M399307 五、新型說明： 【新型所屬之技術領域】 本新型係提供一種能將熱傳導移熱及雙相流移熱整合為 之迴路式散熱模組。 【先前技術】 本公司申請在案之我國第M324240號『回路式熱管全紹 散熱器』專利前案，其揭示有鋁製之冷凝器、蒸發器總成及 • 二毛細管；所述冷凝器係於散熱片間穿設散熱管所組成，此 散熱管具有一輸入端、一輸出端，用以供毛細管連接至蒸發 器總成’其各零組件連接處中介附著有鋁基材料所構成之填 料物’俾在硬焊加熱至填料物的熔點以上，填料物會被炫化 會/爹入連接處，俾藉由同性質相容介面接合，令該冷凝哭、 蒸發器總成及二毛細管相對連接處熱炫鏈結密著成—體，據 以構成一回路式熱管（Loop Heat Pipe)循環散熱之裝置。 Φ 該專利前案由於功效卓著、實用性奇高，且結構精簡新 穎，確係一具創作性之設計。然，其冷凝器、蒸發器仍舊是 採分離式設計’故有下述缺點： 1 · ΰ亥專利如案蒸發益仍需透過二毛細管來外接冷凝器 ，除使得整體結構有重量重、較佔空間、須另外安裝冷凝器 之缺點，且該二毛細管亦會增加整體之成本。 2·其~砝益热法直接對蒸發器進行熱傳導移熱，故而蒸 發器之熱交換面積相當有限，如此便會造成該蒸發器於運作 M399307 時之運作溫度較高，且有不穩定的情形，其無法進一步優化 工作流體於雙相間之潛熱變化，故而其散熱效率及穩定性尚 '有可提升之空間。 ’ 【新型内容】 本創作主要内容在於：提供一種迴路式散熱模組，其包 括有： 一鋁製蒸發器，其界定一封閉之腔室，用以供工作流體 • 充填，該蒸發器至少設有一組相匹配之導氣孔、回流孔，該 導氣孔、回流孔係連通腔室内外；以及 一鋁製冷凝器，其係由複數散熱片間隔排列而組成，該 等散熱片底端係硬焊於蒸發器頂面，且設有與導氣孔、回流 孔相匹配之組裝孔，並以鋁製散熱管硬焊於組裝孔中，令該 散熱管一端硬焊於導氣孔、另端硬焊於回流孔，使工作流體 於腔室吸熱而汽化時，能經導氣孔或回流孔而為冷凝器冷 • 卻，使之形成液態的返還腔室，俾令工作流體以雙相間之潛 熱變化而移走蒸發器大量熱源。 是以，本創作使冷凝器直接硬焊於蒸發器，此結構配置， 除能免除上揭專利前案之毛細管設置，且能達到體積較小、 重量較輕之優點，使之較符合現今輕薄短小之市場主流，且 能免除冷凝器安裝於電腦或燈具之困擾。。 此外，本創作冷凝器能直接對蒸發器進行熱傳導移熱， 如此可加大蒸發器之熱交換面積，俾強化該蒸發器之散熱效 4 M399307 率及穩定性，以進一步優化工作流體於雙相間之潛熱變化。 【實施方式】 “為使貴審查委員能進一步瞭解本創作之結構，特徵及 '其他目的，玆附以較佳實施例之圖式詳細說明如後： 請參閱第一〜五圖，本創作包括·· 一鋁製蒸發器（1)，其具有一相對設置之底板（11)、頂板 (12)，該底板（11)由頂面向下成型有一開口朝上之凹陷空間 • (13)，使該頂板（12)對合硬焊於底板（11)上時，可令該凹陷 空間（13)用以界定出一封閉之腔室；此底板（11)、頂板（12) 於對合位置設有一連通腔室内外之注液孔（14)，用以供一注 液管（140)硬焊固定，俾將工作流體充填至腔室中；其底板 (11)、頂板（12)另於對合位置一側水平向的貫設有連通腔室 内外之左回流孔（15)，至於另側則設有與左回流孔（15)相對 應的右回流孔（150);該頂板（12)縱向貫設有與左回流孔（15) φ 相匹配之左導氣孔（16)、與右回流孔（150)相匹配之右導氣孔 (160)，令該左、右導氣孔（16)(160)底端係位於左、右回流 孔（15) (150)上方；而該頂板（12)頂面於左回流孔（15)、左導 氣孔（16)之間形成第一導熱區（171)，於右回流孔（150)、右 導氣孔（160)形成第二導熱區（172)，然後在左導氣孔（16)、 右導氣孔（160)之間形成第三導熱區（173);以及 一鋁製冷凝器（2)，其包括有一安裝於第一導熱區（1 71) 之第一鰭片組（2Λ)、安裝於第二導熱區（172)之第二鰭片組 M399307 (2B)、安裝於第三導熱區（173)之第三鰭片組（2C)，該三鰭片 組（2A)(2B)(2C)均由複數散熱片（20)間隔排列而組成，該等 散熱片（20)相對之兩表面係呈波浪形，且底端彎設有折板 (21)，用以保持相鄰散熱片（20)之間距，使兩兩散熱片（20) 之間形成有一前後向貫通之波浪形歧流道（22)，據以供空氣 對流，而該等折板（21)係採硬焊的方式固定於頂板（12)頂面 之預定位置，以使該等散熱片（20)可直接熱傳導的移走蒸發 • 器（1)一部份熱源，進而使該冷凝器（2)能直接增加蒸發器（1) 之熱交換面積，使之能提升蒸發器（1)之散熱效率及穩定性； 為使該冷凝器（2)具有渦流散熱效果，其於該等散熱片（20) 前、後兩側各設有左右向貫通之引流孔（23)，以及於該等散 熱片（2 0)中段設有左右向貫通之引流槽（2 4) *令該引流孔 (23)、引流槽（24)能與歧流道（22)相交，如此即可達到較佳 之渦流散熱效果；所述第一鰭片組（2A)更在對應左回流孔 • (15)、左導氣孔（16)的位置設有左右向貫通之組裝孔（25)， 至於第二鰭片組（2B)亦在對應右回流孔（150)、右導氣孔（160) 的位置設有左右向貫通之組裝孔（25);然後在每一組裝孔（25) 中硬焊有一鋁製散熱管（26)，且令散熱管（26)—端硬焊於對 應之左導氣孔（16)或右導氣孔（160)、另端硬焊於對應之左回 流孔（15)或右回流孔（150)，使工作流體於腔室吸熱而汽化 時，能自動上升的進入導氣孔（16)(16 0 )，進而為冷凝器（2) 冷卻，然後形成液態的由回流孔（]5)(1 5 0)返還腔室，使工作 M399307 流體以雙相間之潛熱變化而移走蒸發器大量熱源。 由上述之結構說明得知本創作至少具有以下優點： L本創作蒸發器（1)之底板（11)、頂板（12)、注液管 (140)，以及冷凝器（2)三鰭片組（2a)(2B)(2C)、散熱管（26)， 均才木用相同之紹材質，俾在透過整體相對應之結構設計，使 之旎達到CORE組付—塗助焊劑―送入硬焊爐進行硬焊，故而 本創作在實施上具有一貫化生產之經濟效益。 2. 本創作免除上揭專利前案之毛細管設置，進一步的使 冷凝器（2)能直接硬焊於蒸發器（！），在散熱效率不變下，可 以達到體積較小、重量較輕之優點，使之較符合現今輕薄短 h之市場主流，且能免除冷凝器安裝於電腦或燈具之困擾。 3. 本創作之冷凝器（2)尚能直接對蒸發器〇)進行熱傳導 矛夕熱，如此可以加大蒸發器⑴之熱交換面積，俾強化該蒸發 為（1)之散熱效率及穩定性，以進一步優化工作流體於雙相間 之潛熱變化。 請參閱第六〜十圖，其係本創作第二實施例，該實施例 主要說明蒸發器（1)之回流孔（15)(15〇)、導氣孔（16)Π6〇) 句貝设於頂板（12)，此種實施方式係與第一〜五圖等效，惟 "工作流體於雙相間之潛熱變化時會有汽、液挾帶現象，但 是，在本創作冷凝器（2)能直接對蒸發器（1)進行熱傳導移熱 下，其穩定性將大為增加’足以克服傳統蒸發器之乾化現象， 因此本創作確能改善現有熱管（Heat Pipe)之缺失。 7 M399307 綜上所述，本創作整體結構新穎，且具有上述之功效增 進處，其確為一技術理念上的高度創作，應符專利申請要件， 爰依法提出申請。惟以上所述者，僅為本創作之一較佳實施 例而已，當不能以之限定本創作實施之範圍，即大凡依本創 作申請專利範圍所作之均等變化與修飾，皆應仍屬本新型涵 蓋之範圍内。