of the quartz wafers, a detector corresponding to the clamping device and capable of detecting the quartz wafers, and a detector disposed on the clamping device a sensor on the moving path; further, the discharge table is provided with a discharge tray for the quartz wafer; wherein the clamping device has a base, and the receiving device is disposed on the base An actuating member which is laterally movable, a jig disposed on the actuating member and movable up and down and left and right, and a nozzle disposed on the jig and capable of adsorbing the quartz wafer.