M332365 八、新型說明·· 【新型所屬之技術領域】 本新型是有關於一種電路板裝置，特別是指一種多腔 式電磁屏蔽裝置。 【先别技術】 如圖1、2所示，為現今一種多腔式電磁屏蔽裝置，包 含一可固設設於一電路板3上的金屬框架1，及_金屬蓋 2。該金屬框架1是利用表面黏著技術（Surface M〇um Technology，SMT)固設於該電路板3上。該金屬蓋2具有 一頂壁201，及一周壁202，當該金屬蓋2裝設於該金屬框 木1上時’該金屬蓋2與該金屬框架丨可配合界定出二腔 室203、204,該電路板3具有數不同高度且分別位於該^ 腔室203、204内的電子元件3〇1、3〇2。 雖然，此種屏蔽裝置藉由該金屬蓋2與該金屬框架！ 的電連接’即可對該等電子元件3〇1、搬產生電磁屏蔽的 效果’但是，在實際製造、使用時，此種屏蔽裝置卻具有 以下的缺失·· ”、、了避免该金屬蓋2的頂壁201與該等電子元# 30 1、302接觸’而發生柄政q _ 生短路問遞，該頂壁20 1相對於該, 路板3的一高度h i甬登$丨、λ t ^ 门又通吊至少要達到2mm的大小，造成該益 屬蓋2整體高度較高，； 而伯二間，不利於產品的小型化。 -屬I 2疋用金屬板沖壓製成，若要將該頂與 201沖壓成相對於該電1 兔路板3具有不同的高度變化，以配么 該等腔室203、204内^ π σ 、不同笔路區塊設計（即配合該等電 M332365 子^件3(n、3G2的不同高度設計），-般來說設計難度相 當鬲，而不利於製造。 三、該金屬蓋2是用金屬板沖壓製成，因此，該頂壁 2〇1在沖壓後一般只會具有一個固定的厚度（一般介ς 0.l5mm〜0.2mm)’若要配合該等電子元件3〇1、3〇2的不 同高度設計，而將該頂1201 f中壓成具有不同的厚度變 化，一般來說設計難度亦相當高，而不利於製造。 【新型内容】 因此’本新型之目的，即在提供一種外蓋高度低且可 針對不同電路區塊作不同高度與不同厚度設計的多腔式電 磁屏蔽裝置。 於是，本新型之多腔式電磁屏蔽裝置，是設置於一電 路板上，包含一金屬框架，及一外蓋。該金屬框架是設置 於忒電路板上’該金屬框架界定出一圍繞空間，該圍繞空 間分隔成至少二分隔區。該外蓋是與該金屬框架銜接，並 具有一塑膠盍體，及一塗佈於該塑膠蓋體外側上的屏蔽材 料層，該塑膠蓋體具有一頂壁，及一與該頂壁連接的周 土名頂壁具有至少二分別對應於該等分隔區的壁部，該 等壁部相對於該電路板的一高度是互不相同，該外蓋配合 該金屬框架界定出至少二分別對應於該等分隔區的腔室。 【實施方式】 本新型之前述以及其他技術内容、特點與功效，在以 下配合參考圖式之二較佳實施例的詳細說明中，將可清楚 的明白。 6 M332365 在知:出詳細說明之前，要注意的是，在以下的說明 中’類似的元件是以相同的編號來表示。 參閱圖3、4、5,本新型之多腔式電磁屏蔽裝置的一第 一較佳實施例，是設置於一電路板100上，該電路板100 配合不同電路區塊設計，具有數不同高度的電子元件11〇、 120。該多腔式電磁屏蔽裝置包含：一金屬框架丄〇、一外蓋 20，及一導電膠30。M332365 VIII. New Description·· 【New Technical Fields Included】 The present invention relates to a circuit board device, and more particularly to a multi-chamber electromagnetic shielding device. [First Technology] As shown in Figs. 1 and 2, a multi-chamber electromagnetic shielding device of the present invention comprises a metal frame 1 and a metal cover 2 which can be fixed on a circuit board 3. The metal frame 1 is fixed on the circuit board 3 by Surface M〇um Technology (SMT). The metal cover 2 has a top wall 201 and a peripheral wall 202. When the metal cover 2 is mounted on the metal frame 1, the metal cover 2 and the metal frame can cooperate to define two chambers 203 and 204. The circuit board 3 has a plurality of electronic components 3〇1, 3〇2 of different heights and located in the chambers 203, 204, respectively. Although such a shielding device is made of the metal cover 2 and the metal frame! The electrical connection 'is an effect of electromagnetic shielding for the electronic components 3', but the shielding device has the following defects during actual manufacturing and use." The top wall 201 of the second contact 201 is in contact with the electronic components #30, 302, and the handle is generated. The top wall 20 1 is opposite to the height of the road plate 3 by a height hi. t ^ The door is at least 2mm in size, resulting in a higher overall height of the lid 2; and the second room is not conducive to the miniaturization of the product. - The I 2 is made of sheet metal stamping, if The top and 201 are stamped to have different height variations with respect to the electric 1 rabbit road board 3, so as to match the π σ and the different stroke block designs in the chambers 203 and 204 (ie, match the electric power) M332365 sub-piece 3 (n, 3G2 different height design), in general, the design difficulty is quite embarrassing, not conducive to manufacturing. Third, the metal cover 2 is stamped with a metal plate, therefore, the top wall 2〇 1 generally only has a fixed thickness after stamping (generally in the range of 0.15mm~0.2mm) 'to match these electronic elements The different heights of the pieces 3〇1 and 3〇2 are designed, and the top 1201 f is pressed into different thickness variations, and the design difficulty is generally quite high, which is not advantageous for