M332528 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種清潔設備，尤其關於一種具機械 閥之清潔設備。 【先前技術】 傳統的晶圓清潔設備，為了達成自動化控制的目 的，通常是利用電磁閥來控制清潔氣體是否進入至晶圓 盒的腔室中。舉例而言，在前開式晶圓盒（Fr〇nt 〇peningM332528 VIII. New description: [New technical field] This creation is about a cleaning device, especially a cleaning device with a mechanical valve. [Prior Art] Conventional wafer cleaning equipment, in order to achieve the purpose of automatic control, usually uses a solenoid valve to control whether the cleaning gas enters into the chamber of the wafer cassette. For example, in the front open wafer cassette (Fr〇nt 〇pening
Ur^fied Pod簡稱F0UP)中，必須利用電磁閥來控制 從官線提供之清潔氣體是否能進入F〇up中。為了達成 大夏生產的目#，眾多電磁閥的配置，必須搭配眾多的 導線、眾多的感測器及複雜的控制系統。在控制流程中， 必須利用感測器來確認晶圓盒是否已經被正確放置，缺 後再輸出電氣信號來控制電磁閥開啟。因；In Ur^fied Pod (F0UP), solenoid valves must be used to control whether the cleaning gas supplied from the official line can enter the F〇up. In order to achieve the goal of Daxia production, the configuration of many solenoid valves must be matched with numerous wires, numerous sensors and complicated control systems. In the control flow, the sensor must be used to confirm that the wafer cassette has been properly placed, and then an electrical signal is output to control the solenoid valve to open. because;
設備的建構及維修都必須花費相$古沾# 士 “ 郡肩化費相Μ的成本，不利於成 L新型内容】 :卜=此：本創作之—個目的係提供-種具機械閥之清 心又備’猎以簡化配置及降低成本。 ^ y 曰 λα , 備，其包含一、生 創作提供一種具機械閥之清潔設 撐平台、 j裝置及-晶圓盒。清潔裝置包含一支 一管線及一第一機械閥。第一機械閥係裝 5 M332528 設於支撐平台卜 咕 管線。晶圓盒 一連接部設置 開啟第一機械 機械閥注入至 下文特舉較 下。 ’卓一機械閥連接至繁 包含一底部、―胪含芬^ Α 弟_ 腔至及一弟一連接部。| 於底口Ρ ’第一連接《ώβ、奈拉s够The construction and maintenance of the equipment must cost the cost of the ancient 沾 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士Qingxin also prepares 'hunting to simplify configuration and reduce costs. ^ y 曰λα, 备, including, I created a cleaning platform with mechanical valves, j device and - wafer cassette. The cleaning device contains one The pipeline and a first mechanical valve. The first mechanical valve system is installed on the support platform dip line. The connection of the wafer cassette is set to open the first mechanical mechanical valve and is injected below to the below. Connected to the complex including a bottom, 胪 胪 芬 ^ Α _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
^妾邛連接至第一機械閥D 閥，使第一管绩Φ ^ 吕琛中之一清潔媒介 腔室中。 弟 二5本創作之上述内容能更明顯易懂 佳實施例，並配合所阱同斗、 、， u 口尸/Γ附圖式，作詳細說明 【實施方式】^妾邛 Connect to the first mechanical valve D valve to make the first tube Φ ^ 琛 琛 one of the clean media chambers. The above contents of the second and fifth creations can be more clearly understood and better, and the detailed description will be made in conjunction with the wells, and, u
圖1顯示依據本創作筐—與#义丨> Q 钔作第貝轭例之具機械閥之清潔 设備之分解不意圖。圖2顯干佑姑士 >^丨a μ 口 Ζ顯不依據本創作第一實施例之 具機械閥之清潔設備之組合示意圖。如圖丨與2所示， 本實施例之具機械閥之清潔設備包含一清潔裝置1〇及 一晶圓盒20。 清 >糸裝置1 〇包含一支撐平台丨丨、一第一管線丨2及 一第一機械閥13。第一機械閥丨3係裝設於支撐平台i i 上，第一機械閥13連接至第一管線12。 晶圓盒20包含一底部21、一腔室22及一第一連接 部23。第一連接部23設置於底部21。第一連接部23 連接至第一機械閥13以開啟第一機械閥1 3，使第一管 線12中之一清潔媒介24通過第一機械閥13注入至腔 室22中。 清潔裝置10可以更包含一第二管線14及一第二機 械閥15，第二機械閥1 5係裝設於支撐平台11上，並連 M332528 接至第—管線14。晶圓各9 n 墙一、包 日日w皿2〇可以更包含一第二連接部 复篦-诚只接°Ρ 25 6又置於底部21，第二連接部25連接 械閥15以開啟第二機械閥15,使腔室22中之 ，介24通過第二機械間15從第二管線Μ排出。 wL —連接部23設有一第—凸塊231，第一凸塊231 技壓弟-侧13以開啟第—機械闊13。第二連接部 25设有一第二凸塊251，第二凸塊251按壓第二機械閥 1 5以開啟第二機械閥1 5。 牛例而口第一機械閥！ 3或第二機械閥工5可以是 具有類似於腳踏車輪胎的充氣嘴之構造，而第一連接部 23或第二連接部25可以是具有類似於充氣機之充氣嘴 之構造。當機械手臂(未顯示)將裝有複數個晶圓3〇之晶 圓盒20置放到清潔裝置1()之支撐平台u _，第一連 接4 23之第凸塊231碰觸並壓下第一機械閥13，因 而促使第-機械閥13開啟。此時，譬如是空氣或氮氣 之清潔媒介24可以透過第一機械閥13及第一連接部23 而從第-管線12進入腔室22中。同時，第二連接部25 之第二凸i鬼251碰觸並壓下第二機械％ 15，因而促使第 二機械閥15開啟。此時，清潔媒介24可以再透過第二 連接部25及第二機械閥15而流出腔室22而到達第二 管線u，因而達到清潔腔室22中之晶圓3〇的效果。當 晶圓盒20與清潔裝置1〇分離時，第一機械閥13及第 二機械間15會被關閉。