五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關一種電連接器，尤指一種利用平行設置之 金屬導線或金屬平板所提供串音補償電容值之電連接器 〇 C先前技術] [0002] 隨著主機板外頻速度的提昇以及可攜式消費電子產品寬 頻通訊的需求日增，帶動互連元件（如印刷電路板、連接 器及電纜線…等）朝向高密度及高傳輸量發展。此外，該 些互連元件除了扮演訊號連接的角色外，其本身所產生 的高頻效應更是無法被忽略。同時，因為有線傳輸介面 具有無線傳輸無法取代的高速傳輸特性，因此，這些高 頻效應也成為高速傳輸系統所需要克服的瓶頸之一。 [0003] 串音干擾（cross talk noise)起因於鄰近電線間的耦 合電容（coupling capacitance)。因此，當信號沿著 印刷電路板的佈線傳送時’會使鄰近線路產生信號，而 感應出串音干擾（cross talk noise)，此感應之串音 干擾對整個電路的影響不容小覷。 [0004] 美國專利US 5, 299, 956係揭露一種低串音干擾（i〇w cross talk)之電訊號傳送系統。請參閱第一圖，係為 該電訊號傳送系統之一電連接裝置之内部電路連接圖。 其中’該電訊號傳送系統係主要包含一電連接裝置 (electrical connection apparatus)，並且，該電 連接裝置係包含一電連接器10A與一電路板20A。該電連 表單編號A0101 第3頁/共27頁 接器10A係包含至少一第一導體71、一第二導體R1、—第 一 V體R2與一第四導體T2。其中，該第一導體τι與該第 二導體R1係組成一第一信號路徑對（f irst signalV. New Description: [New Technology Field] [0001] This creation relates to an electrical connector, especially an electrical connector that uses a cross-wired metal wire or a metal plate to provide a crosstalk compensation capacitor value. Technology] [0002] With the increase in the FSB speed of the motherboard and the increasing demand for broadband communication in portable consumer electronics, the interconnection components (such as printed circuit boards, connectors and cables, etc.) are oriented toward high density and High throughput development. In addition, in addition to the role of signal connections, these interconnected components have their own high-frequency effects that cannot be ignored. At the same time, because the wired transmission interface has high-speed transmission characteristics that cannot be replaced by wireless transmission, these high-frequency effects have become one of the bottlenecks that high-speed transmission systems need to overcome. [0003] Cross talk noise is caused by coupling capacitance between adjacent wires. Therefore, when the signal is transmitted along the wiring of the printed circuit board, the adjacent line generates a signal, and the cross talk noise is induced, and the influence of the induced crosstalk interference on the entire circuit cannot be underestimated. [0004] US Patent No. 5,299,956 discloses an electronic signal transmission system with low crosstalk. Please refer to the first figure, which is the internal circuit connection diagram of one of the electrical connection devices of the telecommunication transmission system. Wherein the electrical signal transmission system mainly comprises an electrical connection apparatus, and the electrical connection device comprises an electrical connector 10A and a circuit board 20A. The electrical connector form No. A0101, page 3 of 27, includes at least a first conductor 71, a second conductor R1, a first V body R2 and a fourth conductor T2. The first conductor τι and the second conductor R1 form a first signal path pair (f irst signal
Pair)(未標示），而且，該第三導體R2與該第四導體τ2 係組成一第二信號路徑對（second signal pair)(未 標示）。此外，該第一導體T1與該第二導體R1在該電連接 器10A中係大部分互為平行且鄰近，並且，該第三導體R2 與該第一導體Tl以及該第四導體·!^與該第二導體R1在該 電連接器10A中係部分互為平行且鄰近，故此，形成一第 一信號路徑組（first group of signal paths)(未標 示）。並且，在此電連接裝置之導體連接架構之下，只要 .有k號傳遞經過該第一信號路徑組，則會在該第一信號 路徑對與該第二信號路徑對之間產生感應串音。 [0005] 故此’在此專利中提出消除該些信號路徑對之間所產生 感應串音之解決方法：係透過將該第三導體“平行且鄰 近該第二導體R1，以及該第四導體T2平行且鄰近該第一 導體T1，而形成一第二信號路徑組（second group of signal paths)(未標示）》因此’當信號傳遞經過該 第一信號路徑組在該些信號路徑對之間所產生的感應串 音’並經過該第二信號路徑組之後，利用改變該些導體 R1〜T2之相對鄰近位置，以產生抵銷該些信號路徑對之間 產生感應串音之電容補償值》 惟’所揭露之該低串音干擾之電訊號傳送系統，雖可利 用改變該些導體之相對鄰近位置提供多種信號路徑對之 間產生感應串音之電容補償值，但只要該些導體之相對 表單編號A0101 第4頁/共27頁 [0006] M379261 鄰近位置確定後，當串音大小有所改變時，則就無法提 供完全消除信號路徑對之間所產生之感應串音。 [0007] 因此，如何設計出一種能改善習知缺失之具有串音補償 之電連接器，乃為本案創作人所欲行克服並加以解決的 一大課題。 【新型内容】 [0008] 有鑑於此，本創作係提供一種具有串音補償之電連接器 。為了達成上述目的，本創作係提供一種具有串音補償 之電連接器，該串音補償之電連接器係包含一基板、一 第一導體組、一第二導體組、一第一金屬導線、一第二 金屬導線。 [0009] 該第一導體組係至少具有四個導體，並裝設於該基板上 。其中，該四個導體分別為第一導體、第二導體、第三 導體及第四導體，並且，兩兩導體形成一導體對，即該 第一導體與該第二導體形成一第一導體對，該第三導體 與該第四導體形成一第二導體對。 [0010] 該第二導體組係至少具有四個導體，並裝設於該基板上 。其中，該四個導體分別為第一導體、第二導體、第三 導體及第四導體，並且，兩兩導體形成一導體對，即該 第一導體與該第二導體形成一第一導體對，該第三導體 與該第四導體形成一第二導體對。 [0011] 此外，該第二導體組之該第一導體對係與該第一導體組 之該第一導體對電性連接以形成一第一信號路徑對，並 且，該第二導體組之該第二導體對係與該第一導體組之 表單編號A0101 第5頁/共27頁 該第二導體對電性連接以形成一第二信號路徑對。 [0012] 該第一金屬導線係電性連接該第二導體組之該第二導體 。該第二金屬導線係電性連接該第二導體組之該第四導 體。 [0013] 藉以該第一金屬導線與該第二金屬導線相互平行設置於 該基板上，可得到補償電容值，以減弱甚至消除當信號 傳送經過該第一信號路徑對與該第二信號路徑對時，於 該兩信號路徑對之間所產生之感應串音。 [0014] 為了能更進一步瞭解本創作為達成預定目的所採取之技 術、手段及功效，請參閱以下有關本創作之詳細說明與 附圖，相信本創作之目的、特徵與特點，當可由此得一 深入且具體之瞭解，然而所附圖式僅提供參考與說明用 ，並非用來對本創作加以限制者。 【實施方式】 [0015] 有關本創作之技術内容及詳鈿說明，配合圖式說明如下 [0016] 請參見第二圖A、第二圖B與第二圖C，係分別為本創作一 具有串音補償之電連接器第一實施例之立體圖、電路連 接圖與電路連接示意圖。該串音補償之電連接器係包含 一基板10、一第一導體組G1、一第二導體組G2、一第一 金屬導線C1、一第二金屬導線C2。 [0017] 該基板10係為一印刷電路板。該第一導體組G1係至少具 有四個導體，並裝設於該基择10上。