M369456 五、新型說明： 【新型所屬之技術領域】 本創作係提供一種探針卡之技術領域，尤指其技術上提 供一種模組化的探針卡裝置，使其克服大面積製作不易問 題，並在損壞時只需局部更換即可。 【先前技術】 按’目前半導體技術發展趨勢是發展300mm(12吋）製 程技術，縮小線寬使得每片晶圓（wa f e Γ)可容納更多晶片 (chip) ’如此將可有效降低製造成本、提高生產率。因此， 大面積探針卡技術需求相當迫切。 傳統大面積針測（probing for large area)用之探針 卡技術’如台灣新型專利M31 1030，以空間轉換裝置（space trans f ormer )上之微探針（又稱為微探針基板）連接待測之 晶片（Dut，Die under testing)及測試機台，空間轉換裝 置為多層線路基板（Mul ti-layer wiring board)，其具有 將線路間距（p i tch )放大的功能，一般空間轉換裝置可為多 層陶究基板（如 LTCC/low temperature cofired ceramics or HTCC/high temperature cofired ceramics)、多層線 路基板（如 PCB or multi - layer organics substrate)或内 含線路之矽基板或陶瓷基板等。另本專利特別是應用在多 層陶瓷基板、内含線路之矽基板及陶瓷基板。 惟，這類探針卡在發展大面積針測技術時，如多層陶 M369456 竟基板报難製作qnilm . 表作300mm大且製作成本高，另3〇〇mm大之基 板上製作探針(probes)很難維持高良率。 θ 叶對上述I知結構所存在之問題點，如何開發 一種更具理想實用性之創新結構’實消費者所殷切企盼， 亦係相關業者須努力研發突破之目標及方向。 有银於此，創作人本於多年從事相關產品之製造開發 又计、對上述之目標’詳加設計與審慎評估後， 終得一確具實用性之本創作。 【新型内容】 欲解決之技術問題點：習知大面積針測（probing for large area)用之探針卡技術，以空間轉換裝置（space transformer)連接測試機台及待測之晶片（])ut，Die under testing)，一般空間轉換裝置為多層陶瓷基板 (Multi-layer ceramics substarate)其上有多·數探針 (probes)用以針測裸晶。但是這類探針卡在發展大面積針 測技術時，因多層陶瓷基板很難製作300mm大且製作成本 高’另300mm大之基板上製作探針（probes)很難維持高良 率。 解決問題之技術特點：提供一種模組化的探針卡裝 置’其以小面積、模組化微探針基板（module probe substrate with small area)組立成大面積微探針基板， 如此將可克服大面積基板製作困難問題、有效降低成本； M369456 又因模組化設計，可提高探針生產良率，且當探針卡使用 過程中發生局部損壞時僅需更換所屬區域之單元，無須整 組汰換。可以節省整組汰換之成本浪費。 對照先前技術之功效：先前技術之探針卡在發展大面 積針測技術時，因多層基板很難製作繼随大且製作成本 门另3〇〇m>n大之基板上製作探針（Probes)很難維持高良 率。局部損壞時也要整組汰換。而本創作以小面積、模組 化微探針基板組立成大面積微探針基板，如此將可克服大 面積基板製作困難問題、有效降低成本；又因模組化設計， 可提高探針生產良率，且當探針卡使用過程中發生局部損 壞時僅需更換所屬區域之單元，無須整組汰換。可以節省 整組汰換之成本浪費。 有關本創作所採用之技術、手段及其功效，茲舉一較 佳實施例並配合圖式詳細說明於后，相信本創作上述之目 的、構造及特徵，當可由之得一深入而具體的瞭解。 【實施方式】 參閱第一圖所示’本創作係提供一種模組化的探針卡 裝置。該模組化的探針卡裝置，包含有： 數模組化微探針基板11，該數模組化微探針基板丨i包 含有數基板111，該基板111可為多層陶瓷基板 (Multi-layer ceramics)、内含線路之矽基板或陶瓷基板， 該基板111正面佈植數個微探針112,且微探針112之位置 5 M369456 ”待測裸曰曰之測試墊（testing pads)18互相對應，並經由 基板111線路放大功能將其背面之電氣接點與印刷電路板 15電氣接點互相對應，該基板丨i丨提供線路放大、良好的 平坦度及剛性； 一印刷電路板（PCB) 15，該印刷電路板丨5設有數電氣 接點與该基板111背面之電氣接點互相對應； 一電氣連接裝置20,該電氣連接裝置2〇連接基板lu 與印刷電路板15間； 數調整機構，該每組模組化微探針基板u皆搭配一組 調整機構，如該調整機構得為差動螺絲1 7，即模組化微探 針基板11背面設複數個差動螺絲17，可藉由調動該差動螺 絲17得個別調整每一模組化微探針基板n，使該探針卡i 與一測試機台可維持良好的共平面度（c〇—planari ty); 一固定裝置，該固定裝置包括一上固定座14及一下固 定座16，因該印刷電路板15是FR_4材料，基本上是有一 定的翹曲度，本創作設計有上固定座14及下固定座16，該 上固定座14及該下固定座16將該印刷電路板15夾於其 間，並將該印刷電路板15調整出較佳的平坦度，再經由電 亂連接裝置20上之彈性針（pog〇 pins) 13補償該印刷電路 板15不佳的平坦度，並將該基板ηι上的電子訊號連接至 該印刷電路板15上。 參閱第二圖所示’係本創作之另一實施例，該電氣連 M369456 接裝置20 (如第一圖所示）亦可配合該模組化微探針基板 11而設成為一模組化之電氣連接裝置2〇A,以降低該電氣 連接裝置20製作的困難。 參閱第二圖所示，係本創作之又一實施例，將電氣連 接裝置20B之彈性針固定座21製作成兩端開口大小不同的 複數通孔211，通孔211兩端分別為大開口 21丨丨及小開口 2112，再將兩端大小不同具大端222及小端221的彈性針 22由小開口 2112置入通孔211中，此設計可使得在組裝前 整個電氣連接裝置20B不易散落。由於印刷電路板15 (如 第一圖所示）的電氣接點尺寸較大，因此將彈性針22針頭 較大的大端222與印刷電路板15電氣接點連接，針頭較小 的小端221與模組化微探針基板丨丨電氣接點連接；藉由連 接過程中彈性針22的變形可以印刷電路板（pcB)15與模組 化微探針基板11之間因平行度與平坦度差異，使得印刷電 -路板（PCB)15與模組化微探針基板u相對連接的電氣接點 •都可以有良好的電氣連接。 本創作之該電氣連接裝置20B亦可改用模組化設計以 降低製作困難。 參閱第四圖所示，係本創作之再一實施例。該電氣連 接裝置20C係包含有，利用本身已具有弧度的數彈性針23， 將其組裝在兩片固定板之間，兩片固定板分別為第一固定 板24與第二固定板25，使其容易固定具有弧度的彈性針 M369456 23 ’並且方便組裝在該印刷電路板15 (如第一圖所示）與 該模組化微探針基板11之間。因此可利用這種彈性針23 來克服印刷電路板15與模組化微探針基板u之間平坦度 的差異，使得印刷電路板15與模組化微探針基板u相對 連接的電氣接點都可以有良好的電氣連接。 本創作之該電氣連接裝置20C亦可改用模組化設計以 降低製作困難。 參閱第五圖所示，係本創作之又再一實施例。該電氣 連接裝置20D係包含有’在該印刷電路板15上先黏一導電 膠26 ’其上有複數個電氣連接凸點ι51，另在該模組化微 探針基板11上有與該印刷電路板1 5對應之複數個電氣連 接凸點113，將兩者對位、施加特定壓力使得所有電氣連接 凸點151、113全部都獲得良好的電氣連接。