M399307 V. New description: [New technology field] This new type provides a loop type heat dissipation module that can integrate heat transfer heat transfer and two-phase flow heat transfer. [Prior Art] The company applied for the patent case No. M324240 of the "Circular heat pipe full radiator" patent, which discloses an aluminum condenser, an evaporator assembly and a second capillary; the condenser system The heat sink has a heat-dissipating tube, and the heat-dissipating tube has an input end and an output end for connecting the capillary tube to the evaporator assembly, and the filler of the aluminum-based material is interposed between the components of the component. The material '俾 is heated to a temperature above the melting point of the filler, and the filler will be dazzled/into the joint, and the condensed crying, the evaporator assembly and the two capillaries are relatively The hot chain at the junction is densely packed into a body, which constitutes a loop heat pipe for heat dissipation. Φ The patent's predecessor is a creative design because of its outstanding efficacy, high practicality, and a streamlined structure. However, the condenser and the evaporator are still separated and designed to have the following disadvantages: 1 · The patent of the ΰ海 patent still needs to be connected to the condenser through the two capillary tubes, except that the overall structure is heavy and heavy. The space has to be additionally installed with the disadvantage of the condenser, and the two capillaries also increase the overall cost. 2. The heat transfer method directly transfers heat to the evaporator, so the heat exchange area of the evaporator is quite limited, which will cause the evaporator to operate at a higher temperature and operate in an unstable state when operating the M399307. It can not further optimize the latent heat change of the working fluid between the two phases, so its heat dissipation efficiency and stability still have room for improvement. 'New content】 The main content of this creation is to provide a loop type heat dissipation module, which comprises: an aluminum evaporator, which defines a closed chamber for working fluid filling, the evaporator is at least provided a set of matching air guiding holes and returning holes, wherein the air guiding holes and the return holes communicate with the inside and outside of the cavity; and an aluminum condenser, which is composed of a plurality of fins arranged at intervals, and the bottom ends of the heat sinks are brazed The top surface of the evaporator is provided with an assembly hole matched with the air guiding hole and the return hole, and is brazed into the assembly hole by an aluminum heat pipe, so that one end of the heat pipe is hard welded to the air guiding hole, and the other end is hard welded. The return hole allows the working fluid to be cooled by the air vent or the return hole to cool the condenser through the air vent or the return hole, so that the liquid return chamber is formed, and the working fluid is moved by the latent heat between the two phases. Take