其中，該四個導體 分別為第一導體T11、第二導體R11、第三導體T12及第 表單編號A0101 第6頁/共27頁 M379261 四導體R12，並且，兩兩導體形成一導體對，即該第一導 體T11與該第二導體R11形成一第一導體對S11，該第三 導體T12與該第四導體R12形成一第二導體對S12。 [0018] 該第二導體組G2係至少具有四個導體，並裝設於該基板 10上。其中，該四個導體分別為第一導體T21、第二導體 R21、第三導體T22及第四導體R22，並且，兩兩導體形 成一導體對，即該第一導體T21與該第二導體R21形成一 第一導體對S21，該第三導體T22與該第四導體R22形成 一第二導體對S22。其中，該第二導體組G2之該第一導體 對S21係與該第一導體組G1之該第一導體對S11電性連接 以形成一第一信號路徑對L1，並且，該第二導體組G2之 該第二導體對S22係與該第一導體組G1之該第二導體對 S1 2電性連接以形成一第二信號路徑對L2。 [0019] 此外，該第一金屬導線C1係電性連接該第二導體組G2之 該第二導體R21。該第二金屬導線C2係電性連接該第二導 體組G2之該第四導體R22。其中該第一金屬導線C1與該第 二金屬導線C2皆可為直線結構。 [0020] 當信號分別在該第一信號路徑對L1與該第二信號路徑對 .L2傳送時，在該第一信號路徑對L1與該第二信號路徑對 L2之間會產生感應串音。並且，因為所產生之串音大小 值係由該第一信號路徑對L1與該第二信號路徑對L2之間 的耦合電容所決定。故此，在本創作第一實施例中，係 利用該第二導體組G2之該第二導體R21與該第四導體R22 分別與該第一金屬導線C1及該第二金屬導線C2電性連接 ，而形成該第一金屬導線C1與該第二金屬導線C2相互平 表單編號A0101 第7頁/共27頁 M379261 行設置於該基板10上，產生一電容值Crlr2以補償由該耦 合電容所造成之感應串音。並且，該第一金屬導線C1與 該第二金屬導線C2之規格係可利用平行板電容公式為依 據所設計。其中，該電容計算公式如下列第（1)式所表示 [0021] p厂.（1) c ——— a [0022] 其中，ε為介電係數，並且，介電係數f又為空氣介電係 數與相對介電係數ε之乘積，即ί*= e ，其中 cO cr f f 0 ’空氣介電係數4 = g激4X 10—l2(F/m)。 [0023] 以本實施例為例，該第二導體R21係電性連接該第一金屬 導線C1，而該第四導體R22係電性連接該第二金屬導線C2 。其中，該第一金屬導線C1與該第二金屬導線C2之規格（ 如長度、寬度、兩金屬導線之間距）係為相同。並且，介 質為空氣之相對介電係數為1。因此，若以此規格之數據 可計算出該補償電容值Crl r2。 [0024] 惟，在實際應用上，需考慮該第一金屬導線C1與該第二 金屬導線C2間可能有該基板10表面絕緣漆塗佈（亦即，兩 金屬導線之平行空間内並非只存在空氣），因此，導致實 際所計算出該補償電容值並非完全與上述電容計算公式 所得之結果相同。 [0025] 因此，補償因耦合電容所造成之感應串音之設計實務上 則為：當估測出該串音大小值所對應之耦合電容值後， 表單編號A0101 第8頁/共27頁 則可依據電容計算公式（第（1)式）與元件之實際使用情形 ，設計該第一金屬導線C1與該第二金屬導線C2之長度、 寬度與兩金屬導線Cl、C2之間距等等該些參數之數據， 以減弱甚至消除當信號傳送經過該第一信號路徑對L1與 該第二信號路徑對L2時，於該兩信號路徑對LI、L2之間 所產生之感應串音。 [0026] 此外，在本實施例中，該第二導體R21係亦可電性連接該 第二金屬導線C2，而該第四導體R22係亦可電性連接該第 一金屬導線C1，可得到等效之補償電容值Crlr2。由於僅 為電性連接關係之改變，故在此不再贅述。 [0027] 請參見第三圖A與第三圖B，係分別為該具有串音補償之 電連接器第二實施例之電路連接圖與電路連接示意圖。 該第一信號路徑對L1與該第二信號路徑對L2之間的耦合 電容亦可利用本實施例補償之。在該第二實施例中，係 利用該第二導體組G2之該第一導體T21與該第三導體T22 分別與該第一金屬導線C1及該第二金屬導線C2電性連接 ，而形成該第一金屬導線C1與該第二金屬導線C2相互平 行設置於該基板10上，產生一電容值Ctlt2以補償由該耦 合電容所造成之感應串音。同樣地，該第一金屬導線C1 與該第二金屬導線C2之規格（如長度、寬度、兩金屬導線 之間距）係為相同。並且，介質為空氣之相對介電係數為 1。因此，若以此規格之數據可計算出該補償電容值 Ctlt2 。 [0028] 因此，補償因耦合電容所造成之感應串音之設計實務上 則為：當估測出該串音大小值所對應之耦合電容值後， 表單編號A0101 第9頁/共27頁 M379261 則可依據電容計算公式（第（l)式）與元件之實際使用情形 ，設計該第一金屬導線C1與該第二金屬導線C2之長度、 寬度與兩金屬導線Cl、C2之間距等等該些參數之數據， 以減弱甚至消除當信號傳送經過該第一信號路徑對L1與 該第二信號路徑對L2時，於該兩信號路徑對LI、L2之間 所產生之感應串音。 [0029] 此外，在本實施例中，該第一導體T21係亦可電性連接該 第二金屬導線C2，而該第三導體T22係亦可電性連接該第 一金屬導線C1，可得到等效之補償電容值Ctlt2。由於僅 為電性連接關係之改變，故在此不再贅述。 [0030] 請參見第四圖A與第四圖B，係分別為該具有串音補償之 電連接器第三實施例之電路連接圖與電路連接示意圖。 本實施例與第一實施例皆利用該第二導體組G 2之該第二 導體R21與該第四導體R22分別與該第一金屬導線C1及該 第二金屬導線C2電性連接，而形成該第一金屬導線C1與 該第二金屬導線C2相互平行設置於該基板10上，產生一 電容值Crlr2以補償由該麵合電容所造成之感應串音。然 而，兩實施例最大的不同在於：在本實施例中，該第一 金屬導線C1與該第二金屬導線C2皆可撓成梳狀結構，並 將該兩金屬導線Cl、C2以交錯方式設置，用以產生較大 之面積。根據平行板電容公式（第（1)式）與元件之實際使 用情形，由於補償電容值係與面積成正比，因此，只需 要增加金屬導線之面積，即可得到較大的補償電容值。 [0031] 請參見第五圖A與第五圖B，係分別為該具有串音補償之 電連接器第四實施例之電路連接圖與電路連接示意圖。 表單編號A0101 第10頁/共27頁 M379261 本實施例與第二實施例皆利用該第二導體組G2之該第一 導體T21與該第三導體T22分別與該第一金屬導線C1及該 第二金屬導線C2電性連接，而形成該第一金屬導線C1與 該第二金屬導線C2相互平行設置於該基板10上，產生一 電容值Ctlt2以補償由該耦合電容所造成之感應串音。然 而，兩實施例最大的不同在於：在本實施例中，該第一 金屬導線C1與該第二金屬導線C2皆可撓成梳狀結構，並 將該兩金屬導線Cl、C2以交錯方式設置，用以產生較大 之面積。根據平行板電容公式（第（1)式）與元件之實際使 用情形，由於補償電容值係與面積成正比，因此，只需 要增加金屬導線之面積，即可得到較大的補償電容值。 [0032] 請參見第六圖A與第六圖B，係分別為該具有串音補償之 電連接器第五實施例之電路連接圖與電路連接示意圖。 在本實施例中，該具有串音補償之電連接器更包含一第 一金屬平板P1，係電性連接該第一導體組G1之該第一導 體T11 ;及一第二金屬平板P2，係電性連接該第一導體組 G1之該第三導體T1 2。亦即，在第一實施例中，除了該第 二導體組G2之該第二導體R21電性連接該第一金屬導線C1 ，而該第四導體R22係電性連接該第二金屬導線C2之外， 更包含該第一導體組G1之該第一導體T11電性連接該第一 金屬平板P1，而該第三導體T12電性連接該第二金屬平板 P2 ° [0033] 首先，僅就該第一導體組G1之該第一導體T11電性連接該 第一金屬平板P1，而該第三導體T12電性連接該第二金屬 平板P2為例說明（即不考慮該第二導體組G2之該第二導體 表單編號A0101 第11頁/共27頁 M379261 R21電性連接該第一金屬導線Cl，而該第四導體R22係電 性連接該第二金屬導線C2)。該兩金屬平板PI、P2之設計 ，同樣係根據前文内容所述之第（1)式與元件之實際使用 情形計算： [0034] 以本實施彳列為例，該第一金屬平板P1與該第二金屬平板 P2之規格（如面積、兩金屬平板之間距）係為相同。並且 ，介質為印刷電路板之相對介電係數。因此，若以此規 格之數據可計算出該補償電容值Ctlt2。 [0035] 因此，補償因耦合電容所造成之感應串音之設計實務上 則為：當估測出該串音大小值所對應之耦合電容值後， 則可依據電容計算公式（第（1)式）與元件之實際使用情形 ，設計該第一金屬平板P1與該第二金屬平板P2之長度、 寬度所構成之面積與兩金屬平板PI、P2之間距等等該些 參數之數據，以減弱甚至消除當信號傳送經過該第一信 號路徑對L1與該第二信號路徑對L2時，於該兩信號路徑 對L1、L 2之間所產生之感應串音。 [0036] 更進一步，若再考慮該第二導體組G2之該第二導體R21電 性連接該第一金屬導線C1，而該第四導體R22係電性連接 該第二金屬導線C2之補償電容值，則可設計該第一金屬 導線C1、該第二金屬導線C2、該第一金屬平板P1與該第 二金屬平板P2之長度、寬度與兩金屬平板PI、P2之間距 等等該些參數之數據，以減弱甚至消除當信號傳送經過 該第一信號路徑對L1與該第二信號路徑對L2時，於該兩 信號路徑對LI、L2之間所產生之感應串音。