M309684 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種背光模組及顯示器，尤其係指一種具有發 光二極體的背光模組及顯示器。 【先前技術】 近年來，由於發光二極體(Light Emitting Diodes;下稱led) 的發光效率提升，使LED在某些產品應用上已逐漸取代曰光燈與 白熱燈泡，成為普遍使用的光源，例如以LED作為液晶顯示裝置 的背光源。LED屬於高發熱且對溫度非常敏感的元件，因此背光模 組内若累積過多的熱，會使LED的溫度上升，造成發光效率下降 或發光不均的情況。所以該如何設計背光模組的散熱結構，為實 務上極為重要的問題。 請參閱圖1，習知LED液晶顯示裝置1〇包含一前框u、一 LED 早元12、一擴散板13、一反射片14、一光學材料層15、一背板 18以及一液晶面板17。其中，LED單元12設置於背板18的上方， 且包含一基板122與一承載於基板122上之LED121，基板122為 金屬印刷電路板(Metal Core Printed Circuit Board; MCPCB)。 於背板18的兩側内壁及相鄰LED121之間貼上反射片14 ;擴散板 13設置於LED單元12的上方，光學材料層15設置於擴散板13的 上方，於前框11上方設置一液晶面板17，藉以組成液晶顯示裝置 M309684 10。 白知液晶顯示裝置10的散熱機制為函21點亮時，產生的熱 先傳到基板122，再由基板122傳到背板18，最後由透過設置於 θ板18的散熱機制，如風扇或散熱鰭片（heat sink)等（圖未示）， 將”、、V出衣置外。由於傳熱路徑過長，熱傳導的接觸面過多，造 成熱傳導的效果不佳，且基板122 '背板18等接觸面的熱傳導不 I所以即使貼上導熱片，仍無法迅速將熱排出，導致熱量累積， ’度刀佈不均’造成每一麵以的發光效率不同，而影響液晶顯 不裝置ίο的顯不品質。而且，反射片14僅部份貼在基板122上， 其餘部分將懸空，因此，反射片14易受熱影響容易變形。 Θ 2係另驾知LED液晶顯示裝置之散熱結構圖，與上述液晶 顯示裝置10不同的是乂仙丨訂載於基板丨烈上：基板丨以下方有 固定座24，一背板18設置於固定座24下方，在固定座24内裝設 1 有一熱管(heatpipe)22。背板18下方連接散熱鰭片28及風扇26。 請參閱目3，箭頭所示為散熱方向，LED121點亮後產生的熱先傳 到基板122，再由基板122傳到固定座24，藉由固定座24内的熱 官22熱管22作為熱均衡的介質（並不直接作為傳熱介質），迅速 物熱平衡後制背板18，触背板18傳至散朗# 28，由風 扇26吹入的風可將散熱鰭片28上的熱排出。熱管”不斷將熱由 中間往左右兩側傳遞，散熱鰭片28不斷將熱傳出，形成散熱循環。 M3 09684 ⑽’因為熱管吸熱的部位未直接與熱源接觸，造成熱管吸熱效 果減少，^熱管散熱的部分未直接與散熱則接觸，造成熱管散 熱性能降低。而且，由於傳熱路徑過長，熱傳導的接觸面過多， 也會造成熱傳導的效果不佳。 【新型内容】 本創作之-目的’係提供—種背光模組及顯示器，以解決習知 之問題。 為達到上述目的，本創作背光模组包含一基板、一發光元件、 一熱管、-散熱元件及-背板。基板具有相對的第—面與第二面， 發光元件電性連接於基板的第―面，熱管連接基板的第二面；散 熱元件連接熱管且包含-傳熱元件、—散細片及—風扇；背板 具有開孔’發光树穿過開孔露出於f板内，基板的兩側延伸出 -連接部’亚彻連接元件將連接部@定於背板上。另外，本創 作提出一種顯示器。 【實施方式】 有關本創作為達到上述目的，所採用之技術手段及其 餘功效，兹舉較佳實施例，並配合圖式加以說明如下： 請參閱圖4'本創作一實施例之背光模組包含一背板 110、一發光7L件120、一基板130、—熱管14〇、一散熱元件15〇、 -反射片160及-擴散板170。在背光模組之擴散板17〇上方設 M309684 置一液晶面板180，就可組成顯示器。 發光元件120設置於基板130上，基板130具有相對的第一 面1301及第二面1302，發光元件120承載於基板上13〇並電性 連接於基板130的第一面1301，熱管140直接與基板13〇的第二 面1302連接；其中，發光元件120例如是發光二極體、有機發 光二極體或其他適當的發光元件；基板130例如為金屬印刷電路 > 板^士81 Core Printed Circuit Board; MCPCB)。 背板110具有開孔1101，發光元件120穿過開孔11〇1露出於 背板110内，基板130之兩側可透過折彎延伸出一連接部132， 用連接元件131將連接部132固定於背板11〇上，其中，連接元 件131例如為螺絲。將基板130折彎可強化結構強度，有效強化 背光模組整體結構強度。 背板110的内表面貼設反射片160，於發光元件12〇上方適當 射出至擴散板170，或經由反射片⑽反射後再向上射出’擴散 板170可使光線分佈更均勻，於擴散板17〇±可加設一光學材料 層（圖未示）’如棱鏡片、增亮膜等。 散熱元件150位於熱管，的下方，並連接於熱管⑽及基 板130的第二面1302。其中，熱管14〇係直接錫：^在基板13〇上， 爽管140例如為一扁平狀熱管、一溝槽形熱管、一粉末燒結型 M309684 提高傳熱的效率’並可降低背板的厚度，有助於提升背板11〇的 傳熱性。散熱元件150經無電解鎳處理後再與熱管14〇及基板13〇 錫焊接合，故結合處不必使用導熱介質(屬高價位產品），也不用 裝導熱塊，可降低背光模組的整體厚度，使背光模組薄型化、輕 量化，且同時亦降低熱阻抗、重量及成本。若發光元件12〇或基 及基板130，故本創作可增進維修之便利性。習知的反射片懸空 貼在基板上，所以反射片受熱影響容易變形，本創作之反射片16〇 ' 係平貼於背板110的内表面，未懸空貼設，故反射片不易變形。 - ^f，請參閱圖5,基板130之連接部132亦可改利用背板 110折彎形成，其係於背板110之開孔1101處將背板11〇折彎出 連接部112，用連接元件131將連接部112與基板130連接在一 損及電路。 再者，請參閱圖6，亦可同時將基板13〇折彎出連接部132， 且背板110於開孔1101處折彎出連接部112，並以連接 元件131將連接部132及連接部U2連接在一起，以將 基板130固定於背板11〇上。 發光元件120產生賴_絲13〇後，有兩槪熱途徑； M309684 -第一種途徑為基板130將熱傳至熱管140迅速達到熱平衡後，再 由熱管140將熱傳至散熱元件150，再透過自然對流將散熱元 件150的熱排出。第二種途徑為熱從基板13()傳至背板11〇，由 背板110散熱，將背板110當作散熱的介質。 此外，請參閱圖7，散熱元件15〇更可包含傳熱元件 151、政熱鰭片152以及一風扇153。熱管14〇埋設於傳 152設置於傳熱元件ι51下方，且散熱鰭片ι52與傳熱元 件151相接觸，風扇153設置於散熱鰭片152下方，使散 - 熱鰭片152位於傳熱元件15與風扇153之間，風扇丄53 - 並與政熱鰭片152相接觸。發光元件120產生的熱傳到基板 130後’有兩種散熱途徑；第一種途徑為基板13〇將熱傳至傳熱 元件151，藉由傳熱元件151内的熱管14〇迅速達到熱平衡後， 癱 再由熱管140將熱傳至散熱縛片152，由風扇153將熱排出。第 二種途徑為熱從基板130傳至背板110，由背板110散熱，將背 板110當作散熱的介質。 請參閱圖8 ,亦可將散熱鰭片152延伸至與背板11〇接觸，使 發光元件120產生的熱傳到基板130後，由基板130將熱傳到背 板113，熱再由背板113傳到散熱鰭片152，透過散熱鰭片I” 自然對流或風扇153的強制對流，可有效散熱。 M309684 請參閱圖9，也可將熱管14〇延伸至散熱鰭片152内，以加速 熱& 140傳熱速度’達到增進背光模組的散熱效率。