且因這類導電 膠26具有軸向可電氣導通、側向絕緣的優點，如異方性導 電膠，另這導電膠26具有彈性，仍可補償印刷電路板15 與模組化微探針基板11之間平坦度的差異。另印刷電路板 1 5及模組化微探針基板11上之電氣連接凸點丨5丨、丨丨3可 為錫鉛凸塊（solder bumps)或金凸塊（golden bumps)。 本創作之該電氣連接裝置2〇D亦可改用模組化設計以 降低製作困難。 則文係針對本創作之較佳實施例為本創作之技術特徵 進行具體之說明，惟，熟悉此項技術之人士當可在不脫離 M369456 本創作之精神與㈣τ對本創作進行變更與修改，而該等 變更與修改，皆應涵蓋於如下巾請專利範圍所界定之料 【圖式簡單說明】 第-圖··係本創作之其一實施例平面示意圖。 第二圖：係本創#之另一實施例平面示意圖。 第三圖：係本創#之又一實施例平面示意圖。 第四圖：係本創作之再一實施例平面示意圖。 第五圖：係本創作之又再一實施例平面示意圖。 【主要元件符號說明】 1探針卡 111基板 113電氣連接凸點 14上固定座 151電氣連接凸點 • 17差動螺絲 20電氣連接裝置 20Β電氣連接裝置 20D電氣連接裝置 211通孔 2112小開口 2 21小端 11模組化微探針基板 112微探針 13彈性針 15印刷電路板 16下固定座 18測試墊 20Α模組化之電氣連接裝置 20C電氣連接裝置 21彈性針固定座 2111大開口 22彈性針 222大端 M369456 定板 23彈性針 24第一固 25第二固定板 26導電膠M369456 V. New Description: [New Technology Field] This creation provides a technical field of probe cards, especially the technology of providing a modular probe card device, which makes it difficult to overcome large-area production problems. And only need to be replaced locally when it is damaged. [Prior Art] According to the current trend of semiconductor technology is to develop 300mm (12吋) process technology, reducing the line width so that each wafer (wa fe Γ) can accommodate more chips (such) will effectively reduce manufacturing costs ,Improve productivity. Therefore, the demand for large-area probe card technology is quite urgent. Conventional large-area probe card technology for probing for large area, such as Taiwan's new patent M31 1030, connected by micro-probes (also known as micro-probe substrates) on space trans f ormers Dut (Die under testing) and test machine, the space conversion device is a Mul ti-layer wiring board, which has the function of amplifying the line spacing (pi tch ), and the general space conversion device can It is a multi-layer ceramic substrate (such as LTCC/low temperature cofired ceramics or HTCC/high temperature cofired ceramics), a multilayer circuit substrate (such as PCB or multi-layer organics substrate) or a germanium substrate or ceramic substrate containing a line. In addition, the patent is applied to a multi-layer ceramic substrate, a germanium substrate containing a line, and a ceramic substrate. However, such probes are used in the development of large-area needle testing techniques, such as multi-layer ceramic M369456. The substrate is difficult to make qnilm. The table is 300mm large and the production cost is high. The probe is made on the other 3mm substrate. It is difficult to maintain high yields. θ leaves on the problem of the above-mentioned I-known structure, how to develop an innovative structure that is more ideal and practical. The consumers are eagerly awaiting, and the relevant industry must strive to develop the goal and direction of breakthrough. With silver in mind, the creator has been engaged in the manufacturing and development of related products for many years, and after detailed design and careful evaluation of the above objectives, he has finally achieved a practical and practical creation. [New content] The technical problem to be solved: the probe card technology used for probing for large area, the space transformer is connected to the test machine and the chip to be tested (]) Ut, Die under testing), the general space conversion device is a multi-layer ceramics sub-star (multi-layer ceramics substarate) with