M331083 八、新型說明： 【新型所屬之技術領域】 本創作係為一種LED車燈散熱裝置，尤指一種LED車燈之散 熱裝置之結構設計者。 【先前技術】 • 按，目前車輛所使用的車燈所使用之發光體，主要可分為白 '熾燈泡、鹵素燈泡、氙氣燈泡及LED等四種。尤其該LED以現行 _ 之技術而言，其已達到高亮度之技術水準。而該LED要應用在車 燈上時，仍必須使用多顆之LED才能提供足夠的亮度，而符合車 用燈具之相關法規之規範。然而，該LED因其本身發光效率約只 佔輸入能量的20%，約80%的輸入能量以熱能散出，因此功率消耗 上會產生較高之熱能。當多顆之LED應用在車燈上，會產生較高 之熱能，且該LED所產生之熱能未能藉其他方式消除時，致使該 LED會因過熱而降低光輸出或改變色溫、色度，甚至於損壞。 • 有鑑於此，本創作係針對LED應用在車燈上時所產生之缺失， 經長期時間研究後，始有本案之產生。 【新型内容】 爰是本創作之目的，在提供一種LED車燈散熱裝置及其方法， 藉由该LED車燈所没置之溫度控制裝置，而達到對led所產生之 熱能進行散熱，進而使該LED車燈之LE1D不會因過熱而降低光輸 出或改變色溫、色度，甚至於損壞，並延長LED車燈使用壽命。 為能實現上述之創作目的，本創作人提供一種LED車燈散熱 M331083 裝置，其包含有車燈組，該車燈組包含有一底座及一燈殼，該燈 殼係為可透光體，並固設於該底座之前方；若干發光裝置，該等 發光裝置設於該車燈組之内部，該發光裝置包含有一發光單元、 一反射單元及一透鏡單元，該發光單元係包含一 LED及一基板， 該基板係具有一電路板及一設於該電路板底面之散熱片，用以供 • 該LED電性連接於該電路板，並將該LED所產生之熱能傳導至該 散熱片，該反射單元係供該LE1D相對設於其底部，用以將該LED • 所投射之光線經該反射單元反射，該透鏡單元係設於該反射單元 之前方；若干熱電致冷晶片，該等熱電致冷晶片係具有一產生高 溫之熱端及一背向該熱端並產生低溫之冷端，該冷端係連接於該 散熱片之底面，用以強制對該散熱片降溫；至少一散熱座，其設 有多數鍺片，並使該散熱座與該熱電致冷晶片之熱端連接，用以 降低該熱端之溫度；溫度控制裝置，其包含有至少一溫度感測元 件及一控制電路單元，該溫度感測元件用以偵測該發光裝置特定 _ 量測點之溫度，並產生有電子訊號，該控制電路單元係同時與該 溫度感測元件、該熱電致冷晶片為電性連接，用以接收該溫度感 測元件產生之電子訊號，以及對該熱電致冷晶片輸出功率。 依據上述構想，其中該基板之電路板設穿孔，該LED具有一 發光本體，該發光本體底面設有主體座，該主體座設有至少二個 電性接腳及其底面設有一金屬導熱體，用以令該金屬導熱體對應 穿設該電路板之穿孔，使該金屬導熱體與該散熱片形成接觸。 M331083 依據上述構想’其巾該_電 用以當該溫度_元件彳貞酬、、θ” ^預°又有4條件程序， -分、— 干糊H化時，使該_電路單元執 仃“溫度條件料而產生不同之輸出辨。 =上述構想’射_溫度條件程序設有第—溫度條件及 f聽件，用以當該溫度感測树侧到相同於或高於第一 =條件時，她幡_靖輸料，使該控制電 ^執彳了溫度條件程相輸出第—辨，#該温度感測元件偵 =相_或低於第二溫度條件時，其即輸出電子訊號至該控制 電路早心使·路單元執行溫度條件鱗*触第二功率。 【實施方式】 、〜關於本·之技射段，轉數較佳實_配合圖式於下文 進行詳細綱’俾賴上深人了解並綱本獅。 百先請參閱第-、二圖所示，於本實施例中該led車燈散熱 ^置係包含有-輕組丨、若干發絲置2、若干_致冷晶片3、 若干散熱座4及一溫度控制裝置5，其中： /該車燈組1係固設於車輛本體（圖式未顯示），而該車燈組1 ，包含有-底座n及—燈殼12，該底座u適當處係可設有一個 或個以上之穿孔111 (本細式只顯示一個穿孔⑴），該燈殼 12係為可透光體。 該發光裝置2係固設於該車燈組丨之内部，該發光裝置2包 :有發光單元2卜-反射單元22及-透鏡單元23。該發光單 元21係包含一 LED211及一基板212。該LED2U具有一發光本體 M331083 2111，該發光本體2111底面設有主體座2112，該主體座2112設 有二個電性接腳2113及該主體座2112底面設有一金屬導熱體 2114。該基板212係由一電路板2121與一設於該電路板2121底 面之散熱片2122所組成，該電路板2121係供該LED211電性連接， 並使該電路板2121與車輛本體之LED車燈驅動電路（圖式未顯示） 為電性連接，用以提供該電路板2121所需之電能，且該電路板M331083 VIII. New description: [New technical field] This creation is a kind of LED lamp heat sink, especially the structure designer of the heat sink of LED lamp. [Prior Art] • According to the current illuminators used in the lights used in vehicles, they can be mainly divided into white 'incand bulbs, halogen bulbs, xenon bulbs and LEDs. In particular, the LED has reached the technical level of high brightness in terms of current technology. When the LED is to be applied to a vehicle lamp, it is still necessary to use a plurality of LEDs to provide sufficient brightness to comply with the regulations of the relevant regulations of the vehicle lamp. However, the LED itself accounts for only about 20% of the input energy due to its own luminous efficiency, and about 80% of the input energy is dissipated as heat energy, so that high power is generated in power consumption. When a plurality of LEDs are applied to a vehicle lamp, high thermal energy is generated, and the thermal energy generated by the LED cannot be eliminated by other means, so that the LED may reduce light output or change color temperature and chromaticity due to overheating. Even damaged. • In view of this, this creation is aimed at the lack of LED application on the headlights. After a long period of research, the case has been produced. [New content] 爰 is the purpose of this creation, providing an LED