若該第一金 屬導線C1與該第二金屬導線C2所產生之補償電容值為 表單編號A0101 第12頁/共27頁 M379261Pair) (not shown), and the third conductor R2 and the fourth conductor τ2 form a second signal pair (not shown). In addition, the first conductor T1 and the second conductor R1 are mostly parallel and adjacent to each other in the electrical connector 10A, and the third conductor R2 and the first conductor T1 and the fourth conductor are included. The second conductor R1 is parallel and adjacent to each other in the electrical connector 10A, and thus forms a first group of signal paths (not labeled). Moreover, under the conductor connection structure of the electrical connection device, as long as the k number is transmitted through the first signal path group, an induced crosstalk is generated between the first signal path pair and the second signal path pair. . [0005] Therefore, in this patent, a solution for eliminating the induced crosstalk between the pair of signal paths is proposed by "singing the third conductor "parallel and adjacent to the second conductor R1, and the fourth conductor T2" Parallel and adjacent to the first conductor T1 to form a second group of signal paths (not labeled), thus 'when a signal passes through the first signal path group between the pair of signal paths After the generated inductive crosstalk ' passes through the second signal path group, the relative proximity positions of the conductors R1 T T2 are changed to generate a capacitance compensation value that cancels the induced crosstalk between the pair of signal paths. The disclosed low crosstalk interference electrical signal transmission system may provide a capacitance compensation value for inductive crosstalk between a plurality of signal path pairs by changing the relative proximity of the conductors, but as long as the relative forms of the conductors are No. A0101 Page 4 of 27 [0006] When the proximity of the M379261 is determined, when the crosstalk size is changed, it is impossible to provide a complete elimination of the signal path between the pairs. Inductive crosstalk. [0007] Therefore, how to design an electrical connector with crosstalk compensation that can improve the conventional knowledge is a major problem that the creators of this case want to overcome and solve. [New content] [ 0008] In view of this, the present invention provides an electrical connector with crosstalk compensation. To achieve the above object, the present invention provides an electrical connector with crosstalk compensation, the crosstalk compensation electrical connector includes a a substrate, a first conductor set, a second conductor set, a first metal wire, and a second metal wire. [0009] The first conductor set has at least four conductors and is mounted on the substrate. The four conductors are respectively a first conductor, a second conductor, a third conductor and a fourth conductor, and the two conductors form a conductor pair, that is, the first conductor forms a first conductor pair with the second conductor. The third conductor and the fourth conductor form a second conductor pair. [0010] The second conductor group has at least four conductors and is mounted on the substrate, wherein the four conductors are respectively the first conductor First a conductor, a third conductor and a fourth conductor, and the two conductors form a pair of conductors, that is, the first conductor forms a first conductor pair with the second conductor, and the third conductor forms a second with the fourth conductor [0011] In addition, the first conductor pair of the second conductor set is electrically connected to the first conductor pair of the first conductor set to form a first signal path pair, and the second conductor The second conductor pair of the group is electrically connected to the second conductor pair of Form No. A0101 of the first conductor group to form a second signal path pair. [0012] The first metal wire The second conductor is electrically connected to the second conductor of the second conductor set. The second metal conductor is electrically connected to the fourth conductor of the second conductor set. [0013] The first metal wire and the second metal wire are disposed on the substrate in parallel with each other, and a compensation capacitance value can be obtained to reduce or even eliminate the signal transmission through the first signal path pair and the second signal path pair. The induced crosstalk between the two signal path pairs. [0014] In order to further understand the techniques, means and effects of this creation in order to achieve the intended purpose, please refer to the following detailed description and drawings of the creation, and believe that the purpose, characteristics and characteristics of the creation can be obtained from The in-depth and specific understanding of the present invention is provided by way of illustration and description. [Embodiment] [0015] The technical content and detailed description of the present invention are described below with reference to the following figures [0016] Please refer to the second figure A, the second figure B and the second figure C, respectively A perspective view of a first embodiment of a crosstalk compensation electrical connector, a circuit connection diagram and a circuit connection diagram. The crosstalk compensating electrical connector comprises a substrate 10, a first conductor set G1, a second conductor set G2, a first metal conductor C1, and a second metal conductor C2. [0017] The substrate 10 is a printed circuit board. The first conductor group G1 has at least four conductors and is mounted on the substrate 10. Wherein, the four conductors are a first conductor T11, a second conductor R11, a third conductor T12, and a form number A0101, a sixth conductor, and a second conductor R12, and the two conductors form a conductor pair, that is, The first conductor T11 and the second conductor R11 form a first conductor pair S11, and the third conductor T12 and the fourth conductor R12 form a second conductor pair S12. [0018] The second conductor group G2 has at least four conductors and is mounted on the substrate 10. The four conductors are a first conductor T21, a second conductor R21, a third conductor T22, and a fourth conductor R22, respectively, and the two conductors form a conductor pair, that is, the first conductor T21 and the second conductor R21 A first conductor pair S21 is formed, and the third conductor T22 and the fourth conductor R22 form a second conductor pair S22. The first conductor pair S21 of the second conductor group G2 is electrically connected to the first conductor pair S11 of the first conductor group G1 to form a first signal path pair L1, and the second conductor group The second conductor pair S22 of G2 is electrically connected to the second conductor pair S1 2 of the first conductor group G1 to form a second signal path pair L2. [0019] In addition, the first metal wire C1 is electrically connected to the second conductor R21 of the second conductor group G2. The second metal wire C2 is electrically connected to the fourth conductor R22 of the second conductor group G2. The first metal wire C1 and the second metal wire C2 may each have a linear structure. [0020] When the signals are respectively transmitted between the first signal path pair L1 and the second signal path pair .L2, an induced crosstalk is generated between the first signal path pair L1 and the second signal path pair L2. Also, since the generated crosstalk magnitude is determined by the coupling capacitance between the first signal path pair L1 and the second signal path pair L2. Therefore, in the first embodiment of the present invention, the second conductor R21 and the fourth conductor R22 of the second conductor group G2 are electrically connected to the first metal wire C1 and the second metal wire C2, respectively. The first metal wire C1 and the second metal wire C2 are formed to be flush with each other. Form No. A0101, page 7 / 27 pages of M379261 are disposed on the substrate 10 to generate a capacitance value Crrr2 to compensate for the coupling capacitor. Inductive crosstalk. Moreover, the specifications of the first metal wire C1 and the second metal wire C2 can be designed based on the parallel plate capacitance formula. Wherein, the capacitance calculation formula is expressed by the following formula (1) [0021] p factory. (1) c ——— a [0022] wherein ε is a dielectric coefficient, and the dielectric constant f is air The product of the electric coefficient and the relative dielectric coefficient ε, that is, ί*= e , where cO cr ff 0 'the air dielectric coefficient 4 = g is 4X 10−l2 (F/m). [0023] In the embodiment, the second conductor R21 is electrically connected to the first metal wire C1, and the fourth conductor R22 is electrically connected to the second metal wire C2. The specifications of the first metal wire C1 and the second metal wire C2 (such as the length, the width, and the distance between the two metal wires) are the same. Also, the medium has a relative dielectric constant of 1 for air. Therefore, if the data of this specification can be used, the compensation capacitance value Crl r2 can be calculated. [0024] However, in practical applications, it is considered that there may be coating the surface of the substrate 10 between the first metal wire C1 and the second metal wire C2 (that is, the parallel space between the two metal wires does not exist only). Air), therefore, the actual calculation of the compensation capacitance value is not exactly the same as the result of the above