值得注意的是，藉由晶圓盒2〇 的足夠重里即可輕易讓第一機械閥13及第二機械閥15 7Fig. 1 shows an exploded view of a cleaning device with a mechanical valve according to the present invention, which is an example of a yoke. Fig. 2 shows the combination of the cleaning device with the mechanical valve according to the first embodiment of the present invention. As shown in Figures 2 and 2, the cleaning device with mechanical valve of this embodiment includes a cleaning device 1A and a wafer cassette 20. The cleaning device 1 includes a support platform, a first line 2, and a first mechanical valve 13. The first mechanical valve 3 is mounted on the support platform i i , and the first mechanical valve 13 is connected to the first line 12 . The wafer cassette 20 includes a bottom portion 21, a chamber 22, and a first connecting portion 23. The first connecting portion 23 is provided at the bottom portion 21. The first connecting portion 23 is connected to the first mechanical valve 13 to open the first mechanical valve 13 such that one of the cleaning lines 24 of the first line 12 is injected into the chamber 22 through the first mechanical valve 13. The cleaning device 10 can further include a second line 14 and a second mechanical valve 15. The second mechanical valve 15 is mounted on the support platform 11 and connected to the first line 14 via M332528. Each of the 9 n walls of the wafer, the package of the day 2, can contain a second connection, and the second connection is repeated. The connection is only placed at the bottom 21, and the second connection 25 is connected to the mechanical valve 15 to open. The second mechanical valve 15 causes the passage 24 in the chamber 22 to be discharged from the second line 通过 through the second mechanical chamber 15. wL - The connecting portion 23 is provided with a first bump 231, and the first bump 231 is pressed against the side 13 to open the first mechanical flange 13. The second connecting portion 25 is provided with a second projection 251, and the second projection 251 presses the second mechanical valve 15 to open the second mechanical valve 15. The cow is the first mechanical valve! 3 or the second mechanical valve 5 may be of a configuration having a gas-filling nozzle similar to a bicycle tire, and the first connecting portion 23 or the second connecting portion 25 may be of a configuration having a gas-filling nozzle similar to an inflator. When the robot arm (not shown) places the wafer cassette 20 containing a plurality of wafers 3 onto the support platform u_ of the cleaning device 1 (), the first bumps 231 of the first connection 4 23 touch and press down The first mechanical valve 13, thus causing the first mechanical valve 13 to open. At this time, a cleaning medium 24 such as air or nitrogen may pass through the first mechanical valve 13 and the first connecting portion 23 to enter the chamber 22 from the first line 12. At the same time, the second convex 255 of the second connecting portion 25 touches and presses the second mechanical % 15, thereby causing the second mechanical valve 15 to open. At this time, the cleaning medium 24 can again flow out of the chamber 22 through the second connecting portion 25 and the second mechanical valve 15 to reach the second line u, thereby achieving the effect of cleaning the wafer 3 in the chamber 22. When the wafer cassette 20 is separated from the cleaning device 1, the first mechanical valve 13 and the second mechanical chamber 15 are closed. It is worth noting that the first mechanical valve 13 and the second mechanical valve 15 7 can be easily made by the sufficient weight of the wafer cassette 2〇.