multi-number probes for pinning the bare crystal. However, when such a probe card is developed for a large-area needle-measuring technique, it is difficult to manufacture a multilayer ceramic substrate of 300 mm and a high manufacturing cost. It is difficult to maintain a high yield on probes made on another 300 mm substrate. Technical Problem of Solving the Problem: Providing a modular probe card device that is assembled into a large-area micro-probe substrate by a small-area, modular probe substrate with small area, which can be overcome The large-area substrate is difficult to manufacture and the cost is effectively reduced. The M369456 also improves the probe production yield due to the modular design. When the probe card is partially damaged during use, it only needs to replace the unit in the area. Replace. It can save the cost of the whole set of replacement. Compared with the efficacy of the prior art: the probe card of the prior art is developed in the large-area needle-measuring technique, because the multi-layer substrate is difficult to make a probe on the substrate which is large and the manufacturing cost is 3 〇〇m>n large (Probes It is difficult to maintain high yields. In case of partial damage, the whole group should be replaced. In this creation, a small-area, modular micro-probe substrate is used to form a large-area micro-probe substrate, which can overcome the difficulty of large-area substrate fabrication and effectively reduce the cost; and the modular design can improve the probe production. Yield, and when local damage occurs during use of the probe card, only the unit of the area to be replaced needs to be replaced, and the whole group does not need to be replaced. It can save the cost of the whole set of replacement. With regard to the techniques, means and functions of the present invention, a preferred embodiment is described in detail with reference to the drawings, and it is believed that the above objects, structures and features of the present invention can be obtained from an in-depth and specific understanding. . [Embodiment] Referring to the first figure, the present invention provides a modular probe card device. The modular probe card device comprises: a plurality of modular micro-probe substrates 11 comprising a plurality of substrates 111, which may be multi-layer ceramic substrates (Multi- Layer ceramics), a substrate or ceramic substrate containing a line, a plurality of micro-probes 112 are implanted on the front side of the substrate 111, and the position of the micro-probes 112 is 5 M369456 "testing pads of the bare test to be tested 18" Corresponding to each other, and through the substrate 111 line amplification function, the electrical contacts on the back side correspond to the electrical contacts of the printed circuit board 15, which provides line amplification, good flatness and rigidity; a printed circuit board (PCB) The printed circuit board 丨5 is provided with a plurality of electrical contacts corresponding to the electrical contacts on the back side of the substrate 111; an electrical connection device 20, the electrical connection device 2 Between the connection substrate lu and the printed circuit board 15; The mechanism, each set of modular