請參閱圖, 而熱管14G㈣至散熱鰭片152的部份可加以折f處理，如將熱 '140向下折彎成熱管14〇1 ;或將熱管14〇折彎向上成熱管 1402 ;將熱管14G外側折彎後，與垂直線形成—任意角度的夾角 R，如熱管1403。請參閱圖11熱管140亦係由複數熱管題 接在-起使I齡的搭接方式於此例示三種，第—種係將熱管 140施以外型加工’如折彎成熱管14〇5，然後搭接複數熱管歷 使用’或將熱官140壓扁成熱管14〇6，然後搭接複數熱管14〇6 使用;第二種係以高傳熱材料將兩根熱管雨的接觸端加以包覆 後搭接，兩傳熱材料如金屬材料、銅塊、導熱片⑽㈣心_ 等，第二種係以可傳熱的黏結劑將二根熱管1408直接黏在一起使 用。 綜上所述，本創作之優點如下述： 1·本創作之熱官14〇與發光元件120之間僅有基板13〇作為間 隔，可減少傳熱的接觸面，提升散熱的效率。 2. 本創作具有熱管傳熱及背板散熱兩種途徑，可強化散熱效 果，減少熱能累積。 3. 利用散熱鰭片與熱管的幾何設計，可提高背光模組整體散熱 效率。 11 M309684 4.本創作將熱管當作傳熱介質，藉由熱管的高傳導係數可快速 傳熱並達熱平衡的狀態。 以上所述，僅用以方便說明本創作之較佳實施例，本創作之範 圍不限於該等較佳實施例，凡依本創作所做的任何變更，於不脫 離本創作之精神下，皆屬本創作申請專利範圍。 【圖式簡單說明】 圖1係習知一 LED液晶顯示裝置之側視圖； 圖2係習知另一 LED液晶顯示裝置之側視圖·， 圖3係圖2之前視圖； 圖4係本創作顯示器一實施例之側視圖； 圖5係本創作背板之另一結構側視圖； 圖6係本創作背板之又一結構側視圖; 圖7係本創作具有傳熱元件、散熱鰭片及風扇之散熱元 件之顯示器之側視圖； 圖8係本創作散熱鰭片之另一結構側視圖; 圖9係本創作熱管之另一結構側視圖； 爵10係本創作具有折彎處理之熱管之結構側視圖；以及 圖11係本創作具有搭接處理之熱管之結構側視圖。 12 M3 09684 【主要元件符號說明】M309684 VIII. New Description: [New Technology Field] This creation is about a backlight module and display, especially a backlight module and display with a light-emitting diode. [Prior Art] In recent years, due to the improved luminous efficiency of Light Emitting Diodes (LED), LEDs have gradually replaced xenon lamps and incandescent bulbs in certain product applications, becoming a commonly used light source. For example, an LED is used as a backlight of a liquid crystal display device. LEDs are components that are highly hot and very sensitive to temperature. Therefore, if too much heat is accumulated in the backlight module, the temperature of the LEDs rises, resulting in a decrease in luminous efficiency or uneven illumination. Therefore, how to design the heat dissipation structure of the backlight module is an extremely important problem in practice. Referring to FIG. 1 , a conventional LED liquid crystal display device 1A includes a front frame u, an LED early element 12, a diffusing plate 13, a reflective sheet 14, an optical material layer 15, a back plate 18, and a liquid crystal panel 17. . The LED unit 12 is disposed above the backplane 18 and includes a substrate 122 and an LED 121 carried on the substrate 122. The substrate 122 is a Metal Core Printed Circuit Board (MCPCB). A reflective sheet 14 is attached between the inner walls of the two sides of the back plate 18 and the adjacent LEDs 121; the diffusing plate 13 is disposed above the LED unit 12, and the optical material layer 15 is disposed above the diffusing plate 13 and is disposed above the front frame 11. The liquid crystal panel 17 is configured to constitute a liquid crystal display device M30968410. The heat dissipation mechanism of the liquid crystal display device 10 is such that when the light is turned on, the generated heat is first transmitted to the substrate 122, then transferred from the substrate 122 to the back plate 18, and finally transmitted through a heat dissipating mechanism such as a fan or the θ plate 18. Heat sinks, etc. (not shown), put "," V out of the clothes. Because the heat transfer path is too long, the heat conduction contact surface is too much, resulting in poor heat conduction, and the substrate 122 'back plate The heat conduction of the 18-contact surface is not so that even if the heat-conducting sheet is attached, the heat cannot be quickly discharged, resulting in heat accumulation, and the unevenness