M332528 開啟。 圖3顯示依據本創作第二實施例之具機械閥之清潔 ό又備之分解示意圖。如圖3 ’、 〜卜 口 3所不，本貝^例係類似於第 了貫施例，不同之處在於本實施例省略了第二管線M、 =二機械Μ 15及第二連接部25。於此情況下，利用腔 至22與大氣環境之壓差，可以使進入腔室之清潔媒 介24可以透過清潔裝置1〇與晶圓盒2〇之間的空隙流 出至大氣環境中。 本創作之主要特點在於利用將晶圓盒2〇置放在清 潔裝置10上之動作，達成閥門之開啟的動作。目前2 產線上都具有大量的晶圓盒20及清潔裝置1〇，因此需 2用到大量的清潔媒介的控制閥。相較於習知技術而 言，利用機械閥的設計，可以簡化線路的配置複雜度及 降低成本。 在較佳實施例之詳細說明中所提出之具體實施例僅 用以方便說明本創作之技術内容，而非將本創作狹義地 限制於上述實施例，在不超出本創作之精神及以下申請 專利範圍之情況，所做之種種變化實施，皆屬於本創作 之範圍。 8 M332528 【圖式簡單說明] 圖1顯示依據本創作第一實施例之具機械閥之清潔 設備之分解示意圖。 圖2顯不依據本創作第一實施例之具機械閥之清潔 設傷之組合示意圖。 圖3顯示依據本創作第二實施例之具機械 設備之分解示意圖 月 【主要元件符號說明】 10 : 清潔裝置 12 : 第一管線 14 ： 第二管線 20 : 晶圓盒 22 ： 腔室 24 : 清潔媒介 30 : 晶圓 251 •第二凸塊 11 :支撐平台 13 :第一機械閥 1 5 ·弟一機械閥 21 :底部 23 :第一連接部 25 :第二連接部 23 1 ·•第一凸塊M332528 is turned on. Fig. 3 is a perspective view showing the cleaning of the mechanical valve according to the second embodiment of the present invention. As shown in FIG. 3' and FIG. 3, the present example is similar to the first embodiment, except that the second line M, the second mechanical cymbal 15 and the second connecting portion 25 are omitted in this embodiment. . In this case, the pressure difference between the cavity 22 and the atmosphere can be used to allow the cleaning medium 24 entering the chamber to flow out into the atmosphere through the gap between the cleaning device 1 and the wafer cassette 2〇. The main feature of the present invention is that the operation of opening the valve is achieved by the action of placing the wafer cassette 2 on the cleaning device 10. At present, there are a large number of wafer cassettes 20 and cleaning devices in the 2 production lines, so it is necessary to use a large number of cleaning medium control valves. Compared with the prior art, the design of the mechanical valve can simplify the configuration complexity of the line and reduce the cost. The specific embodiments set forth in the detailed description of the preferred embodiments are merely used to facilitate the description of the technical contents of the present invention, and the present invention is not limited to the above embodiments, and does not exceed the spirit of the present invention and the following patents. The scope of the scope, the implementation of all kinds of changes, are within the scope of this creation. 8 M332528 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing a cleaning apparatus with a mechanical valve according to a first embodiment of the present invention. Fig. 2 is a schematic view showing the combination of the cleaning of the mechanical valve according to the first embodiment of the present invention. 3 is a schematic exploded view of a mechanical device according to a second embodiment of the present invention. [Main component symbol description] 10: Cleaning device 12: First line 14: Second line 20: wafer cassette 22: chamber 24: cleaning Medium 30: Wafer 251 • Second bump 11: Support platform 13: First mechanical valve 1 5 • Younger mechanical valve 21: Bottom 23: First connecting portion 25: Second connecting portion 23 1 • First convex Piece