manufacturing. [New content] Therefore, the present invention The purpose of the present invention is to provide a multi-chamber electromagnetic shielding device with a low cover height and different heights and different thicknesses for different circuit blocks. Thus, the multi-chamber electromagnetic shielding device of the present invention is disposed on a circuit. The board comprises a metal frame and an outer cover. The metal frame is disposed on the circuit board. The metal frame defines a surrounding space, and the surrounding space is divided into at least two partitions. The outer cover is opposite to the metal. The frame is connected and has a plastic body, and a shielding material layer coated on the outer side of the plastic cover, the plastic cover has a top wall, and a top wall of the surrounding soil connected to the top wall has at least Two corresponding to the wall portions of the partitions, the heights of the walls are different from each other with respect to the height of the circuit board, and the outer cover and the metal frame define at least two respectively corresponding to the partitions The above-mentioned and other technical contents, features and effects of the present invention will be clearly understood from the following detailed description of the preferred embodiment of the second embodiment with reference to the drawings. 6 M332365 Before the detailed description, it should be noted that in the following description, 'similar elements are denoted by the same reference numerals. Referring to Figures 3, 4 and 5, a first preferred embodiment of the multi-chamber electromagnetic shielding device of the present invention is shown. The embodiment is disposed on a circuit board 100. The circuit board 100 is designed with different circuit blocks and has electronic components 11 〇 and 120 of different heights. The multi-chamber electromagnetic shielding device comprises: a metal frame 丄〇, An outer cover 20 and a conductive adhesive 30.
該金屬框架1〇是設置於該電路板1〇〇上。在本實施例 中，該金屬框架10可利用表面黏著技術（Surface M〇umThe metal frame 1〇 is disposed on the circuit board 1〇〇. In this embodiment, the metal frame 10 can utilize surface adhesion technology (Surface M〇um)
Technology，SMT)或其他方式固設於該電路板1〇〇上。 该金屬框架10具有一圍繞出一圍繞空間13的框壁 11，及一設置於該框壁11内的分隔壁12，該分隔壁12將 該圍繞空間13分隔成二分隔區13 1、132。 ,玄框壁11具有一頂面lu、一内周面112，及數間隔地 凸設於該内周面112上的第一凸塊113,該分隔壁12具有 一頂面121，及數間隔地設置於該頂面121上的第二凸塊 122，且，該分隔壁12兩端與該框壁u的兩相對側之間分 別間隔出一間隙123。 刀 該外蓋20是與該金屬框架1〇銜接，並具有一塑膠莫 體2卜及-塗佈於該塑膠蓋體21外側上的屏蔽材料= 22。要說明的是，在圖5中，為了清楚表現出該屏蔽材二 層22，是將該屏蔽材料層22的厚度作增厚表示。 在本實施例中，該塑膠蓋體21是以射出成形的 成。該塑膠蓋體21具有-頂壁23，及一與該頂壁23 ^ 7 M332365 的周壁24 〇 該頂壁23具有-公％丨姐鹿 、’一刀別對應於該等分隔區131、132的 壁部231、232，及一彳查技认斤卜 夂連接於该等壁部231、232之間的傾斜 壁部233。該等壁部231、加相對於該電路板1〇〇的一高 度hi、h2是互不相同，且該壁部攻具有數鄰近於該傾斜 壁部233且分別對應於該等第二凸塊122的接合孔234。在 本實施例中，該㈣23的厚度是介於〇 13麵〜〇15醜， 該壁部231的高度μ是大於該壁部232的高度^，且，該 壁部23.1相對於該電路板的高度以是不大於以咖。 該周壁24具有—外周面241，及數分別對應於該等一 凸塊113的嵌槽242。 該屏蔽材料層22是塗佈於該塑膠蓋體21的外周面 上’並塗佈於該等接合孔234内與該等嵌槽242内。在本 實施例中，該屏蔽材料層22是一種金屬漆。另外，在本實 施例中’該屏蔽材料層22雖然是呈等厚狀，然而，該屏蔽 材料層22在該等壁部231、232上的厚度，也可視實際設 計需求’而塗佈成不同厚度，或者，該屏蔽材料層22在任 -壁部231 < 232上也可塗佈成不同厚度。要說明的是， 該外蓋20亦可需視實際需求，而於該屏蔽材料層22上設 覃一印刷天線（圖未示），以產生接收訊號的作用。 如此，當該外蓋20裝設於該金屬框架1〇上時，該外 蓋20配合該金屬框架1〇可界定出二分別對應於該等：隔 區131、U2的腔室40、50,且，該周壁24是設置於該= 繞空間13内，並嵌入該等間隙123内，該周壁％是與該 8 M332365 框壁π靠合，使該框壁u與該周壁24上的屏蔽材料層^ 電連接’同時’該等第一凸塊113是分別嵌入該等喪槽 242 ’而與該等嵌槽242内的屏蔽材料層22電連接，該等 二凸塊122是分別與該等接合孔234卡合，而與該等接合 孔234内的屏蔽材料層22電連接。 該導電膠30是塗佈於該框壁u的頂面iu與該周壁 24的外周φ 241之間’並塗佈於該等二凸塊122與該等: 合孔234之間。