capacitance calculation formula. [0025] Therefore, the design of the sense crosstalk caused by the coupling capacitance is actually: when the coupling capacitance value corresponding to the crosstalk size value is estimated, the form number A0101 is 8 pages/total 27 pages. The length and width of the first metal wire C1 and the second metal wire C2 and the distance between the two metal wires C1 and C2 may be designed according to the capacitance calculation formula (the formula (1)) and the actual use of the component. The data of the parameter is used to attenuate or even eliminate the induced crosstalk generated between the two signal path pairs LI, L2 when the signal is transmitted through the first signal path pair L1 and the second signal path pair L2. In addition, in the embodiment, the second conductor R21 can be electrically connected to the second metal wire C2, and the fourth conductor R22 can also be electrically connected to the first metal wire C1. The equivalent compensation capacitor value Crlr2. Since it is only a change in the electrical connection relationship, it will not be described here. [0027] Please refer to FIG. 3A and FIG. BB respectively, which are circuit connection diagrams and circuit connections of the second embodiment of the electrical connector with crosstalk compensation, respectively. The coupling capacitance between the first signal path pair L1 and the second signal path pair L2 can also be compensated by the present embodiment. In the second embodiment, the first conductor T21 and the third conductor T22 of the second conductor group G2 are electrically connected to the first metal wire C1 and the second metal wire C2, respectively, to form the The first metal wire C1 and the second metal wire C2 are disposed on the substrate 10 in parallel with each other to generate a capacitance value Ctlt2 to compensate for the induced crosstalk caused by the coupling capacitance. Similarly, the specifications of the first metal wire C1 and the second metal wire C2 (such as the length, the width, and the distance between the two metal wires) are the same. Also, the medium has a relative dielectric constant of 1 for air. Therefore, if the data of this specification can be used, the compensation capacitance value Ctlt2 can be calculated. [0028] Therefore, the design of the sensed crosstalk caused by the coupling capacitance is actually: when the coupling capacitance value corresponding to the crosstalk size value is estimated, the form number A0101 is 9 pages/27 pages M379261 The length and width of the first metal wire C1 and the second metal wire C2 and the distance between the two metal wires C1 and C2, etc. may be designed according to the capacitance calculation formula (Formula (1)) and the actual use of the component. The data of the parameters to attenuate or even eliminate the induced crosstalk generated between the two signal path pairs LI, L2 when the signal is transmitted through the first signal path pair L1 and the second signal path pair L2. [0029] In this embodiment, the first conductor T21 can also be electrically connected to the second metal wire C2, and the third conductor T22 can also be electrically connected to the first metal wire C1. The equivalent compensation capacitance value Ctlt2. Since it is only a change in the electrical connection relationship, it will not be described here. [0030] Please refer to FIG. 4A and FIG. BB respectively, which are circuit connection diagrams and circuit connections of the third embodiment of the electrical connector with crosstalk compensation, respectively. In this embodiment and the first embodiment, the second conductor R21 and the fourth conductor R22 of the second conductor group G2 are electrically connected to the first metal wire C1 and the second metal wire C2, respectively. The first metal wire C1 and the second metal wire C2 are disposed on the substrate 10 in parallel with each other to generate a capacitance value Crrl2 to compensate for the induced crosstalk caused by the surface capacitance. However, the biggest difference between the two embodiments is that in the embodiment, the first metal wire C1 and the second metal wire C2 can be flexed into a comb structure, and the two metal wires C1 and C2 are arranged in an interlaced manner. Used to create a larger area. According to the parallel plate capacitance formula (Equation (1)) and the actual use of the component, since the compensation capacitance value is proportional to the area, it is only necessary to increase the area of