lamp heat sink and method thereof, and by using the temperature control device not provided by the LED lamp, the heat generated by the LED is dissipated, thereby enabling The LE1D of the LED lamp does not reduce the light output or change the color temperature, chromaticity, or even damage due to overheating, and prolongs the service life of the LED lamp. In order to achieve the above-mentioned creative purpose, the present invention provides an LED lamp heat dissipation M331083 device, which comprises a lamp group, the lamp group includes a base and a lamp housing, the lamp housing is a light transmissive body, and The light-emitting device comprises a light-emitting unit, a reflective unit and a lens unit, and the light-emitting unit comprises an LED and a light-emitting device. The light-emitting device comprises a light-emitting unit, a reflective unit and a lens unit. a substrate having a circuit board and a heat sink disposed on a bottom surface of the circuit board for electrically connecting the LED to the circuit board and conducting thermal energy generated by the LED to the heat sink a reflective unit is disposed on the bottom of the LE1D for reflecting the light projected by the LED through the reflective unit, the lens unit is disposed in front of the reflective unit; a plurality of thermoelectrically cooled wafers, the thermoelectric The cold chip has a hot end for generating a high temperature and a cold end facing away from the hot end and generating a low temperature, the cold end being connected to the bottom surface of the heat sink for forcibly cooling the heat sink; at least one a plurality of cymbals, and the heat sink is coupled to the hot end of the thermoelectrically cooled wafer for reducing the temperature of the hot end; the temperature control device includes at least one temperature sensing element and a control a circuit unit, wherein the temperature sensing component is configured to detect a temperature of the specific measuring point of the light emitting device, and generate an electronic signal, wherein the control circuit unit is electrically connected to the temperature sensing component and the thermoelectric cooling chip simultaneously Connected to receive an electronic signal generated by the temperature sensing element and output power to the thermoelectrically cooled wafer. According to the above concept, the circuit board of the substrate is provided with a through hole, the LED has a light emitting body, and the bottom surface of the light emitting body is provided with a main body seat, the main body seat is provided with at least two electrical pins and a bottom surface thereof is provided with a metal heat conductor. The metal heat conductor is configured to pass through the through hole of the circuit board, so that the metal heat conductor is in contact with the heat sink. According to the above concept, the M331083 is used to make the _ circuit unit stubborn when the temperature_component is paid, θ", and the conditional program is further divided into four conditions. "The temperature conditions are expected to produce different outputs. = The above concept 'shooting_temperature condition program is provided with the first temperature condition and the f hearing piece, when the temperature sensing tree side is the same as