Technology, SMT) or other means are fixed on the board. The metal frame 10 has a frame wall 11 surrounding a surrounding space 13, and a partition wall 12 disposed in the frame wall 11, which partition wall 12 divides the surrounding space 13 into two partitions 13 1 and 132. The wall 11 has a top surface lu, an inner circumferential surface 112, and a first protrusion 113 protrudingly spaced apart from the inner circumferential surface 112. The partition wall 12 has a top surface 121 and a plurality of intervals. The second protrusions 122 are disposed on the top surface 121, and a gap 123 is respectively spaced between the two ends of the partition wall 12 and the opposite sides of the frame wall u. The outer cover 20 is engaged with the metal frame 1b and has a plastic body 2 and a shielding material applied to the outer side of the plastic cover body 22 = 22. It is to be noted that, in Fig. 5, in order to clearly show the two layers 22 of the shield material, the thickness of the shield material layer 22 is thickened. In the present embodiment, the plastic cover 21 is formed by injection molding. The plastic cover body 21 has a top wall 23, and a peripheral wall 24 of the top wall 23^7 M332365. The top wall 23 has a male 鹿 鹿 deer, and the knives correspond to the partitions 131 and 132. The wall portions 231, 232, and a slanting wall portion 233 connected between the wall portions 231, 232. The heights hi and h2 of the wall portions 231 and the circuit board 1 are different from each other, and the wall portions have a number adjacent to the inclined wall portions 233 and respectively correspond to the second bumps. The engagement hole 234 of 122. In the present embodiment, the thickness of the (four) 23 is between 〇13 and 〇15, the height μ of the wall portion 231 is greater than the height of the wall portion 232, and the wall portion 23.1 is opposite to the circuit board. The height is not greater than the coffee. The peripheral wall 24 has an outer peripheral surface 241 and a plurality of recesses 242 corresponding to the one of the projections 113, respectively. The shielding material layer 22 is applied to the outer peripheral surface of the plastic cover 21 and is coated in the engaging holes 234 and in the fitting grooves 242. In the present embodiment, the shielding material layer 22 is a metallic lacquer. In addition, in the present embodiment, the shielding material layer 22 is of an equal thickness, however, the thickness of the shielding material layer 22 on the wall portions 231 and 232 may be coated differently depending on actual design requirements. The thickness, or the shielding material layer 22 may also be applied to different thicknesses on the any-wall portion 231 < 232. It should be noted that the outer cover 20 may also be provided with a printed antenna (not shown) on the shielding material layer 22 to generate a receiving signal. As such, when the outer cover 20 is mounted on the metal frame 1 , the outer cover 20 cooperates with the metal frame 1 to define two chambers 40 , 50 respectively corresponding to the partitions 131 , U2 . The peripheral wall 24 is disposed in the space 13 and is embedded in the gap 123. The peripheral wall % is abutted against the 8 M332365 frame wall π, so that the frame wall u and the shielding material on the peripheral wall 24 are The first bumps 113 are electrically embedded in the slabs 242 ′ and are electrically connected to the shielding material layer 22 in the slats 242 , and the two bumps 122 are respectively The engagement holes 234 are engaged and electrically connected to the shielding material layer 22 in the engagement holes 234. The conductive paste 30 is applied between the top surface iu of the frame wall u and the outer circumference φ 241 of the peripheral wall 24 and is applied between the two bumps 122 and the: hole 234.
