M330553 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種晶粒取放治具，可應用於半導 體封裝製程與半導體晶片組裝過程。 【先前技術】 在不斷講求速度與競爭力的高科技產業，每一個生 產環節都必須不斷檢討與改進，使每一個製程或步驟都 . 能符合精簡、快速以及安全等原則。在晶片封襞或晶片 • 測試等電子業中，用來安裝晶片至基板（或導線架）的機 械設備中，通常係以晶粒取放治具，以真空吸附原理來 取放晶片。 一般而言，晶粒取放治具係藉由抽氣孔提供負壓使 吸嘴（Collet)得以吸附晶片，在吸附之後，吸嘴會移動 至定位，並解除真空吸力以將晶片放置至基板（或導線 架）之一特定之位置。然而在不斷使用的情況下，吸嘴 • 會產生熱此而容易導致吸嘴散熱不均勻，產生局部集 _熱。此外，由於吸嘴直接接觸晶片，熱能係直接傳導至 - 晶片’ 一旦集熱溫度超過晶片可承受範圍，容易造成晶 片損傷而降低所製成產品之穩定性。 【新型内容】 本創作之主要目的係在於提供一種晶粒取放治具， 可有效將吸嘴在運作時產生的熱能傳導至外界，以增加 製成產品穩定性。 依據本創作之一種晶粒取放治具，主要包含一吸嘴 4 M330553 以及複數個# # 吸附面以及一連通 連接於該吸嘴之側 政熱片。该吸嘴係且 至該吸附面之乜> a嚿一 抽亂孔。該些散熱片係 邊。 ’丁、 本創作的目的及解決其技術 措施進一步實現。 ]崎還可採用以下技術 在刖述的晶粒取放治具中， W+而之一表 /、 邊些散熱片在遠離該吸 附面二表面係可形成有複數個散熱鱗片。M330553 VIII. New Description: [New Technology Field] This creation is about a kind of die pick and place fixture, which can be applied to the semiconductor package process and semiconductor wafer assembly process. [Prior Art] In the high-tech industry that constantly emphasizes speed and competitiveness, every production process must be constantly reviewed and improved so that every process or step can be consistent with the principles of streamlining, speed, and safety. In the electronics industry such as wafer packaging or wafer testing, in the mechanical equipment used to mount the wafer to the substrate (or lead frame), the die is usually taken by the die and the wafer is taken by vacuum adsorption. In general, the die attach and receive jig provides a negative pressure by the air vent to allow the nozzle to adsorb the wafer. After the adsorption, the nozzle moves to the position, and the vacuum suction is released to place the wafer on the substrate ( Or a specific location of the lead frame. However, in the case of continuous use, the nozzle will generate heat, which may easily cause the nozzle to dissipate unevenly, resulting in localized heat. In addition, since the nozzle directly contacts the wafer, the thermal energy is directly conducted to the wafer. Once the heat collection temperature exceeds the acceptable range of the wafer, the wafer is easily damaged and the stability of the manufactured product is lowered. [New content] The main purpose of this creation is to provide a die pick and place fixture that can effectively transfer the heat generated by the nozzle during operation to the outside to increase the stability of the finished product. According to the present invention, a die pick-and-place jig includes a nozzle 4 M330553 and a plurality of ## adsorption faces and a side heating piece connected to the nozzle. The nozzle is attached to the suction surface > a. These heat sinks are tied. ’Ding, the purpose of this creation and the technical measures to solve it are further realized. ] The following techniques can also be used in the above-mentioned die-receiving fixtures. One of the W+/, and the fins can form a plurality of heat-dissipating scales away from the surface of the suction surface.