of the 'knife unevenness' causes the luminous efficiency of each side to be different, and affects the liquid crystal display device. Moreover, the reflective sheet 14 is only partially attached to the substrate 122, and the remaining portion will be suspended. Therefore, the reflective sheet 14 is easily affected by heat and is easily deformed. Θ 2 is another knowledge of the heat dissipation structure of the LED liquid crystal display device. Different from the liquid crystal display device 10 described above, the 乂 丨 丨 is mounted on the substrate: the substrate 丨 has a fixing seat 24 below, a back plate 18 is disposed under the fixing seat 24, and a heat pipe is installed in the fixing seat 24 (heatpipe) 22. Backplane 18 The heat sink fins 28 and the fan 26 are connected to the lower side. Please refer to item 3, the arrow indicates the heat dissipation direction, and the heat generated after the LED 121 is turned on is first transmitted to the substrate 122, and then transferred from the substrate 122 to the fixed seat 24, by the fixing seat 24 The heat pipe 22 inside the heat pipe 22 serves as a medium for heat equalization (not directly as a heat transfer medium), and the back plate 18 is quickly heated and thermally balanced, and the back plate 18 is transmitted to the Sanlang #28, and the wind blown by the fan 26 can be used. The heat on the heat dissipation fins 28 is discharged. The heat pipes continuously transmit heat from the middle to the left and right sides, and the heat dissipation fins 28 continuously transmit heat to form a heat dissipation cycle. M3 09684 (10)' Because the heat-absorbing part of the heat pipe is not directly in contact with the heat source, the heat-absorbing effect of the heat pipe is reduced, and the heat-dissipating portion of the heat pipe is not directly in contact with the heat-dissipating heat, thereby causing the heat-dissipating performance of the heat pipe to be lowered. Moreover, since the heat transfer path is too long, the contact surface of heat conduction is excessive, and the effect of heat conduction is also poor. [New Content] The purpose of this creation is to provide a backlight module and display to solve the conventional problems. To achieve the above objective, the backlight module comprises a substrate, a light-emitting element, a heat pipe, a heat dissipating component and a backing plate. The substrate has opposite first and second faces, the light emitting device is electrically connected to the first surface of the substrate, and the heat pipe is connected to the second surface of the substrate; the heat dissipating component is connected to the heat pipe and includes a heat transfer component, a fine film and a fan The back plate has an opening. The illuminating tree is exposed through the opening to the f-plate, and the two sides of the substrate extend out of the connecting portion. The Attorney connecting element sets the connecting portion@ on the back plate. In addition, this creation proposes a display. [Embodiment] The present invention aims to achieve the above object, the technical means and the remaining functions, and the preferred embodiments are described as follows: Please refer to FIG. 4' backlight module of an embodiment of the present invention. A backing plate 110, a light