藉此°亥外盍20的屏蔽材料層22可與該金屬框架1〇 產生良好的電連接，而對分處於該等腔室4〇、内的電子 元件110、120，產生分區屏蔽的電磁屏蔽效果。 此外，在本實施例中，雖然該塑膠蓋體21的頂壁U 的壁4 231、232是呈等厚狀，然而，如圖6所示，該等壁 部231、232的厚度tl、t2也可視實際需求，而成形為不同 厚度，或者，任-壁部231《232自身上也可成形出不同 厚度。 經由以上的說明，可再將本新型的優點歸納如下·· -、本新型的外i 20是由該塑膠蓋體21與該屏蔽材 料層22所構成，該塑膠蓋體21是塑膠材質，就算其内側 面與該等電子元件110、12〇接觸，也不會發生短路問題， 因此，相較於習知技術，該頂壁23相對於該電路板1〇〇的 高度可進一步降低，而不佔空間，有利於產品的小型化。 一、本新型的外蓋2〇是在該塑膠蓋體21外侧塗佈該 屏蔽材料層22，該塑膠蓋體21是以射出成形的方式製成， 9 M332365 - @可視實際設計需求成形出不同高度與形狀變化，因此， 相較於習知技術，該頂壁23可容易地配合該等該腔室4〇、 50㈣不同電路區塊設計（即配合該等電子元件m、120 的:同同度），而使§亥等壁部231、232相對於該電路板⑽ — 的间度h 1 h2產生不同的高度變化，如此，該外蓋20在 • _ 可產生電磁屏蔽效果的同時，亦可顧及高度上的設計需 、 ，求。 • 三、本新型的外蓋2〇是在該塑膠蓋體21外側塗佈該 屏蔽材料層22,該塑膠蓋體21是以射出成形方式製成，而 可視實際設計需求成形出不同的厚度變化，因此，相較於 習知技術，該頂壁23可容易地配合該等該腔室4〇、5〇内 的不同電路區塊設計，而使該等壁部23丨、232的厚度U、 t2 (見圖6)，產生不同的厚度變化，例如該等電子元件 的·咼度較低，該壁部232的厚度t2即可成形為較厚的狀 恶，以增加結構強度，如此，該外蓋2〇在可產生電磁屏蔽 鲁效果的同時，亦可顧及厚度上的設計需求。此外，習知金 . 屬蓋2的成形厚度，會受限於原來金屬板的厚度及沖壓技 術的限制’其厚度減縮有其極限，然而，本新型的塑膠蓋 體21是以射出成形方式製成，所受限制較少，因此，相較 • 於習知技術，該塑膠蓋體21的成形厚度可較薄。 四、本新型塑膠蓋體21的接合孔234與嵌槽242内也 塗佈有该屏蔽材料層22，當該外蓋20裝設於該金屬框架 ίο上時，該金屬框架10的第一、二凸塊113、122也可與 該等嵌槽242、該等接合孔234產生良好的電連接，因而可 10 佈有該導電膠30，如此 不僅能強化該外蓋20與該金屬框The shielding material layer 22 of the outer casing 20 can be electrically connected to the metal frame 1 , and the electronic components 110 and 120 halved in the chambers 4, and the electromagnetic shielding of the partition shielding can be generated. effect. In addition, in the present embodiment, although the walls 4 231, 232 of the top wall U of the plastic cover 21 are of equal thickness, as shown in FIG. 6, the thicknesses tl, t2 of the wall portions 231, 232 are as shown in FIG. It can also be formed into different thicknesses depending on actual needs, or the wall portion 231 "232 itself can be formed with different thicknesses. Through the above description, the advantages of the present invention can be summarized as follows: - The outer cover 20 of the present invention is composed of the plastic cover 21 and the shielding material layer 22, and the plastic cover 21 is made of plastic material, even if The inner side surface is in contact with the electronic components 110, 12, and the short circuit problem does not occur. Therefore, the height of the top wall 23 relative to the circuit board 1 可 can be further reduced compared to the prior art, without Taking up space, it is conducive to the miniaturization of products. 1. The outer cover 2 of the present invention is coated with the shielding material layer 22 outside the plastic cover body 21, and the plastic cover body 21 is formed by injection molding, and 9 M332365 - @ can be formed differently according to actual design requirements. The height and shape change, therefore, the top wall 23 can be easily matched with the different circuit block designs of the chambers 4, 50 (4) compared with the prior art (ie, the same electronic components m, 120 are used: the same Degrees, such that the wall portion 231, 232 of the wall is different from the circuit board (10) - the height h 1 h2 produces different height changes, so that the outer cover 20 can also produce electromagnetic shielding effect at the same time Can consider the design needs, and requirements. 