micro-probe substrate u is matched with a set of adjustment mechanism, such as the differential mechanism of the differential screw 17 , that is, a plurality of differential screws 17 are arranged on the back of the modular micro-probe substrate 11 . By mobilizing the differential snail The wire 17 has to individually adjust each modular micro-probe substrate n so that the probe card i and a test machine can maintain a good degree of coplanarity; a fixing device, the fixing device includes The upper fixing base 14 and the lower fixing base 16 have substantially a certain degree of warpage because the printed circuit board 15 is made of FR_4 material. The original design has an upper fixing seat 14 and a lower fixing seat 16, and the upper fixing seat 14 And the lower holder 16 sandwiches the printed circuit board 15 therebetween, and the printed circuit board 15 is adjusted to a better flatness, and then compensated by the elastic pins 13 on the electrical connecting device 20. The printed circuit board 15 has poor flatness and connects the electronic signal on the substrate η to the printed circuit board 15. Referring to the second figure, another embodiment of the present invention, the electrical connection M369456 20 (as shown in the first figure) can also be used as a modular electrical connection device 2A in conjunction with the modular micro-probe substrate 11 to reduce the difficulty in manufacturing the electrical connection device 20. As shown in the figure, another embodiment of the present invention will be electrically connected. The elastic needle fixing seat 21 of the 20B is formed into a plurality of through holes 211 having different opening sizes at both ends. The two ends of the through hole 211 are respectively a large opening 21丨丨 and a small opening 2112, and the ends are different in size and have large ends 222 and small. The resilient pin 22 of the end 221 is inserted into the through hole 211 by the small opening 2112. This design makes it impossible for the entire electrical connecting device 20B to be scattered before assembly. Due to the electrical contact size of the printed circuit board 15 (as shown in the first figure) Larger, so the large end 222 of the flexible needle 22 needle is electrically connected to the printed circuit board 15, and the small end 221 of the small needle is connected to the electrical contact of the modular micro-probe substrate; The deformation of the elastic needle 22 during the process may be caused by the difference in parallelism and flatness between the printed circuit board (pcB) 15 and the modular micro-probe substrate 11, so that the printed circuit board (PCB) 15 and the modular micro-exploration The electrical contacts of the pin substrate u are connected to each other and can have a good electrical connection. The electrical connection device 20B of the present invention can also be modularized to reduce manufacturing difficulties. Referring to the fourth figure, there is still another embodiment of the present creation. The electrical connecting device 20C includes a plurality of elastic pins 23 having a curvature, and is assembled between the two fixing plates. The two fixing plates are the first fixing plate 24 and the second fixing plate 