the metal wire to obtain a larger compensation capacitance value. [0031] Referring to FIG. 5A and FIG. 5B, respectively, a circuit connection diagram and a circuit connection diagram of the fourth embodiment of the electrical connector with crosstalk compensation are shown. Form No. A0101 Page 10 of 27 M379261 This embodiment and the second embodiment utilize the first conductor T21 and the third conductor T22 of the second conductor group G2 and the first metal wire C1 and the first The two metal wires C2 are electrically connected, and the first metal wire C1 and the second metal wire C2 are formed in parallel with each other on the substrate 10 to generate a capacitance value Ctlt2 to compensate for the induced crosstalk caused by the coupling capacitance. However, the biggest difference between the two embodiments is that in the embodiment, the first metal wire C1 and the second metal wire C2 can be flexed into a comb structure, and the two metal wires C1 and C2 are arranged in an interlaced manner. Used to create a larger area. According to the parallel plate capacitance formula (Equation (1)) and the actual use of the component, since the compensation capacitance value is proportional to the area, it is only necessary to increase the area of the metal wire to obtain a larger compensation capacitance value. [0032] Please refer to FIG. 6A and FIG. BB respectively, which are circuit connection diagrams and circuit connections of the fifth embodiment of the electrical connector with crosstalk compensation, respectively. In this embodiment, the electrical connector with crosstalk compensation further includes a first metal plate P1 electrically connected to the first conductor T11 of the first conductor group G1 and a second metal plate P2. The third conductor T1 2 of the first conductor group G1 is electrically connected. That is, in the first embodiment, the second conductor R21 of the second conductor group G2 is electrically connected to the first metal wire C1, and the fourth conductor R22 is electrically connected to the second metal wire C2. The first conductor T11 further including the first conductor group G1 is electrically connected to the first metal plate P1, and the third conductor T12 is electrically connected to the second metal plate P2. [0033] First, only The first conductor T11 of the first conductor group G1 is electrically connected to the first metal plate P1, and the third conductor T12 is electrically connected to the second metal plate P2 as an example (ie, the second conductor group G2 is not considered). The second conductor form number A0101 page 11 / 27 pages M379261 R21 is electrically connected to the first metal wire C1, and the fourth conductor R22 is electrically connected to the second metal wire C2). The design of the two metal plates PI and P2 is also calculated according to the first use of the above formula (1) and the actual use of the components: [0034] Taking the present embodiment as an example, the first metal plate P1 and the The specifications of the second metal plate P2 (such as the area and the distance between the two metal plates) are the same. Also, the medium is the relative dielectric constant of the printed circuit board. Therefore, the compensation capacitance value Ctlt2 can be calculated from the data of this specification. [0035] Therefore, the design of the induced crosstalk caused by the coupling capacitance is actually: when the coupling capacitance value corresponding to the crosstalk size value is estimated, the capacitance calculation formula can be used (FIG. (1) And the actual use of the component, design the data of the length and width of the first metal plate P1 and the second metal plate P2 and the distance between the two metal plates PI, P2, etc., to weaken Even the induced crosstalk generated between the two signal path pairs L1, L2 when the signal is transmitted through the first signal path pair L1 and the second signal path pair L2 is eliminated. [0036] Further, if the second conductor R21 of the second conductor group G2 is electrically connected to the first metal wire C1, the fourth conductor R22 is electrically connected to the compensation capacitor of the second metal wire C2. The value of the first metal wire C1, the second metal wire C2, the length and width of the first metal plate P1 and the second metal plate P2, and the distance between the two metal plates PI and P2, etc. The data is used to attenuate or even eliminate the induced crosstalk generated between the two signal path pairs LI, L2 as the signal is transmitted through the first signal path pair L1 and the second signal path pair L2. The compensation capacitance value generated by the first metal wire C1 and the second metal wire C2 is Form No. A0101 Page 12 of 27 M379261