or higher than the first = condition, she 输 靖 靖, The control circuit executes the temperature condition phase output first-discriminate, #the temperature sensing component detects the phase_ or lower than the second temperature condition, and outputs the electronic signal to the control circuit to implement the early heart unit The temperature condition scale* touches the second power. [Embodiment] ~, about the technical shooting section of Ben, the number of revolutions is better _ with the schema below to carry out a detailed outline 俾 上 上 上 人 。 。 。 。 。 。 。 。 。 。 。 。 。 Please refer to the first and second figures. In the embodiment, the LED lamp heat dissipation system includes a light group, a plurality of hair sets 2, a number of _cooling chips 3, and a plurality of heat sinks 4 and a temperature control device 5, wherein: / the vehicle light group 1 is fixed to a vehicle body (not shown), and the vehicle light group 1 includes a base n and a lamp housing 12, and the base u is appropriate One or more perforations 111 may be provided (only one perforation (1) is shown in this detail), and the lamp housing 12 is a light transmissive body. The illuminating device 2 is fixed inside the lamp group ,. The illuminating device 2 includes a light-emitting unit 2, a reflection unit 22 and a lens unit 23. The light emitting unit 21 includes an LED 211 and a substrate 212. The LED 2U has a light-emitting body M331083 2111. The bottom surface of the light-emitting body 2111 is provided with a main body 2112. The main body 2112 is provided with two electrical pins 2113 and a metal heat conductor 2114 is disposed on the bottom surface of the main body 2112. The substrate 212 is composed of a circuit board 2121 and a heat sink 2122 disposed on the bottom surface of the circuit board 2121. The circuit board 2121 is electrically connected to the LED 211, and the LED board of the circuit board 2121 and the vehicle body is used. The driving circuit (not shown) is electrically connected to provide the power required by the circuit board 2121, and the circuit board
2121於中央處設有一穿孔2123，用以供該LED211之金屬導熱體 2114對應穿设，使该金屬導熱體2114與該散熱片2122形成接觸 狀態。該反射單元22係設於該發光單元21及該透鏡單元烈之間， 該反射單元22具有-開π端，沿該開口端圍繞成财弧面，並於 該弧面底部對應該開口端設有一定位孔221，用以供該led2ii之 發光本體2111誠穿設，使該發光本體2ni相對位於該反射單 兀22之底部，使該LED211所產生之光線經反射單元&之弧面内 侧反射。該透鏡單元23設於反射單元22前方，該透鏡單元23係 包含有-透鏡體231及-供該透鏡體231固定限位之固定架咖’。、 該熱電致冷晶片 舔熱電致冷晶片3之數目令 與該發光裝置2之數目相同。該熱電致一曰 …电蚁令日日片3經輸入功率後， 其具有-儀係域生低溫之冷端31，同時背向該冷㈣之另一 侧面係為產“溫之熱端32。該冷端31倾該錄d 用以對該散熱片2122降溫。 、 要 該散熱座4係以金屬材質、 陶究或其他高導_數之材質所 M331083 製成。該散熱座4之數目係與該熱電致冷晶片3之數目相同，反 該散熱座4係與該熱電致冷晶片3之熱端32連接，用以供該熱瑞 32之熱能傳導至該散熱座4，而降低該熱端32之溫度，以避免該 熱電致冷晶片3過熱而損壞。該散熱座4係設有複數鰭片41，用 以增加該散熱座4之散熱面積。該散熱座4之籍片41係可因車燈 組空間、車體空間及車燈外觀造型不同，可做不同鰭片造型之設 • 計。 Φ 該溫度控制裝置5包含有一溫度感測元件51 (該溫度感測元 件51之數目不以此為限），以及一控制電路單元52。該溫度感測 元件51用以偵測該發光裝置21之LED211特定量測點之溫度，並 即時產生有電子訊號。該控制電路單元52係同時與該溫度感測元 件51、該熱電致冷晶片3為電性連接，用以接收該溫度感測元件 51產生之電子訊號，以及對該熱電致冷晶片輸出功率。 當組設時，先行將該LED211電性連接於該基板212之電路板 • 2121 ’使該LED211之金屬導熱體2114穿設該電路板2121之穿孔i 2123，並貼合於該散熱片2122即組成發光單元21。再將該反射單 元22之定位孔221與該LED211之發光本體2111對應設置，使該 LED211之發光本體2111相對位於該反射單元22之底部，並將透 鏡單元23以固定架232固定限位設於反射單元22之前方，即完 成單-發絲置2之組設。