a large amount of heat from the evaporator. Therefore, this design allows the condenser to be directly brazed to the evaporator. This structure configuration can eliminate the capillary setting of the previous patent application, and can achieve the advantages of smaller volume and lighter weight, making it more suitable for today's thin and light. The short market is mainstream and can eliminate the trouble of installing the condenser on a computer or a light fixture. . In addition, the creation condenser can directly transfer heat to the evaporator, which can increase the heat exchange area of the evaporator, and enhance the heat dissipation efficiency of the evaporator 4 M399307 rate and stability to further optimize the working fluid between the two phases. The latent heat changes. [Embodiment] "To enable the review board to further understand the structure, features and 'other purposes of this creation, the following is a detailed description of the drawings of the preferred embodiment as follows: Please refer to the first to fifth figures, this creation includes An aluminum evaporator (1) having an oppositely disposed bottom plate (11) and a top plate (12) formed by a top surface facing downwardly with a recessed opening facing upwards (13), When the top plate (12) is brazed to the bottom plate (11), the recessed space (13) can be used to define a closed chamber; the bottom plate (11) and the top plate (12) are disposed at the opposite positions. There is a liquid injection hole (14) communicating with the inside and outside of the chamber for brazing and fixing a liquid injection pipe (140), and filling the working fluid into the chamber; the bottom plate (11) and the top plate (12) are different from A left return hole (15) communicating with the inside and outside of the chamber is disposed horizontally on one side of the mating position, and a right return hole (150) corresponding to the left return hole (15) is provided on the other side; the top plate (12) a left air guide hole (16) matching the left return hole (15) φ and a right air guide hole (160) matching the right return hole (150) , the bottom ends of the left and right air guiding holes (16) (160) are located above the left and right return holes (15) (150); and the top surface (12) top surface is the left return hole (15), the left air guiding hole A first heat conduction zone (171) is formed between (16), and a second heat conduction zone (172) is formed at the right return hole (150) and the right air guide hole (160), and then the left air guide hole (16) and the right air guide hole (16). Forming a third heat transfer zone (173) therebetween; and an aluminum condenser (2) including a first fin set (2Λ) mounted to the first heat transfer zone (1 71) and mounted to the second a second fin group M399307 (2B) of the heat conduction region (172), a third fin group (2C) mounted on the third heat conduction region (173), and the three fin groups (2A) (2B) (2C) The plurality of fins (20) are arranged at intervals. The fins (20) are wavy with respect to the two surfaces, and the bottom end is bent with