25, respectively. It is easy to fix the elastic needle M369456 23' having a curvature and is easily assembled between the printed circuit board 15 (as shown in the first figure) and the modular micro-probe substrate 11. Therefore, the elastic pin 23 can be used to overcome the difference in flatness between the printed circuit board 15 and the modular micro-probe substrate u, so that the printed circuit board 15 and the modular micro-probe substrate u are electrically connected to each other. Both can have good electrical connections. The electrical connection device 20C of the present invention can also be modularized to reduce manufacturing difficulties. Referring to the fifth figure, there is still another embodiment of the present creation. The electrical connecting device 20D includes a first conductive adhesive 26 on the printed circuit board 15 and a plurality of electrical connecting bumps ι 51 thereon, and the printed micro-probe substrate 11 has the same printed thereon. A plurality of electrical connection bumps 113 corresponding to the circuit board 15 are aligned, and a specific pressure is applied such that all of the electrical connection bumps 151, 113 are electrically connected. And because the conductive adhesive 26 has the advantages of axial electrical conduction and lateral insulation, such as anisotropic conductive adhesive, the conductive adhesive 26 has elasticity, and can still compensate the printed circuit board 15 and the modular micro-probe substrate. The difference in flatness between 11. The electrical connection bumps 丨5丨 and 丨丨3 on the printed circuit board 1 5 and the modular micro-probe substrate 11 may be solder bumps or gold bumps. The electrical connection device 2〇D of the present invention can also be replaced with a modular design to reduce manufacturing difficulties. The text is specifically described for the technical features of the present invention, but those skilled in the art can change and modify the creation without departing from the spirit of M369456 and (4) τ. Such changes and modifications shall be covered by the following materials as defined in the scope of the patent [Simplified description of the drawings] - Figure 1 is a schematic plan view of one embodiment of the present creation. Second figure: a schematic plan view of another embodiment of the system. The third figure is a plan view of another embodiment of the system. The fourth figure is a plan view of another embodiment of the present creation. Fig. 5 is a plan view showing still another embodiment of the present invention. [Main component symbol description] 1 probe card 111 substrate 113 electrical connection bump 14 upper mount 151 electrical connection bumps 17 17 differential screw 20 electrical connection device 20 electrical connection device 20D electrical connection device 211 through hole 2112 small opening 2 21 small end 11 modular micro-probe substrate 112 micro-probe 13 elastic needle 15 printed circuit board 16 lower mount 18 test pad 20 Α modular electrical connection device 20C electrical connection device 21 elastic needle holder 2111 large opening 22 Elastic needle 222 big end M369456 fixed plate 23 elastic needle 24 first solid 25 second fixed plate 26 conductive adhesive