3. The outer cover 2 of the present invention is coated with the shielding material layer 22 on the outside of the plastic cover body 21. The plastic cover body 21 is formed by injection molding, and different thickness variations can be formed according to actual design requirements. Therefore, compared to the prior art, the top wall 23 can easily fit the different circuit block designs in the chambers 4, 5, and the thickness U of the wall portions 23, 232, T2 (see Fig. 6), which produces different thickness variations, for example, the degree of twist of the electronic components is low, and the thickness t2 of the wall portion 232 can be formed into a thicker shape to increase the structural strength, so that The outer cover 2 can also produce the electromagnetic shielding effect, and can also take into account the design requirements of the thickness. In addition, the thickness of the cover of the cover 2 is limited by the thickness of the original metal plate and the limitation of the stamping technique. The thickness of the cover 2 has its limit. However, the plastic cover 21 of the present invention is formed by injection molding. The plastic cover 21 can be formed to be thinner than conventional techniques. The shielding hole layer 234 is also coated in the engaging hole 234 and the recess 242 of the new plastic cover 21, and when the outer cover 20 is mounted on the metal frame ίο, the first of the metal frame 10 is The two bumps 113 and 122 can also form a good electrical connection with the soldering holes 242 and the matching holes 234. Therefore, the conductive adhesive 30 can be disposed on the first cover 20 and the metal frame.
M332365 強化該等腔室40、50電磁屏蔽的隔絕效果。 五、本新型屏蔽材料層22在該頂壁23上的厚度，可 視實際設計需求而塗佈成不同厚度’例如，當該等電子元 件m、120的其中—者是發光元件時，該屏蔽材料層22在 在該頂壁23的相對位置上，即可塗佈成較薄的厚度，以便 於從外界檢視發光元件。 /、本新型在该外盍20與該金屬框架1〇的銜接處塗 架10之間的電性連結，亦可增加整體的結構強度。 如圖7所不，為本新型的一第二較佳實施例，該第二 較佳實施例是類似於該第一較佳實施例，其差異之處在 於： 該外蓋20的屏蔽材料層22在該塑膠蓋體21外側上是 塗佈成印刷天線狀，而可產生接收訊號的作用。 歸納上述，本新型之多腔式電磁屏蔽裝置，不僅外蓋 高度Μ利於產品的小型化，並可針對不同的電路區塊= 不同咼度、厚度的變化設計，且外蓋與金屬框架之間的電 性連結佳，而可產生良好的電磁屏蔽效果，而，故確實能 達到本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 11 M332365 【圖式簡單說明】 圖1是習知一種多腔式電磁屏蔽裝置的立體分解示意 圖， 圖2是該電磁屏蔽裝置的組合剖視示意圖； 圖3是本新型多腔式電磁屏蔽裝置的一第一較佳實施 例的立體分解示意圖； 圖4是該第一較佳實施例的立體組合示意圖； 圖5是該第一較佳實施例的組合剖視示意圖； 圖6是一類似圖5的視圖，說明該第一較佳實施例的 一外蓋頂壁厚度可作不同變化設計；及 圖7是一類似圖4的視圖，說明本新型多腔式電磁屏 蔽裝置的一第二較佳實施例。M332365 enhances the isolation of electromagnetic shielding of these chambers 40, 50. 5. The thickness of the shielding material layer 22 of the present invention on the top wall 23 can be applied to different thicknesses according to actual design requirements. For example, when the electronic components m, 120 are light-emitting elements, the shielding material The layer 22, at the opposite position of the top wall 23, can be coated to a relatively thin thickness to facilitate viewing of the light-emitting elements from the outside. / The present invention electrically connects the coating frame 10 at the junction of the outer casing 20 and the metal frame 1〇, and can also increase the overall structural strength. As shown in FIG. 7, a second preferred embodiment of the present invention