a flap (21) for holding the adjacent fins (20). The distance between the two heat sinks (20) is formed with a wave-shaped split flow passage (22) extending forward and backward for air convection, and the fold plates (21) are fixed by brazing. Top plate (12) top surface reservation So that the heat sink (20) can directly transfer heat to remove a part of the heat source of the evaporator (1), so that the condenser (2) can directly increase the heat exchange area of the evaporator (1), so that The heat dissipation efficiency and stability of the evaporator (1) can be improved; in order to make the condenser (2) have a vortex heat dissipation effect, the front and rear sides of the heat sink (20) are provided with left-right flow through a hole (23), and a drain groove (2 4) extending in the middle and the middle of the heat sink (20) * such that the drain hole (23), the drain groove (24) and the manifold (22) Intersecting, so that a better eddy current heat dissipation effect can be achieved; the first fin group (2A) is provided with an assembly hole that penetrates left and right at a position corresponding to the left return hole (15) and the left air guide hole (16) ( 25), as for the second fin group (2B), the assembly holes (25) for the right and left direction are provided at positions corresponding to the right return hole (150) and the right air guide hole (160); and then in each assembly hole (25) Medium-hard soldering of an aluminum heat pipe (26), and the heat pipe (26) end is hard welded to the corresponding left air hole (16) or right air hole (160), the other end Soldering to the corresponding left return hole (15) or right return hole (150), so that when the working fluid absorbs heat in the chamber and vaporizes, it can automatically rise into the air guiding hole (16) (16 0 ), and then the condenser (2) Cooling, then forming a liquid return to the chamber by the return orifice (5) (1 50), allowing the working M399307 fluid to remove a large amount of heat from the evaporator with a latent heat change between the two phases. According to the above structural description, the present invention has at least the following advantages: L-created evaporator (1) bottom plate (11), top plate (12), liquid injection pipe (140), and condenser (2) three fin group (2a) (2B) (2C), heat pipe (26), the same material is used for the wood, and the structure is designed to pass the overall corresponding structure, so that it can reach the CORE group. The welding furnace is hard-welded, so the creation has the economic benefits of consistent production. 2. This creation eliminates the capillary setting of the previous patent application, and further enables the condenser (2) to be directly brazed to the evaporator (!), which can achieve smaller volume and lighter weight under the same heat dissipation efficiency. The advantage is that it is more in line with the mainstream of today's light and thin h, and can eliminate the trouble of installing the condenser on the computer or the lamp. 3. The condenser (2) of this creation can directly conduct heat transfer to the evaporator ,), so that the heat exchange area of the evaporator (1) can be increased, and the heat dissipation efficiency and stability of the evaporation (1) can be enhanced. To further optimize the latent heat change of the working fluid between the two phases. Please refer to the sixth to tenth drawings, which is the second embodiment of the present invention. The embodiment mainly describes the return hole (15) (15〇) and the air guiding hole (16) Π6〇 of the evaporator (1). The top plate (12), this embodiment is equivalent to the first to fifth figures, but the working fluid has a phenomenon of vapor and liquid enthalpy when the latent heat changes between the two phases, but in the creation condenser (2) The ability to directly transfer heat to the evaporator (1), its stability will be greatly increased 'to overcome the drying phenomenon of the traditional evaporator, so this creation can indeed improve the lack of the existing heat pipe (Heat Pipe). 7 M399307 In summary, the overall structure of the creation is novel and has the above-mentioned effect enhancement. It is indeed a high-level creation of a technical concept, which should meet the requirements of the patent application, and apply in accordance with the law. However, the above is only a preferred embodiment of the present invention. When it is not possible to limit the scope of the implementation of this creation, that is, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application for this creation should still belong to the present invention. Within the scope of coverage.
M399307 【圖式簡單說明】 弟· ~~圖.係本新型之分解不意圖。 第二、三圖：係本新型之組合外觀示意圖。 第四圖：係本新型之俯視示意圖。 第五圖：係本新型之組合剖面示意圖。 第六圖：係本新型第二實施例之分解示意圖。M399307 [Simple description of the schema] Brother ~ ~ ~ diagram. This is not intended to be decomposed. The second and third figures are schematic diagrams of the combined appearance of the novel. The fourth picture is a top view of the novel. Fig. 5 is a schematic cross-sectional view of the novel. Figure 6 is an exploded perspective view of the second embodiment of the present invention.
第七、八圖：係本新型第二實施例之組合外觀示意圖 第九圖：係本新型第二實施例之俯視示意圖。 第十圖：係本新型第二實施例之組合剖面示意圖。 主要元件符號說明7 and 8 are schematic views showing the combination of the second embodiment of the present invention. FIG. 9 is a top plan view of the second embodiment of the present invention. Figure 10 is a cross-sectional view showing the combination of the second embodiment of the present invention. Main component symbol description
(1)蒸發器 (11)底板 (13)凹陷空間 （14)注液孔 (15)(150)回流孔（16)(160)導氣孔 (172)第二導熱區（173)第三導熱區 (2)冷凝器 （2A)第一鰭片組 (2C)第三鰭片組 （20)散熱片 (12)頂板 (140)注液管 (171)第一導熱區 (22)歧流道 (23)引流孔 (2B)第二鰭片組 (21)折板 (24)引流槽 (25)組裝孔 (26)散熱管(1) Evaporator (11) bottom plate (13) recessed space (14) liquid injection hole (15) (150) return hole (16) (160) air guide hole (172) second heat transfer area (173) third heat transfer area (2) condenser (2A) first fin set (2C) third fin set (20) heat sink (12) top plate (140) liquid injection pipe (171) first heat transfer zone (22) manifold flow path ( 23) Drainage hole (2B) Second fin set (21) Folding plate (24) Drainage groove (25) Assembly hole (26) Heat pipe