次將該發光單元21之散熱片2122與 雜電致冷晶片3之冷端31為連接，並使該熱電致冷晶片3之熱 9A through hole 2123 is formed in the center of the 2121 for the metal heat conductor 2114 of the LED 211 to be correspondingly disposed, so that the metal heat conductor 2114 is in contact with the heat sink 2122. The reflecting unit 22 is disposed between the light emitting unit 21 and the lens unit, and the reflecting unit 22 has an -open π end, surrounds the curved surface along the open end, and is corresponding to the open end at the bottom of the curved surface. A positioning hole 221 is provided for the light-emitting body 2111 of the LED 2ii to be disposed such that the light-emitting body 2ni is located opposite to the bottom of the reflective unit 22, so that the light generated by the LED 211 is reflected by the inner side of the reflective unit& . The lens unit 23 is disposed in front of the reflecting unit 22, and the lens unit 23 includes a lens body 231 and a fixed holder for fixing the lens body 231. The thermoelectrically cooled wafer has the same number of thermoelectrically cooled wafers 3 as the number of the light-emitting devices 2. The thermoelectrically induced 曰 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电The cold end 31 dumps the d to cool the heat sink 2122. The heat sink 4 is made of metal material, ceramics or other high-conductivity material M331083. The number of the heat sink 4 The number of the thermoelectrically cooled wafers 3 is the same as that of the thermoelectrically cooled wafers 3, and the heat sinks 4 are connected to the hot ends 32 of the thermoelectrically cooled wafers 3 for conducting the heat energy of the heatsinks 32 to the heat sinks 4. The temperature of the hot end 32 prevents the thermoelectrically cooled wafer 3 from being overheated and damaged. The heat sink 4 is provided with a plurality of fins 41 for increasing the heat dissipation area of the heat sink 4. The heat sink 4 is 41 Depending on the space of the lamp unit, the space of the car body and the appearance of the lamp, the design of different fin shapes can be made. Φ The temperature control device 5 includes a temperature sensing element 51 (the number of the temperature sensing elements 51) Not limited to this, and a control circuit unit 52. The temperature sensing component 51 is configured to detect the The LED 211 of the optical device 21 measures the temperature of the measuring point and generates an electronic signal. The control circuit unit 52 is electrically connected to the temperature sensing element 51 and the thermoelectric cooling chip 3 for receiving the temperature. The electronic signal generated by the sensing component 51 and the output power of the thermoelectrically cooled chip. When assembled, the LED 211 is first electrically connected to the circuit board of the substrate 212. 2121 'The metal thermal conductor 2114 of the LED 211 is worn. The hole i 2123 of the circuit board 2121 is disposed on the heat sink 2122 to form the light-emitting unit 21. The positioning hole 221 of the reflection unit 22 is disposed corresponding to the light-emitting body 2111 of the LED 211, so that the light-emitting body of the LED 211 is provided. 2111 is located at the bottom of the reflecting unit 22, and the lens unit 23 is fixed in the fixing frame 232 to the front of the reflecting unit 22, that is, the assembly of the single-hair setting 2 is completed. The sheet 2122 is connected to the cold end 31 of the hetero-electrically cooled wafer 3, and the heat of the thermoelectrically cooled wafer 3 is 9