的晶粒取放治具中’該些散熱片在朝向該吸 附面之表面係可與該吸附面有一高度差。 在則述的晶粒取放治具中，該些散熱片與該吸嘴係 可為金屬材質並一體連接。 該吸嘴在該些散熱片之 在前述的晶粒取放治具中 間係可形成有一非圓形基座。 【實施方式】 請參閱第1圖所示，本創作之一種晶粒取放治具i 00 主要包含一吸嘴110以及複數個散熱片120。該吸嘴110 係具有一吸附面1 1 1以及一連通至該吸附面1 1 1之抽氣 孔11 2。請參閱第2圖所示，該吸附面111係為一平整 之接觸面，概為一矩型平面，以便於在黏晶步驟中吸附 一半導體晶片（圖中未繪出）。該抽氣孔11 2係以真空管 線連接一真空源，例如抽氣幫浦。透過該抽氣孔112用 以形成一真空通路，使著該晶粒取放治具1 〇 〇得以產生 吸附力，以吸附晶片。待該吸嘴11 〇吸取該晶片後，該 晶粒取放治具1 〇 〇係可移動該晶片並將該晶片置放於 5 M330553 一晶片承載件（圖未繪出）上’例如導線架、印刷電路 板、陶瓷基板、玻璃基板或晶片收集槽，然後透過正壓 空氣以破除真空吸力，釋放吸著於該吸附面111之晶 片。本創作之該晶粒取放治具1 00不僅可用來輸送晶片 亦可應用於黏晶步驟中，因此該晶片便得以藉由預先塗 佈之膠黏劑而黏著於該晶片承載件上，再進行下一步之 打線或其它電性連接作業。請參閱第3圖所示，在本實 施例中，該吸嘴11 〇在該些散熱片1 2 0之間係可形成有 ® —非圓形基座113，增加該吸嘴11〇與該些散熱片120 之接合與熱傳導面積，加強其結構強度與導散熱效果。 而邊非圓形基座1 1 3之非圓形狀則有助於該吸嘴丨丨〇之 拆卸與組裝。 請參閱第2圖所示，該些散熱片丨2〇係連接於該吸 嘴1 1 0之側邊。在本實施例中，該些散熱片1 2〇係具有 一退離該吸附面1 11之第一表面1 2丨與一朝向該吸附面 藝 111之第二表面122。請再參閱第i圖所示，該些散熱 片1 2〇之該第一表面1 2 1係可形成有複數個散熱鰭片 123。因此，該些散熱鰭片123之設置不會影響晶片之 取放作業。另，在兩兩散熱鰭片123之間係具有一通氣 間距以利熱里排出及均勻分散熱量。換言之，該些散 熱片120對該吸嘴110之熱耦合關係能吸收該吸嘴n〇 所產生的熱量，並將所吸收的熱量傳導至該散熱鰭片 1 2 3進行散發。該些散熱片i 2 〇之該第二表面1 2 2係可 與該吸附面111有一高度差，如此一來可以確保在黏晶 6 M330553 過私中3亥些散熱片12〇之該第二表面m不會與晶片直 接接觸’故可避免晶片到傷或損壞。較佳地，該些散熱 片120與該吸嘴110係可為金屬材質並一體連接，不須 用任何零組件加以固定，故具有節省組裝時間且能使結 構強度增加不易彎曲變形，並可加強導熱效果。 因此，藉由该些散熱片丨2 0可有效將該吸嘴i i 〇在 運作時產生的熱能傳導致外界，縮短了在晶片與晶片取In the die attaching fixture, the fins may have a height difference from the adsorbing surface on the surface facing the sucking surface. In the above-mentioned die attaching and disposing jig, the fins and the nozzles may be made of a metal material and integrally connected. The nozzle may be formed with a non-circular base in the middle of the heat sink. [Embodiment] Referring to FIG. 1 , a die attach and receive fixture i 00 of the present invention mainly includes a nozzle 110 and a plurality of fins 120 . The suction nozzle 110 has an adsorption surface 11 1 and a suction hole 11 2 connected to the adsorption surface 11 1 . Referring to Fig. 2, the adsorption surface 111 is a flat contact surface, which is a rectangular plane to facilitate adsorption of a semiconductor wafer (not shown) in the die bonding step. The air vent 11 2 is connected to a vacuum source, such as a pumping pump, by a vacuum line. The evacuation hole 112 is used to form a vacuum path, so that the die pick and place the jig 1 to generate an adsorption force to adsorb the wafer. After the nozzle 11 picks up the wafer, the die attaching and detaching fixture 1 can move the wafer and place the wafer on a 5 M330553 wafer carrier (not shown), such as a lead frame. The printed circuit board, the ceramic substrate, the glass substrate or the wafer collecting tank is then passed through the positive pressure air to break the vacuum suction, and the wafer sucked on the adsorption surface 111 is released. The die pick-and-place jig 100 of the present invention can be used not only to transport the wafer but also in the die bonding step, so that the wafer can be adhered to the wafer carrier by the pre-applied adhesive, and then Carry out the next step of wire or other electrical connection. Referring to FIG. 3, in the embodiment, the nozzle 11 is formed with a non-circular base 113 between the fins 120, and the nozzle 11 is added. The bonding and heat conduction areas of the heat sinks 120 enhance the structural strength