emitting 7L member 120, a substrate 130, a heat pipe 14A, a heat dissipating component 15A, a reflective sheet 160, and a diffusing plate 170 are included. A liquid crystal panel 180 is disposed above the diffusion plate 17 of the backlight module to form a display. The light-emitting element 120 is disposed on the substrate 130. The substrate 130 has a first surface 1301 and a second surface 1302. The light-emitting element 120 is mounted on the substrate 13 and electrically connected to the first surface 1301 of the substrate 130. The heat pipe 140 directly The second surface 1302 of the substrate 13 is connected; wherein, the light emitting element 120 is, for example, a light emitting diode, an organic light emitting diode or other suitable light emitting element; the substrate 130 is, for example, a metal printed circuit>Board; MCPCB). The back plate 110 has an opening 1101. The light emitting element 120 is exposed in the back plate 110 through the opening 11〇1. Both sides of the substrate 130 can be bent out to extend a connecting portion 132, and the connecting portion 132 is fixed by the connecting member 131. On the back plate 11 ,, the connecting element 131 is, for example, a screw. Bending the substrate 130 can strengthen the structural strength and effectively strengthen the overall structural strength of the backlight module. The inner surface of the back plate 110 is attached with a reflection sheet 160, and is appropriately emitted to the diffusion plate 170 above the light-emitting element 12, or is reflected by the reflection sheet (10) and then emitted upwards to the 'diffusion plate 170 to make the light distribution more uniform. 〇± can be added with an optical material layer (not shown) such as a prism sheet, a brightness enhancement film, and the like. The heat dissipating component 150 is located below the heat pipe and is coupled to the heat pipe (10) and the second face 1302 of the substrate 130. Wherein, the heat pipe 14 is direct tin: on the substrate 13 ,, the cool tube 140 is, for example, a flat heat pipe, a grooved heat pipe, a powder sintered type M309684 to improve heat transfer efficiency 'and can reduce the thickness of the back plate It helps to improve the heat transfer of the backing plate 11〇. The heat dissipating component 150 is treated by electroless nickel and then soldered to the heat pipe 14 and the substrate 13 so that the heat transfer medium (which is a high-priced product) is not used at the joint, and the heat conductive block is not required, thereby reducing the overall thickness of the backlight module. The backlight module is made thinner and lighter, and at the same time, the thermal impedance, weight and cost are also reduced. If the light-emitting element 12 or the substrate 130 is used, the creation can improve the convenience of maintenance. The conventional reflection sheet is suspended on the substrate, so that the reflection sheet is easily deformed by the heat. The reflective sheet 16' of the present invention is flatly attached to the inner surface of the back sheet 110, and is not suspended, so that the reflection sheet is not easily deformed. - ^f, please refer to FIG. 5, the connecting portion 132 of the substrate 130 can also be formed by bending the back plate 110, and the back plate 11 is bent and