Crlr2，而該第一金屬平板P1與該第二金屬平板P2所產 生之補償電容值為Ctlt2。故此，當該第一導體組G1之該 些金屬導線Cl、C2與該第二導體組G2之該些金屬平板P1 、P2同時進行補償，則可得到整體之補償電容值Ct等於 Crlr2 與 Ctlt2相加。 [0037] 此外，在本實施例中，該第一導體T11係亦可電性連接該 第二金屬平板P2，而該第三導體T12係亦可電性連接該第 一金屬平板P1，可得到等效之補償電容值Ctlt2。由於僅 為電性連接關係之改變，故在此不再贅述。 [0038] 上述該些實施例說明本創作之具有串音補償之電連接器 係可透過單側之金屬導線或金屬平板進行電容補償，或 雙側之金屬導線與金屬平板同時進行電容補償，以減弱 甚至消除當信號傳送經過該第一信號路徑對L1與該第二 信號路徑對L2時，於該兩信號路徑對LI、L2之間所產生 之感應串音。 [0039] 請參見第七圖，係第一實施例（具有電容補償）之串音值 測試與無電容補償之串音值測試比較曲線圖。如圖所示 ，圖中横座標為頻率（單位為MHz)，縱座標為串音功率值 .(單位為dB)，並且，圖中具有二條曲線，其中一條（以虛 線表示）為該第一信號路徑對L1與該第二信號路徑對L2間 無該些金屬導線Cl、C2補償之串音功率值（即補償前）， 另一條（以實線表示）則為該第一信號路徑對L1與該第二 信號路徑對L2間有該些金屬導線Cl、C2補償之串音功率 值（即補償後）。其中，測試數據係為該些金屬導線C1、 C2之長度約為8mm、寬度為0. 254mm、兩金屬導線C1、 表單編號A0101 第13頁/共27頁 M379261 C2之間距為0. 254mm。如圖可看出，在頻率1ΜΗζ~ 500MHz之間，增加該些金屬導線Cl、C2間之補償電容值 ，可減少約5dB左右串音值。特別在50MHz至350MHz之頻 率區間，串音值減少的程度尤為明顯。 [0040] 综上所述，本創作之主要優點係如下：根據所估測之需 要補償串音值大小，可彈性地設計該些金屬導線Cl、C2 或該些金屬平板PI、P2之規格（包含長度、寬度）或調整 該些金屬導線Cl、C2或該些金屬平板PI、P2之佈線間距 ，以減弱甚圭消除當信號傳送經過該第一信號路徑對P1 與該第二信號路徑對P1時，於該兩信號路徑對PI、P2之 間所產生之感應串音。 [0041] 惟，以上所述，僅為本創作較佳具體實施例之詳細說明 與圖式，惟本創作之特徵並不侷限於此，並非用以限制 本創作，本創作之所有範圍應以下述之申請專利範圍為 準，凡合於本創作申請專利範圍之精神與其類似變化之 實施例，皆應包含於本創作之範疇中，任何熟悉該項技 藝者在本創作之領域内，$輕易思及之變化或修飾皆可 涵蓋在以下本案之專利範圍。 【圖式簡單說明】 [0042] 第一圖係習知一電連接裝置之内部電路連接圖； [0043] 第二圖A係本創作一具有串音補償之電連接器第一實施例 之立體圖； [0044] 第二圖B係該具有串音補償之電連接器第一實施例之電路 連接圖， 表單編號A0101 第14頁/共27頁 M379261 [0045] 第二圖C係該具有串音補償之電連接器第一實施例之電路 連接不意圖， [0046] 第三圖A該具有_音補償之電連接器第二實施例之電路連 接圖， [0047] 第三圖B係該具有串音補償之電連接器第二實施例之電路 連接不意圖， [0048] 第四圖A係該具有串音補償之電連接器第三實施例之電路 連接圖； [0049] 第四圖B係該具有串音補償之電連接器第三實施例之電路 連接示意圖； [0050] 第五圖A係該具有串音補償之電連接器第四實施例之電路 連接圖； [0051] 第五圖B係該具有串音補償之電連接器第四實施例之電路 連接示意圖； [0052] 第六圖A係該該具有串音補償之電連接器第五實施例之電 路連接圖； [0053] 第六圖B係該具有串音補償之電連接器第五實施例之電路 連接示意圖；及 [0054] 第七圖係第一實施例（具有電容補償）之串音值測試與無 電容補償之串音值測試比較曲線圖。 【主要元件符號說明】 [0055] 〔習知技術〕 表單編號A0101 第15頁/共27頁 M379261 [0056] 10A 電連接器 [0057] 20A 電路板 [0058] T1 第一導體 [0059] R1 第二導體 [0060] R2 第三導體 [0061] T2 第四導體 [0062] 〔本創作〕 [0063] 10 基板 [0064] G1 第一導體組 [0065] T11 第一導體 [0066] R11 第二導體 [0067] T12 第三導體 [0068] R12 第四導體 [0069] S11 第一導體對 [0070] S12 第二導體對 [0071] S21 第一導體對 [0072] S22 第二導體對 [0073] L1 第一信號路徑對 [0074] L2 第二信號路徑對 表單編號A0101 第16頁/共27頁 M379261 [0075] G2 第二導體組 [0076] T21 第一導體 [0077] R21 第二導體 [0078] T22 第三導體 [0079] R22 第四導體 [0080] C1 第一金屬導線 [0081] C2 第二金屬導線 [0082] P1 第一金屬平板 [0083] P2 第二金屬平板Crlr2, and the compensation capacitance value generated by the first metal flat plate P1 and the second metal flat plate P2 is Ctlt2. Therefore, when the metal wires C1 and C2 of the first conductor group G1 and the metal plates P1 and P2 of the second conductor group G2 are simultaneously compensated, the overall compensation capacitance value Ct is equal to Crlr2 and Ctlt2. plus. [0037] In addition, in the embodiment, the first conductor T11 can also be electrically connected to the second metal plate P2, and the third conductor T12 can also be electrically connected to the first metal plate P1. The equivalent compensation capacitance value Ctlt2. Since it is only a change in the electrical connection relationship, it will not be described here. [0038] The embodiments described above illustrate that the electrical connector with crosstalk compensation of the present invention can perform capacitance compensation through a single-sided metal wire or a metal plate, or both sides of the metal wire and the metal plate simultaneously perform capacitance compensation. The induced crosstalk generated between the two signal path pairs LI, L2 when the signal is transmitted through the first signal path pair L1 and the second signal path pair L2 is weakened or even eliminated. [0039] Referring to the seventh figure, a comparison diagram of the crosstalk value test of the first embodiment (with capacitance compensation) and the crosstalk value test without capacitance compensation is shown. As shown in the figure, the abscissa is the frequency (in MHz), the ordinate is the crosstalk power value (in dB), and there are two curves in the figure, one of which (indicated by the dotted line) is the first The crosstalk power value (ie, before compensation) compensated by the signal path pair L1 and the second signal path pair L2 without the metal wires C1 and C2, and the other (indicated by the solid line) is the first signal path pair L1 And the crosstalk power value (ie, after compensation) compensated by the metal wires C1 and C2 between the second signal path pair L2. Wherein, the test data is that the length of the metal wires C1, C2 is about 8 mm, the width is 0. 