and the heat dissipation effect. The non-circular shape of the non-circular base 1 1 3 facilitates the disassembly and assembly of the nozzle. Referring to Fig. 2, the fins 2 are attached to the sides of the nozzles 110. In this embodiment, the fins 12 have a first surface 12 2 退 away from the adsorption surface 11 11 and a second surface 122 facing the adsorption surface 111 . Referring to FIG. 1 again, the first surface 112 of the heat sinks 12 2 may be formed with a plurality of heat dissipation fins 123. Therefore, the arrangement of the heat dissipation fins 123 does not affect the handling of the wafer. In addition, there is a venting distance between the two fins 123 to dissipate heat and uniformly dissipate heat. In other words, the thermal coupling relationship of the heat sinks 120 to the nozzles 110 can absorb the heat generated by the nozzles n〇 and conduct the absorbed heat to the heat dissipation fins 1 2 3 for dissipation. The second surface 1 2 2 of the heat sinks i 2 可 can have a height difference from the adsorption surface 111, so as to ensure that the second surface of the heat sink 12 330 M The surface m does not come into direct contact with the wafer, so the wafer can be prevented from being damaged or damaged. Preferably, the heat dissipating fins 120 and the nozzles 110 are made of metal material and integrally connected, and do not need to be fixed by any components, so that the assembly time is saved and the structural strength is increased, the bending deformation is not easy, and the nozzle can be strengthened. Thermal conductivity. Therefore, the heat sinks 丨20 can effectively transfer the heat generated by the nozzles i i during operation to the outside world, shortening the wafer and the wafer.
放之間的等待時間，以延長使用壽命及增加製成產品穩 定性，進而提高生產效率與良率。此外，亦可一併解決 I知吸嘴散熱不均及造成製成產品不穩定之問題。 以上所述，僅是本創作的較佳實施例而已，並非對 本創作作任何形式上的限制，雖然本創作已以較佳實施 例揭露如上，然而並非用以限定本創作，任何熟悉本項 技術者，在不脫離本創作之申請專利範圍内，所作的任 何簡單L改、等效性變化與修飾，皆涵蓋於本創作的技 術範圍内。 【圖式簡單說明】 第1圖·依據本創作之一種晶粒取放治具之立體示意圖。 第2圖·依據本創作之一種晶粒取放治具之側視示意圖。 第3圖··依據本創作之一種晶粒取放治具之頂視示意圖。 【主要元件符號說明】 1 〇 〇晶粒取放治具 110吸嘴 ， 111吸附面 U2抽氣孔 113非圓形基座 7 M330553 120散熱片 121第一表面 122第二表面 123散熱鰭片Waiting time between releases to extend service life and increase product stability, thereby increasing productivity and yield. In addition, it can also solve the problem of uneven heat dissipation of the nozzle and the instability of the finished product. The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention, and any familiar technology. Any simple changes, equivalence changes and modifications made within the scope of the patent application of the present invention are covered by the technical scope of the present invention. [Simple description of the drawing] Fig. 1 is a three-dimensional schematic diagram of a die pick-and-place jig according to the present invention. Fig. 2 is a side view showing a die attaching and detaching jig according to the present invention. Fig. 3 is a top plan view of a die pick and place jig according to the present invention. [Main component symbol description] 1 〇 〇 die pick and place fixture 110 nozzle, 111 suction surface U2 suction hole 113 non-circular base 7 M330553 120 heat sink 121 first surface 122 second surface 123 heat sink fin