bent out of the connecting portion 112 at the opening 1101 of the back plate 110. The connecting member 131 connects the connecting portion 112 and the substrate 130 to a damage circuit. In addition, referring to FIG. 6 , the substrate 13 can be bent and bent out of the connecting portion 132 , and the back plate 110 is bent out of the connecting portion 112 at the opening 1101 , and the connecting portion 132 and the connecting portion are connected by the connecting member 131 . U2 is connected together to fix the substrate 130 to the back plate 11A. After the light-emitting element 120 generates the ray-filament 13 ,, there are two thermal paths; M309684 - the first way is that the substrate 130 transfers heat to the heat pipe 140 to quickly reach thermal equilibrium, and then the heat is transferred to the heat-dissipating component 150 by the heat pipe 140, and then The heat of the heat dissipating member 150 is discharged by natural convection. The second way is that heat is transferred from the substrate 13 () to the back plate 11 , and the back plate 110 is used as a heat dissipating medium. In addition, referring to FIG. 7 , the heat dissipating component 15 further includes a heat transfer component 151 , a thermal fin 152 , and a fan 153 . The heat pipe 14 is buried under the heat transfer element ι51, and the heat dissipation fin ι52 is in contact with the heat transfer element 151. The fan 153 is disposed under the heat dissipation fin 152, so that the heat dissipation fin 152 is located at the heat transfer element 15. Between the fan 153 and the fan 153, and in contact with the political fins 152. After the heat generated by the light-emitting element 120 is transmitted to the substrate 130, there are two ways of dissipating heat; the first way is that the substrate 13 is transferred to the heat transfer element 151, and the heat pipe 14 in the heat transfer element 151 quickly reaches the heat balance. The heat is transferred from the heat pipe 140 to the heat dissipation tab 152, and the heat is discharged by the fan 153. The second way is that heat is transferred from the substrate 130 to the backing plate 110, and the backing plate 110 is used as a heat dissipating medium. Referring to FIG. 8 , the heat dissipation fins 152 may also be extended to contact with the back plate 11 , so that the heat generated by the light emitting element 120 is transmitted to the substrate 130 , and the heat is transmitted from the substrate 130 to the back plate 113 , and the heat is further transmitted from the back plate. 113 is transmitted to the heat dissipation fins 152, and is convectively convected by the heat dissipation fins I" natural convection or the fan 153 to effectively dissipate heat. M309684 Referring to FIG. 9, the heat pipes 14A can also be extended into the heat dissipation fins 152 to accelerate heat. & 140 heat transfer speed 'to improve the heat dissipation efficiency of the backlight module. Please refer to the figure, and the heat pipe 14G (four) to the heat sink fin 152 part can be folded f, such as the heat '140 down bend into a heat pipe 14〇 1; or bend the heat pipe 14〇 into a heat pipe 1402; after bending the outer side of the heat pipe 14G, form an angle R with an arbitrary angle with the vertical line, such as the heat pipe 1403. Please