is similar to the first preferred embodiment, and the difference is that: the shielding material layer of the outer cover 20 22 is coated on the outer side of the plastic cover 21 to form a printed antenna, and can generate a receiving signal. In summary, the multi-cavity electromagnetic shielding device of the present invention not only has a high degree of cover for miniaturization of the product, but also can be designed for different circuit blocks = different twists and thicknesses, and between the outer cover and the metal frame. The electrical connection is good, and the electromagnetic shielding effect can be produced, so that the purpose of the novel can be achieved. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent. 11 M332365 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a multi-chamber electromagnetic shielding device, FIG. 2 is a schematic cross-sectional view of the electromagnetic shielding device; FIG. 3 is a schematic view of the multi-chamber electromagnetic shielding device of the present invention; 3 is a schematic exploded perspective view of the first preferred embodiment; FIG. 4 is a schematic cross-sectional view of the first preferred embodiment; FIG. 5 is a schematic cross-sectional view of the first preferred embodiment; The view shows that the thickness of the top wall of an outer cover of the first preferred embodiment can be changed differently; and FIG. 7 is a view similar to FIG. 4, illustrating a second preferred embodiment of the multi-chamber electromagnetic shielding device of the present invention. Example.
12 M33236512 M332365
【主要元件符號說明】 1 ....... …金屬框架 131… £ 2 ....... …·金屬盍 132… 为隔£ 201 ··· |…頂壁 20 …·· …·外蓋 202 ·.·. •…周壁 21 ••… •…塑膠蓋體 203 _ •…腔室 22•…· …·屏蔽材料層 204 ·.·_ •…腔室 23•…. •…頂壁 O Q 1 ... •…辟立β 3 ...... •…笔路板 301 ··· —電子元件 232… •…壁部 302… —電子元件 233… •…傾斜壁部 h ...... •南度 234… ----接合孔 100… 24•…· …·周壁 110 — •…電子元件 241… •…外周面 120·.. •…電子元件 242… ----肷槽 10….· …·金屬框架 30"… …·導電膠 11 ···.· …·框壁 40…·· …·腔室 111… •…頂面 50····· …·腔室 112… —内周面 hi ••… …·咼度 113… •…第一凸塊 h2"… 问度 12 …·. 分壁 tl ··..· …·厚度 m… •…頂面 t2 ••… …·厚度 122… •…第二凸塊 123… …·間隙 13•… …·圍繞空間 13[Description of main component symbols] 1 ....... ...metal frame 131... £ 2 ....... .... metal 盍 132... is separated by £ 201 ··· |... top wall 20 ...·... ·Outer cover 202 ···. •...Wall wall 21 ••... •...Plastic cover 203 _ •...Case 22•...···Shield material layer 204 ·.·_ •... Chamber 23•.... •... The top wall OQ 1 ... • ... sets up the β 3 ... • ... the pen board 301 ··· - the electronic component 232... • the wall 302... the electronic component 233... • the inclined wall h ... • South 234... - Joint hole 100... 24•...·...·Wall wall 110 — •...Electronic component 241... •...Outer circumferential surface 120·.. •...electronic component 242... -- --肷10....·...·Metal frame 30"...·Conductive adhesive 11 ·······Frame wall 40...···· chamber 111... •...Top surface 50····· ... · Chamber 112... - Inner peripheral surface hi ••...·咼度113... •...First bump h2"... Question 12 ...·. Partition wall tl ··..·...·thickness m... Face t2 ••......thickness 122... •...second bump 123 ... · gap 13 • ... ... · space around 13