254 mm, the two metal wires C1, the form number A0101, the 13th page, the total of 27 pages, the distance between the M379261 C2 is 0. 254mm. As can be seen, increasing the compensation capacitance between the metal wires C1 and C2 between 1 ΜΗζ and 500 MHz reduces the crosstalk value of about 5 dB. Especially in the frequency range of 50MHz to 350MHz, the degree of crosstalk reduction is particularly significant. [0040] In summary, the main advantages of the present invention are as follows: according to the estimated need to compensate for the crosstalk value, the metal wires Cl, C2 or the specifications of the metal plates PI, P2 can be flexibly designed ( Include length, width) or adjust the wiring pitch of the metal wires C1, C2 or the metal plates PI, P2 to weaken the signal when the signal is transmitted through the first signal path pair P1 and the second signal path pair P1 At the same time, the induced crosstalk generated between the two signal paths between PI and P2. [0041] However, the above description is only for the detailed description and drawings of the preferred embodiments of the present invention, but the features of the present invention are not limited thereto, and are not intended to limit the creation, and all the scope of the creation should be as follows. The scope of the patent application is subject to change. The embodiments of the spirit of the patent application and the similar changes to the scope of this creation should be included in the scope of this creation. Anyone familiar with the artist in the field of this creation, Any changes or modifications considered may be covered by the patents in this case below. BRIEF DESCRIPTION OF THE DRAWINGS [0042] The first figure is an internal circuit connection diagram of a conventional electrical connection device; [0043] FIG. 2A is a perspective view of a first embodiment of an electrical connector with crosstalk compensation [0044] FIG. 2B is a circuit connection diagram of the first embodiment of the electrical connector with crosstalk compensation, Form No. A0101, page 14/27, M379261 [0045] The second figure C is the crosstalk The circuit connection of the first embodiment of the compensating electrical connector is not intended, [0046] FIG. 3A is a circuit connection diagram of the second embodiment of the electrical connector with _ tone compensation, [0047] FIG. The circuit connection of the second embodiment of the crosstalk compensation electrical connector is not intended, [0048] FIG. 4A is a circuit connection diagram of the third embodiment of the electrical connector with crosstalk compensation; [0049] The circuit connection diagram of the third embodiment of the electrical connector with crosstalk compensation; [0050] FIG. 5 is a circuit connection diagram of the fourth embodiment of the electrical connector with crosstalk compensation; [0051] Figure B is a circuit connection diagram of the fourth embodiment of the electrical connector with crosstalk compensation [0052] FIG. 6 is a circuit connection diagram of the fifth embodiment of the electrical connector with crosstalk compensation; [0053] FIG. 6B is a fifth embodiment of the electrical connector with crosstalk compensation The circuit connection diagram; and [0054] The seventh diagram is a comparison graph of the crosstalk value test of the first embodiment (with capacitance compensation) and the crosstalk value test without capacitance compensation. [Explanation of main component symbols] [0055] [Prior Art] Form No. A0101 Page 15 of 27 M379261 [0056] 10A Electrical Connector [0057] 20A Circuit Board [0058] T1 First Conductor [0059] R1 Two conductor [0060] R2 third conductor [0061] T2 fourth conductor [0062] [this creation] [0063] 10 substrate [0064] G1 first conductor set [0065] T11 first conductor [0066] R11 second conductor T12 third conductor [0068] R12 fourth conductor [0069] S11 first conductor pair [0070] S12 second conductor pair [0071] S21 first conductor pair [0072] S22 second conductor pair [0073] L1 First signal path pair [0074] L2 Second signal path pair form number A0101 Page 16 / Total 27 pages M379261 [0075] G2 Second conductor set [0076] T21 First conductor [0077] R21 Second conductor [0078] T22 third conductor [0079] R22 fourth conductor [0080] C1 first metal wire [0081] C2 second metal wire [0082] P1 first metal plate [0083] P2 second metal plate
表單編號A0101 第17頁/共27頁Form No. A0101 Page 17 of 27