refer to Fig. 11 the heat pipe 140 is also connected by a plurality of heat pipes In the case of the I-year-old lap joint, three types are exemplified, and the first type is to heat-process the heat pipe 140 into a shape such as bending into a heat pipe 14〇5, and then lapping a plurality of heat pipes to use 'or press the heat officer 140 Flat heat pipe 14〇6, then lapped multiple heat pipes 14〇6; second system The high heat transfer material coats the contact ends of the two heat pipe rains, and the two heat transfer materials are metal materials, copper blocks, heat conductive sheets (10), and the second type is a heat transferable adhesive. The root heat pipe 1408 is directly bonded together. In summary, the advantages of the present invention are as follows: 1. The heat exchanger 14 of the present creation and the light-emitting element 120 have only the substrate 13〇 as a space to reduce heat transfer contact. Surface, improve the efficiency of heat dissipation 2. This design has two ways of heat pipe heat transfer and back plate heat dissipation, which can enhance the heat dissipation effect and reduce the heat accumulation. 3. Using the geometric design of heat sink fins and heat pipes, the backlight module can be improved. Heat dissipation efficiency 11 M309684 4. The author uses the heat pipe as a heat transfer medium, which can quickly transfer heat and reach a state of heat balance by the high conductivity of the heat pipe. The above description is only for convenience of explaining the preferred embodiment of the present invention. The scope of this creation is not limited to the preferred embodiments, and any changes made in accordance with this creation are within the scope of this creation application without departing from the spirit of this creation. [Simplified illustration] Figure 1 Learning 2 is a side view of another LED liquid crystal display device, FIG. 3 is a front view of FIG. 2; FIG. 4 is a side view of an embodiment of the present display; FIG. FIG. 6 is a side view showing another structure of the back sheet of the present invention; FIG. 7 is a side view of the display having the heat transfer element, the heat sink fin and the heat dissipating component of the fan; FIG. 9 is a side view of another structure of the heat pipe of the present invention; FIG. 9 is a side view of another structure of the heat pipe of the present invention; A side view of the structure of the heat pipe to be treated. 12 M3 09684 [Main component symbol description]
10 LED液晶顯示裝置 11 前框 12 LE1D單元 13 擴散板 14 反射片 15 光學材料層 18 背板 17 液晶面板 121 LED 122 基板 24 固定座 22 熱管 110 背板 120 發光元件 130 基板 140 熱管 150 散熱元件 160 反射片 170 擴散板 13 M309684 180 液晶面板 1101 開孔 131 連接元件 132 連接部 1301 第一面 1302 第二面 112 連接部 151 傳熱元件 152 散熱鰭片 153 風扇 1410 LED liquid crystal display device 11 Front frame 12 LE1D unit 13 Diffuser plate 14 Reflector 15 Optical material layer 18 Back plate 17 Liquid crystal panel 121 LED 122 Substrate 24 Fixing block 22 Heat pipe 110 Back plate 120 Light-emitting element 130 Substrate 140 Heat pipe 150 Heat-dissipating component 160 Reflecting sheet 170 Diffuser plate 13 M309684 180 Liquid crystal panel 1101 Opening 131 Connecting member 132 Connecting portion 1301 First surface 1302 Second surface 112 Connecting portion 151 Heat transfer element 152 Heat sink fin 153 Fan 14